Eutectic welding equipment for LED epitaxial barrier wafer

Abstract

The utility model relates to the technical field of eutectic furnaces, in particular to an LED epitaxial barrier wafer eutectic welding device which comprises an eutectic welding device body and a vacuum pump machine, a vacuum opening is formed in the left side wall of the eutectic welding device body, a vacuum pipe is connected between the suction end of the vacuum pump machine and the vacuum opening, and a filter cylinder is connected to the vacuum pipe. The two sides of the filter cylinder are communicated with the vacuum pipe, a bearing part is arranged in the filter cylinder, the filter assemblies can be detached in through holes of the bearing part, the bearing part can be positioned through the positioning assembly, and when the filter assembly on the lower side is blocked, limiting of the bearing part is relieved through the positioning assembly, and the filter assembly on the upper side is moved into the filter cylinder. According to the structure, the filter screen can be rapidly replaced, the cleaning time is shortened, the probability that a vacuum pump machine breaks down due to the fact that foreign matter enters the vacuum pump machine is reduced, and the welding efficiency of the eutectic welding equipment body is improved.

Description

Technical Field

[0001] This utility model relates to the field of eutectic furnace technology, specifically to an LED epitaxial barrier wafer eutectic welding device. Background Technology

[0002] Eutectic bonding, also known as low-melting-point alloy bonding, is a technique where two different metals can form an alloy in a specific weight ratio at temperatures far below their respective melting points. In microelectronic devices, eutectic bonding is most commonly used for bonding silicon chips to gold-plated substrates or lead frames. Currently, eutectic bonding furnaces are widely used for bonding LED epitaxial wafers.

[0003] Patent publication number CN209598370U discloses a high-vacuum eutectic furnace welding machine for LED packaging, comprising a main body and a heating tube. A controller is mounted on the main body, and a furnace chamber body is also mounted on the main body. The heating tube penetrates the furnace chamber body and is connected to a sealing sleeve. The sealing sleeve is connected to a first spring via a first pressure plate. The first spring is connected to a locking block via a second pressure plate, and the locking block is connected to a first locking groove. A pull-out door is provided on the front side of the furnace chamber body. A pressure rod is connected to a second locking groove via a locking strip, and the locking strip is connected to a third spring. The pull-out door is connected to a base, and the base is connected to a slide rail. In this high-vacuum eutectic furnace welding machine for LED packaging, when the heating tube is connected to the furnace chamber body, there will be a gap between the furnace chamber body and the heating tube. Therefore, a sealing sleeve is provided between the heating tube and the furnace chamber body to prevent heat leakage from the inside of the furnace chamber body.

[0004] Existing eutectic welding furnaces require vacuuming. If foreign objects enter the vacuum pump, it can easily cause the vacuum pump to malfunction, affecting the vacuum effect. Repairing these issues is also time-consuming. Utility Model Content

[0005] To address the shortcomings of existing technologies, this invention provides an LED epitaxial barrier wafer eutectic bonding device.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an LED epitaxial barrier wafer eutectic welding device, comprising a eutectic welding device body and a vacuum pump, a vacuum port is provided on the left side wall of the eutectic welding device body, a vacuum tube is connected between the suction end of the vacuum pump and the vacuum port, a filter cartridge is connected to the vacuum tube, the two sides of the filter cartridge are connected to the vacuum tube, a support component is provided inside the filter cartridge, the support component includes a filter seat, two sets of through holes are provided on the left outer wall of the filter seat, a filter assembly is provided in the through holes, positioning components are provided on the front and rear side walls of the filter cartridge, and a sealing gasket is fixedly provided at the contact position between the inner wall of the filter cartridge and the support component.

[0007] To facilitate the filtration of gas within the main body of the eutectic welding equipment, the present invention includes an improvement in the filter assembly comprising a filter sleeve and a filter screen. The filter screen is fixedly installed in the inner hole of the filter sleeve, a threaded groove is provided on the outer wall of the filter sleeve, a convex thread is provided on the inner wall of the through hole, and the filter sleeve is threadedly connected to the through hole.

[0008] To improve the sealing between the filter sleeve and the through hole, this invention includes a retaining edge. A retaining edge is fixedly provided on the inner wall of the through hole on the right side of the filter sleeve, and a sealing ring is fixedly provided at the contact position between the retaining edge and the filter sleeve.

[0009] To facilitate the rotation of the filter sleeve, the present invention includes a connecting handle, which is fixedly installed on the left and right side walls of the filter sleeve.

[0010] To facilitate the positioning of the carrier, the present invention includes improvements such as a positioning assembly comprising a positioning seat, an electromagnet, a return spring, and a positioning pin. Sliding holes are provided on the front and rear outer walls of the filter cartridge. Positioning seats are fixedly installed on the front and rear outer walls of the filter cartridge at positions corresponding to the sliding holes. An inner cavity is provided within the positioning seat. An electromagnet is fixedly installed on the inner wall of the inner cavity on the side away from the filter cartridge. A positioning pin is slidably installed within the sliding holes. A return spring connects the positioning pin and the electromagnet. Two sets of positioning grooves are provided on the front and rear side walls of the filter seat, distributed vertically. The positioning pin is adapted to the positioning groove.

[0011] To prevent the support component from falling out of the filter cartridge, the improvement of this utility model is that multiple sets of extension rods are fixedly installed on the bottom wall of the filter cartridge, and baffles are fixedly installed on the bottom wall of the extension rods.

[0012] To facilitate the lifting of the support component, the improvement of this utility model is that handles are fixedly provided on the upper and lower side walls of the filter base.

[0013] Compared with the prior art, this utility model provides an LED epitaxial barrier wafer eutectic bonding device, which has the following beneficial effects:

[0014] In this LED epitaxial barrier wafer eutectic welding equipment, the filter assembly can be disassembled within the through hole of the carrier. The carrier can be positioned by the positioning assembly. When the lower filter assembly becomes clogged, the positioning assembly releases the restriction on the carrier, and the upper filter assembly is moved into the filter cartridge. This structure enables quick filter replacement, reduces cleaning time, and lowers the probability of vacuum pump failure due to foreign objects entering, thereby improving the welding efficiency of the eutectic welding equipment. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This utility model Figure 1 Another perspective on the structure;

[0017] Figure 3 This utility model Figure 2 Enlarged schematic diagram of the structure at point A in the middle;

[0018] Figure 4 This is a schematic diagram of the structure of the carrier and filter assembly of this utility model from another perspective.

[0019] In the diagram: 1. Main body of eutectic welding equipment; 2. Vacuum pump; 3. Vacuum tube; 4. Filter cartridge; 5. Filter base; 6. Filter sleeve; 7. Side guard; 8. Connecting handle; 9. Handle; 10. Positioning seat; 11. Extension rod; 12. Baffle plate; 13. Positioning groove; 14. Electromagnet; 15. Return spring; 16. Positioning pin; 17. Filter screen. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 An LED epitaxial barrier wafer eutectic bonding device includes a eutectic bonding device body 1 and a vacuum pump 2. A vacuum port is provided on the left side wall of the eutectic bonding device body 1. A vacuum tube 3 connects the suction end of the vacuum pump 2 to the vacuum port. A filter cartridge 4 is connected to the vacuum tube 3, and both sides of the filter cartridge 4 are connected to the vacuum tube 3. A support component is provided inside the filter cartridge 4, including a filter base 5. Two sets of through holes are provided on the left outer wall of the filter base 5, and filter components are installed in the through holes. Positioning components are provided on the front and rear side walls of the filter cartridge 4. A sealing gasket is fixedly provided at the contact position between the inner wall of the filter cartridge 4 and the support component. The filter assembly can be disassembled within the through hole of the carrier. The carrier can be positioned by the positioning assembly. When the filter assembly on the lower side becomes clogged, the positioning assembly releases the restriction on the carrier, allowing the carrier to move down so that the filter assembly on the upper side is located inside the filter cartridge 4 and connected to the vacuum tube 3. Subsequently, the filter assembly that has been removed from the filter cartridge 4 on the lower side can be cleaned and replaced. This structure allows for quick replacement of the filter screen 17, reduces cleaning time, and lowers the probability of the vacuum pump 2 malfunctioning due to foreign objects entering, thereby improving the welding efficiency of the eutectic welding equipment body 1.

[0022] Please see Figure 1 and 4The above-mentioned filter components can be any type. This application provides an embodiment in which the filter components include a filter sleeve 6 and a filter screen 17. The filter screen 17 is fixedly disposed in the inner hole of the filter sleeve 6. The outer wall of the filter sleeve 6 is provided with a threaded groove, and the inner wall of the through hole is provided with a protruding thread. The filter sleeve 6 is threadedly connected to the through hole. When the eutectic welding equipment body 1 is evacuated through the vacuum tube 3, the gas is filtered through the filter screen 17 in the filter sleeve 6 to prevent impurities from entering the vacuum pump 2 and causing the vacuum pump 2 to malfunction.

[0023] Please see Figure 1 Furthermore, it also includes a retaining edge 7. A retaining edge 7 is fixedly installed on the inner wall of the through hole on the right side of the filter sleeve 6. A sealing ring is fixedly installed at the contact position between the retaining edge 7 and the filter sleeve 6. By adding the retaining edge 7, the filter assembly can be limited when it is screwed into the through hole.

[0024] Please see Figure 1 Furthermore, in order to solve the above problems, a connecting handle 8 is also included. A connecting handle 8 is fixedly installed on the left and right side walls of the filter sleeve 6. By adding the connecting handle 8, it is easy to rotate the filter sleeve 6 by holding the connecting handle 8.

[0025] Please see Figure 1-3 The positioning component described above can be any type. This application provides an embodiment in which the positioning component includes a positioning seat 10, an electromagnet 14, a return spring 15, and a positioning pin 16. Sliding holes are provided on the front and rear outer walls of the filter cylinder 4. The positioning seat 10 is fixedly disposed on the front and rear outer walls of the filter cylinder 4 at positions corresponding to the sliding holes. An inner cavity is provided inside the positioning seat 10. The electromagnet 14 is fixedly disposed on the inner wall of the inner cavity on the side away from the filter cylinder 4. The positioning pin 16 is slidably disposed within the sliding holes. A return spring 15 connects the positioning pin 16 and the electromagnet 14. The spring 15 and the filter seat 5 are provided with two sets of positioning grooves 13 on the front and rear side walls. The two sets of positioning grooves 13 are distributed vertically. The positioning pin 16 is adapted to the positioning groove 13. When the electromagnet 14 is not energized, the reset spring 15 pushes the positioning pin 16 into the positioning groove 13, thereby positioning the filter seat 5. When it is necessary to move the filter seat 5, the electromagnet 14 is energized, and then the positioning pin 16 is attracted, so that the positioning pin 16 moves out of the positioning groove 13, and the filter seat 5 loses its limit, thereby facilitating the movement of the filter seat 5 in the filter cylinder 4.

[0026] Please see Figure 1-2 Furthermore, multiple sets of extension rods 11 are fixedly installed on the bottom wall of the filter cartridge 4, and baffles 12 are fixedly installed on the bottom wall of the extension rods 11. By adding extension rods 11 and baffles 12, the load-bearing components can be prevented from detaching inside the filter cartridge 4.

[0027] Please see Figure 1 , 2 Furthermore, the filter base 5 is further provided with handles 9 fixed on the upper and lower side walls. With the addition of handles 9, the load-bearing component can be lifted and moved more conveniently.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An LED epitaxial barrier wafer eutectic bonding equipment, comprising a eutectic bonding equipment body (1) and a vacuum pump (2), wherein a vacuum port is provided on the left side wall of the eutectic bonding equipment body (1), and a vacuum tube (3) is connected between the suction end of the vacuum pump (2) and the vacuum port, characterized in that: A filter cartridge (4) is connected to a vacuum tube (3). The filter cartridge (4) is connected to the vacuum tube (3) on both sides. A carrier is provided inside the filter cartridge (4). The carrier includes a filter seat (5). Two sets of through holes are provided on the outer left side of the filter seat (5). Filter components are provided inside the through holes. Positioning components are provided on the front and rear side walls of the filter cartridge (4). A sealing gasket is fixedly provided at the contact position between the inner wall of the filter cartridge (4) and the carrier.

2. The LED epitaxial barrier wafer eutectic bonding equipment according to claim 1, characterized in that: The filter assembly includes a filter sleeve (6) and a filter screen (17). The filter screen (17) is fixedly installed in the inner hole of the filter sleeve (6). The outer wall of the filter sleeve (6) is provided with a threaded groove, and the inner wall of the through hole is provided with a protruding thread. The filter sleeve (6) is threadedly connected to the through hole.

3. The LED epitaxial barrier wafer eutectic bonding equipment according to claim 2, characterized in that: It also includes a retaining edge (7), a retaining edge (7) is fixedly installed on the inner wall of the through hole on the right side of the filter sleeve (6), and a sealing ring is fixedly installed at the contact position between the retaining edge (7) and the filter sleeve (6).

4. The LED epitaxial barrier wafer eutectic bonding equipment according to claim 3, characterized in that: It also includes a connecting handle (8), and the connecting handle (8) is fixedly installed on the left and right side walls of the filter sleeve (6).

5. The LED epitaxial barrier wafer eutectic bonding equipment according to claim 1, characterized in that: The positioning assembly includes a positioning seat (10), an electromagnet (14), a reset spring (15), and a positioning pin (16). The filter cylinder (4) has sliding holes on its front and rear outer walls. The positioning seat (10) is fixedly installed on the front and rear outer walls of the filter cylinder (4) at the corresponding positions of the sliding holes. The positioning seat (10) has an inner cavity. The electromagnet (14) is fixedly installed on the inner wall of the inner cavity away from the filter cylinder (4). The positioning pin (16) is slidably installed in the sliding hole. The reset spring (15) is connected between the positioning pin (16) and the electromagnet (14). The filter seat (5) has two sets of positioning grooves (13) on its front and rear side walls. The two sets of positioning grooves (13) are distributed vertically. The positioning pin (16) is adapted to the positioning groove (13).

6. The LED epitaxial barrier wafer eutectic bonding equipment according to claim 5, characterized in that: The bottom wall of the filter cartridge (4) is fixedly provided with multiple sets of extension rods (11), and the bottom wall of the extension rods (11) is fixedly provided with baffles (12).

7. The LED epitaxial barrier wafer eutectic bonding equipment according to claim 1, characterized in that: The filter base (5) is fixedly equipped with handles (9) on the upper and lower side walls.

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