Substrate processing device and laser processing equipment

Abstract

The utility model discloses a substrate processing device and laser processing equipment. The substrate processing device comprises a lathe bed; the cross beam is fixedly arranged on the machine body; the machining assembly is arranged on the cross beam, the machining assembly at least comprises two machining parts, one machining part does not move in the first direction, at least one machining part moves in the first direction, and the first direction is the extending direction of the cross beam; the working table is located below the machining assemblies, the working table comprises at least one machining station, the working table moves in the second direction perpendicular to the first direction, each machining station bears one base plate, and the machining assemblies correspond to the base plates in a one-to-one mode. According to the utility model, at least one group of single-station double-laser processing is provided, so that the laser processing efficiency is remarkably improved, and the processing of substrates with multiple sizes can be met.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and more specifically, to a substrate processing apparatus and a laser processing equipment. Background Technology

[0002] Existing laser processing equipment for laser drilling circuit boards typically uses only one laser head to drill holes in a single workstation, resulting in low processing efficiency that cannot meet customers' growing efficiency demands. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned defects in the prior art and provide a substrate processing device and a laser processing equipment that can provide at least one set of single-station dual-laser processing, which not only significantly improves the efficiency of laser processing, but also meets the processing needs of circuit boards of various sizes.

[0004] To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] A substrate processing apparatus, comprising:

[0006] Bed frame;

[0007] The crossbeam is fixedly installed on the bed;

[0008] At least one processing component is disposed on the crossbeam, the processing component includes at least two processing parts, wherein one processing part does not move along the first direction, and at least one processing part moves along the first direction, the first direction being the extension direction of the crossbeam;

[0009] A worktable is located below the processing components. The worktable includes at least one processing station. The worktable moves along a second direction perpendicular to the first direction. Each processing station carries a substrate. The processing components correspond one-to-one with each substrate.

[0010] Another technical solution of this utility model is as follows:

[0011] A laser processing apparatus includes the aforementioned substrate processing device.

[0012] Implementing the embodiments of this utility model will have the following beneficial effects:

[0013] This utility model embodiment significantly improves the processing speed by setting at least two processing parts to process a substrate at one processing station; by fixing one processing part in the first direction, it is convenient to fix the reference positioning of the processing component in the first direction; by enabling at least another processing part to move along the first direction, the distance between the two processing parts can be adjusted, which can be used to process substrates of different sizes and substrates with different drilling spacing. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] in:

[0016] Figure 1 This is a schematic diagram of the overall structure of a substrate processing apparatus according to a specific embodiment of the present invention.

[0017] Figure 2 yes Figure 1 A partial structural diagram of the structure shown.

[0018] Figure 3 yes Figure 1 A partial structural diagram of the structure shown. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] refer to Figure 1 , Figure 2 and Figure 3This utility model discloses a substrate processing apparatus, including: a bed 10, a worktable 40 disposed on the bed 10, a gantry frame 50 disposed on the bed 10, and a processing assembly 60 disposed on the crossbeam of the gantry frame 50. The processing assembly 60 includes at least two processing sections, for example, a first processing section 61 and a second processing section 62 in this embodiment. One processing section is fixed in a first direction and does not move along that direction; for example, the first processing section 61 is fixed in the first direction. At least one processing section moves along the first direction; for example, the second processing section 62 moves along the first direction, which is the extension direction of the crossbeam. The worktable 40 is located below the processing assembly 60 and moves along a second direction perpendicular to the first direction. The worktable 40 includes at least one processing station, each processing station carrying a substrate, such as a circuit board. The processing assembly 60 corresponds one-to-one with a substrate; for example, the first processing section 61 and the second processing section 62 are aligned together with a substrate at a processing station. In a specific embodiment, the second direction is the substrate feeding direction.

[0021] The above implementation scheme significantly improves the processing speed by setting at least two processing units to process a substrate located at a processing station; by fixing one processing unit in the first direction, it is convenient to fix the reference positioning of the processing unit in the first direction; by enabling at least one processing unit to move along the first direction, the distance between the two processing units can be adjusted, which can be used to process substrates of different sizes and substrates with different drilling spacing.

[0022] The above implementation scheme, by enabling the worktable 40 to move along the second direction and preventing the processing part from moving along the second direction, can ensure that the positioning reference of the processing part (i.e. the first processing part 61) fixed in the first direction remains unchanged in the first and second directions during the processing process, thus avoiding affecting the accuracy of laser processing and also avoiding affecting the accuracy of the spacing adjustment between the two processing parts.

[0023] When the processing assembly 60 includes three processing parts, the three processing parts are arranged sequentially along a first direction. One of the three processing parts is fixed in the first direction, while the other two processing parts can move along the first direction. In this way, the distance between any two processing parts can be adjusted. When the processing assembly includes four or more processing parts, one processing part is fixed in the first direction, while the other processing parts can move along the first direction.

[0024] Furthermore, each processing unit also moves along a third direction, which is perpendicular to the worktable, allowing each processing unit to move up and down to perform laser processing on the substrate. Specifically, in this embodiment, the first processing unit 61 and the second processing unit 62 also move along a third direction, enabling them to move up and down to perform laser processing on the substrate. The worktable 40 can also move along a first direction, allowing it to be precisely positioned at any location within a plane, adjusting the position of the substrate 70 disposed on the surface of the worktable 40.

[0025] Continue to refer to Figures 1-3 In one specific embodiment, the laser processing apparatus further includes: a first driving assembly 20, a second driving assembly 30, a third driving assembly 63, and a fourth driving assembly 65. The first driving assembly 20 and the second driving assembly 30 are disposed on the bed 10 and below the worktable 40, and are used to drive the worktable 40 to move in a plane along a first direction and a second direction, adjust the position of the worktable 40, and thereby adjust the position of the substrate 70 supported on the worktable 40.

[0026] The third drive assembly 63 is installed on the crossbeam. Each processing part is equipped with a third drive assembly 63. Each third drive assembly 63 drives each processing part to move along a third direction. By setting a third drive assembly 63 that corresponds to each processing part, each processing part can move independently and adapt to more working conditions.

[0027] A fourth drive assembly 65 is mounted on the crossbeam. Each machining part that can move along the first direction is equipped with a fourth drive assembly 65, and each fourth drive assembly 65 drives the corresponding machining part to move along the first direction. By mounting a fourth drive assembly 65 on each machining part that can move along the first direction, each machining part can move independently, thus adapting to more working conditions.

[0028] In this embodiment, a third driving component 63 is provided on the first processing unit 61, and the third driving component 63 drives the first processing unit 61 to move along a third direction. A third driving component 63 and a fourth driving component 65 are provided on the second processing unit 62, and the third driving component 63 drives the second processing unit 62 to move along a third direction. The fourth driving component 65 drives the second processing unit 62 to move along a first direction, thereby adjusting the distance between the second processing unit 62 and the first processing unit 61.

[0029] Specifically, in this embodiment, the first drive assembly 20 is mounted on the bed 10, the second drive assembly 30 is mounted on the first drive assembly 20, and the worktable 40 is mounted on the second drive assembly 30. The first drive assembly 20 and the second drive assembly 30 drive the worktable 40 to move in a plane along a first direction and a second direction, adjusting the position of the worktable 40, thereby adjusting the position of the base plate 70. In this embodiment, the second drive assembly 30 and the first drive assembly 20 form a cross-shaped vertical motion platform, providing a stable XY motion platform for the device. In another embodiment, the positions of the first drive assembly 20 and the second drive assembly 30 are interchanged.

[0030] In one specific embodiment, both the first drive assembly 20 and the second drive assembly 30 are linear motor drives. In the prior art, lead screw and linear guide transmissions are typically used, resulting in low transmission efficiency, low acceleration, large rotational backlash, easy wear of the lead screw, and complex assembly, leading to low processing efficiency. In this technical solution, the linear motor drive is a transmission device that directly converts electrical energy into linear motion mechanical energy without any intermediate conversion mechanism. This not only simplifies the structure but also offers advantages such as high control precision, high speed, low vibration and noise, and high acceleration, significantly improving processing efficiency.

[0031] Specifically, in one embodiment, the first drive assembly 20 includes a first stator disposed within the bed 10, a first guide rail 21 disposed on the bed 10, and a first mover sliding along the first guide rail 21. The second drive assembly 30 includes a connector 31 fixedly connected to the first mover, a second stator disposed within the connector 31, a second guide rail disposed on the connector 31, and a second mover sliding along the second guide rail; the worktable 40 is fixedly connected to the second mover, and the second drive assembly 30 and the worktable 40 as a whole can move along the first guide rail 21 in a second direction, and the worktable 40 can move relative to the second drive assembly 30 along the second guide rail in a first direction.

[0032] The number of first guide rails 21 can be two or more, enhancing the stability of the structure during operation. In this embodiment, the number of first guide rails 21 is four; in other embodiments, it can also be three, five, six, etc.

[0033] refer to Figure 1Preferably, on both sides of the worktable 40, in the non-feeding direction, specifically, in this embodiment, symmetrical dual Y-axis cable chains 22 are set outside the two outermost first guide rails 21, and dual X-axis cable chains 32 are also set on both sides of the worktable 40, in the non-feeding direction. The dual Y-axis cable chains 22 are cable chains of the second drive component, and the dual X-axis cable chains 32 are cable chains of the first drive component. The symmetrical dual cable chain structure can effectively balance the influence of the cable chain tension on the running platform, ensure the stability of operation, and at the same time reduce the size of the cable chains, making the space utilization more reasonable and compact.

[0034] refer to Figure 1 In one specific embodiment, dust covers are provided on the first guide rail 21 and the first mover, as well as on the second guide rail and the second mover, to reduce dust and powder falling onto the linear rails and reduce service life; at the same time, the linear motor stator has strong magnets, and the dust covers isolate magnetic objects from falling and adhering to the motor, ensuring safe and stable operation.

[0035] In one specific embodiment, the worktable 40 is a vacuum adsorption worktable, which allows the workpiece to be fixed without additional custom tooling fixtures, making the overall structure more compact, reducing the load on the second drive assembly 30 and the first drive assembly 20, and improving the platform's operating accuracy.

[0036] Specifically, in one embodiment, the vacuum adsorption workbench includes a workbench surface with adsorption holes and a workbench base with an adsorption cavity. The workbench surface is disposed on the workbench base, and the adsorption cavity is connected to the vacuum equipment through a pipeline.

[0037] In one specific embodiment, the third drive component 63 and the fourth drive component are respectively driven by a lead screw motor or a linear motor. Preferably, the third drive component 63 and the fourth drive component 65 are respectively driven by a lead screw motor, which has a simpler structure, is more stable, has higher reliability, and is lower in cost.

[0038] Specifically, two third drive components 63 are arranged side-by-side on the front sidewall of the gantry frame 50 crossbeam, and a fourth drive component 65 is positioned above the third drive components 63. Specifically, the third drive component 63 includes a first motor 631, a first lead screw, a first track 633, and a first slider 632. The first track 633 is located on the front sidewall of the gantry frame 50 crossbeam, and the first slider 632 slides along the first track 633. The first motor 631 and the first lead screw are also fixedly mounted on the front sidewall of the gantry frame 50 crossbeam. The first slider 632 is threadedly connected to the first lead screw, and the first lead screw is fixedly connected to the output shaft of the first motor 631. The rotation of the output shaft of the first motor 631 drives the first lead screw to rotate, causing the first slider 632 to move along the first track 633 in a third direction. A first processing part 61 is fixedly mounted on the first slider 632, and the first slider 632 drives the first processing part 61 to move together.

[0039] The fourth drive assembly 65 includes a second motor 651, a second lead screw, a second track 653, and a second slider 652. The second track 653 is disposed on the first slider 632, and the second slider 652 slides along the second track 653. The second motor 651 and the second lead screw are both fixedly disposed on the first slider 632. The second slider 652 is threadedly connected to the second lead screw, and the second lead screw is fixedly connected to the output shaft of the second motor 651. The rotation of the output shaft of the second motor 651 drives the second lead screw to rotate. The rotation of the second lead screw causes the second slider 652 to move along the second track 653 in a first direction. The second processing part 62 is fixedly disposed on the second slider 652. The second slider 652 drives the second processing part 62 to move together in the first direction. At the same time, the first slider 632 can drive the fourth drive assembly 65 and the second processing part 62 to move together in a third direction.

[0040] In one specific embodiment, the substrate processing apparatus further includes a dual dust suction hood assembly 80, which is fixedly mounted on the gantry 50 and located below the processing assembly 60. The dual dust suction hood assembly 80 is fixed relative to the gantry 50. In this embodiment, the dual dust suction hood assembly 80 is independent of the processing assembly 60 and does not move with the movement of the first processing section 61 and the second processing section 62. This reduces the load weight of the third drive assembly 63 and the fourth drive assembly 65, improving their motion accuracy and lifespan.

[0041] Specifically, in one embodiment, the dual dust collection hood assembly 80 comprises a first dust collection hood 81 located below the first processing section 61 and a second dust collection hood 82 located below the second processing section 62. The first dust collection hood 81 has a first through hole 811 at its front end, and a first air outlet on its side wall. When the first processing section 61 moves downwards along a third direction, it passes through the first through hole 811, and the first air outlet blows air onto the first processing section 61 to cool the processing head and prevent dust from entering the laser channel within the processing head. The second dust collection hood 82 has a second through hole 821 at its front end, and a second air outlet on its side wall. When the second processing section 62 moves downwards along a third direction, it passes through the second through hole 821, and the second air outlet blows air onto the second processing section 62 to cool the processing head and prevent dust from entering the laser channel within the processing head.

[0042] In this application, preferably, the second through hole 821 has a width extending along the first direction so that the second processing part 62 can move left and right along the first direction.

[0043] Further preferably, the number of processing components 60 is two or more, with each processing component 60 sequentially distributed along the first direction. The number of processing stations on the worktable 40 is the same as the number of processing components 60. In this technical solution, two or more substrates 70 can be processed simultaneously. All substrates 70 processed simultaneously move synchronously along the first and second directions. Compared to the technical solution with only one processing component 60, the processing speed is increased several times. Furthermore, since the spacing between each pair of processing sections of the processing components 60 is adjustable, the dimensions of the substrates 70 processed simultaneously can be the same or different, further expanding the applicable working conditions. (Reference) Figure 1 In this embodiment, specifically, there are two processing components 60, which can process two substrates 70 at the same time.

[0044] This utility model also discloses a laser processing equipment, including the aforementioned substrate processing device, and further including a laser generator 91 and an optical platform assembly 92. The laser generator 91 is fixedly mounted on the rear side wall of the gantry 50, and provides the required laser. The optical platform assembly 92 is positioned above the gantry 50 and is used for laser propagation. In this specific embodiment, the optical platform assembly 92 is a sealed, independent optical platform, allowing the optical path system to be uniformly placed, facilitating the optical path system conditions. Simultaneously, it fully utilizes the space above the crossbeam of the gantry 50, reducing the machine's length. In this specific embodiment, the laser generator 91 is horizontally fixed, not occupying additional machine space, thus saving space.

[0045] The laser processing equipment of this utility model has a compact overall structure and reasonable layout. It can process two or more substrate products simultaneously and adapt to the processing needs of different batches of substrate products of different sizes. The processing parts in each processing component 60 work together to improve product processing efficiency, increase the processing coverage of processed products, and improve the flexibility and versatility of the equipment.

[0046] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A substrate processing apparatus, characterized in that, include: Bed frame; The crossbeam is fixedly installed on the bed; At least one processing component is disposed on the crossbeam, the processing component includes at least two processing parts, wherein one processing part does not move along the first direction, and at least one processing part moves along the first direction, the first direction being the extension direction of the crossbeam; A worktable is located below the processing components. The worktable includes at least one processing station. The worktable moves along a second direction perpendicular to the first direction. Each processing station carries a substrate. The processing components correspond one-to-one with each substrate.

2. The substrate processing apparatus according to claim 1, characterized in that, The processing unit also moves along a third direction, which is perpendicular to the worktable.

3. The substrate processing apparatus according to claim 2, characterized in that, The worktable also moves along the first direction.

4. The substrate processing apparatus according to claim 3, characterized in that, Also includes: A first drive assembly is disposed below the worktable and drives the worktable to move along the second direction. A second drive assembly is disposed below the worktable, and the second drive assembly drives the worktable to move along the first direction.

5. The substrate processing apparatus according to claim 4, characterized in that, Also includes: A third drive assembly is disposed on the crossbeam, and each processing part is provided with one third drive assembly, and each third drive assembly independently drives the processing part to move along the third direction; A fourth drive assembly is disposed on the crossbeam and drives the processing unit to move along the first direction.

6. The substrate processing apparatus according to claim 5, characterized in that, Both the first drive component and the second drive component are linear motor drives; The third drive component and the fourth drive component are respectively a lead screw motor drive and a linear motor drive.

7. The substrate processing apparatus according to claim 6, characterized in that, The linear motor drive is equipped with a dust cover.

8. The substrate processing apparatus according to claim 7, characterized in that, Symmetrical dual Y-axis cable chains are installed on both sides of the worktable; Symmetrical dual x-axis cable chains are installed on both sides of the worktable.

9. The substrate processing apparatus according to claim 1, characterized in that, It also includes a dust collection hood assembly, which is fixedly mounted on the crossbeam and located below the processing component. The dust collection hood assembly is fixed relative to the crossbeam and includes dust collection hoods in the same number as the processing units, with one dust collection hood provided below each processing unit.

10. A laser processing apparatus, comprising the substrate processing apparatus according to any one of claims 1 to 9.

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