Grinding device and grinding machine table

Abstract

The utility model provides a grinding device and a grinding machine table, and relates to the technical field of semiconductor equipment. The grinding device comprises a spraying assembly and a grinding head. The first end face and the second end face are oppositely arranged, the peripheral face is used for connecting the first end face and the second end face, the area of the first end face is larger than that of the second end face, and the first end face serves as a grinding face; the second end face is connected with the spraying assembly. A drainage groove is formed in the peripheral surface. Wastewater and organic matters can be rapidly discharged, and the defects of light rings, light spots and the like of ground wafers caused by the fact that grinding particles are clamped on the grinding head are avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and in particular to a grinding device and a grinding machine. Background Technology

[0002] Chemical Mechanical Planarization (CMP) is an ultra-precision surface finishing process that achieves global planarization. To achieve a contaminant-free wafer surface, it is necessary to remove a large number of residual abrasive particles and grinding byproducts to prevent their re-entry before the next process. Therefore, multiple surface cleanings are required during wafer manufacturing. Traditional cleaning methods utilize roller brushes to remove contaminants such as metal ions, atoms, organic matter, and particles adhering to the wafer surface. However, traditional polishing equipment carries the risk of abrasive particles becoming embedded in the polishing pad, leading to wafer breakage and spots after polishing. Furthermore, the polishing wastewater from traditional equipment can contaminate the edges of the polishing head. Utility Model Content

[0003] The purpose of this invention is to provide a grinding device and grinding machine that can improve grinding quality, reduce the risk of wafer damage, help prevent contamination of the grinding head edge, and extend the service life of the grinding head.

[0004] In a first aspect, this utility model provides a grinding device, comprising:

[0005] Spray system components;

[0006] The grinding head includes a first end face, a second end face, and an outer peripheral surface for connecting the first end face and the second end face, wherein the area of ​​the first end face is larger than the area of ​​the second end face, and the first end face serves as the grinding surface; the second end face is connected to the spray assembly; and the outer peripheral surface is provided with a drainage groove.

[0007] In an optional embodiment, the outer peripheral surface is a conical surface.

[0008] In an optional embodiment, the drainage channel extends from the second end face to the first end face.

[0009] In an optional embodiment, multiple drainage channels are designed; the multiple drainage channels are evenly spaced along the outer peripheral surface.

[0010] In an optional embodiment, the spray assembly includes a mounting beam and a connecting column, one end of the connecting column being connected to the mounting beam and the other end being connected to the grinding head; the end of the connecting column away from the mounting beam is provided with a spray hole.

[0011] In an optional embodiment, the connecting column has a cavity for the flow of abrasive, and the spray hole communicates with the cavity.

[0012] In an optional embodiment, the mounting beam is provided with a plurality of connecting posts, each of which is connected to a grinding head.

[0013] In an optional embodiment, the mounting beam has a mounting portion on the side away from the connecting column.

[0014] In an optional embodiment, a grinding support is connected to the second end face of the grinding head, and the grinding support is connected to the connecting column.

[0015] Secondly, the present invention provides a grinding machine base, including a machine base and a grinding device as described in any of the foregoing embodiments, wherein the grinding device is mounted on the machine base.

[0016] The beneficial effects of the grinding device and grinding machine provided by this utility model include:

[0017] The grinding apparatus provided in this embodiment of the invention has a first end face of the grinding head that directly contacts the wafer surface. The area of ​​the first end face is larger than that of the second end face. This design facilitates the timely discharge of grinding waste liquid and contaminants, preventing contamination of the grinding head edges. The drainage groove further accelerates wastewater discharge, preventing grinding particles from getting stuck on the grinding head and causing spots or halos on the wafer surface. This improves grinding quality, reduces the risk of wafer damage, helps prevent contamination of the grinding head edges, and extends the service life of the grinding head.

[0018] The grinding machine provided in this embodiment of the present invention includes the above-mentioned grinding device, which is beneficial to improving grinding quality, reducing the risk of wafer damage, preventing contamination of the grinding head edge, and extending the service life of the grinding head. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 A first-view structural schematic diagram of the grinding device provided in an embodiment of this utility model;

[0021] Figure 2 A second-view structural schematic diagram of the grinding device provided in an embodiment of this utility model;

[0022] Figure 3 This is a third-view structural schematic diagram of the grinding device provided in an embodiment of the present invention.

[0023] Icons: 100-Grinding device; 110-Spray assembly; 111-Mounting beam; 112-Mounting part; 113-Connecting column; 114-Annular mounting part; 115-Spray hole; 130-Grinding head; 131-First end face; 132-Outer peripheral surface; 133-Drainage groove; 134-Grinding support column. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0027] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0028] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0029] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0031] This invention provides a grinding device that can be used to clean residual contaminants on the surface of a wafer.

[0032] Please combine Figures 1 to 3 The grinding apparatus 100 includes a spray assembly 110 and a grinding head 130. The grinding head 130 includes a first end face 131, a second end face, and an outer peripheral surface 132 for connecting the first end face 131 and the second end face. The area of ​​the first end face 131 is larger than the area of ​​the second end face, and the first end face 131 serves as the grinding surface. The second end face is connected to the spray assembly 110; the outer peripheral surface 132 is provided with a drainage groove 133. The first end face 131 of the grinding head 130 serves as the grinding surface that directly contacts the wafer surface. The larger area of ​​the first end face 131 compared to the second end face facilitates the timely discharge of grinding waste liquid and contaminants, preventing contamination of the edges of the grinding head 130. The drainage groove 133 on the grinding head 130 can accelerate the discharge of wastewater, prevent grinding particles from getting stuck on the grinding head 130 and causing spots and halos on the wafer surface, which is beneficial to improving the grinding quality, reducing the risk of wafer damage, preventing the edge of the grinding head 130 from being contaminated, and extending the service life of the grinding head 130.

[0033] In this embodiment, the outer peripheral surface 132 is a conical surface, which facilitates the rapid discharge of wastewater, etc. Of course, in some other embodiments, the outer peripheral surface 132 may also be a pyramidal surface or other shapes, which are not specifically limited here.

[0034] Optionally, the drain groove 133 extends from the second end face to the first end face 131. That is, the liquid can flow from top to bottom along the circumferential surface, making the drainage smoother and avoiding liquid contamination of the edge of the grinding head 130.

[0035] Optionally, multiple drainage channels 133 are designed; the multiple drainage channels 133 are evenly spaced along the outer peripheral surface 132. Setting multiple drainage channels 133 can speed up the drainage speed, make the drainage smoother, and avoid liquid contamination of the edge of the grinding head 130.

[0036] Optionally, the spray assembly 110 includes a mounting beam 111 and a connecting column 113. One end of the connecting column 113 is connected to the mounting beam 111, and the other end is connected to the grinding head 130. A spray hole 115 is provided at the end of the connecting column 113 away from the mounting beam 111. The spray hole 115 is used to spray abrasive into the grinding head 130.

[0037] Optionally, the connecting column 113 has a cavity for the abrasive to flow through, and the spray hole 115 communicates with the cavity. In this embodiment, the connecting column 113 can be designed as a hollow column, which can serve as both a connection and a flow channel or storage channel for the abrasive, resulting in a compact structure.

[0038] Optionally, the mounting beam 111 is provided with multiple connecting posts 113, each of which is connected to a grinding head 130. The multiple connecting posts 113 are spaced apart. This arrangement allows multiple grinding heads 130 to operate simultaneously, improving grinding efficiency. The cross-section of the connecting post 113 can be circular, triangular, quadrilateral, pentagonal, hexagonal, or octagonal, etc., and is not specifically limited here.

[0039] Optionally, a grinding support column 134 is connected to the second end face of the grinding head 130, and the grinding support column 134 is connected to the connecting column 113. In this embodiment, an annular mounting member 114 is provided at the end of the connecting column 113 near the grinding head 130, and spray holes 115 are formed on the annular mounting member 114. The grinding support column 134 is connected to the annular mounting member 114. The connection method includes, but is not limited to, using sleeve, snap-fit, flange connection, riveting, bonding or welding. The annular mounting member 114 and the connecting column 113 can be separately fixedly connected or integrally formed.

[0040] Optionally, the cross-section of the grinding support 134 can be circular, triangular, quadrilateral, pentagonal, hexagonal, or octagonal, etc., without specific limitations.

[0041] Optionally, a mounting part 112 is provided on the side of the mounting beam 111 away from the connecting column 113. The mounting part 112 is used to connect with the machine base, that is, the mounting beam 111 is connected to the machine base through the mounting part 112. The mounting part 112 can be a mounting boss or a mounting groove, etc., and is not specifically limited here.

[0042] It should be noted that during the operation of the polishing apparatus 100, the wafer and the polishing surface of the polishing head 130 need to come into contact and move relative to each other to achieve polishing and cleaning of the wafer surface. The relative movement between the polishing head 130 and the wafer can be as follows: the wafer remains stationary while the polishing head 130 moves; or the polishing head 130 remains stationary while the wafer moves; or both the polishing head 130 and the wafer move. Depending on the actual situation, if the polishing head 130 needs to move, a drive component capable of moving the polishing head 130 can be installed on the mounting beam 111.

[0043] This utility model embodiment also provides a grinding machine, including a machine base and the aforementioned grinding device 100, wherein the grinding device 100 is mounted on the machine base.

[0044] The working principle of the grinding device 100 provided in this embodiment of the utility model is as follows:

[0045] The grinding head 130 is designed as a conical grinding head 130, meaning that the outer peripheral surface 132 of the grinding head 130 is a conical surface. During grinding, the conical outer peripheral surface 132 can prevent grinding wastewater and organic matter from contaminating the edge of the grinding head 130, achieving rapid drainage. A drainage groove 133 is also designed to achieve rapid drainage of wastewater and organic matter, preventing grinding particles from getting stuck on the grinding head 130, thereby avoiding defects such as halos and spots on the ground wafer. A spray hole 115 is designed above the grinding head 130, which can be used to spray grinding chemicals, such as hydrofluoric acid or ammonia, to achieve chemical polishing of the wafer surface. Two or more grinding heads 130 are designed on the mounting beam 111, thereby achieving dual-head or multi-head grinding and improving grinding efficiency.

[0046] In summary, the grinding device 100 and grinding machine provided by this utility model have the following beneficial effects, including:

[0047] The grinding apparatus 100 provided in this embodiment of the present invention has a first end face 131 of the grinding head 130, which serves as the grinding surface that directly contacts the wafer surface. The area of ​​the first end face 131 is larger than the area of ​​the second end face. This arrangement facilitates the timely discharge of grinding waste liquid and contaminants, preventing contamination of the edges of the grinding head 130. The drainage groove 133 accelerates wastewater discharge, preventing grinding particles from getting stuck on the grinding head 130 and causing spots and halos on the wafer surface after grinding. This improves grinding quality, reduces the risk of wafer damage, helps prevent contamination of the edges of the grinding head 130, and extends the service life of the grinding head 130. By arranging multiple grinding heads 130 on a single mounting beam 111, grinding efficiency is improved.

[0048] The grinding machine provided in this embodiment of the present invention includes the grinding device 100 described above, which is beneficial to improving grinding quality, reducing the risk of wafer damage, preventing the edge of the grinding head 130 from being contaminated, and extending the service life of the grinding head 130.

[0049] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A grinding apparatus, characterized in that, include: Spray system components; The grinding head includes a first end face, a second end face, and an outer peripheral surface for connecting the first end face and the second end face, wherein the area of ​​the first end face is larger than the area of ​​the second end face, and the first end face serves as the grinding surface; the second end face is connected to the spray assembly; and the outer peripheral surface is provided with a drainage groove.

2. The grinding apparatus according to claim 1, characterized in that, The outer peripheral surface is a conical surface.

3. The grinding apparatus according to claim 1, characterized in that, The drainage channel extends from the second end face to the first end face.

4. The grinding apparatus according to claim 1, characterized in that, The drainage channel is designed in multiple ways; the multiple drainage channels are evenly spaced along the outer circumference.

5. The grinding apparatus according to claim 1, characterized in that, The spray assembly includes a mounting beam and a connecting column. One end of the connecting column is connected to the mounting beam, and the other end is connected to the grinding head. The end of the connecting column away from the mounting beam is provided with a spray hole.

6. The grinding apparatus according to claim 5, characterized in that, The connecting column has a cavity for the abrasive to flow through, and the spray hole communicates with the cavity.

7. The grinding apparatus according to claim 5, characterized in that, The mounting beam is provided with multiple connecting posts, and each connecting post is connected to a grinding head.

8. The grinding apparatus according to claim 5, characterized in that, The mounting beam has a mounting section on the side away from the connecting column.

9. The grinding apparatus according to claim 5, characterized in that, The second end face of the grinding head is connected to a grinding support column, and the grinding support column is connected to the connecting column.

10. A grinding machine, characterized in that, It includes a machine base and a grinding apparatus according to any one of claims 1 to 9, wherein the grinding apparatus is mounted on the machine base.

Images