Mortar temperature control device and multi-wire cutting system

Abstract

The utility model provides a mortar temperature control device and a multi-wire cutting system, and belongs to the technical field of semiconductor manufacturing. The mortar temperature control device comprises a mortar tank configured to provide mortar; the heat exchanger comprises a first mortar inlet and a second mortar outlet, the first mortar inlet is connected with the mortar tank, the second mortar outlet is connected with the mortar tank, and the heat exchanger is configured to cool mortar entering the heat exchanger; and the mortar nozzle is configured to spray mortar to the cutting steel wire and comprises a second mortar inlet connected with the mortar tank. The problem that the temperature of mortar is unstable in the cutting process can be solved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a slurry temperature control device and a multi-wire cutting system. Background Technology

[0002] Silicon wafers, a crucial raw material in the semiconductor industry, are currently a scarce resource in the domestic market. Generally, silicon wafers are obtained by multi-wire dicing of crystal ingots followed by grinding and polishing. The slurry is a vital material in the dicing process. In wire dicing equipment, the slurry adheres to steel wires, which then drive the SiC particles in the slurry to grind and cut the silicon ingot, ultimately yielding a silicon wafer with good thickness and flatness parameters (bending, warping, and overall thickness deviation). The crystal ingot generates a significant amount of heat during dicing, which is dissipated by the slurry to prevent excessive heat from causing severe deformation of the silicon wafer.

[0003] Currently, the temperature of the mortar is automatically controlled by the wire cutting machine. The system monitors the mortar temperature in real time through a temperature sensor. The mortar undergoes temperature regulation through the heat exchanger of the wire cutting machine's temperature control system. However, existing technologies suffer from mortar temperature fluctuations, which affect the quality of silicon wafers. Utility Model Content

[0004] To address the aforementioned technical problems, this utility model provides a mortar temperature control device and a multi-wire cutting system, which can improve the problem of unstable mortar temperature during the cutting process.

[0005] To achieve the above objectives, the technical solution adopted in this utility model embodiment is as follows:

[0006] A mortar temperature control device, comprising:

[0007] A mortar tank is configured to supply mortar;

[0008] A heat exchanger includes a first mortar inlet connected to the mortar tank and a second mortar outlet connected to the mortar tank, the heat exchanger being configured to cool the mortar entering the heat exchanger;

[0009] A mortar nozzle is configured to spray mortar onto the cutting wire and includes a second mortar inlet connected to the mortar tank.

[0010] In some embodiments, a mortar cooling pump is provided on the mortar cooling pipe between the first mortar inlet of the heat exchanger and the mortar tank. The mortar cooling pump is configured to draw mortar from the mortar tank and deliver it to the heat exchanger through the mortar cooling pipe.

[0011] In some embodiments, a mortar supply pump is provided on the mortar output pipe between the second mortar inlet of the mortar nozzle and the mortar tank. The mortar supply pump is configured to draw mortar from the mortar tank and deliver it to the mortar nozzle through the mortar output pipe.

[0012] In some embodiments, it also includes:

[0013] A chiller is configured to provide cooling water; the heat exchanger includes a cooling water inlet and a cooling water outlet connected to the chiller, and a flow control valve is provided on the cooling water input pipe between the chiller and the heat exchanger; a first temperature sensor is provided on the mortar cooling pipe between the first mortar inlet of the heat exchanger and the mortar tank.

[0014] The temperature control structure is configured to control the opening degree of the flow control valve based on the mortar temperature information transmitted by the first temperature sensor.

[0015] In some embodiments, it also includes:

[0016] A mortar recycling structure is provided between the mortar nozzle and the mortar tank. The mortar recycling structure includes a mortar recycling pipe connected to the mortar tank, and a second temperature sensor is provided on the mortar recycling pipe.

[0017] The temperature control structure is configured to control the opening degree of the flow control valve based on the temperature information transmitted by the first temperature sensor and the second temperature sensor.

[0018] In some embodiments, a filter structure is provided between the mortar tank and the heat exchanger.

[0019] In some embodiments, a flow meter is installed on the mortar output pipe between the mortar tank and the mortar nozzle.

[0020] In some embodiments, the temperature control structure includes a PC and a controller connected by a signal, the input of the controller being connected to the first temperature sensor, the output of the controller being connected to the flow control valve, and the PC being configured to input control commands to the controller via a human-machine interface.

[0021] This utility model embodiment also provides a multi-wire cutting system, including the above-mentioned mortar temperature control device.

[0022] The beneficial effects of this utility model are:

[0023] In this embodiment, mortar is transferred to a heat exchanger for cooling through a first mortar inlet, and then transferred to a mortar nozzle through a second mortar inlet. The first and second mortar inlets are independent of each other. After the heat exchanger cools the mortar, the cooled mortar enters the mortar tank and is then delivered to the mortar nozzle. This provides the mortar nozzle with a stable temperature, thereby improving the problem of unstable mortar temperature during the cutting process and resulting in silicon wafers with more stable warpage. Attached Figure Description

[0024] Figure 1 A schematic diagram showing the structure of an existing mortar temperature control device;

[0025] Figure 2 This is a schematic diagram showing the structure of the mortar temperature control device according to an embodiment of the present invention.

[0026] Figure 3 A schematic diagram illustrating the temperature fluctuations of existing mortar;

[0027] Figure 4 This is a schematic diagram illustrating the temperature fluctuation of mortar in an embodiment of the present invention.

[0028] Figure Labels

[0029] 1 mortar tank

[0030] 2 Mortar Cooling Pumps

[0031] 3 Mortar Supply Pump

[0032] 4 heat exchangers

[0033] 5 mortar nozzles

[0034] 6 First Temperature Sensor

[0035] 7 Flowmeter

[0036] 8 Second temperature sensor

[0037] 9. Mortar cooling pipes

[0038] 10. Mortar output pipe

[0039] 11 Mortar recycling pipeline Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model are within the protection scope of this utility model.

[0041] Figure 1 This is a schematic diagram of the structure of an existing mortar temperature control device, such as... Figure 1 As shown, the mortar in mortar tank 1 is supplied to heat exchanger 4 via mortar cooling pump 2 and then directly delivered to mortar nozzle 5. supply The mortar temperature fluctuates greatly, which is detrimental to the stability of the cutting process.

[0042] This invention provides a mortar temperature control device and a multi-wire cutting system, which can improve the problem of unstable mortar temperature during the cutting process.

[0043] This utility model embodiment provides a mortar temperature control device, such as... Figure 2 As shown, it includes:

[0044] Mortar tank 1 is configured to supply mortar;

[0045] The heat exchanger 4 includes a first mortar inlet connected to the mortar tank 1 and a second mortar outlet connected to the mortar tank 1, and the heat exchanger 4 is configured to cool the mortar entering the heat exchanger 4.

[0046] The mortar nozzle 5 is configured to spray mortar onto the cutting steel wire and includes a second mortar inlet connected to the mortar tank 1.

[0047] In this embodiment, mortar is transferred to heat exchanger 4 for cooling through the first mortar inlet, and mortar is transferred to mortar nozzle 5 through the second mortar inlet. The first mortar inlet and the second mortar inlet are independent of each other. After the heat exchanger 4 cools the mortar, the cooled mortar enters mortar tank 1 and is then transported to mortar nozzle 5. This can provide mortar with a stable temperature to mortar nozzle 5, thereby improving the problem of unstable mortar temperature during the cutting process, and thus obtaining silicon wafers with more stable warpage.

[0048] like Figure 1 As shown, in some embodiments, a mortar cooling pump 2 is installed on the mortar cooling pipe 9 between the first mortar inlet of the heat exchanger 4 and the mortar tank 1. The mortar cooling pump 2 is configured to draw mortar from the mortar tank 1 and deliver it to the heat exchanger 4 through the mortar cooling pipe 9. A mortar supply pump 3 is installed on the mortar output pipe 10 between the second mortar inlet of the mortar nozzle 5 and the mortar tank 1. The mortar supply pump 3 is configured to draw mortar from the mortar tank 1 and deliver it to the mortar nozzle 5 through the mortar output pipe 10.

[0049] In this embodiment, the mortar output pipe 10 and the mortar cooling pipe 9 are independent of each other. After cooling, the mortar enters the mortar tank 1 and is then transported to the mortar nozzle 5. This can provide the mortar nozzle 5 with a stable temperature, thereby improving the problem of unstable mortar temperature during the cutting process and thus obtaining a silicon wafer with more stable warpage.

[0050] In some embodiments, the mortar temperature control device further includes:

[0051] A chiller is configured to provide cooling water; the heat exchanger 4 includes a cooling water inlet and a cooling water outlet connected to the chiller, and a flow control valve is provided on the cooling water input pipe between the chiller and the heat exchanger 4; a first temperature sensor 6 is provided on the mortar cooling pipe 9 between the first mortar inlet of the heat exchanger 4 and the mortar tank 1.

[0052] The temperature control structure is configured to control the opening degree of the flow control valve based on the mortar temperature information transmitted by the first temperature sensor 6.

[0053] The working principle of a semiconductor multi-wire dicing machine is as follows: A cutting steel wire, driven by a grooved wheel, reciprocates, and the steel wire, carrying slurry, cuts the crystal rod. Due to the repeated friction between the steel wire and the crystal rod, the slurry is needed to cool the steel wire and remove the heat generated during cutting. Simultaneously, the slurry also lubricates the crystal rod to improve the cutting quality. Therefore, to ensure the reliability of the multi-wire dicing machine, the slurry temperature must be controlled. The slurry temperature is controlled by a slurry temperature control device, which includes the heat exchanger 4 and the first temperature sensor 6. The temperature control structure controls the opening of the flow control valve based on the slurry temperature information transmitted by the first temperature sensor 6, thereby controlling the flow rate of cooling water entering the heat exchanger 4. In other words, the slurry temperature control device regulates the slurry temperature using low-temperature cooling water, ensuring temperature stability, avoiding temperature fluctuations, and improving the quality of the cut product. Specifically, when the mortar temperature information transmitted by the first temperature sensor 6 indicates that the mortar temperature is greater than the threshold, the opening of the flow control valve can be increased; when the mortar temperature information transmitted by the first temperature sensor 6 indicates that the mortar temperature is less than the threshold, the opening of the flow control valve can be decreased.

[0054] In some embodiments, the mortar temperature control device further includes:

[0055] A mortar recycling structure is provided between the mortar nozzle 5 and the mortar tank 1. The mortar recycling structure includes a mortar recycling pipe 11 connected to the mortar tank 1, and a second temperature sensor 8 is provided on the mortar recycling pipe 11.

[0056] The temperature control structure is configured to control the opening degree of the flow control valve based on the temperature information transmitted by the first temperature sensor 6 and the second temperature sensor 8.

[0057] During multi-wire cutting, the temperature generated by the cutting is uncontrollable, that is, the heat carried away by the mortar is uncontrollable. By setting the second temperature sensor 8, the temperature information of the mortar entering the heat exchanger 4 can be obtained. Thus, combined with the temperature information of the mortar obtained by the first temperature sensor 6, the valve opening of the flow control valve can be controlled, which can improve the accuracy and efficiency of mortar temperature control.

[0058] In some embodiments, a filter structure is provided between the mortar tank 1 and the heat exchanger 4. This filter structure removes impurities from the mortar, allowing the mortar to smoothly enter the heat exchanger 4.

[0059] In some embodiments, a flow meter 7 is provided on the mortar output pipe 10 between the mortar tank 1 and the mortar nozzle 5, and the spray volume of the mortar nozzle 5 can be controlled by the flow meter 7.

[0060] In some embodiments, the temperature control structure includes a PC and a controller connected by a signal, the input of the controller being connected to the first temperature sensor 6, the output of the controller being connected to the flow control valve, and the PC being configured to input control commands to the controller through a human-machine interface.

[0061] Figure 3 A schematic diagram illustrating the temperature fluctuations of existing mortar. Figure 4 This diagram illustrates the temperature fluctuation of the mortar in this embodiment of the invention. The horizontal axis represents the coordinates of multiple test points on the mortar output pipe 10, and the vertical axis represents the difference between the temperature of the mortar sprayed from the mortar nozzle 5 and the target mortar temperature (e.g., 23°C), in degrees Celsius. As can be seen, this embodiment can reduce the temperature difference between the mortar sprayed from the mortar nozzle 5 and the target mortar temperature to below 0.3 degrees Celsius, which can effectively improve the problem of unstable mortar temperature during the cutting process and help to obtain silicon wafers with more stable warpage.

[0062] This utility model embodiment also provides a multi-wire cutting system, including the above-mentioned mortar temperature control device.

[0063] It should be noted that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, since the embodiments are basically similar to the product embodiments, the descriptions are relatively simple, and the relevant parts can be referred to the descriptions of the product embodiments.

[0064] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0065] It is understandable that when a component such as a layer, film, region, or substrate is referred to as being "above" or "below" another component, the component may be "directly" located "above" or "below" the other component, or there may be intermediate components present.

[0066] In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0067] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A mortar temperature control device, characterized in that, include: Mortar tanks are configured to supply mortar; A heat exchanger includes a first mortar inlet connected to the mortar tank and a second mortar outlet connected to the mortar tank, the heat exchanger being configured to cool the mortar entering the heat exchanger; A mortar nozzle is configured to spray mortar onto the cutting wire and includes a second mortar inlet connected to the mortar tank.

2. The mortar temperature control device according to claim 1, characterized in that, A mortar cooling pump is installed on the mortar cooling pipe between the first mortar inlet of the heat exchanger and the mortar tank. The mortar cooling pump is configured to extract mortar from the mortar tank and deliver it to the heat exchanger through the mortar cooling pipe.

3. The mortar temperature control device according to claim 1, characterized in that, A mortar supply pump is provided on the mortar output pipe between the second mortar inlet of the mortar nozzle and the mortar tank. The mortar supply pump is configured to draw mortar from the mortar tank and deliver it to the mortar nozzle through the mortar output pipe.

4. The mortar temperature control device according to claim 1, characterized in that, Also includes: A chiller is configured to provide cooling water; the heat exchanger includes a cooling water inlet and a cooling water outlet connected to the chiller, and a flow control valve is provided on the cooling water input pipe between the chiller and the heat exchanger; a first temperature sensor is provided on the mortar cooling pipe between the first mortar inlet of the heat exchanger and the mortar tank. The temperature control structure is configured to control the opening degree of the flow control valve based on the mortar temperature information transmitted by the first temperature sensor.

5. The mortar temperature control device according to claim 4, characterized in that, Also includes: A mortar recycling structure is provided between the mortar nozzle and the mortar tank. The mortar recycling structure includes a mortar recycling pipe connected to the mortar tank, and a second temperature sensor is provided on the mortar recycling pipe. The temperature control structure is configured to control the opening degree of the flow control valve based on the temperature information transmitted by the first temperature sensor and the second temperature sensor.

6. The mortar temperature control device according to claim 1, characterized in that, A filter structure is provided between the mortar tank and the heat exchanger.

7. The mortar temperature control device according to claim 1, characterized in that, A flow meter is installed on the mortar output pipe between the mortar tank and the mortar nozzle.

8. The mortar temperature control device according to claim 4, characterized in that, The temperature control structure includes a PC and a controller connected by a signal. The input terminal of the controller is connected to the first temperature sensor, and the output terminal of the controller is connected to the flow control valve. The PC is configured to input control commands to the controller through a human-machine interface.

9. A multi-wire cutting system, characterized in that, Includes the mortar temperature control device according to any one of claims 1-8.

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