Printed circuit board and printed circuit board packaging structure

Abstract

The utility model relates to a printed circuit board and a printed circuit board packaging structure, the printed circuit board comprises a substrate, the substrate comprises a first surface, the first surface is provided with a first ink layer and a first support bulge at an interval, and the thickness of the first ink layer is consistent with the height of the first support bulge; the first ink layer and the first supporting protrusions are used for jointly supporting another printed circuit board or jointly supporting the substrate. The printed circuit board can be placed on the horizontal plane through the first supporting protrusions and the water surface of the first ink layer, and due to the fact that the first supporting protrusions can support the area, not provided with the first ink layer, of the substrate, when the substrate is horizontally placed, the situation that the substrate is locally suspended can be avoided. Therefore, when the printed circuit boards are packaged and transported in an up-and-down lamination mode, the first supporting protrusions and the first ink layers between every two adjacent substrates can ensure that the substrates are horizontal, and therefore the warping problem caused by unevenness between the printed circuit boards is avoided.

Description

Technical Field

[0001] This application relates to the field of printed circuit board technology, and in particular to a circuit board and a circuit board packaging structure. Background Technology

[0002] Printed Circuit Boards (PCBs) are important electronic components, serving as the support for electronic components and the carrier for their electrical connections. With the booming development of the electronics industry, PCBs are increasingly used in high-power applications, which necessitates that PCBs have excellent heat dissipation performance to ensure that the performance of each electronic component is not affected by high heat.

[0003] Printing thermal ink on PCBs is one of the effective ways to improve their heat dissipation performance. However, when packaging and transporting the PCBs in a stacked manner, the PCBs may warp. Utility Model Content

[0004] Therefore, it is necessary to provide a printed circuit board and a printed circuit board packaging structure to address the above problems. This printed circuit board can effectively avoid PCB board warping caused during packaging and transportation.

[0005] The technical solution is as follows:

[0006] On one hand, this application provides a printed circuit board, including:

[0007] The substrate includes a first surface, on which a first ink layer and a first support protrusion are disposed at intervals. The thickness of the first ink layer is the same as the height of the first support protrusion. The first ink layer and the first support protrusion are used to jointly support another printed circuit board or to jointly support the substrate.

[0008] In the aforementioned printed circuit board, since both the first ink layer and the first support protrusion are disposed on the first surface, and the thickness of the first ink layer is the same as the height of the first support protrusion, when the printed circuit board is placed on a horizontal support plane with the first surface as its bottom, the first support protrusion and the first ink layer can support the substrate on the same horizontal plane. Furthermore, because the first support protrusion and the first ink layer are spaced apart, when the substrate is placed on a horizontal surface, the first support protrusion can support areas of the substrate without the first ink layer, thereby preventing localized suspension of the substrate. This improves the stability of the printed circuit board when placed flat. Therefore, when packaging and transporting printed circuit boards using a stacked configuration, the first support protrusion and the first ink layer between two adjacent substrates can jointly support their corresponding substrates or the substrate of another printed circuit board. This not only ensures that adjacent substrates remain parallel with equal spacing but also prevents the board from tilting due to localized suspension, thus ensuring the printed circuit board remains horizontal and avoiding warping caused by unevenness between printed circuit boards.

[0009] The technical solution will be further explained below:

[0010] In one embodiment, the substrate further includes a second surface disposed opposite to the first surface, and the second surface is provided with a second ink layer and a second support protrusion at intervals, wherein the thickness of the second ink layer is the same as the height of the second support protrusion;

[0011] Wherein, in the thickness direction of the substrate, the first support protrusion, the first ink layer, the second support protrusion, and the second ink layer are all staggered; or,

[0012] In the thickness direction of the substrate, at least a portion of the projection of the first ink layer overlaps with at least a portion of the projection of the second ink layer, and the projection of the first support protrusion overlaps with the projection of the second support protrusion; or,

[0013] In the thickness direction of the substrate, at least a portion of the projection of the first ink layer overlaps with at least a portion of the projection of the second ink layer, and the projection of the first ink layer covers the projection of the second support protrusion, and the projection of the second ink layer covers the projection of the first support protrusion.

[0014] In one embodiment, there are multiple first support protrusions, and the multiple first support protrusions are spaced apart.

[0015] In one embodiment, the substrate further includes a second surface disposed opposite to the first surface, the second surface being provided with a second ink layer and a plurality of second support protrusions at intervals, the thickness of the second ink layer being consistent with the height of each of the second support protrusions;

[0016] Wherein, in the thickness direction of the substrate, the projection of the second ink layer covers at least a portion of the projection of the first ink layer and the projection of at least one of the first support protrusions, and the projections of the remaining first support protrusions overlap with the projections of the plurality of second support protrusions in a one-to-one correspondence; or,

[0017] In the thickness direction of the substrate, the projection of the first ink layer covers at least a portion of the projection of the second ink layer and the projection of at least one of the second support protrusions, and the projections of the remaining second support protrusions overlap with the projections of the plurality of first support protrusions in a one-to-one correspondence; or,

[0018] In the thickness direction of the substrate, at least a portion of the projection of the first ink layer overlaps with at least a portion of the projection of the second ink layer, and the projection of the second ink layer covers the projection of at least one of the first support protrusions, the projection of the first ink layer covers the projection of at least one of the second support protrusions, and the projections of the remaining second support protrusions are arranged opposite to the projections of the remaining first support protrusions in a one-to-one correspondence.

[0019] In one embodiment, the first ink layer is a heat-dissipating ink layer; and / or, the first support protrusion is a heat-dissipating ink protrusion.

[0020] In one embodiment, the thickness of the first ink layer is between 125 μm and 150 μm.

[0021] In one embodiment, the second ink layer is a heat-dissipating ink layer; and / or, the second support protrusion is a heat-dissipating ink protrusion.

[0022] In one embodiment, the thickness of the second ink layer is between 125 μm and 150 μm.

[0023] On the other hand, this application also provides a printed circuit board packaging structure, including a partition and a plurality of the above-mentioned printed circuit boards, wherein the plurality of printed circuit boards are stacked sequentially along the thickness direction of the printed circuit boards, and the first surface of all the printed circuit boards faces the same side, and a partition is provided between each pair of adjacent printed circuit boards.

[0024] In the aforementioned printed circuit board (PCB) packaging structure, since both the first ink layer and the first support protrusion are disposed on the first surface, and the thickness of the first ink layer is the same as the height of the first support protrusion, when the PCB is placed on a horizontal support plane with the first surface as its bottom, the first support protrusion and the first ink layer can support the substrate on the same horizontal plane. Furthermore, because the first support protrusion and the first ink layer are spaced apart, when the substrate is placed on a horizontal surface, the first support protrusion can support areas of the substrate without the first ink layer, thus preventing localized suspension of the substrate. This improves the stability of the PCB when placed flat. Therefore, in this PCB packaging structure, the first support protrusion and the first ink layer between two adjacent substrates can jointly support their corresponding substrates or the substrate of another PCB. This not only keeps the two adjacent substrates parallel with equal spacing but also prevents the substrate from tilting due to localized suspension, thus ensuring the PCB remains horizontal and avoiding warping caused by unevenness between PCBs, thereby improving product yield. In addition, since there is a paper separator between two adjacent printed circuit boards, the paper separator can prevent the ink layer from being scratched due to direct contact between the panels, which helps to reduce the scrap rate of the products.

[0025] In one embodiment, the partition is sulfur-free paper or adhesive paper. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a printed circuit board in one embodiment.

[0027] Figure 2 This is a cross-sectional view of a printed circuit board packaging structure in one embodiment.

[0028] Figure 3 This is a cross-sectional view of a printed circuit board packaging structure in another embodiment.

[0029] Figure 4 This is a cross-sectional view of a printed circuit board packaging structure in another embodiment.

[0030] Figure 5 This is a cross-sectional view of a printed circuit board packaging structure in another embodiment.

[0031] Figure 6 This is a schematic diagram of the structure of a printed circuit board in another embodiment.

[0032] Figure 7 This is a cross-sectional view of a printed circuit board packaging structure in another embodiment.

[0033] Figure 8This is a cross-sectional view of a printed circuit board packaging structure in another embodiment.

[0034] Figure 9 This is a cross-sectional view of a printed circuit board packaging structure in another embodiment.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100. Printed circuit board packaging structure; 10. Printed circuit board; 1. Substrate; 11. First surface; 12. Second surface; 2. First support protrusion; 3. First ink layer; 4. Second support protrusion; 5. Second ink layer; S1. Thickness direction. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0043] See Figure 1 and Figure 2 An embodiment of this application provides a printed circuit board 10, including a substrate 1. The substrate 1 includes a first surface 11. The first surface 11 is provided with a first ink layer 3 and a first support protrusion 2 at intervals. The thickness of the first ink layer 3 is the same as the height of the first support protrusion 2. The first ink layer 3 and the first support protrusion 2 are used to jointly support another printed circuit board 10 or to jointly support the substrate 1.

[0044] In the aforementioned printed circuit board 10, since both the first ink layer 3 and the first support protrusion 2 are disposed on the first surface 11, and the thickness of the first ink layer 3 is the same as the height of the first support protrusion 2, when the printed circuit board 10 is placed on a horizontal support plane with the first surface 11 as its bottom surface, the first support protrusion 2 and the first ink layer 3 can support the substrate 1 on the same horizontal plane. Furthermore, since the first support protrusion 2 and the first ink layer 3 are spaced apart, when the substrate 1 is placed on a horizontal surface, the first support protrusion 2 can support areas of the substrate 1 where the first ink layer 3 is not disposed, thereby preventing localized suspension of the substrate. This improves the stability of the printed circuit board 10 when placed flat. Therefore, when the printed circuit board 10 is packaged and transported by stacking the upper and lower boards, the first support protrusion 2 and the first ink layer 3 between two adjacent substrates 1 can jointly support their corresponding substrate 1 or the substrate 1 of another printed circuit board 10. This not only keeps the two adjacent substrates 1 in a parallel state with equal spacing, but also avoids the substrate 1 from tilting due to partial suspension. This helps to ensure that the printed circuit board 10 is in a horizontal state, avoids the problem of warping of the printed circuit board 10 caused by unevenness between printed circuit boards 10, improves product yield, and also avoids scratching the ink layer.

[0045] In illustrative terms, in order to ensure that the setting of the first support protrusion 2 does not affect the function of the printed circuit board 10, the first support protrusion 2 can be set in the non-functional area of ​​the printed circuit board 10, such as at the connection position or non-soldering position of the printed circuit board 10.

[0046] Indicatively, the shape of the first support protrusion 2 can be designed as needed. For example, the first support protrusion 2 can be a linear structure or a columnar structure.

[0047] In one embodiment, combined Figure 3As shown, the substrate 1 also includes a second surface 12, which is disposed opposite to the first surface 11. The second surface 12 is provided with a second ink layer 5 and a second support protrusion 4 at intervals. The thickness of the second ink layer 5 is the same as the height of the second support protrusion 4. In the thickness direction S1 of the substrate 1, the first support protrusion 2, the first ink layer 3, the second support protrusion 4, and the second ink layer 5 are all staggered. Thus, when both sides of the substrate 1 are provided with ink layers, and the printed circuit board 10 is packaged and transported using a stacked configuration, the staggered arrangement of the first support protrusion 2, the second support protrusion 4, the first ink layer 3, and the second ink layer 5 between the opposing first surface 11 and second surface 12 ensures that the lower printed circuit board 10 can horizontally support the upper printed circuit board 10, thus ensuring the horizontal spacing between adjacent substrates 1 and guaranteeing the flatness of adjacent printed circuit boards 10, preventing warping between printed circuit boards 10 due to unevenness.

[0048] Indicatively, when the first support protrusion 2, the first ink layer 3, the second support protrusion 4, and the second ink layer 5 are all staggered, the distance between two adjacent substrates 1 is equal to the thickness of the larger of the first ink layer 3 and the second ink layer 5.

[0049] In another embodiment, combined with Figure 4 As shown, the substrate 1 further includes a second surface 12, which is disposed opposite to the first surface 11. The second surface 12 is provided with a second ink layer 5 and a second support protrusion 4 spaced apart. The thickness of the second ink layer 5 is the same as the height of the second support protrusion 4. In the thickness direction S1 of the substrate 1, at least a portion of the projection of the first ink layer 3 overlaps with at least a portion of the projection of the second ink layer 5, and the projection of the first support protrusion 2 overlaps with the projection of the second support protrusion 4. Thus, when ink layers are provided on both sides of the substrate 1, and the printed circuit board 10 is packaged and transported using a stacked configuration, adjacent substrates 1 can remain flat due to the contact between the first ink layer 3 and the second ink layer 5, and the contact between the first support protrusion 2 and the second support protrusion 4. Furthermore, the distance between adjacent substrates 1 is equal to the sum of the thickness of the first ink layer 3 and the thickness of the second ink layer 5, thereby preventing warping of the printed circuit board 10.

[0050] In another embodiment, combined with Figure 5As shown, the substrate 1 further includes a second surface 12, which is disposed opposite to the first surface 11. The second surface 12 is provided with a second ink layer 5 and a second support protrusion 4 spaced apart. The thickness of the second ink layer 5 is the same as the height of the second support protrusion 4. In the thickness direction S1 of the substrate 1, at least a portion of the projection of the first ink layer 3 overlaps with at least a portion of the projection of the second ink layer 5, and the projection of the first ink layer 3 covers the projection of the second support protrusion 4, while the projection of the second ink layer 5 covers the projection of the first support protrusion 2. Thus, when ink layers are provided on both sides of the substrate 1, and the printed circuit board 10 is packaged and transported using a stacked configuration, adjacent substrates 1 can remain flat due to the contact between the first ink layer 3 and the second support protrusion 4, and the contact between the first support protrusion 2 and the second ink layer 5. Furthermore, the distance between adjacent substrates 1 is equal to the sum of the thickness of the first ink layer 3 and the thickness of the second ink layer 5, thereby preventing warping of the printed circuit board 10.

[0051] In one embodiment, combined Figure 6 As shown, there are multiple first support protrusions 2, which are spaced apart. This helps improve the stability of the printed circuit board 10 when placed horizontally, and also helps ensure the flatness of the printed circuit board 10 during packaging and transportation.

[0052] Indicatively, the position of the first support protrusion 2 can be designed according to actual needs, as long as the first support protrusion 2 can support the substrate 1 to be placed horizontally together with the first ink layer 3. For example, when the first ink layer 3 is located in the middle of the first surface 11, multiple first support protrusions 2 can be arranged at intervals on the outer periphery of the first ink layer 3; or, when the first ink layer 3 is located at one corner of the first surface 11, multiple first support protrusions 2 can be arranged at intervals on the other three corners of the first surface 11.

[0053] Furthermore, in one embodiment, combined with such Figures 3 to 5As shown, the substrate 1 further includes a second surface 12, which is disposed opposite to the first surface 11. The second surface 12 is provided with a second ink layer 5 and a plurality of second support protrusions 4 spaced apart. The thickness of the second ink layer 5 is the same as the height of the second support protrusions 4. In the thickness direction S1 of the substrate 1, the first support protrusions 2, the first ink layer 3, the second support protrusions 4, and the second ink layer 5 are all staggered; or, at least a portion of the projection of the first ink layer 3 overlaps with at least a portion of the projection of the second ink layer 5, and the projections of the first support protrusions 2 and 4 overlap one-to-one; or, at least a portion of the projection of the first ink layer 3 overlaps with at least a portion of the projection of the second ink layer 5, the projection of the first ink layer 3 covers the projections of the plurality of second support protrusions 4, and the projection of the second ink layer 5 covers the projections of the plurality of first support protrusions 2. This helps to ensure the flatness between printed circuit boards 10 during packaging and transportation, and helps to reduce the probability of warping of the printed circuit boards 10.

[0054] In another embodiment, combined with Figure 7 As shown, the substrate 1 further includes a second surface 12, which is disposed opposite to the first surface 11. The second surface 12 is provided with a second ink layer 5 and a plurality of second support protrusions 4 spaced apart. The thickness of the second ink layer 5 is the same as the height of each second support protrusion 4. In the thickness direction S1 of the substrate 1, the projection of the second ink layer 5 covers at least a portion of the projection of the first ink layer 3 and the projection of at least one first support protrusion 2. The projections of the remaining first support protrusions 2 overlap with the projections of the plurality of second support protrusions 4 in a one-to-one correspondence. Thus, when the printed circuit board 10 is packaged and transported using a stacked configuration, adjacent substrates 1 can remain flat under the support of the first ink layer 3, the second support protrusions 4, the first support protrusions 2, and the second ink layer 5. Furthermore, the distance between adjacent substrates 1 is equal to the sum of the thickness of the first ink layer 3 and the thickness of the second ink layer 5, thereby preventing warping of the printed circuit board 10.

[0055] In another embodiment, combined with Figure 8As shown, the substrate 1 further includes a second surface 12, which is disposed opposite to the first surface 11. The second surface 12 is provided with a second ink layer 5 and a plurality of second support protrusions 4 spaced apart. The thickness of the second ink layer 5 is the same as the height of each second support protrusion 4. In the thickness direction S1 of the substrate 1, the projection of the first ink layer 3 covers at least a portion of the projection of the second ink layer 5 and the projection of at least one second support protrusion 4. The projections of the remaining second support protrusions 4 overlap with the projections of the plurality of first support protrusions 2 in a one-to-one correspondence. Thus, when the printed circuit board 10 is packaged and transported using a stacked configuration, the distance between two adjacent substrates 1 is equal to the sum of the thickness of the first ink layer 3 and the thickness of the second ink layer 5. Furthermore, the two adjacent substrates 1 can remain flat under the support of the first ink layer 3, the second support protrusions 4, the first support protrusions 2, and the second ink layer 5, thereby preventing warping of the printed circuit board 10.

[0056] In another embodiment, combined with Figure 9 As shown, the substrate 1 further includes a second surface 12, which is disposed opposite to the first surface 11. The second surface 12 is provided with a second ink layer 5 and a plurality of second support protrusions 4 spaced apart. The thickness of the second ink layer 5 is the same as the height of each second support protrusion 4. Specifically, in the thickness direction S1 of the substrate 1, at least a portion of the projection of the first ink layer 3 overlaps with at least a portion of the projection of the second ink layer 5, and the projection of the second ink layer 5 covers the projection of at least one first support protrusion 2. The projection of the first ink layer 3 covers the projection of at least one second support protrusion 4, and the projections of the remaining second support protrusions 4 overlap with the projections of the remaining first support protrusions 2 in a one-to-one correspondence. Thus, when the printed circuit board 10 is packaged and transported using a stacked configuration, the distance between two adjacent substrates 1 is equal to the sum of the thickness of the first ink layer 3 and the thickness of the second ink layer 5. Furthermore, the two adjacent substrates 1 can remain flat under the support of the first ink layer 3, the second support protrusions 4, the first support protrusions 2, and the second ink layer 5, thereby preventing warping of the printed circuit board 10.

[0057] Furthermore, the first ink layer 3 is a heat-dissipating ink layer. Thus, the first ink layer 3 can be formed by screen printing heat-dissipating ink. Since heat-dissipating ink has excellent heat dissipation properties, the heat-dissipating ink layer can dissipate the heat transferred from electronic components to the substrate 1, thereby improving the heat dissipation capacity and efficiency of the printed circuit board 10.

[0058] Furthermore, the first support protrusion 2 is a heat-dissipating ink protrusion. Thus, the first support protrusion 2 can be formed by screen printing heat-dissipating ink, allowing it to be formed in the same process as the first ink layer 3. This improves production efficiency and reduces production costs.

[0059] Optionally, the first support protrusion 2 is a columnar structure, and the outer perimeter of the first support protrusion 2 decreases from one end near the first surface 11 to the other end. Optionally, the cross-section of the first support protrusion 2 can be circular or rectangular.

[0060] Furthermore, the thickness of the first ink layer 3 is between 125μm and 150μm. Thus, when the first ink layer 3 is a heat-dissipating ink layer, it can effectively absorb and dissipate the heat from the substrate 1, thereby ensuring the heat dissipation effect of the printed circuit board 10.

[0061] Furthermore, the second ink layer 5 is a heat-dissipating ink layer. Thus, the second ink layer 5 can also be formed by screen printing heat-dissipating ink, so that the first ink layer 3 and the second ink layer 5 can simultaneously dissipate heat from the substrate 1, thereby improving the heat dissipation efficiency and heat dissipation capacity of the printed circuit board 10 and ensuring that the circuit components carried on the printed circuit board 10 are not affected by high heat.

[0062] Furthermore, the second support protrusion 4 is a heat-dissipating ink protrusion. Thus, the second support protrusion 4 can also be formed by screen printing heat-dissipating ink, allowing the second support protrusion 4 to be formed in the same process as the second ink layer 5, which helps to improve production efficiency and reduce production costs.

[0063] Optionally, the second support protrusion 4 is a columnar structure, and the outer perimeter of the second support protrusion 4 decreases from one end near the first surface 11 to the other end. Optionally, the cross-section of the second support protrusion 4 can be circular or rectangular.

[0064] Furthermore, the thickness of the second ink layer 5 is between 125 μm and 150 μm. Thus, when the second ink layer 5 is a heat-dissipating ink layer, it can effectively absorb and dissipate the heat from the substrate 1, thereby ensuring the heat dissipation effect of the printed circuit board 10.

[0065] Combination Figure 1 and Figure 2 As shown, this application also provides a printed circuit board packaging structure 100, including a partition (not shown) and a plurality of printed circuit boards 10 of any of the above embodiments. The plurality of printed circuit boards 10 are stacked sequentially along the thickness direction S1 of the printed circuit boards 10, and the first surface 11 of all printed circuit boards 10 faces the same side. A partition is provided between each pair of adjacent printed circuit boards 10.

[0066] In the aforementioned printed circuit board packaging structure 100, since both the first ink layer 3 and the first support protrusion 2 are disposed on the first surface 11, and the thickness of the first ink layer 3 is the same as the height of the first support protrusion 2, when the printed circuit board 10 is placed on a horizontal support plane with the first surface 11 as its bottom surface, the first support protrusion 2 and the first ink layer 3 can support the substrate 1 on the same horizontal plane. Furthermore, since the first support protrusion 2 and the first ink layer 3 are spaced apart, when the substrate 1 is placed on a horizontal surface, the first support protrusion 2 can support areas of the substrate 1 where the first ink layer 3 is not disposed, thereby preventing the substrate 1 from being partially suspended. This improves the stability of the printed circuit board 10 when placed flat. Therefore, in this printed circuit board packaging structure, the first support protrusion 2 and the first ink layer 3 between two adjacent substrates 1 can jointly support their corresponding substrate 1 or the substrate 1 of another printed circuit board 10. This not only keeps the two adjacent substrates 1 in a parallel state with equal spacing, but also prevents the substrate 1 from tilting due to partial suspension. This helps to ensure that the printed circuit board 10 is in a horizontal state, avoiding the problem of warping of the printed circuit board 10 caused by unevenness between printed circuit boards 10, improving product yield, and preventing the ink layer from being scratched. In addition, since a paper separator is provided between two adjacent printed circuit boards 10, the paper separator can prevent the ink layer from being scratched due to direct contact between the panels, which helps to reduce the product scrap rate.

[0067] In one embodiment, the partition is made of sulfur-free paper or adhesive paper. Since both sulfur-free paper and adhesive paper are relatively soft, placing sulfur-free paper or adhesive paper between two adjacent printed circuit boards can effectively prevent the ink layer from being scratched.

[0068] For illustrative purposes, the adhesive paper can be PE adhesive paper, which refers to adhesive paper made of polyethylene (PE) material. PE adhesive paper has a smoother texture, which helps to further prevent the ink layer from scratching.

[0069] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0070] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A printed circuit board, characterized in that, include: The substrate includes a first surface, on which a first ink layer and a first support protrusion are disposed at intervals. The thickness of the first ink layer is the same as the height of the first support protrusion. The first ink layer and the first support protrusion are used to jointly support another printed circuit board or to jointly support the substrate.

2. The printed circuit board according to claim 1, characterized in that, The substrate further includes a second surface, which is disposed opposite to the first surface. The second surface is provided with a second ink layer and a second support protrusion at intervals. The thickness of the second ink layer is the same as the height of the second support protrusion. Wherein, in the thickness direction of the substrate, the first support protrusion, the first ink layer, the second support protrusion, and the second ink layer are all staggered; or, In the thickness direction of the substrate, at least a portion of the projection of the first ink layer overlaps with at least a portion of the projection of the second ink layer, and the projection of the first support protrusion overlaps with the projection of the second support protrusion; or, In the thickness direction of the substrate, at least a portion of the projection of the first ink layer overlaps with at least a portion of the projection of the second ink layer, and the projection of the first ink layer covers the projection of the second support protrusion, and the projection of the second ink layer covers the projection of the first support protrusion.

3. The printed circuit board according to claim 1, characterized in that, The number of the first support protrusions is multiple, and the multiple first support protrusions are spaced apart.

4. The printed circuit board according to claim 3, characterized in that, The substrate further includes a second surface, which is disposed opposite to the first surface. The second surface is provided with a second ink layer and a plurality of second support protrusions at intervals. The thickness of the second ink layer is the same as the height of each second support protrusion. Wherein, in the thickness direction of the substrate, the projection of the second ink layer covers at least a portion of the projection of the first ink layer and the projection of at least one of the first support protrusions, and the projections of the remaining first support protrusions overlap with the projections of the plurality of second support protrusions in a one-to-one correspondence; or, In the thickness direction of the substrate, the projection of the first ink layer covers at least a portion of the projection of the second ink layer and the projection of at least one of the second support protrusions, and the projections of the remaining second support protrusions overlap with the projections of the plurality of first support protrusions in a one-to-one correspondence; or, In the thickness direction of the substrate, at least a portion of the projection of the first ink layer overlaps with at least a portion of the projection of the second ink layer, and the projection of the second ink layer covers the projection of at least one of the first support protrusions, the projection of the first ink layer covers the projection of at least one of the second support protrusions, and the projections of the remaining second support protrusions overlap with the projections of the remaining first support protrusions in a one-to-one correspondence.

5. The printed circuit board according to any one of claims 1 to 4, characterized in that, The first ink layer is a heat-dissipating ink layer; and / or, the first support protrusion is a heat-dissipating ink protrusion.

6. The printed circuit board according to claim 5, characterized in that, The thickness of the first ink layer is between 125 μm and 150 μm.

7. The printed circuit board according to claim 2 or 4, characterized in that, The second ink layer is a heat-dissipating ink layer; and / or, the second support protrusion is a heat-dissipating ink protrusion.

8. The printed circuit board according to claim 7, characterized in that, The thickness of the second ink layer is between 125 μm and 150 μm.

9. A printed circuit board packaging structure, characterized in that, The device includes a partition and a plurality of printed circuit boards as described in any one of claims 1 to 8, wherein the plurality of printed circuit boards are stacked sequentially along the thickness direction of the printed circuit boards, and the first surface of all the printed circuit boards faces the same side, and a partition is provided between each pair of adjacent printed circuit boards.

10. The printed circuit board packaging structure according to claim 9, characterized in that, The partition is made of sulfur-free paper or adhesive paper.

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