Pressure adjusting device and semiconductor processing equipment
By using a springless pressure regulating device that utilizes gravity to control pressure relief, the problem of poor pressure regulation caused by spring fatigue in semiconductor processing equipment is solved, achieving stable and sensitive pressure regulation and reducing equipment failure rate and cost.
Patent Information
- Application Number
- CN202423298374.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In existing semiconductor processing equipment, the springs in the pressure relief devices are prone to fatigue or failure after long-term use, leading to problems with smooth pressure regulation.
A springless pressure regulating device is adopted, which stabilizes pressure relief through gravity control. It utilizes a combination of seat structure, shaft structure, pressure plate structure and upper limit structure to achieve gas pressure regulation. Pressure regulation and control are achieved by relying on the gravity of the pressure plate structure, thus avoiding the problem of poor pressure regulation caused by spring fatigue.
It achieves high stability and sensitivity in pressure regulation, avoids unsmooth pressure regulation caused by spring failure, and has a simple structure and low cost.
Smart Images
Figure CN223511579U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of semiconductor equipment technology, and more specifically, it relates to a pressure regulating device and a semiconductor processing device. Background Technology
[0002] Semiconductor processing equipment, such as glove boxes, needs to maintain a certain pressure. During the transfer of semiconductor manufacturing equipment or devices, such as substrates and pedestals, through the glove box, inert gas needs to be continuously purged to ensure that the content of oxygen, moisture, etc., is reduced to extremely low levels so as not to affect subsequent processes or device performance. However, semiconductor processing equipment has a limited pressure-bearing capacity, and in the event of overpressure, appropriate pressure relief devices are required to release the pressure.
[0003] Existing pressure relief devices typically include components such as a valve body, valve core, spring, and sealing ring. Under overpressure conditions in semiconductor processing equipment, these components work together to move the valve core under pressure, thereby opening the pressure relief channel and releasing gas from the glove box. However, springs are prone to fatigue or failure after prolonged use, leading to problems with smooth pressure regulation. Utility Model Content
[0004] The purpose of this invention is to provide a pressure regulating device and a semiconductor processing equipment. This pressure regulating device does not require a spring, but can rely on gravity to control stable pressure release. It will not have problems with unsmooth pressure regulation due to spring fatigue or failure, and it has high sensitivity.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: The first aspect of this utility model provides a pressure regulating device, comprising:
[0006] The seat structure has a recessed structure on the top surface, and the seat structure has an air passage that runs through it along the axial direction. The air passage is connected to the recessed structure.
[0007] A shaft structure is fixedly disposed on the seat structure along the axial direction of the seat structure;
[0008] A pressure plate structure is located above the recessed structure and is fitted onto the shaft structure in a dynamic sealing manner to move along the axial direction of the shaft structure, so that the pressure plate structure contacts the recessed structure to seal the opening of the recessed structure;
[0009] An upper limit structure is provided at the top of the shaft structure to limit the extreme position of the pressure plate structure away from the seat structure.
[0010] Furthermore, the pressure plate structure includes a pressure plate body and a sealing structure connected to each other. The sealing structure is sleeved on the shaft structure in a dynamic sealing manner to drive the pressure plate body to move axially along the shaft structure, so that the pressure plate structure strengthens the sealing relationship with the recessed structure through the sealing structure. The pressure plate body is sleeved on the shaft structure in a dynamic sealing manner.
[0011] Furthermore, the pressure plate body includes several layers of sub-pressure plate bodies, each of the sub-pressure plate bodies being dynamically sealed around the shaft structure, and adjacent sub-pressure plate bodies being detachably connected.
[0012] Furthermore, it also includes a cover body, which is fixedly connected to the seat structure and surrounds the recessed structure. The pressure plate structure is located inside the cover body, and there is a gap between the pressure plate structure and the cover body.
[0013] Furthermore, it also includes a ring body, which is fixedly connected to the bottom of the cover and the top of the seat structure. The ring body is located outside the cover and extends radially along the seat structure. The radial dimension of the structure enclosed by the outer edge of the ring body is greater than the radial dimension of the seat structure.
[0014] Furthermore, the shaft structure extends through the seat structure along its axial direction, and a locking structure is provided at the bottom of the shaft structure. The seat structure is located between the locking structure and the pressure plate structure, and the locking structure is used to strengthen the fixed relationship between the shaft structure and the seat structure.
[0015] Furthermore, the locking structure is provided at the bottom of the shaft structure in a threaded connection manner.
[0016] Furthermore, the number of airways is at least two, and each airway is distributed around the axis structure.
[0017] Furthermore, the upper limit structure is provided on the shaft structure by means of a threaded connection to adjust the height of the limit position.
[0018] The second aspect of this utility model provides a semiconductor processing apparatus, including a processing cavity, a pipe connected to the processing cavity, and a pressure regulating device. The pressure regulating device is the pressure regulating device described above, and the seat structure of the pressure regulating device is sealed on the processing cavity or the pipe.
[0019] The beneficial effects of the pressure regulating device and semiconductor processing equipment provided by this utility model are as follows: When the pressure regulating device is applied to the semiconductor processing equipment, the gas inside the semiconductor processing equipment enters the recessed structure from the gas passage of the seat structure. The internal gas pressure acts directly on the pressure plate structure at the opening of the recessed structure. When there is overpressure inside the semiconductor processing equipment, the gas pressure acting on the pressure plate structure is greater than the weight of the pressure plate structure, and the pressure plate structure is lifted. The pressure regulating device releases pressure, thereby regulating the internal gas pressure of the semiconductor processing equipment. The upper limit structure limits the pressure plate structure to the extreme position away from the seat structure. When the pressure plate structure moves to the extreme position... Gas can only flow out from the confined space, allowing the pressure regulating device to limit the gas flow during the pressure relief process and achieve stable pressure relief. During the pressure relief process, when the pressure of the gas inside the semiconductor processing equipment acting on the pressure plate structure is less than the weight of the pressure plate structure, the pressure plate structure moves along the axial direction of the shaft structure toward the seat structure. When the pressure plate structure comes into contact with the recessed structure, the pressure plate structure seals the opening of the recessed structure, thereby maintaining the pressure inside the semiconductor processing equipment. This pressure regulating device relies on the weight of the pressure plate structure to achieve pressure regulation control, which is highly sensitive and avoids the problem of unsmooth pressure regulation caused by using a pressure relief valve containing a spring. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 A schematic diagram of the pressure regulating device provided in an embodiment of this utility model;
[0022] Figure 2 A cross-sectional three-dimensional structural diagram of the pressure regulating device provided in an embodiment of this utility model;
[0023] Figure 3 A cross-sectional structural schematic diagram of the pressure regulating device provided in an embodiment of this utility model;
[0024] Figure 4 A schematic diagram of the base structure of the pressure regulating device provided in this embodiment of the utility model;
[0025] Figure 5 This is a schematic diagram of the structure of a pressure regulating device provided in an embodiment of the present invention, which is installed on the processing cavity or pipeline of a semiconductor processing equipment.
[0026] The following are the labeling elements in the figure:
[0027] 1-Pressure regulating device; 2-Semiconductor processing equipment; 11-Seat structure; 12-Shaft structure; 13-Pressure plate structure; 14-Upper limit structure; 15-Cover; 16-Ring body; 17-Locking structure; 21-Processing chamber; 22-Pipe; 111-Recessed structure; 112-Air passage; 131-Pressure plate body; 132-Sealing structure. Detailed Implementation
[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0029] In the description of this utility model, it should be understood that the terms "comprising" and "having" as used herein, and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.
[0030] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. It should be understood that the term "and / or" as used herein is merely a description of the relationship between related objects, indicating that three relationships may exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. In the description of this utility model, unless otherwise stated, "multiple" means two or more.
[0032] Existing pressure relief devices typically include components such as a valve body, valve core, spring, and sealing ring. Under overpressure conditions in semiconductor processing equipment, these components work together to cause the valve core to move under pressure, thereby opening the pressure relief channel and releasing gas from the glove box. However, springs are prone to fatigue or failure after prolonged use, leading to problems with smooth pressure regulation. This application addresses these issues by providing a pressure regulating device and a semiconductor processing device incorporating this device.
[0033] The pressure regulating device and semiconductor processing equipment provided by this utility model will be described in detail below with reference to specific embodiments.
[0034] Please see Figures 1-3 The first aspect of this embodiment provides a pressure regulating device 1, including a seat structure 11, a shaft structure 12, a pressure plate structure 13, and an upper limit structure 14. The top surface of the seat structure 11 is provided with a recessed structure 111 and an axially penetrating air passage 112. The air passage 112 is connected to the recessed structure 111. The shaft structure 12 is fixedly disposed on the seat structure 11 along the axial direction of the seat structure 11. The pressure plate structure 13 is located above the recessed structure 111 and is sleeved on the shaft structure 12 in a dynamic sealing manner to move along the axial direction of the shaft structure 12, so that the pressure plate structure 13 contacts the recessed structure 111 to seal the opening of the recessed structure 111. The upper limit structure 14 is disposed on the top of the shaft structure 12 to limit the extreme position of the pressure plate structure 13 away from the seat structure 11.
[0035] Figure 4 Please refer to the structural diagram of the seat structure of the pressure regulating device provided in the embodiment of this utility model. Figure 4 The seat structure 11 of this embodiment includes a recessed structure 111 and an axially penetrating air passage 112, wherein the air passage 112 communicates with the recessed structure 111. The seat structure 11 of this embodiment can be used to mount the pressure regulating device 1 onto a semiconductor processing device. This embodiment does not impose any particular limitations on the material and size of the seat structure 11. Exemplarily, the seat structure 11 of this embodiment is made of non-metallic ceramic material. Figure 5 Please refer to the schematic diagram of the pressure regulating device provided in this embodiment of the invention being installed on the processing cavity or pipeline of a semiconductor processing equipment. Figure 5 When the pressure regulating device 1 of this embodiment is applied to the semiconductor processing equipment 2 to regulate the pressure in the processing chamber 21 or pipe 22 of the semiconductor processing equipment 2, the seat structure 11 of the pressure regulating device 1 of this embodiment is sealed on the processing chamber 21 or pipe 22 of the semiconductor processing equipment 2.
[0036] In this embodiment, the recessed structure 111 is disposed on the top surface of the seat structure 11. When the pressure regulating device 1 is closed, the pressure plate structure 13 contacts the recessed structure 111 to seal the opening of the recessed structure 111. Exemplarily, the outer contour of the recessed structure 111 is circular, and this embodiment does not impose any particular limitation on the specific depth of the recessed structure 111. Exemplarily, a sealing structure is provided on the outer periphery of the recessed structure 111 to ensure that the opening of the recessed structure 111 is sealed when the pressure plate structure 13 contacts the seat structure 11. Alternatively, a sealing structure is provided on the side of the pressure plate structure 13 facing the seat structure 11 to ensure that the opening of the recessed structure 111 is sealed when the pressure plate structure 13 contacts the seat structure 11. In this embodiment, the air passage 112 is connected to the recessed structure 111. After overpressure occurs inside the semiconductor processing equipment, the gas pressure acting on the pressure plate structure 13 is greater than the weight of the pressure plate structure 13, and the pressure plate structure 13 is lifted. The internal gas flows out between the pressure plate structure 13 and the seat structure 11. The pressure regulating device 1 releases pressure to regulate the internal gas pressure of the semiconductor processing equipment. After the internal pressure of the semiconductor processing equipment decreases, the gas pressure acting on the pressure plate structure 13 is less than the weight of the pressure plate structure 13, and the pressure plate structure 13 falls back onto the seat structure 11 due to gravity. The pressure plate structure 13 seals the opening of the recessed structure 111, and at this time the pressure regulating device is closed.
[0037] In this embodiment, the shaft structure 12 is fixedly disposed on the seat structure 11 along the axial direction of the seat structure 11. Exemplarily, the shaft structure 12 and the seat structure 11 are integrally formed, or the shaft structure 12 and the seat structure 11 are fixedly connected by a connector. The seat structure 11 has a mounting hole at its center, and the shaft structure 12 passes through the mounting hole. The shaft structure 12 and the seat structure 11 are sealed together. During the rising and falling processes of the pressure plate structure 13 of the pressure regulating device in this embodiment, the shaft structure 12 and the seat structure 11 remain relatively stationary. The seal between the shaft structure 12 and the seat structure 11 in this embodiment can be achieved using existing sealing methods, for example, by providing a sealing element between the shaft structure 12 and the seat structure 11.
[0038] In this embodiment, the pressure plate structure 13 is arranged to seal around the shaft structure 12. The pressure plate structure 13 is fitted onto the shaft structure 12 in a dynamic sealing manner to move along the axial direction of the shaft structure 12. When the pressure plate structure 13 contacts the recessed structure 111, it seals the opening of the recessed structure 111. In this embodiment, the dynamic seal between the shaft structure 12 and the pressure plate structure 13 is achieved by a sliding seal method in the prior art. This embodiment does not impose any particular limitation on the implementation method of the sliding seal.
[0039] In this embodiment, the upper limit structure 14 is disposed on the top of the shaft structure 12 to limit the extreme position of the pressure plate structure 13 away from the seat structure 11. When the pressure regulating device 1 of this embodiment is applied to a semiconductor processing equipment, the gas inside the semiconductor processing equipment enters the recessed structure 111 through the air passage of the seat structure 11. The internal gas pressure acts directly on the pressure plate structure 13. When there is overpressure inside the semiconductor processing equipment, the gas pressure acting on the pressure plate structure 13 is greater than the weight of the pressure plate structure 13, and the pressure plate structure 13 is lifted. During the lifting process of the pressure plate structure 13, the upper limit structure 14 limits the extreme position of the pressure plate structure 13 away from the seat structure 11. When the pressure plate structure 13 moves to the extreme position, the gas can only flow out from the confined space, so that the pressure regulating device can limit the gas flow during the pressure relief process to achieve stable pressure relief. In this embodiment, the upper limit structure 14 can be integrally fixed to the shaft structure 12, or the upper limit structure 14 and the shaft structure 12 can be fixedly connected by a detachable connection.
[0040] Semiconductor processing equipment, such as glove boxes, needs to maintain a certain pressure. A pressure regulating device 1 is required on the glove box to release pressure in case of overpressure. In this embodiment, the pressure regulating device 1 is applied to the glove box of a semiconductor device to regulate pressure. The working principle is as follows: When there is overpressure inside the glove box, the gas pressure acting on the pressure plate structure 13 is greater than the weight of the pressure plate structure 13. The pressure plate structure 13 is lifted, and the internal gas flows out between the pressure plate structure 13 and the seat structure 11. The pressure regulating device releases pressure, thereby regulating the internal gas pressure of the glove box. During the pressure release process, when the pressure of the gas inside the glove box acting on the pressure plate structure 13 is less than the weight of the pressure plate structure 13, the pressure plate structure 13 moves along the axial direction of the shaft structure 12 towards the seat structure 11. When the pressure plate structure 13 contacts the recessed structure 111, the pressure plate structure 13 seals the opening of the recessed structure 111, thus maintaining pressure inside the glove box.
[0041] Existing pressure relief valves include components such as a valve body, valve core, spring, and sealing ring. When the glove box is overpressurized, these components work together to move the valve core under pressure, thereby opening the pressure relief channel and releasing gas from the glove box. However, springs are prone to fatigue or failure after prolonged use, leading to problems with smooth pressure regulation. In this embodiment, the pressure regulating device 1, when applied to a glove box, can lift the pressure plate structure 13 after overpressurization, allowing gas inside the glove box to flow out between the pressure plate structure 13 and the seat structure 11, thus achieving pressure relief. After the pressure inside the glove box decreases, the pressure plate structure 13 moves towards the top surface of the seat structure 11 due to gravity, contacting the recessed structure 111 to seal the opening and maintain pressure. This avoids the pressure regulation problems caused by using pressure relief valves containing springs. Moreover, the pressure regulating device 1 of this embodiment has a simple structure and low manufacturing cost.
[0042] In one specific embodiment, the pressure plate structure 13 includes a pressure plate body 131 and a sealing structure 132 connected to each other. The sealing structure 132 is fitted onto the shaft structure 12 in a dynamic sealing manner to drive the pressure plate body 131 to move axially along the shaft structure 12. This strengthens the sealing relationship between the pressure plate structure 13 and the recessed structure 111 through the sealing structure 132. The pressure plate body 131 is fitted onto the shaft structure 12 in a dynamic sealing manner. In this embodiment, by providing the sealing structure 132 on the side of the pressure plate structure 13 near the seat structure 11, it is possible to better seal the opening of the recessed structure 111 when the pressure plate structure 13 comes into contact with the recessed structure 111. In this embodiment, the sealing between the pressure plate body 131, the sealing structure 132, and the shaft structure 12 can be achieved by sealing methods in the prior art. For example, a sliding seal between the shaft structure 12 and the pressure plate body 131 can be achieved by providing a sealing element between the shaft structure 12 and the pressure plate body 131, or a sliding seal between the sealing structure 132 and the shaft structure 12 can be achieved by an interference fit between the sealing structure 132 and the shaft structure 12.
[0043] Furthermore, the pressure plate body 131 of this embodiment includes several layered sub-pressure plate bodies. Each sub-pressure plate body is dynamically sealed around the shaft structure 12, and adjacent sub-pressure plate bodies are detachably connected. In this embodiment, when there is overpressure inside the semiconductor processing equipment, the gas pressure acting on the pressure plate structure 13 is greater than the weight of the pressure plate structure 13, and the pressure plate structure is lifted. When the pressure of the gas inside the semiconductor processing equipment acting on the pressure plate structure 13 is less than the weight of the pressure plate structure 13, the pressure plate structure 13 moves towards the seat structure 11 along the axial direction of the shaft structure 12. When the pressure plate structure 13 contacts the recessed structure 111, the pressure plate structure 13 seals the opening of the recessed structure 111, thereby achieving pressure maintenance inside the semiconductor processing equipment. The pressure regulating device of this embodiment relies on the weight of the pressure plate structure 13 to achieve pressure regulation control. By changing the weight of the pressure plate structure 13, the pressure inside the semiconductor processing equipment can be controlled. Since the pressure plate body 131 of this embodiment includes several layers of sub-pressure plate bodies, and adjacent pressure plate bodies 131 are detachably connected, when the pressure regulating device 1 of this embodiment adjusts the weight of the pressure plate structure 13, it is only necessary to remove the upper limit structure 14 and then disassemble the sub-pressure plate bodies on the pressure plate body 131 to quickly adjust the weight of the pressure plate structure 13.
[0044] Furthermore, the pressure regulating device 1 also includes a cover 15, which is fixedly connected to the seat structure 11. The cover 15 surrounds the recessed structure 111, and the pressure plate structure 13 is located inside the cover 15, with a gap between the pressure plate structure 13 and the cover 15. In this embodiment, the pressure regulating device 1 includes a cover 15 fixedly connected to the seat structure 11, and the pressure plate structure 13 is located inside the cover 15. The cover 15 protects the pressure plate structure 13, and a gap exists between the pressure plate structure 13 and the cover 15. During the process of the pressure plate structure 13 being raised to release air, the cover 15 does not affect the venting process of the pressure regulating device 1 during pressure regulation. Exemplarily, in this embodiment, the cover 15 is fixedly connected to the seat structure 11, or the cover 15 and the seat structure 11 are integrally formed.
[0045] Please see Figure 2 , Figure 5In one specific embodiment, the pressure regulating device 1 further includes a ring 16, which is fixedly connected to the bottom of the cover 15 and the top of the seat structure 11. The ring 16 is located outside the cover 15 and extends radially along the seat structure 11. The radial dimension of the structure enclosed by the outer edge of the ring 16 is larger than the radial dimension of the seat structure 11. In this embodiment, the pressure regulating device 1 is installed on the processing chamber 21 or the pipe 22 of the semiconductor processing equipment 2 by means of the ring 16 surrounding the cover 15, which facilitates the installation of the pressure regulating device 1. This embodiment does not impose any special limitations on the material and specific size of the ring 16. For example, the ring 16 in this embodiment is made of non-metallic ceramic material, which has good corrosion resistance and is not easily corroded or oxidized. In this embodiment, the radial dimension of the outer edge of the ring 16 is larger than the radial dimension of the seat structure 11, which facilitates the installation of the pressure regulating device on the processing chamber 21 or the pipe 22 of the semiconductor processing equipment 2 through the outer edge of the ring 16.
[0046] In one specific embodiment, please refer to Figure 2 , Figure 3 The upper limit structure 14 is threadedly connected to the shaft structure 12 to adjust the height of the pressure plate structure 13 away from the limit position of the seat structure 11. Exemplarily, the shaft structure 12 in this embodiment has a threaded top, and the upper limit structure 14 is a nut adapted to the thread on the top of the shaft structure 12. The upper limit structure 14 and the shaft structure 12 are connected by a threaded connection, facilitating the disassembly of the upper limit structure 14. For example, this improves the efficiency of installing or disassembling the sub-pressure plate body. In other embodiments, the upper limit structure 14 and the shaft structure 12 can be connected by other detachable connection methods. This embodiment does not impose any particular restrictions on other detachable connection methods between the upper limit structure 14 and the shaft structure 12.
[0047] Furthermore, the shaft structure 12 extends axially through the seat structure 11, and a locking structure 17 is provided at the bottom of the shaft structure 12. The seat structure 11 is located between the locking structure 17 and the pressure plate structure 13. The locking structure 17 is used to strengthen the fixed relationship between the shaft structure 12 and the seat structure 11. Exemplarily, the seat structure 11 in this embodiment has an axial mounting hole with an internal thread, and the shaft structure 12 has an external thread. The shaft structure 12 passes through the mounting hole of the seat structure 11, and the shaft structure 12 and the seat structure 11 are fixedly installed through a threaded engagement. In this embodiment, the bottom of the shaft structure 12 is provided with a locking structure 17 to strengthen the fixed relationship between the shaft structure 12 and the seat structure 11. The locking structure 17 is fixedly installed at the bottom of the shaft structure 12, and a sealing gasket is provided between the locking structure 17 and the seat structure 11, ensuring a sealed connection between the shaft structure 12 and the seat structure. This embodiment strengthens the fixing relationship between the shaft structure 12 and the seat structure 11 by using the locking structure 17, thereby improving the service life of the pressure regulating device 1 in this embodiment.
[0048] This embodiment prevents the shaft structure 12 from detaching from the seat structure 11 due to excessive pressure exerted by the internal airflow on the pressure plate structure 13 when the internal overpressure of the semiconductor processing device 2 is too high. Optionally, the locking structure 17 in this embodiment is provided at the bottom of the shaft structure 12 in a threaded connection manner. For example, the locking structure 17 may be a nut that is threaded into the shaft structure 12.
[0049] Optionally, please refer to Figures 2-5 The number of air passages 112 is at least two, and each air passage 112 is distributed around the shaft structure 12. In this embodiment, the air passages 112 are distributed circumferentially along the shaft structure 12. In this embodiment, the pressure regulating device 1 is installed on the pipe 22 or processing chamber 21 of the semiconductor processing device 2. When the pressure in the pipe 22 or processing chamber 21 exceeds a certain value, gas enters the recessed structure 111 from the air passage 112. The gas lifts the pressure plate structure 13 so that it flows out between the pressure plate structure 13 and the seat structure 11. In this embodiment, the number of air passages 112 is multiple, and the air passages 112 are distributed around the shaft structure 12, which allows the gas flowing into the recessed structure 111 from the air passages 112 to be evenly distributed on the pressure plate structure 13, thereby enabling the pressure plate structure 13 to be stably lifted in the extension direction of the shaft structure 12, avoiding the shaking of the pressure plate structure 13 during the axial movement of the shaft structure 12. In this embodiment, the specific number of air passages 112 is not particularly limited.
[0050] When the pressure regulating device of this embodiment is applied to a semiconductor processing equipment, the gas inside the semiconductor processing equipment enters the recessed structure through the gas passage of the seat structure. The internal gas pressure acts directly on the pressure plate structure. When there is overpressure inside the semiconductor processing equipment, the gas pressure acting on the pressure plate structure is greater than the weight of the pressure plate structure, and the pressure plate structure is lifted. The pressure regulating device releases pressure, thereby regulating the internal gas pressure of the semiconductor processing equipment. The upper limit structure limits the movement of the pressure plate structure away from the seat structure to the extreme position. When the pressure plate structure moves to the extreme position, the gas can only flow out from the confined space, so that the pressure regulating device can limit the gas flow during the pressure release process and achieve stable pressure release. During the pressure release process, when the pressure of the gas inside the semiconductor processing equipment acting on the pressure plate structure is less than the weight of the pressure plate structure, the pressure plate structure moves towards the seat structure along the axial direction of the shaft structure. When the pressure plate structure comes into contact with the recessed structure, the pressure plate structure seals the opening of the recessed structure, realizing pressure maintenance inside the semiconductor processing equipment. This pressure regulating device relies on the weight of the pressure plate structure to achieve pressure regulation control, which has high sensitivity and avoids the problem of unsmooth pressure regulation caused by using a pressure relief valve containing a spring.
[0051] Please see Figure 2 , Figure 5 A second aspect of this embodiment provides a semiconductor processing apparatus 2, which includes a processing chamber 21, a pipe 22 connecting the processing chamber 21, and a pressure regulating device 1. The pressure regulating device 1 is the pressure regulating device 1 described in the above embodiment, and the seat structure 11 of the pressure regulating device 1 is sealed on the processing chamber 21 or the pipe 22. Exemplarily, the pressure regulating device 1 of this embodiment is mounted on the processing chamber 21 or the pipe 22 by means of a fixing member.
[0052] The pressure regulating device 1 of this embodiment includes a seat structure 11, a shaft structure 12, a pressure plate structure 13, and an upper limit structure 14. The top surface of the seat structure 11 is provided with a recessed structure 111 and an axially penetrating air passage 112. The air passage 112 is connected to the recessed structure 111. The shaft structure 12 is fixedly disposed on the seat structure 11 along the axial direction of the seat structure 11. The pressure plate structure 13 is located above the recessed structure 111 and is sleeved on the shaft structure 12 in a dynamic sealing manner to move along the axial direction of the shaft structure 12, so that the pressure plate structure 13 contacts the recessed structure 111 to seal the opening of the recessed structure 111. The upper limit structure 14 is disposed on the top of the shaft structure 12 to limit the extreme position of the pressure plate structure 13 away from the seat structure 11.
[0053] When the aforementioned pressure regulating device 1 is applied to the semiconductor processing equipment 2, the gas inside the processing chamber 21 or pipe 22 of the semiconductor processing equipment 2 enters the recessed structure 111 from the air passage 112 of the seat structure 11. The internal gas pressure directly acts on the pressure plate structure 13. When there is overpressure inside the semiconductor processing equipment 2, the gas pressure acting on the pressure plate structure 13 is greater than the weight of the pressure plate structure 13, and the pressure plate structure 13 is lifted. The pressure regulating device 1 releases pressure, thereby regulating the internal gas pressure of the semiconductor processing equipment 2. The upper limit structure 14 limits the pressure plate structure 13 to the extreme position away from the seat structure 11. When the pressure plate structure 13 moves to the extreme position, the gas can only flow out from the confined space. This allows the pressure regulating device 1 to limit the gas flow during the pressure relief process, achieving stable pressure relief. During the pressure relief process, when the pressure of the gas inside the semiconductor processing equipment 2 acting on the pressure plate structure 13 is less than the weight of the pressure plate structure 13, the pressure plate structure 13 moves along the axial direction of the shaft structure 11 toward the seat structure 11. When the pressure plate structure 13 comes into contact with the recessed structure 111, the pressure plate structure 13 seals the opening of the recessed structure 111, thereby maintaining the pressure inside the semiconductor processing equipment 2. This pressure regulating device 1 relies on the weight of the pressure plate structure 13 to achieve pressure regulation control, which is highly sensitive and avoids the problem of unsmooth pressure regulation caused by using a pressure relief valve containing a spring.
[0054] For example, in this embodiment, the semiconductor processing device 2 is a glove box. The pressure regulating device 1 is installed on the processing chamber 21 of the glove box. Before using the glove box, it needs to be purged with air to replace the air and other unsuitable gases in the processing chamber 21, so that the moisture and oxygen content in the box is reduced to a low level, thereby ensuring a high-purity working environment inside the glove box. During the air blowing process into the processing chamber 21 of the glove box, a certain pressure needs to be maintained inside the glove box. In the case of overpressure, existing glove boxes generally release pressure through a pressure relief valve. The pressure relief valve includes components such as a valve body, valve core, spring, and sealing ring. When the glove box is overpressured, the valve core moves under pressure, thereby opening the pressure relief channel to release the gas inside the glove box. During the cleaning process, the glove box needs to continuously supply cleaning gas to carry out the impurities inside. If the pressure inside the glove box is too high, it will be relieved through the pressure relief valve. When the pressure reaches a certain value, in order to avoid wasting cleaning gas, the pressure relief valve needs to be closed normally. However, springs are prone to fatigue or malfunction under long-term use, which can reduce the sensitivity of the pressure relief valve. For example, spring fatigue can cause the valve body to fail to close completely after opening, resulting in the waste of cleaning gas.
[0055] When the pressure regulating device 1 of this embodiment is applied to a glove box, during the cleaning process, if the air pressure inside the glove box is too high, the gas enters the recessed structure through the air passage 112, which can lift the pressure plate structure 13 so that it flows out between the pressure plate structure 13 and the seat structure 11. The pressure regulating device releases pressure to regulate the air pressure inside the glove box. When the pressure of the gas inside the glove box acting on the pressure plate structure 13 is less than the weight of the pressure plate structure 13, the pressure plate structure 13 moves toward the top surface of the seat structure 11, and the pressure plate structure 13 seals the opening of the recessed structure 111 to achieve pressure maintenance inside the glove box. This pressure regulating device 1 has high sensitivity during pressure regulation and can avoid the problem of wasting cleaning gas when the pressure inside the glove box reaches a certain value.
[0056] In the above description, the terms "an embodiment," "some embodiments," "example," "specific example," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.
[0057] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A pressure regulating device, characterized in that, include: The seat structure has a recessed structure on the top surface, and the seat structure has an air passage that runs through it along the axial direction. The air passage is connected to the recessed structure. A shaft structure is fixedly disposed on the seat structure along the axial direction of the seat structure; A pressure plate structure is located above the recessed structure and is fitted onto the shaft structure in a dynamic sealing manner to move along the axial direction of the shaft structure, so that the pressure plate structure contacts the recessed structure to seal the opening of the recessed structure; An upper limit structure is provided at the top of the shaft structure to limit the extreme position of the pressure plate structure away from the seat structure.
2. The pressure regulating device according to claim 1, characterized in that: The pressure plate structure includes a pressure plate body and a sealing structure connected to each other. The sealing structure is sleeved on the shaft structure in a dynamic sealing manner to drive the pressure plate body to move along the axial direction of the shaft structure, so that the pressure plate structure strengthens the sealing relationship with the recessed structure through the sealing structure. The pressure plate body is sleeved on the shaft structure in a dynamic sealing manner.
3. The pressure regulating device according to claim 2, characterized in that: The pressure plate body includes several layers of sub-pressure plate bodies, each of which is dynamically sealed around the shaft structure and is detachably connected to adjacent sub-pressure plate bodies.
4. The pressure regulating device according to claim 1, characterized in that: It also includes a cover body, which is fixedly connected to the seat structure and surrounds the recessed structure. The pressure plate structure is located inside the cover body, and there is a gap between the pressure plate structure and the cover body.
5. The pressure regulating device according to claim 4, characterized in that: It also includes a ring body, which is fixedly connected to the bottom of the cover and the top of the seat structure. The ring body is located outside the cover and extends radially along the seat structure. The radial dimension of the structure enclosed by the outer edge of the ring body is greater than the radial dimension of the seat structure.
6. The pressure regulating device according to claim 1, characterized in that, The shaft structure extends through the seat structure along its axial direction. A locking structure is provided at the bottom of the shaft structure. The seat structure is located between the locking structure and the pressure plate structure. The locking structure is used to strengthen the fixed relationship between the shaft structure and the seat structure.
7. The pressure regulating device according to claim 6, characterized in that, The locking structure is provided at the bottom of the shaft structure via a threaded connection.
8. The pressure regulating device according to claim 1, characterized in that: The number of airways is at least two, and each airway is distributed around the axis structure.
9. The pressure regulating device according to claim 1, characterized in that: The upper limit structure is provided on the shaft structure by means of a threaded connection to adjust the height of the limit position.
10. A semiconductor processing apparatus, characterized in that: It includes a processing chamber, a pipe connected to the processing chamber, and a pressure regulating device, wherein the pressure regulating device is the pressure regulating device according to any one of claims 1-9, and the pressure regulating device is disposed on the processing chamber or the pipe.