Control device
By introducing data processing modules, data transmission modules, and interface expansion modules into the control equipment, and combining them with high-performance central processing units and graphics processors, efficient data processing and power management for complex large systems are achieved, solving the problem of insufficient functionality of existing equipment in complex scenarios and large system applications.
Patent Information
- Application Number
- CN202423314965.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing control equipment is insufficient to meet the needs of integrated control of complex large systems, especially in complex scenarios and large system applications, and cannot provide efficient data processing, network interaction and power management functions.
A control device was designed, comprising a data processing module, a data transmission module, and an interface expansion module. It employs an interconnected central processing unit and a graphics processing unit, combined with a power management unit, and achieves modular connection through a COME interface device. It also provides various peripheral interfaces, supports video decoding, data processing, and high-performance network interaction, and has power management functions.
It enables efficient completion of complex data processing tasks, supports the use of various communication peripherals and network device management, and can centrally manage the power switches of peripheral devices and system power consumption, making it suitable for integrated control of complex large systems.
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Figure CN223513477U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of integrated circuit technology, and in particular to a control device. Background Technology
[0002] With the development of automation technology, more and more fields are beginning to adopt automated control systems to assist in achieving intelligent automated production. Automated control systems can achieve automated control and monitoring of production equipment through standardized program design, reducing the possibility of manual intervention and thus significantly improving production efficiency.
[0003] However, the key to the currently applied automated control systems is the control equipment, and most of the current control equipment focuses on basic operation control in the production process. For the increasingly complex scenarios and large-scale system applications, the current control functions are difficult to meet the needs of the current complex large-scale system integrated control. Utility Model Content
[0004] Therefore, it is necessary to provide a control device to address the problem that the aforementioned control devices cannot meet the usage requirements of complex large-scale system integration control.
[0005] A control device includes a data processing module, a data transmission module, and an interface expansion module. The data processing module and the data transmission module are both fixed to the interface expansion module and at least one peripheral interface is brought out through the interface expansion module. The data processing module includes an interconnected central processing unit and a graphics processing unit. The central processing unit and the data transmission module are connected through the interface expansion module. The interface expansion module includes a power management unit. The central processing unit is connected to the power management unit, and the power management unit brings out a peripheral device control interface.
[0006] In one embodiment, the interface expansion module is provided with a first COME interface device and a second COME interface device;
[0007] The data processing module is fixedly connected to the interface expansion module via the first COME interface device, and the data transmission module is fixedly connected to the interface expansion module via the second COME interface device.
[0008] In one embodiment, the data processing module further includes a storage component and a signal conversion component;
[0009] Both the central processing unit (CPU) and the graphics processing unit (GPU) are connected to the storage component. The CPU has a first MDI Ethernet port, a GPIO interface, a UART interface, and a CAN interface connected to the first COME interface device via the signal conversion component. The CPU also has a PCIe interface directly connected to it. The GPU has an HDMI display interface connected to the first COME interface device via the signal conversion component. The GPU also has a DP display interface directly connected to the first COME interface device.
[0010] In one embodiment, the signal conversion component includes a network transceiver, a video conversion chip, and a level conversion chip;
[0011] The RGMII interface of the central processing unit is converted into the first MDI Ethernet port through the network transceiver. The GPIO interface, UART interface and CAN interface of the central processing unit are converted into levels through the level conversion chip. The DP display interface of the graphics processor is converted into the HDMI display interface through the video conversion chip.
[0012] In one embodiment, the storage component includes a memory controller, a video memory controller, and a system storage disk. The memory controller is connected to the central processing unit, and the video memory controller and the system storage disk are both connected to the graphics processor.
[0013] In one embodiment, the central processing unit is an FT2000-4 core processor, and the graphics processor is a Phytium X100 chipset.
[0014] In one embodiment, the data transmission module includes an interactive processor and an interactive memory controller. The interactive processor is connected to the interactive memory controller, and the interactive processor has a second MDI Ethernet port, a UART interface, and a CAN interface leading to the second COME interface device.
[0015] In one embodiment, the interaction processor is an FSL91030M Ethernet switch chip.
[0016] In one embodiment, the interface expansion module further includes a power conversion unit, and both the data processing module and the data transmission module include an internal power supply unit. The internal power supply unit has a power supply interface leading to the COME interface device, and the interface expansion module also has a power peripheral interface.
[0017] The input side of the power conversion unit is connected to the power peripheral interface, and the output side is connected to the power supply interface.
[0018] In one embodiment, the interface expansion module further includes a signal transceiver, and the interface expansion module also leads out an HDMI / DP peripheral display interface, an RS485 peripheral interface, an RS232 peripheral interface, an RS422 peripheral interface and a CAN peripheral interface.
[0019] The HDMI / DP peripheral display interface is led out from the DP display interface and / or the HDMI display interface. The RS485 peripheral interface, the RS232 peripheral interface and the RS422 peripheral interface are led out from the UART interface after being converted by the signal transceiver. The CAN peripheral interface is led out from the CAN interface after being converted by the signal transceiver. The input side of the power management unit is connected to the power peripheral interface, and the output side has the peripheral device control interface. The control side is connected to the GPIO interface. The first MDI Ethernet port is connected to the second MDI Ethernet port.
[0020] The aforementioned control device integrates a central processing unit (CPU) and a graphics processing unit (GPU) in its data processing module. This allows for complex data processing tasks based on video decoding and data processing capabilities. The data transmission module enables communication via high-performance network interaction, facilitating the use of various communication peripherals and the management and monitoring of network devices. Furthermore, the power management unit within the interface expansion module, combined with the CPU in the data processing module, allows for control of the power switches of peripheral devices via control ports, centrally managing the power-on sequence of peripheral devices and the overall system power consumption. This control device is highly suitable for increasingly complex scenarios and large-scale system applications, fully meeting the current needs for integrated control of complex large-scale systems. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of a system block diagram of a control device in one embodiment;
[0022] Figure 2 This is a schematic diagram of the control device in one embodiment;
[0023] Figure 3 This is a schematic diagram of a system block diagram of a data processing module in one embodiment;
[0024] Figure 4 This is a schematic diagram of a system block diagram of a data transmission module in one embodiment;
[0025] Figure 5 This is a schematic diagram of a system block diagram of a control device in another embodiment. Detailed Implementation
[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
[0028] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.
[0029] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.
[0030] In the description of the embodiments of this application, unless otherwise explicitly specified and limited, the technical terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. For example, in the following embodiments, "connection" should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., transmit electrical signals or data to each other. For those skilled in the art, the specific meaning of the above terms in the embodiments of this application can be understood according to the specific circumstances.
[0031] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.
[0032] In one exemplary embodiment, such as Figure 1 As shown, a control device is provided, including a data processing module 100, a data transmission module 200, and an interface expansion module 300. The data processing module 100 and the data transmission module 200 are both fixed to the interface expansion module 300, and at least one peripheral interface is brought out through the interface expansion module 300. The data processing module 100 includes an interconnected central processing unit 110 and a graphics processing unit 120. The central processing unit 110 and the data transmission module 200 are connected through the interface expansion module 300. The interface expansion module 300 includes a power management unit 310. The central processing unit 110 is connected to the power management unit 310, and the power management unit 310 brings out a peripheral device control interface.
[0033] In this design, both the data processing module 100 and the data transmission module 200 are fixed to the interface expansion module 300, and both can be connected to the interface expansion module 300, thereby achieving an indirect connection between the data processing module 100 and the data transmission module 200. After the data processing module 100 and the data transmission module 200 are fixedly connected to the interface expansion module 300, at least one peripheral interface can be brought out through the interface expansion module 300 to enable combined use with various external devices and equipment. It can be understood that the data processing module 100, the data transmission module 200, and the interface expansion module 300 of this application are modularly designed, with each module being independently designed and capable of being combined and installed into a complete control device. This modular design facilitates module upgrades and replacements as well as maintenance during use.
[0034] Specifically, the data processing module 100 integrates data processing algorithms, which can be used to realize multiple stages such as data acquisition, storage, processing, and analysis in the automated control process. First, various types of data can be collected through various sensors and devices during the process. Then, the collected data is cleaned, denoised, and filtered to improve data quality and accuracy. Further, data mining algorithms and models can be used to conduct in-depth analysis and mining of the preprocessed data to discover hidden patterns and trends. Based on the discovered patterns and trends, mathematical or simulation models are established to describe and predict the behavior and performance of industrial processes. Finally, based on the results of data mining and modeling, decision support and optimization suggestions are provided for industrial production. For different types of automated control processes, the data analysis techniques available in the data processing module 100 can be iteratively replaced to achieve more intelligent, efficient, and refined automated control processes.
[0035] Furthermore, the data transmission module 200 integrates high-performance Ethernet data interaction functionality for data exchange and transmission, while the network management adopts a visual web interface design, which facilitates the use of various communication peripherals and the management and monitoring of network devices.
[0036] The data processing module 100 includes an interconnected central processing unit (CPU) 110 and a graphics processing unit (GPU) 120. The CPU 110 processes data related to the operation of control equipment and can be connected to the data transmission module 200 via an interface expansion module 300. The GPU 120 primarily processes data related to the analysis of automated control processes, such as analyzing and mining data using data mining algorithms and models, and modeling and analyzing patterns and trends. The CPU 110 and GPU 120 can also communicate bidirectionally; the CPU 110 can send data to the GPU 120 for processing and analysis, and the GPU 120 can provide feedback on its operating status to the CPU 110. It is understood that the functions of the CPU 110 and GPU 120 described above are merely illustrative. Those skilled in the art can extend the functionality based on the corresponding interfaces, and any functionality achieved using chips and interfaces similar to those described in this application falls within the scope of protection of this application.
[0037] Furthermore, the interface expansion module 300 includes a power management unit 310, which has a peripheral device control interface for supplying power to the peripheral devices connected to the interface. Simultaneously, the central processing unit 110 in this embodiment is connected to the power management unit 310 to control the on / off state of the power supply circuits for the peripheral devices, thereby achieving centralized management of the power-on sequence of the peripherals and the power consumption of the entire system. This method is convenient and efficient, making the management of peripheral devices in the entire system more reliable.
[0038] The aforementioned control device integrates a central processing unit (CPU) and a graphics processing unit (GPU) in its data processing module. This allows for complex data processing tasks based on video decoding and data processing capabilities. The data transmission module enables communication via high-performance network interaction, facilitating the use of various communication peripherals and the management and monitoring of network devices. Furthermore, the power management unit within the interface expansion module, combined with the CPU in the data processing module, allows for control of the power switches of peripheral devices via control ports, centrally managing the power-on sequence of peripheral devices and the overall system power consumption. This control device is highly suitable for increasingly complex scenarios and large-scale system applications, fully meeting the current needs for integrated control of complex large-scale systems.
[0039] In one exemplary embodiment, such as Figure 2 As shown, the interface expansion module 300 is provided with a first COME interface device 320 and a second COME interface device 330; wherein, the data processing module 100 is fixedly connected to the interface expansion module 300 through the first COME interface device 320, and the data transmission module 200 is fixedly connected to the interface expansion module 300 through the second COME interface device 330.
[0040] Specifically, this application uses a COME connector as an interface device to achieve modular connection of various modules. The COME connector is a connector used to connect circuit boards to each other and to components in electronic devices, enabling connection and signal transmission between circuits. This application specifically uses a board-to-board type COME connector, which not only has high transmission speed but also good durability and stability, ensuring connection reliability and effectively guaranteeing signal quality, thereby achieving product quality reliability.
[0041] The data processing module 100 can be fixed to the interface expansion module 300 via the first COME interface device 320, and connect to the interface expansion module 300 via the first COME interface device 320 to achieve signal transmission. Similarly, the data transmission module 200 can be fixed to the interface expansion module 300 via the second COME interface device 330, and connect to the interface expansion module 300 via the second COME interface device 330 to achieve signal transmission.
[0042] It is understood that the positions of the data processing module 100 and the data transmission module 200 fixed on the interface expansion module 300 are not limited and can be determined according to the actual product size and signal line requirements. For example, in this embodiment, the data processing module 100 can be fixed to the heat dissipation surface of the interface expansion module 300. The heat dissipation surface of the interface expansion module 300 is the outer surface of the interface expansion module 300 where heat dissipation components are provided. Since the data processing module 100 needs to perform a large number of complex data processing tasks, effective heat dissipation is necessary to ensure the stable operation of the control device. For example... Figure 2 As shown, a heat dissipation component is provided on the inner side of the bottom surface of the interface expansion module 300, which allows the data processing module 100 to be fixed to the bottom surface of the interface expansion module 300 via the first COME interface device 320. Meanwhile, for the convenience of signal line setup, the data transmission module 200 is fixed to the top surface of the interface expansion module 300 via the second COME interface device 330.
[0043] In one exemplary embodiment, such as Figure 3 As shown, the data processing module 100 also includes a storage component and a signal conversion component; the central processing unit 110 and the graphics processor 120 are both connected to the storage component. The central processing unit 110 has a first MDI Ethernet port, a GPIO interface, a UART interface and a CAN interface connected to the first COME interface device 320 through the signal conversion component. The central processing unit 110 also has a PCIE interface directly connected to it. The graphics processor 120 has an HDMI display interface connected to the first COME interface device 320 through the signal conversion component. The graphics processor 120 also has a DP display interface connected to the first COME interface device 320 directly.
[0044] Specifically, the data processing module 100 can provide various types of interfaces to the interface expansion module 300. These interfaces can include communication interfaces, such as MDI Ethernet ports, GPIO interfaces, UART interfaces, USB interfaces, and CAN interfaces, as well as display interfaces, such as DP display interfaces and HDMI display interfaces. It can be understood that the interfaces provided by the data processing module 100 can be used for data transmission between the data processing module 100 and the data transmission module 200 (e.g., MDI Ethernet ports), or they can be output by the interface expansion module 300 as peripheral interfaces for connecting external devices (e.g., other communication interfaces and display interfaces).
[0045] Correspondingly, the central processing unit 110 and the graphics processing unit 120 can directly or indirectly expose at least one type of interface as various interfaces from the data processing module 100 to the interface expansion module 300. Indirect exposure can be achieved using a signal conversion component. This can be understood as the signal conversion component converting the data output from the interface between the central processing unit 110 and the graphics processing unit 120, processing it, and then outputting it to the first COME interface device 320, which further transmits it via the interface expansion module 300 to the data transmission module 200 and external devices.
[0046] The MDI Ethernet port, GPIO interface, UART interface, and CAN interface can be derived from the central processing unit 110 and output after being converted by the signal conversion component, while the PCIe interface can be directly derived from the central processing unit 110. The HDMI display interface can be derived from the graphics processor 120 and output after being converted by the signal conversion component, while the DP display interface can be directly derived from the graphics processor 120.
[0047] For example, the number of the various types of interfaces derived from the central processing unit 110 and the graphics processor 120 is not fixed. For example, in this embodiment, the interfaces may include, but are not limited to: 2 first MDI Ethernet ports, 16 GPIO interfaces, 3 UART interfaces, 2 CAN interfaces, 1 PCIe interface, 1 DP display interface and 1 HDMI display interface.
[0048] In one exemplary embodiment, please continue to refer to Figure 3 The signal conversion components include a network transceiver, a video conversion chip, and a level conversion chip; the RGMII interface of the central processing unit 110 is converted into a first MDI Ethernet port through the network transceiver, the GPIO interface, UART interface, and CAN interface of the central processing unit 110 are level converted through the level conversion chip, and the DP display interface of the graphics processor 120 is converted into an HDMI display interface through the video conversion chip.
[0049] The network transceiver uses the YT8521S chip from Yutai Microelectronics, supporting adaptive transmission characteristics of 1000BASE-T / 100BASE-TX / 10BASE-Te; it supports RGMII / SGMII MAC type interfaces; and the power supply supports 3.3V / 2.5V / 1.8V selectable. The video conversion chip uses the domestic GSV6201 chip, supporting the conversion of DP (DisplayPort) signals to HDMI 2.1 signals and supporting 8K 60Hz video output. The GSV6201's display port receiver supports a data transmission rate of up to 32.4Gbps (HBR3, 4 channels), while the HDMI transmitter supports a data transmission rate of up to 48Gbps (FRL, 12G4Lane). The level conversion chip is implemented using a Complex Programmable Logic Device (CPLD) chip, specifically the GW1N-LV4PG256C6 / I5 chip from Guangdong Gaoyun. It features abundant logic resources, supports multiple I / O level standards, and incorporates block-type static random access memory, digital signal processing modules, and phase-locked loop resources. It boasts low power consumption, instant startup, low cost, high security, small product size, diverse package types, and convenient and flexible use. The GW1N-LV4PG256C6 / I5 chip contains 4608 logic units, 180K blocks of memory, 2 PLL phase-locked loops, 4 I / O banks, supports a maximum of 218 I / O pins, and has a core voltage of 1.2V.
[0050] Specifically, the signal from one Gigabit Ethernet interface (RGMII) of the central processing unit 110 is converted into a first MDI Ethernet port via the YT8521S chip for communication with the data transmission module 200. The central processing unit 110 connects to the CPLD chip via its 16 GPIO interfaces, 3 UART interfaces, and 2 CAN interfaces. The CPLD chip performs level conversion on the signals output from the aforementioned interfaces of the central processing unit 110 and outputs them via the interface expansion module 300 to connect to peripheral devices. One of the DP display interfaces of the graphics processor 120 is converted into an HDMI display interface via the GSV6201 chip and output by the interface expansion module 300 to connect to an external display device.
[0051] In one exemplary embodiment, please continue to refer to Figure 3 The central processing unit 110 is an FT2000-4 core processor, and the graphics processor 120 is a Phytium X100 chipset.
[0052] Specifically, the CPU 110 uses the Phytium FT / 2000-4-core processor, a high-performance processor that integrates four independently developed 64-bit FTC663 high-performance cores with a clock speed of 2.2GHz and an operating temperature range of -40~105℃. This processor features high performance and low power consumption, and is therefore widely used in servers, high-performance computers, and high-end embedded applications.
[0053] Furthermore, the Phytium X100 chipset integrates a low-power GPU chip with a base frequency of 400MHz and a maximum frequency of 600MHz; it also integrates a video decoder supporting 4K@30fps decoding. The Phytium X100 chipset also features integrated system control functions, including power-on / off control, reset control, and low-power control. Additionally, it integrates a temperature sensor for real-time monitoring of the internal temperature. Simultaneously, the Phytium X100 chipset communicates with the FT2000-4 core processor via its integrated x8 PCIe 3.0 uplink interface, uploading its operating status, interface communication status, and internal temperature information to the FT2000-4 core processor via this uplink. The FT2000-4 core processor can perform periodic self-tests and report its own and the Phytium X100 chipset's information to the upper-level monitoring center, implementing the BIT (Build-In-Test) function. Because the communication interface between the two supports a theoretical bandwidth of nearly 8GB / s, the entire data processing module 100 runs very smoothly in system operation, data processing, and interface display.
[0054] In this embodiment, by using a combination of domestically produced high-performance, low-power CPU and GPU, 100% domestic production can be achieved, and the overall control device can achieve high performance while keeping power consumption low.
[0055] In one exemplary embodiment, please continue to refer to Figure 3 The storage components include a memory controller, a video memory controller, and a system storage disk. The memory controller is connected to the central processing unit 110, and the video memory controller and the system storage disk are both connected to the graphics processor 120.
[0056] Specifically, the memory controller uses Changxin Memory's DDR4 surface-mount chip CXDQ3A8AM-WG, a 64Gbit LPDDR4 memory controller with a maximum operating speed of 2666Mbps, a power supply voltage of 1.2V, and a maximum voltage of 2.5V. The FT2000-4 core processor's internal DDR4 controller supports eight DDR4 chips to achieve 8GB of memory. The graphics memory controller is a 64-bit DDR4 / LPDDR4 memory controller, using Changxin Memory's LPDDR4 surface-mount chip CXDB5CCAM-MK, with a +1.1V power supply, 32-bit data bits, and a maximum data rate supporting 3200Mbps. The Phytium X100 chipset's 64-bit DDR / LPDDR4 memory controller can achieve 8GB of graphics memory by connecting two external chips. The Phytium X100 chipset also has a system storage drive connected via its one SATA 3.0 interface, including... Figure 3 As shown, the system storage disk can be a solid-state drive with a storage capacity of 64GB.
[0057] In this embodiment, the storage component provides the data processing module 100 with 8GB of system memory and video memory, respectively, which means it has a powerful data cache space. In addition, the mounted 64GB system storage disk supports expansion space, providing the module with a sufficiently large data storage space.
[0058] In one exemplary embodiment, such as Figure 4 As shown, the data transmission module 200 includes an interactive processor 210 and an interactive memory controller. The interactive processor 210 is connected to the interactive memory controller, and the interactive processor 210 has a second MDI Ethernet port, a UART interface and a CAN interface leading to the second COME interface device 330.
[0059] Specifically, the interactive processor 210, through a visual web interface design, enables the use of various communication peripherals and the management and monitoring of network devices. The interactive processor 210 can communicate with the central processing unit 110 via the interface expansion module 300, thereby enabling the feedback and aggregation of all data analysis results processed by the graphics processor 120 to the data processing center, providing accurate signals to technicians and completing automated production control tasks.
[0060] For example, please continue to refer to Figure 4The interactive processor 210 uses the FSL91030M Ethernet switching chip. Specifically, the interactive processor 210 uses the FSL91030M Ethernet switching chip from Wuhan Freescale Technology Co., Ltd., which is a 32G bandwidth Layer 2 Ethernet switching chip with a main frequency of 400MHz. It supports 10 / 100 / 1000BASE-T and 100BASE-FX functions; it supports 8 / 16bits DDR3 with a maximum speed of 1066MHz; it supports complete Layer 2 network protocol processing functions; it supports remote configuration; and it also supports 1.25Gbps Served fiber optic interface communication. The data transmission module 200, implemented through the FSL91030M Ethernet switching chip, has a visual network switch configuration management interface. The interface is built into the data transmission module 200 and can be accessed simply by logging in at the specified address.
[0061] It is understood that the FSL91030M Ethernet switching chip has a second MDI Ethernet port, a UART interface, and a CAN interface leading to the second COME interface device 330. The UART interface and CAN interface can be output after signal type conversion for use in connecting peripheral devices. The four MDI Ethernet ports are used as the second MDI Ethernet ports to achieve communication connection with the central processing unit 110 through the interface expansion module 300.
[0062] Furthermore, the interactive memory controller can also be a DDR4 board-mount chip from Changxin Memory, CXDQ3A8AM-WG, which uses a DDR3 controller inside the FSL91030M Ethernet switching chip to mount a DDR4 chip to achieve 1GB of memory.
[0063] In one exemplary embodiment, such as Figure 3-5 As shown, the interface expansion module 300 also includes a power conversion unit 340, and both the data processing module 100 and the data transmission module 200 include an internal power supply unit. The internal power supply unit has a power supply interface leading to the COME interface device. The interface expansion module 300 also has a power peripheral interface. The input side of the power conversion unit 340 is connected to the power peripheral interface, and the output side is connected to the power supply interface.
[0064] Specifically, the interface expansion module 300 can connect to an external power supply device via a power peripheral interface to obtain a power supply voltage of 18V-36V. The power conversion unit 340 can step down the 18V-36V power supply voltage input to its input side to obtain a 12V power supply voltage, which is then output to the internal power supply units of the data processing module 100 and the data transmission module 200 through the power supply interface, thereby providing power to the data processing module 100 and the data transmission module 200.
[0065] In one exemplary embodiment, such as Figure 5 As shown, the interface expansion module 300 also includes a signal transceiver 350. The interface expansion module 300 also provides an HDMI / DP peripheral display interface, an RS485 peripheral interface, an RS232 peripheral interface, an RS422 peripheral interface, and a CAN peripheral interface. Among them, the HDMI / DP peripheral display interface is led out from the DP display interface and / or the HDMI display interface; the RS485 peripheral interface, RS232 peripheral interface, and RS422 peripheral interface are led out from the UART interface after conversion by the signal transceiver 350; the CAN peripheral interface is led out from the CAN interface after conversion by the signal transceiver 350; the input side of the power management unit 310 is connected to the power peripheral interface, and the output side provides a peripheral device control interface. The control side is connected to the GPIO interface, and the first MDI Ethernet port is connected to the second MDI Ethernet port.
[0066] Specifically, the HDMI / DP peripheral display interface can be a DP display interface and / or an HDMI display interface output from the data processing module 100, which can be used to connect HDMI or DP type display devices. The first MDI Ethernet port and the second MDI Ethernet port are connected to realize the communication connection between the data processing module 100 and the data transmission module 200. In this embodiment, both the first and second MDI Ethernet ports can be dual-channel Gigabit Ethernet interfaces, serving as important paths for external devices to transmit data to the data processing module 100 via the data transmission module 200. Their stable and efficient signal transmission quality is crucial for the stable operation of the control device provided in this application.
[0067] Furthermore, the transceiver 350 is used to convert the UART interface to a serial peripheral interface. The UART interface can be derived from either the data processing module 100 or the data transmission module 200. For example, as... Figure 5 As shown, the signal transceiver 350 can convert the interface types of the six UART interfaces from the data processing module 100 to obtain two RS485 peripheral interfaces, two RS232 peripheral interfaces, and two RS422 peripheral interfaces. Alternatively, the signal transceiver 350 can convert the interface types of the two UART interfaces from the signal transmission module 200 to obtain two RS485 peripheral interfaces. These peripheral serial interfaces can be used to connect various types of peripheral devices to achieve control tasks. The specific device type used in the signal transceiver 350 is not limited; any conversion chip capable of converting UART interface types to serial port types can be used.
[0068] It is understood that, in order to control various types of peripheral devices, the interface expansion module 300 of this application also includes a power management unit 310. The input side of the power management unit 310 is connected to the power peripheral interface to obtain an external power supply voltage of 18V-36V. The output side of the power management unit 310 has a peripheral device control interface, which can be used to connect various types of peripheral devices and supply power to the peripheral devices through the external power supply voltage flowing through the power management unit. The control side of the power management unit 310 is connected to the GPIO interface of the data processing module 100, and can be used to output control signals to control the on / off of the power supply circuit of the peripheral devices, thereby achieving centralized management of the power-on sequence of peripheral devices and the power consumption of the entire system. This method is convenient and easy to operate, making the peripheral usage management of the entire system more reliable.
[0069] The following is Figure 5 The system block diagram shown illustrates the functions of the control device provided in this application.
[0070] Specifically, the control device includes a data processing module 100, a data transmission module 200, and an interface expansion module 300. The data processing module 100 consists of a Phytium FT2000-4 CPU processor and an X100 graphics GPU processor, while the data transmission module 200 consists of a Freescale FSL91030M domestically produced chip. These two modules, combined with the interface expansion module 300, form a highly integrated, high-performance control device. This device overcomes the current shortcomings of low domestic production rates, high power consumption, low performance, and limited interface types in control devices due to the lack of suitable CPU, GPU, and network data exchange solutions. It utilizes a combination of domestically produced high-performance CPUs, GPUs, and network exchange processors to create a high-performance control device integrating data processing algorithms, graphics display and control, video encoding and decoding, and data interaction and transmission functions. It exhibits significant advantages in controlling complex scenarios and large-scale systems.
[0071] First, the CPU processor uses the Phytium FT2000-4, which integrates four Phytium-developed 2.2GHz high-efficiency processor cores FTC663, is compatible with the 64-bit ARMv8 instruction set, supports single and double precision floating-point arithmetic instructions, integrates two DDR4 memory controllers with 64 data bits and 8 ECC parity bits, has a memory capacity of 8GB, and integrates 2x16-lane PCIE3.0, 2x Gigabit Ethernet RGMII, 3x CAN, GPIO and other common interfaces. The GPU processor uses the Phytium X100 chipset, integrating one low-power GPU with a core clock speed of 400MHz, one 64-bit DDR4 / LPDDR4 memory controller with a memory capacity of up to 8GB, and one x16 PCIe 3.0 interface. The graphics card supports a maximum resolution of 3840*2160@60Hz, with HDMI 2.0b as the default interface and eDP / DP optional. It integrates an NPU neural network accelerator, eight USB 3.0 controllers, and four SATA 3.0 interfaces, and supports mainstream video codecs such as H.264 / 265 and MPEG4.
[0072] Secondly, the data transmission module 200 uses the FSL91030M chip from Wuhan Freescale, a 32G bandwidth Layer 2 Ethernet switch chip with a main frequency of 400MHz, supporting 10 / 100 / 1000BASE-T and 100BASE-FX functions; it supports 8 / 16bits DDR3, with a maximum speed of 1066MHz, and supports complete Layer 2 network protocol processing functions, supporting remote configuration; based on the FSL91030M processing, a CAN2.0b / RS422 / RS485 data server is designed to forward data over the network and supports local port and destination port configuration. It integrates a visual network switch configuration management interface, with the processing module built into the interface; users can log in simply by using the specified address.
[0073] Finally, the interface expansion module 300 sets up peripheral interfaces to suit actual applications based on the characteristics and functions of the data processing module 100 and the data transmission module 200. For example, it sets up standard communication peripheral interfaces such as 6 external gigabit Ethernet ports, 2 UART interfaces, 2 CAN interfaces, 2 RS422 interfaces, and 2 RS485 interfaces; the display interface supports HDMI / eDP / DP output options to adapt to different types of displays; it integrates peripheral power management, with 14 external 24V3A power supply capabilities, supports CPU control management, and can effectively manage the power on / off of peripherals within the system and optimize the power consumption of the entire system. Furthermore, the overall size of the control device is determined by the size of the interface expansion module 300. The modules are connected by COME connectors. The overall dimensions are 140±0.2mm*110±0.2mm*40±0.2mm (excluding the housing design); weight: ≤350g (excluding structural components); power supply: supports +18V~+36V wide voltage input, typical input voltage: +24V; power consumption: typical power consumption 28W, peak power consumption less than 36W; operating system: Galaxy Kylin operating system.
[0074] It is understandable that the modules are physically connected via a COME connection. The actual signal connection is that the data processing module 100 and the data transmission module 200 are interconnected via an interface expansion module 300 using two Gigabit Ethernet connections. That is, the data processing module 100 receives data from peripheral devices and performs processing, storage, forwarding, and feedback. The interface expansion module 300 also exposes the common interfaces of the data processing module 100 and the data transmission module 200 for use by peripheral devices, such as Ethernet, CAN, UART, RS422, RS485, HDMI, and peripheral power output management.
[0075] In this embodiment, by applying the technical solution of this application, a data processing module 100 is composed of a Phytium FT2000-4 CPU processor and an X100 graphics GPU, and a domestically produced data transmission module 200 is composed of a Freescale FSL91030M. Through an interface expansion module 300, a highly integrated high-performance control device is formed. This can perfectly solve the shortcomings of current market control device solutions, such as the lack of high-performance CPUs, GPUs, and network data switches, which lead to limitations in usage. Furthermore, the 100% domestically produced design method can quickly participate in and promote the design and development of domestically produced chips.
[0076] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0077] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A control device, characterized in that, The system includes a data processing module, a data transmission module, and an interface expansion module. Both the data processing module and the data transmission module are fixed to the interface expansion module, and at least one peripheral interface is brought out through the interface expansion module. The data processing module includes an interconnected central processing unit and a graphics processing unit. The central processing unit and the data transmission module are connected through the interface expansion module. The interface expansion module includes a power management unit. The central processing unit is connected to the power management unit, and the power management unit brings out a peripheral device control interface.
2. The control device according to claim 1, characterized in that, The interface expansion module is equipped with a first COMe interface device and a second COMe interface device; The data processing module is fixedly connected to the interface expansion module via the first COME interface device, and the data transmission module is fixedly connected to the interface expansion module via the second COME interface device.
3. The control device according to claim 2, characterized in that, The data processing module also includes a storage component and a signal conversion component; Both the central processing unit (CPU) and the graphics processing unit (GPU) are connected to the storage component. The CPU has a first MDI Ethernet port, a GPIO interface, a UART interface, and a CAN interface connected to the first COME interface device via the signal conversion component. The CPU also has a PCIe interface directly connected to it. The GPU has an HDMI display interface connected to the first COME interface device via the signal conversion component. The GPU also has a DP display interface directly connected to the first COME interface device.
4. The control device according to claim 3, characterized in that, The signal conversion component includes a network transceiver, a video conversion chip, and a level conversion chip; The RGMII interface of the central processing unit is converted into the first MDI Ethernet port through the network transceiver. The GPIO interface, UART interface and CAN interface of the central processing unit are converted into levels through the level conversion chip. The DP display interface of the graphics processor is converted into the HDMI display interface through the video conversion chip.
5. The control device according to claim 3, characterized in that, The storage component includes a memory controller, a video memory controller, and a system storage disk. The memory controller is connected to the central processing unit, and the video memory controller and the system storage disk are both connected to the graphics processor.
6. The control device according to claim 3, characterized in that, The central processing unit is an FT2000-4 core processor, and the graphics processor is a Phytium X100 chipset.
7. The control device according to claim 3, characterized in that, The data transmission module includes an interactive processor and an interactive memory controller. The interactive processor is connected to the interactive memory controller, and the interactive processor has a second MDI Ethernet port, a UART interface, and a CAN interface leading to the second COME interface device.
8. The control device according to claim 7, characterized in that, The interaction processor is an FSL91030M Ethernet switching chip.
9. The control device according to claim 7, characterized in that, The interface expansion module also includes a power conversion unit. The data processing module and the data transmission module both include an internal power supply unit. The internal power supply unit has a power supply interface leading to the COME interface device. The interface expansion module also has a power peripheral interface. The input side of the power conversion unit is connected to the power peripheral interface, and the output side is connected to the power supply interface.
10. The control device according to claim 9, characterized in that, The interface expansion module also includes a signal transceiver, and the interface expansion module also leads out an HDMI / DP peripheral display interface, an RS485 peripheral interface, an RS232 peripheral interface, an RS422 peripheral interface and a CAN peripheral interface; The HDMI / DP peripheral display interface is led out from the DP display interface and / or the HDMI display interface. The RS485 peripheral interface, the RS232 peripheral interface and the RS422 peripheral interface are led out from the UART interface after being converted by the signal transceiver. The CAN peripheral interface is led out from the CAN interface after being converted by the signal transceiver. The input side of the power management unit is connected to the power peripheral interface, and the output side has the peripheral device control interface. The control side is connected to the GPIO interface. The first MDI Ethernet port is connected to the second MDI Ethernet port.