Connection structure between processing module and transmission module and cluster-shaped semiconductor device

Abstract

The utility model provides a connecting structure between a processing module and a transmission module and a cluster-shaped semiconductor device, the connecting structure comprises a telescopic pipe body and a cooling assembly, the telescopic pipe body is provided with a first interface end and a second interface end, the first interface end is detachably connected with the transmission module, the second interface end is detachably connected with the processing module, and the cooling assembly is connected with the processing module. The cooling assembly is arranged on the pipe wall of the telescopic pipe body. According to the connecting structure, when the machining module needs to be maintained and cleaned, the first connector end and the second connector end are detached, then the telescopic pipe body is shortened, the connecting structure is moved out, and the space for maintaining and cleaning is vacated, so that the labor intensity of maintenance work is reduced, and the maintenance work efficiency is improved; moreover, the cooling assembly is arranged on the pipe wall of the telescopic pipe body so as to achieve the heat dissipation function of the telescopic pipe body, the telescopic pipe body is particularly suitable for cluster-shaped semiconductor equipment of a silicon carbide epitaxial process, and the cooling assembly is used for reducing the temperature of the telescopic pipe body so that the service life of related parts with poor high-temperature resistance can be prolonged.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor equipment technology, and more specifically, to a connection structure between a processing module and a transmission module, and a cluster semiconductor device. Background Technology

[0002] Currently, in the semiconductor manufacturing field, a common approach is to use multiple Processing Modules (PMs) fixedly connected around a single Transfer Module (TM). Semiconductor devices constructed using this approach are called cluster semiconductor devices. These PMs can perform parallel processing, with wafers transferred via the transfer devices within the TM, thereby improving semiconductor manufacturing efficiency. However, PMs require frequent maintenance and cleaning. Current technologies often involve disassembling the PM and moving it to an open location for easier maintenance. However, the PM's weight makes movement difficult, resulting in high labor intensity for maintenance. Furthermore, the disassembly and reassembly process involves components such as water cooling systems, cables, and special gas pipelines, which is complex and carries the risk of water and gas leaks, leading to low maintenance efficiency. Utility Model Content

[0003] The main objective of this invention is to provide a connection structure between a processing module and a transmission module, as well as a cluster semiconductor device, to at least partially solve at least one of the technical problems in the related art, such as low maintenance efficiency and high labor intensity of cluster semiconductor devices.

[0004] To achieve the above objectives, the present invention provides a connection structure between a processing module and a transmission module, including a telescopic tube and a cooling assembly. The telescopic tube is provided with a first interface end and a second interface end. The first interface end is detachably connected to the transmission module, and the second interface end is detachably connected to the processing module. The cooling assembly is disposed on the tube wall of the telescopic tube.

[0005] Furthermore, the telescopic tube includes a first tube and a second tube. The first tube is provided with a first interface end and a third interface end, and the second tube is provided with a second interface end and a fourth interface end. Either the third interface end or the fourth interface end is sleeved on the outside of the other, so that the first tube and the second tube are slidably telescopically connected.

[0006] Furthermore, a first sealing element is provided between the first tube body and the transmission module, a second sealing element is provided between the second tube body and the processing module, and a third sealing element is provided between the first tube body and the second tube body.

[0007] Furthermore, the cooling assembly includes a first water-cooled cavity and a second water-cooled cavity. The first water-cooled cavity is formed in the wall of the first tube, and the second water-cooled cavity is formed in the wall of the second tube. The first water-cooled cavity includes a first cooling channel, a second cooling channel, and a first water-cooled cavity body. The second water-cooled cavity includes a third cooling channel, a fourth cooling channel, and a second water-cooled cavity body. The first cooling channel extends from one end of the first water-cooled cavity body toward the first sealing member. The second cooling channel extends from the other end of the first water-cooled cavity body toward the third sealing member. The third cooling channel extends from one end of the second water-cooled cavity body toward the third sealing member. The fourth cooling channel extends from the other end of the second water-cooled cavity body toward the second sealing member.

[0008] Furthermore, the first interface end is detachably connected to the transmission module via a threaded connector, and the second interface end is detachably connected to the processing module via a threaded connector.

[0009] Furthermore, the third interface end is provided with a first annular protrusion extending outward, and the fourth interface end is provided with a second annular protrusion extending inward, the first annular protrusion and the second annular protrusion engaging; or, the fourth interface end is provided with a first annular protrusion extending outward, and the third interface end is provided with a second annular protrusion extending inward, the first annular protrusion and the second annular protrusion engaging.

[0010] Furthermore, the third sealing element is provided between the first annular convex edge and the second annular convex edge, and a dovetail-shaped cross-section groove is formed on the surface of the first annular convex edge facing the second annular convex edge, and the third sealing element is located in the dovetail-shaped cross-section groove.

[0011] Furthermore, the second cooling channel is disposed within the first annular convex edge, and the third cooling channel is disposed within the second annular convex edge.

[0012] Furthermore, a third annular protrusion is provided at the first interface end extending outward, and a fourth annular protrusion is provided at the second interface end extending outward; the first cooling channel is disposed within the third annular protrusion, and the fourth cooling channel is disposed within the fourth annular protrusion.

[0013] Furthermore, the first pipe body is provided with a first support column, and a first traveling wheel is installed at the bottom of the first support column; the second pipe body is provided with a second support column, and a second traveling wheel is installed at the bottom of the second support column.

[0014] This invention also provides a cluster semiconductor device, including a processing module, a transmission module, and the aforementioned connection structure.

[0015] Furthermore, the processing module includes an upstream flange, a cooling pipe body, a reaction chamber, and a downstream flange. The two ends of the cooling pipe body are respectively connected to the upstream flange and the downstream flange. The downstream flange is detachably connected to the second interface end of the connection structure. The reaction chamber is disposed inside the cooling pipe body.

[0016] This utility model's connecting structure is used to connect the processing module and the transmission module. The connecting structure consists of a telescopic tube and a cooling assembly. The first interface end of the telescopic tube is detachably connected to the transmission module, and the second interface end is detachably connected to the processing module. When the processing module requires maintenance or cleaning, the first and second interface ends are detached, and the telescopic tube is shortened to a certain length to facilitate the removal of the connecting structure from between the processing module and the transmission module. This frees up space between the processing module and the transmission module, allowing personnel to enter and perform maintenance and cleaning work. Compared to the traditional fixed connection between the processing module and the transmission module, this utility model eliminates the need to move the processing module or the transmission module, thus avoiding the need to dismantle the corresponding water channels. The system incorporates components such as special gas pipelines and heating cables, reducing the labor intensity of maintenance work and improving efficiency. After maintenance and cleaning, the connecting structure is moved between the processing module and the transmission module, and the telescopic tube is extended to allow for detachable connection of the first and second interface ends to the transmission module and processing module, respectively. Furthermore, a cooling component is installed on the tube wall of the telescopic tube to achieve heat dissipation, which is particularly suitable for cluster semiconductor equipment in silicon carbide epitaxial processes (where the temperature in the silicon carbide epitaxial reaction chamber can reach approximately 1600 to 1700 degrees Celsius). Some components with poor high-temperature resistance may be installed on the telescopic tube; reducing the temperature of the telescopic tube through the cooling component helps extend the service life of these components.

[0017] The cluster semiconductor device of this invention has all the beneficial effects of the above-mentioned connection structure, which will not be repeated here. Attached Figure Description

[0018] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:

[0019] Figure 1 This is a schematic diagram of the structure of a cluster semiconductor device in the prior art;

[0020] Figure 2 One of the structural schematic diagrams of the cluster semiconductor device provided by this utility model;

[0021] Figure 3 A cross-sectional schematic diagram of the cluster semiconductor device provided by this utility model;

[0022] Figure 4 An enlarged schematic diagram showing the position of the third sealing element provided by this utility model;

[0023] Figure 5 The second schematic diagram of the structure of the cluster semiconductor device provided by this utility model.

[0024] The above figures include the following reference numerals:

[0025] 01. First seal; 02. Second seal; 03. Third seal;

[0026] 100. Connecting structure; 11. Telescopic tube body; 111. First tube body; 1111. First interface end; 11111. Third annular protrusion; 1112. Third interface end; 11121. First annular protrusion; 112. Second tube body; 1121. Second interface end; 11211. Fourth annular protrusion; 1122. Fourth interface end; 11221. Second annular protrusion; 12. Cooling assembly; 121. First water-cooled cavity; 1211. First cooling channel; 1212. Second cooling channel; 1213. First water-cooled cavity body; 122. Second water-cooled cavity; 1221. Third cooling channel; 1222. Fourth cooling channel; 1223. Second water-cooled cavity body; 13. First support column; 131. First running wheel; 14. Second support column; 141. Second running wheel;

[0027] 200. Processing module; 21. Upstream flange; 22. Cooling pipe; 23. Reaction chamber; 24. Downstream flange;

[0028] 300. Transmission module. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0030] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0031] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.

[0032] Combination Figure 1 As shown, this is a cluster semiconductor device in the prior art. The transfer module 300 is typically a polygonal structure to facilitate fixed connection with different processing modules 200 at different angles. The transfer module 300 is usually equipped with a robotic arm, which can transfer unprocessed wafers from the transfer module 300 to the processing module 200, and transport processed wafers from the processing module 200 to other modules (other modules include other processing modules or loading locking chambers not shown in the figure, where the loading locking chamber is a device fixedly connected to a side of the transfer module 300 for temporary wafer storage). In this way, multiple processing modules 200 can perform parallel processing or sequential multi-step processing. It should be understood that the aforementioned processing modules may include process chambers for implementing epitaxial processes, or chambers for providing functions such as wafer cleaning.

[0033] Combination Figure 2 and Figure 3 As shown, this utility model provides a connection structure 100 between a processing module 200 and a transmission module 300, including a telescopic tube 11 and a cooling assembly 12. The telescopic tube 11 is provided with a first interface end 1111 and a second interface end 1121. The first interface end 1111 is detachably connected to the transmission module 300, and the second interface end 1121 is detachably connected to the processing module 200. The cooling assembly 12 is disposed on the tube wall of the telescopic tube 11.

[0034] The telescopic tube 11 has the function of telescopically changing its length. In one embodiment, the telescopic tube 11 includes at least two tubes, which are nested together to realize the function of telescopically changing its length. In another embodiment, the telescopic tube 11 includes at least two tubes, which are connected by an elastic seal to allow the telescopic tube 11 to elastically telescopically change its length. In yet another embodiment, the telescopic tube 11 has a corrugated tube structure with corrugated walls, which allows the walls to be folded, thereby allowing the entire telescopic tube 11 to telescopically change its length.

[0035] Combination Figure 3 As shown, the telescopic tube 11 is provided with a first interface end 1111 and a second interface end 1121. The first interface end 1111 is connected to the transmission module 300 by any detachable connection method such as snap-fit, screw-fit, or plug-in. The second interface end 1121 is connected to the processing module 200 by any detachable connection method such as snap-fit, threaded connection, or plug-in. The cooling component 12 is disposed on the tube wall of the telescopic tube 11. In one embodiment, the cooling component 12 consists of multiple heat dissipation fins, all of which are installed on the outside of the tube wall of the telescopic tube 11. A cooling fan is installed next to the heat dissipation fins to enable rapid heat dissipation from the tube wall. In another embodiment, a water-cooled pipe is installed around the outside of the tube wall of the telescopic tube 11. The water-cooled pipe is provided with heat dissipation fins at the position corresponding to the tube wall of the telescopic tube 11, thereby achieving rapid water-cooled heat dissipation from the tube wall. When the telescopic tube 11 is in the form of multiple tubes, the cooling components 12 can be arranged on each tube respectively. When multiple tubes extend and retract, the cooling components 12 will not interfere with each other. When the telescopic tube 11 is in the form of a single tube, such as a corrugated pipe, a high-temperature resistant flexible hose can be used as a water cooling pipe, so that the cooling components 12 have the function of elastic deformation, avoiding affecting the extension and retraction deformation of the telescopic tube 11.

[0036] For example, when maintenance and cleaning of the processing module 200 are required, the connection between the first interface end 1111 and the transmission module 300 and the connection between the second interface end 1121 and the processing module 200 are first disconnected. Then, the telescopic tube 11 can be shortened by manual moving or transportation equipment (such as a transport vehicle) to facilitate the removal of the telescopic tube 11 from between the transmission module 300 and the processing module 200. After maintenance and cleaning are completed, the telescopic tube 11 is moved to the space between the transmission module 300 and the processing module 200 in a shortened state by manual moving or transportation equipment. After aligning the corresponding interfaces, the telescopic tube 11 is extended, and the connection between the first interface end 1111 and the transmission module 300, as well as the connection between the second interface end 1121 and the processing module 200, are reconnected.

[0037] The connection structure 100 of this utility model is used to connect the processing module 200 and the transmission module 300. The connection structure 100 consists of a telescopic tube 11 and a cooling component 12. The first interface end 1111 of the telescopic tube 11 is detachably connected to the transmission module 300, and the second interface end 1121 is detachably connected to the processing module 200. When the processing module 200 needs maintenance and cleaning, the first interface end 1111 and the second interface end 1121 are detached, and then the telescopic tube 11 is shortened to a certain length to facilitate the removal of the connection structure 100 from between the processing module 200 and the transmission module 300. The space between the processing module 200 and the transmission module 300 is freed up to allow personnel to enter and carry out maintenance and cleaning work. Compared with the traditional method of fixed connection between the processing module 200 and the transmission module 300, this utility model eliminates the need to move the processing module 200 or the transmission module 300. Block 300 eliminates the need to dismantle corresponding water pipes, special gas pipes, heating cables, and other components, reducing the labor intensity of maintenance work and improving maintenance efficiency. After maintenance and cleaning, the connecting structure 100 is moved between the processing module 200 and the transmission module 300, and the telescopic tube 11 is extended so that the first interface end 1111 and the second interface end 1121 can be detachably connected to the transmission module 300 and the processing module 200, respectively. Furthermore, the cooling component 12 is set on the tube wall of the telescopic tube 11 to realize the heat dissipation function of the telescopic tube 11, which is especially suitable for cluster semiconductor equipment in silicon carbide epitaxial process (the temperature of silicon carbide epitaxial reaction chamber may reach about 1600 to 1700 degrees Celsius). Some components with poor high-temperature resistance may be installed on the telescopic tube 11. Reducing the temperature of the telescopic tube 11 by the cooling component 12 helps to extend the service life of the relevant components.

[0038] Furthermore, the telescopic tube 11 includes a first tube 111 and a second tube 112. The first tube 111 is provided with a first interface end 1111 and a third interface end 1112. The second tube 112 is provided with a second interface end 1121 and a fourth interface end 1122. Either the third interface end 1112 or the fourth interface end 1122 is sleeved on the outside of the other, so that the first tube 111 and the second tube 112 are slidably telescopically connected.

[0039] Combination Figures 2 to 3As shown, the first tube 111 has a first interface end 1111 and a third interface end 1112, and the second tube 112 has a second interface end 1121 and a fourth interface end 1122. The first interface end 1111 is detachably connected to the transmission module 300, and the second interface end 1121 is detachably connected to the processing module 200. In this embodiment, the third interface end 1112 extends into the fourth interface end 1122, so that the fourth interface end 1122 is fitted outside the third interface end 1112, thereby realizing the sliding telescopic connection function between the first tube 111 and the second tube 112. In this way, the diameter of the second tube 112 is larger than that of the first tube 111. The transmission module 300 is usually provided with a docking flange. One end of the docking flange is connected to the transmission module 300, and the other end is suspended, used to dock with the first interface end 1111 of the first tube 111 (in the prior art, it is used to dock with the processing module 200). Therefore, the structural strength of the docking flange is relatively low. Furthermore, in the prior art, the interface area of ​​the transmission module 300 is usually smaller than that of the processing module 200. Without changing the existing technical structure, in this embodiment, it is a relatively preferred solution for the first interface end 1111 of the smaller-diameter first pipe body 111 to connect with the docking flange. This way, when maintenance and cleaning are required, the first interface end 1111 can be disassembled from the docking flange first, thereby avoiding the docking flange bearing excessive force. It is understood that, without considering the above issues, the third interface end 1112 can also be fitted outside the fourth interface end 1122.

[0040] In one embodiment of this utility model, the first tube 111 and / or the second tube 112 can also be a multi-segment tube with a stepped cross-section. From one perspective, this can make the transition between adjacent cross-sections smoother and avoid the problem of tube strength deterioration caused by abrupt changes in cross-section. From another perspective, it can also make the socketing form of the third interface end and the fourth interface end (the third interface end 1112 is sleeved on the outside of the fourth interface end 1122 or the fourth interface end 1122 is sleeved on the outside of the third interface end 1112) no longer restricted by the relative size of the interface area of ​​the transmission module 300 and the processing module 200.

[0041] Thus, by forming a nested relationship between the third interface end 1112 and the fourth interface end 1122, a sliding telescopic connection is achieved between the first tube body 111 and the second tube body 112. When maintenance and cleaning work is required, the first interface end 1111 and the second interface end 1121 are disassembled, and the first tube body 111 and the second tube body 112 are shortened to make room for maintenance. After maintenance and cleaning are completed, the first tube body 111 and the second tube body 112 are extended to reconnect them between the processing module 200 and the transmission module 300.

[0042] Furthermore, a first sealing element 01 is provided between the first tube body 111 and the transmission module 300, a second sealing element 02 is provided between the second tube body 112 and the processing module 200, and a third sealing element 03 is provided between the first tube body 111 and the second tube body 112.

[0043] Combination Figure 3 and Figure 4 As shown, a first sealing element 01 is provided between the first tube body 111 and the transmission module 300. The first sealing element 01 is a sealing ring (e.g., an O-ring). After the first tube body 111 is connected to the transmission module 300, it compresses the first sealing element 01. Preferably, after the telescopic tube body 11 is installed between the transmission module 300 and the processing module 200, the compression rate of the first sealing element 01 is 20% to achieve a better sealing effect. A second sealing element 02 is provided between the second tube body 112 and the processing module 200. The second sealing element 02 is a sealing ring (e.g., an O-ring). After the second tube body 112 is connected to the processing module 200, it compresses the second sealing element 02. Preferably, after the telescopic tube body 11 is installed between the transmission module 300 and the processing module 200, the compression rate of the second sealing element 02 is 20% to achieve a better sealing effect. A third sealing element 03 is provided between the first tube body 111 and the second tube body 112. The third sealing element 03 is a sealing ring (e.g., an O-ring). Optionally, a sliding seal is achieved between the first pipe body 111 and the second pipe body 112 through a third sealing element 03, and... Figure 4 The difference is that in this embodiment, the third sealing element 03 is disposed on the surface where the first tube 111 and the second tube 112 slide relative to each other. When the first tube 111 and the second tube 112 slide relative to each other, the third sealing element 03 will follow the first tube 111 or the second tube 112 to maintain the sealing effect during the sliding process.

[0044] Thus, the sealing performance between the telescopic tube 11, the processing module 200 and the transmission module 300 is maintained by the first seal 01, the second seal 02 and the third seal 03, so as to avoid leakage of reaction gas.

[0045] Further, the cooling assembly 12 includes a first water-cooling cavity 121 and a second water-cooling cavity 122. The first water-cooling cavity 121 is formed in the wall of the first tube 111, and the second water-cooling cavity 122 is formed in the wall of the second tube 112. The first water-cooling cavity 121 includes a first cooling channel 1211, a second cooling channel 1212, and a first water-cooling cavity body 1213. The second water-cooling cavity 122 includes a third cooling channel 1221, a fourth cooling channel 1222, and a second water-cooling cavity body 1223. The first cooling channel 1211 extends from one end of the first water-cooling cavity body 1213 toward the first sealing member 01. The second cooling channel 1212 extends from the other end of the first water-cooling cavity body 1213 toward the third sealing member 03. The third cooling channel 1221 extends from one end of the second water-cooling cavity body 1223 toward the third sealing member 03. The fourth cooling channel 1222 extends from the other end of the second water-cooling cavity body 1223 toward the second sealing member 02.

[0046] Combination Figure 3 As shown, the cooling assembly 12 includes a first water-cooling cavity 121 and a second water-cooling cavity 122. The first water-cooling cavity 121 is formed in the wall of the first tube 111, and the second water-cooling cavity 122 is formed in the wall of the second tube 112. The first tube 111 has a first inlet and a first outlet communicating with the first water-cooling cavity 121. Preferably, the first inlet is located on the lower side of one end of the first tube 111, and the first outlet is located on the upper side of the other end of the first tube 111. Furthermore, the first inlet is located at the end of the first tube 111 closer to the processing module 200. The second tube 112 has a second inlet and a second outlet communicating with the second water-cooling cavity 122, thereby facilitating the removal of heat by the coolant. Preferably, the second inlet is located on the lower side of one end of the second tube 112, and the second outlet is located on the upper side of one end of the second tube 112. Furthermore, the second water inlet is located at the end of the second pipe body 112 closer to the processing module 200. The temperature of the processing module 200 is higher than that of the transmission module 300; this arrangement improves overall cooling and allows the seals (and other potentially heat-sensitive components) near the processing module 200 to operate for a longer period. Combined with... Figure 3 and Figure 4As shown, the first water-cooling cavity 121 has a similar wall shape to the first tube body 111. Its first water-cooling cavity body 1213 is cylindrical. Its first cooling channel 1211 extends toward the first seal 01, thereby providing heat dissipation for the first seal 01. The second cooling channel 1212 extends toward the third seal 03, thereby providing heat dissipation for the third seal 03. The second water-cooling cavity 122 has a similar shape to the second tube body 112. Its second water-cooling cavity body 1223 is cylindrical. Its third cooling channel 1221 extends toward the third seal 03, thereby providing heat dissipation for the third seal 03. The fourth cooling channel 1222 extends toward the second seal 02, thereby providing heat dissipation for the second seal 02.

[0047] Thus, the first cooling channel 1211 dissipates heat from the first seal 01, the second cooling channel 1212 and the third cooling channel 1221 dissipate heat from the third seal 03, and the fourth cooling channel 1222 dissipates heat from the second seal 02, preventing high temperatures from reducing the service life of the first seal 01, the second seal 02, and the third seal 03; the first water-cooled cavity body 1213 and the second water-cooled cavity body 1223 can dissipate heat for the entire connecting structure, effectively ensuring the service life of other components with limited high-temperature resistance in the connecting structure.

[0048] Furthermore, either the third interface end 1112 or the fourth interface end 1122 is provided with a first annular protrusion 11121 extending outward, and the other is provided with a second annular protrusion 11221 extending inward, wherein the first annular protrusion 11121 and the second annular protrusion 11221 are engaged.

[0049] Combination Figure 3 As shown, in this embodiment, the third interface end 1112 is provided with a first annular protrusion 11121 extending outward, and the fourth interface end 1122 is provided with a second annular protrusion 11221 extending inward. The fourth interface end 1122 is sleeved on the outside of the third interface end 1112, so that the first annular protrusion 11121 and the second annular protrusion 11221 form a snap-fit ​​relationship. When the telescopic tube 11 is extended to the end, the first interface end 1111 and the second interface end 1121 are connected to the transmission module 300 and the processing module 200 respectively. If the telescopic tube 11 is stretched further, the first annular protrusion 11121 and the second annular protrusion 11221 will snap together to produce a limiting effect, thereby preventing the first tube 111 from detaching from the second tube 112.

[0050] Thus, the engagement of the first annular protrusion 11121 and the second annular protrusion 11221 creates a certain limiting effect, preventing the first tube 111 from accidentally detaching from the second tube 112. Optionally, the first interface end 1111 is detachably connected to the transmission module 300 via a threaded connector, and the second interface end 1121 is detachably connected to the processing module 200 via a threaded connector.

[0051] Combination Figure 3 As shown, a third annular protrusion 11111 extends outward from the first interface end 1111, and a fourth annular protrusion 11211 extends outward from the second interface end 1121. Through holes are provided on the third annular protrusion 11111 and the fourth annular protrusion 11211 so that the threaded connector can be detachably connected to the processing module 200 and the transmission module 300 after passing through.

[0052] Thus, the first interface end 1111 and the second interface end 1121 are detachably connected by bolt connectors, which is convenient for disassembly and assembly. Furthermore, the thread preload of the bolt connectors helps to improve the sealing performance of the first seal 01 and the second seal 02.

[0053] Preferably, the third interface end 1112 is provided with a first annular protrusion 11121 extending outward, the fourth interface end 1122 is provided with a second annular protrusion 11221 extending inward, the first interface end 1111 is provided with a third annular protrusion 11111 extending outward, the second interface end 1121 is provided with a fourth annular protrusion 11211 extending outward, the first cooling channel 1211 is disposed within the third annular protrusion 11111, the second cooling channel 1212 is disposed within the first annular protrusion 11121, the third cooling channel 1221 is disposed within the second annular protrusion 11221, and the fourth cooling channel 1222 is disposed within the fourth annular protrusion 11211.

[0054] In this way, by accommodating the corresponding cooling channels through the aforementioned protruding edge, all parts of the connecting structure can have heat dissipation function, ensuring the service life of related components with limited high-temperature resistance near the protruding edge.

[0055] Preferably, the first tube 111 and the second tube 112 are provided with dovetail-shaped cross-section grooves to respectively engage the first sealing element 01, the second sealing element 02 and the third sealing element 03.

[0056] Combination Figure 3 and Figure 4As shown, in this embodiment, dovetail-shaped cross-section grooves are respectively formed on the surface of the first interface end 1111 facing the transmission module 300, the surface of the second interface end 1121 facing the processing module 200, and the surface of the third interface end 1112 facing the fourth interface end 1122 (that is, on the surface of the first annular protrusion 11121 facing the second annular protrusion 11221), and the first sealing member 01, the second sealing member 02 and the third sealing member 03 are respectively inserted therein.

[0057] Thus, during the disassembly and assembly of the connection structure 100, the first seal 01, the second seal 02, and the third seal 03 can be fixed in the dovetail-shaped cross-section groove to prevent them from falling off.

[0058] Furthermore, the third sealing element 03 is provided between the first annular protrusion 11121 and the second annular protrusion 11221.

[0059] Combination Figure 4 As shown, along the extension direction of the connecting structure 100, the third seal 03 is disposed between the first annular protrusion 11121 and the second annular protrusion 11221, rather than on the relatively sliding surface between the first tube body 111 and the second tube body 112. That is, a non-sliding sealing scheme is adopted. This is because, generally speaking, the sealing requirements between the first tube body 111 and the second tube body 112 are not high during maintenance and cleaning work.

[0060] Thus, for the third seal 03, there is no need to use a relatively expensive sliding seal, reducing the procurement cost of the seal.

[0061] Preferably, the first tube body 111 is provided with a first support column 13, and a first running wheel 131 is installed at the bottom of the first support column 13. The second tube body 112 is provided with a second support column 14, and a second running wheel 141 is installed at the bottom of the second support column 14.

[0062] Combination Figure 5 As shown, the first support column 13 supports the first tube 111, and the second support column 14 supports the second tube 112. The first tube 111 and the first support column 13 can be detachably connected, integrally connected, or directly abutted against each other. The second tube 112 and the second support column 14 can be detachably connected, integrally connected, or directly abutted against each other. The bottom of the first support column 13 and the bottom of the second support column 14 are respectively equipped with a first running wheel 131 and a second running wheel 141.

[0063] In this way, when disassembling and assembling the connection structure 100, the first support column 13 and the second support column 14 can provide support, and the first traveling wheel 131 and the second traveling wheel 141 can provide auxiliary extension and retraction, thus improving the convenience of disassembly and assembly.

[0064] This utility model also provides a cluster semiconductor device, including a processing module 200, a transmission module 300, and the aforementioned connection structure 100.

[0065] Combination Figures 2 to 5 As shown, at least one processing module 200 is arranged around the transmission module 300. The processing module 200 and the transmission module 300 are connected by a connecting structure 100. The telescopic tube 11 of the connecting structure 100 has a first interface end 1111 and a second interface end 1121. The first interface end 1111 is detachably connected to the transmission module 300, and the second interface end 1121 is detachably connected to the processing module 200. Thus, during maintenance and cleaning, after the connecting structure 100 is disassembled, the telescopic tube 11 is shortened to facilitate its removal from between the processing module 200 and the transmission module 300. After maintenance and cleaning are completed, the connecting structure 100 is moved between the processing module 200 and the transmission module 300, and then the telescopic tube 11 is extended so that the first interface end 1111 is detachably connected to the transmission module 300, and the second interface end 1121 is detachably connected to the processing module 200.

[0066] The cluster semiconductor device of this invention is connected between the processing module 200 and the transmission module 300 via the aforementioned connection structure 100. The connection structure 100 consists of a telescopic tube 11 and a cooling assembly 12. The first interface end 1111 of the telescopic tube 11 is detachably connected to the transmission module 300, and the second interface end 1121 is detachably connected to the processing module 200. When the processing module 200 requires maintenance or cleaning, the first interface end 1111 and the second interface end 1121 are detached, and the telescopic tube 11 is shortened to a certain length to allow the connection structure 100 to be removed from between the processing module 200 and the transmission module 300. This frees up space between the processing module 200 and the transmission module 300, allowing personnel to enter and perform maintenance and cleaning work. Compared to the conventional method of fixed connection between the processing module 200 and the transmission module 300, this invention eliminates the need to move the processing module 200. Alternatively, the transmission module 300 can be used, thus eliminating the need to dismantle corresponding water pipes, special gas pipes, heating cables, and other components, reducing the labor intensity of maintenance work and improving maintenance efficiency. After maintenance and cleaning, the connecting structure 100 is moved between the processing module 200 and the transmission module 300, and the telescopic tube 11 is extended so that the first interface end 1111 and the second interface end 1121 can be detachably connected to the transmission module 300 and the processing module 200, respectively. Furthermore, the cooling component 12 is disposed on the tube wall of the telescopic tube 11 to realize the heat dissipation function of the telescopic tube 11, which is especially suitable for cluster semiconductor equipment in silicon carbide epitaxial process (the temperature of the silicon carbide epitaxial reaction chamber may reach about 1600 to 1700 degrees Celsius). Some components with poor high-temperature resistance may be disposed on the telescopic tube 11. Reducing the temperature of the telescopic tube 11 by the cooling component 12 helps to extend the service life of the relevant components.

[0067] Furthermore, the processing module 200 includes an upstream flange 21, a cooling pipe body 22, a reaction chamber 23, and a downstream flange 24. The cooling pipe body 22 can also be, for example, a water-cooled quartz chamber. Both ends of the cooling pipe body 22 are connected to the upstream flange 21 and the downstream flange 24, respectively. The downstream flange 24 is detachably connected to the second interface end 1121 of the connection structure 100. The reaction chamber 23 is disposed within the cooling pipe body 22. The reaction chamber 23 can be, for example, a graphite reaction chamber.

[0068] Combination Figure 5 As shown, the reaction chamber 23 is located inside the cooling pipe body 22. The two ends of the cooling pipe body 22 are connected to the upstream flange 21 and the downstream flange 24 respectively. The downstream flange 24 and the second interface end 1121 are detachably connected by means of threaded connection, plug connection, snap connection, etc.

[0069] In this way, after the wafer in the reaction chamber 23 is processed, it can be transported to other modules for subsequent process steps. The corresponding processing process has a high temperature, and the cooling component 12 of the connection structure 100 can play a heat dissipation role to ensure the service life of components with poor high temperature resistance near the connection structure 100.

[0070] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or component referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.

[0071] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0072] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.

[0073] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A connection structure between a processing module and a transmission module, characterized in that, The device includes a telescopic tube and a cooling assembly. The telescopic tube has a first interface end and a second interface end. The first interface end is detachably connected to the transmission module, and the second interface end is detachably connected to the processing module. The cooling assembly is disposed on the tube wall of the telescopic tube.

2. The connection structure according to claim 1, characterized in that, The telescopic tube includes a first tube and a second tube. The first tube is provided with a first interface end and a third interface end, and the second tube is provided with a second interface end and a fourth interface end. Either the third interface end or the fourth interface end is sleeved on the outside of the other so that the first tube and the second tube are slidably telescopically connected.

3. The connection structure according to claim 2, characterized in that, A first sealing element is provided between the first tube body and the transmission module, a second sealing element is provided between the second tube body and the processing module, and a third sealing element is provided between the first tube body and the second tube body.

4. The connection structure according to claim 3, characterized in that, The cooling assembly includes a first water-cooled cavity and a second water-cooled cavity. The first water-cooled cavity is formed in the wall of the first tube, and the second water-cooled cavity is formed in the wall of the second tube. The first water-cooled cavity includes a first cooling channel, a second cooling channel, and a first water-cooled cavity body. The second water-cooled cavity includes a third cooling channel, a fourth cooling channel, and a second water-cooled cavity body. The first cooling channel extends from one end of the first water-cooled cavity body toward the first sealing element, the second cooling channel extends from the other end of the first water-cooled cavity body toward the third sealing element, the third cooling channel extends from one end of the second water-cooled cavity body toward the third sealing element, and the fourth cooling channel extends from the other end of the second water-cooled cavity body toward the second sealing element.

5. The connection structure according to claim 1, characterized in that, The first interface end is detachably connected to the transmission module via a threaded connector, and the second interface end is detachably connected to the processing module via a threaded connector.

6. The connection structure according to claim 4, characterized in that, The third interface end is provided with a first annular protrusion extending outward, and the fourth interface end is provided with a second annular protrusion extending inward, the first annular protrusion and the second annular protrusion engaging; or... The fourth interface end is provided with a first annular protrusion extending outward, and the third interface end is provided with a second annular protrusion extending inward, and the first annular protrusion and the second annular protrusion are engaged.

7. The connection structure according to claim 6, characterized in that, The third sealing element is provided between the first annular convex edge and the second annular convex edge; a dovetail-shaped cross-section groove is formed on the surface of the first annular convex edge facing the second annular convex edge, and the third sealing element is located in the dovetail-shaped cross-section groove.

8. The connection structure according to claim 6, characterized in that, The second cooling channel is disposed within the first annular convex edge, and the third cooling channel is disposed within the second annular convex edge.

9. The connection structure according to claim 4, characterized in that, The first interface end has a third annular protrusion extending outward, and the second interface end has a fourth annular protrusion extending outward; the first cooling channel is disposed within the third annular protrusion, and the fourth cooling channel is disposed within the fourth annular protrusion.

10. The connection structure according to claim 2, characterized in that, The first pipe body is provided with a first support column, and a first traveling wheel is installed at the bottom of the first support column. The second pipe body is provided with a second support column, and a second traveling wheel is installed at the bottom of the second support column.

11. A cluster semiconductor device, characterized in that, It includes a processing module, a transmission module, and the connection structure described in any one of claims 1-10.

12. The cluster semiconductor device according to claim 11, characterized in that, The processing module includes an upstream flange, a cooling pipe body, a reaction chamber, and a downstream flange. The two ends of the cooling pipe body are connected to the upstream flange and the downstream flange, respectively. The downstream flange is detachably connected to the second interface end of the connection structure. The reaction chamber is located inside the cooling pipe body.

Images