Packaging structure of semiconductor module

Abstract

The utility model discloses a packaging structure of a semiconductor module, and belongs to the technical field of module packaging. Comprising a shell and an upper cover embedded in the shell, a limiting block extending in the first direction is arranged on the inner side of the shell, a clamping assembly extending in the second direction is arranged on the back face of the upper cover, and the limiting block is connected with the clamping assembly in a buckled mode. The beneficial effects of the above technical scheme are that the embedded upper cover is adopted, the installation of a module finished product and other power devices is prevented from being affected, and the buckle structure is arranged in the housing, so that the packaging is tight, and the loosening is not easy.

Description

Technical Field

[0001] This utility model relates to the field of module packaging technology, and in particular to a packaging structure. Background Technology

[0002] Currently, most common semiconductor integrated modules on the market use packaged designs, such as... Figure 1 , Figure 2 As shown, the upper cover 2 and the outer shell 1 are connected and fixed by external left and right snap-fit ​​structures 6. Due to the relatively thick design of the upper cover 2, the fit between the upper cover 2 and the outer shell 1 is not tight enough, and loosening and separation often occur. This loosening causes the upper surface of the upper cover 2 to sometimes be higher than the top post of the outer shell 1, thus affecting the installation effect of the module with the PCB (printed circuit board) or other power devices, resulting in poor fit. Utility Model Content

[0003] The purpose of this utility model is to provide a packaging structure for a semiconductor module to solve the above-mentioned technical problems;

[0004] A semiconductor module packaging structure, comprising,

[0005] The outer shell and the upper cover embedded inside the outer shell are provided with a limiting block extending in a first direction on the inner side of the outer shell and a snap-fit ​​component extending in a second direction on the back side of the upper cover. The limiting block is snapped into the snap-fit ​​component.

[0006] Preferably, the snap-fit ​​assembly includes a body and a hook portion for connecting the body.

[0007] Preferably, the hook abuts against the bottom surface of the limiting block, and the contact surface between the hook and the limiting block is a horizontal plane.

[0008] Preferably, the first direction forms a first angle with the inner wall of the outer shell, and the first angle is an acute angle.

[0009] Preferably, the second direction forms a second angle with the upper cover, and the second angle is a right angle.

[0010] Preferably, both the outer shell and the upper cover are rectangular.

[0011] Preferably, the bottom height of the snap-fit ​​component is lower than the setting height of the limiting block.

[0012] Preferably, the height of the upper cover is lower than the height of the outer shell.

[0013] Preferably, the outer shell is an injection-molded structure.

[0014] Preferably, it further includes a support member disposed between the back of the upper cover and the snap-fit ​​assembly.

[0015] The advantages of this utility model are: the use of an embedded top cover avoids affecting the installation of the finished module and other power devices, and the use of a snap-fit ​​structure inside the shell ensures tight sealing and prevents loosening. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of a semiconductor integrated module in the prior art;

[0017] Figure 2 This is a schematic diagram of the snap-fit ​​structure of a semiconductor integrated module in the prior art;

[0018] Figure 3 This is a top view of the packaging structure of the semiconductor module of this utility model;

[0019] Figure 4 This is a cross-sectional view of the packaging structure of the semiconductor module of this utility model;

[0020] Figure 5 This is a diagram illustrating the implementation steps of the semiconductor module packaging structure of this utility model.

[0021] In the attached diagram: 1. Outer shell; 2. Top cover; 3. Limiting block; 4. Snap-fit ​​assembly; 41. Body; 42. Hook; 5. Support; 6. Buckle structure. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0024] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the present invention.

[0025] A semiconductor module packaging structure, such as Figure 3 , Figure 4 As shown, including,

[0026] The outer shell 1 and the upper cover 2 embedded inside the outer shell 1 are provided with a limiting block 3 extending in a first direction on the inner side of the outer shell 1 and a snap-fit ​​component 4 extending in a second direction on the back of the upper cover 2. The limiting block 3 and the snap-fit ​​component 4 are snap-fit ​​connected.

[0027] Specifically, this utility model provides a semiconductor module packaging structure, in which a top cover 2 is embedded inside the outer shell 1, effectively avoiding interference with the installation of the finished module and other power devices. The top cover 2 is more securely fixed by being snapped together with the snap-fit ​​component 4 through the limiting block 3.

[0028] In a preferred embodiment, the snap-fit ​​assembly 4 includes a body portion 41 and a hook portion 42 that connects to the body portion 41.

[0029] The hook 42 abuts against the bottom surface of the limiting block 3, and the contact surface between the hook 42 and the limiting block 3 is a horizontal surface.

[0030] Specifically, the contact surface between the hook 42 and the limiting block 3 in the snap-fit ​​assembly 4 is a horizontal plane. During snap-fit, the contact between the hook 42 and the bottom surface of the limiting block 3 will provide uniform snap-fit ​​pressure, and the snap-fit ​​action is smooth and simple.

[0031] When disassembly or replacement is required, it facilitates easy disassembly without the need for excessive tools or complicated steps, simplifying the maintenance and replacement process.

[0032] In a preferred embodiment, the first direction forms a first angle with the inner wall of the outer casing 1, and the first angle is an acute angle.

[0033] Specifically, the limiting block 3 forms an acute angle with the inner wall of the outer shell 1, making the engagement between the locking component 4 and the limiting block 3 more precise. When the hook 42 of the locking component 4 contacts the limiting block 3, the acute angle design provides strong anti-loosening and anti-vibration performance, avoiding unnecessary loosening of the module due to external forces.

[0034] In a preferred embodiment, the second direction forms a second angle with the upper cover 2, and the second angle is a right angle.

[0035] Specifically, the snap-fit ​​component 4 forms a right angle with the top cover 2, which simplifies the snap-fit ​​process, makes the snap-fit ​​stable and smooth, and helps to improve the reliability and ease of disassembly of the packaged components.

[0036] In a preferred embodiment, both the outer shell 1 and the upper cover 2 are rectangular.

[0037] Specifically, the rectangular outer shell 1 and top cover 2 have a relatively simple design, making it easy to manufacture molds, simplifying the manufacturing process, enabling easier mass production, and reducing the complexity and difficulty of manufacturing processes.

[0038] The rectangular shape optimizes the strength-to-weight ratio of the outer shell 1, avoiding the problems of strength concentration and structural instability that may be caused by irregular shapes.

[0039] In a preferred embodiment, the bottom height of the snap-fit ​​component 4 is lower than the setting height of the limiting block 3.

[0040] Specifically, the bottom height of the snap-fit ​​component 4 is lower than the set height of the limit block 3, ensuring that the snap-fit ​​component 4 and the limit block 3 can abut together, making the connection more stable.

[0041] In a preferred embodiment, the height of the top cover 2 is lower than the height of the outer shell 1.

[0042] Specifically, the top cover 2 is embedded inside the outer shell 1, completely eliminating the problem of poor installation of other power devices due to assembly issues of the top cover 2.

[0043] In a preferred embodiment, the outer shell 1 is an injection-molded structure.

[0044] Specifically, the outer shell 1 is manufactured using an injection molding process. Injection molding is a process in which plastic material is heated to a liquid state, injected into a mold under high pressure, and then cooled and solidified to form a specific shape.

[0045] The injection-molded shell 1 is suitable for mass production, significantly reducing production costs. It can be designed in various colors, textures, and shapes to meet both aesthetic and functional requirements.

[0046] In a preferred embodiment, a support member 5 is also included, which is disposed between the back of the upper cover 2 and the snap-fit ​​assembly 4.

[0047] Specifically, the support 5 is fixed between the upper cover 2 and the snap-fit ​​assembly 4 to strengthen the connection between the snap-fit ​​assembly 4 and the upper cover 2 and prevent the snap-fit ​​assembly 4 from breaking.

[0048] Reference Figure 5 The implementation steps of this utility model are as follows:

[0049] (1) Design the dimensions of the embedded top cover and model it, and pre-design the assembly structure of the buckle part;

[0050] (2) Obtain the outer shell 1 that can match the upper cover 2 through injection molding process, and design the 3D structure and size of the buckle position;

[0051] (3) Verify the assembly of the top cover 2 and the outer shell 1, including verification at the model level and actual assembly at the product physical level, to obtain a complete semiconductor module;

[0052] (4) Install complete semiconductor modules and power devices such as PCB boards to verify the fit after installation.

[0053] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made based on the description and illustrations of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A packaging structure for a semiconductor module, characterized in that, include, The outer shell and the upper cover embedded inside the outer shell are provided with a limiting block extending in a first direction on the inner side of the outer shell and a snap-fit ​​component extending in a second direction on the back side of the upper cover. The limiting block is snapped into the snap-fit ​​component.

2. The packaging structure of the semiconductor module according to claim 1, characterized in that, The snap-fit ​​assembly includes a body and a hook that connects to the body.

3. The packaging structure of the semiconductor module according to claim 2, characterized in that, The hook abuts against the bottom surface of the limiting block, and the contact surface between the hook and the limiting block is a horizontal plane.

4. The packaging structure of the semiconductor module according to claim 1, characterized in that, The first direction forms a first angle with the inner wall of the outer shell, and the first angle is an acute angle.

5. The packaging structure of the semiconductor module according to claim 1, characterized in that, The second direction forms a second angle with the upper cover, and the second angle is a right angle.

6. The packaging structure of the semiconductor module according to claim 1, characterized in that, Both the outer shell and the upper cover are rectangular.

7. The packaging structure of the semiconductor module according to claim 1, characterized in that, The bottom height of the snap-fit ​​component is lower than the set height of the limiting block.

8. The packaging structure of the semiconductor module according to claim 1, characterized in that, The height of the upper cover is lower than the height of the outer shell.

9. The packaging structure of the semiconductor module according to claim 1, characterized in that, The outer shell is an injection-molded structure.

10. The packaging structure of the semiconductor module according to claim 1, characterized in that, It also includes a support member disposed between the back of the top cover and the snap-fit ​​assembly.

Images