Chip packaging structure

Abstract

The utility model relates to the technical field of chips, in particular to a chip packaging structure. The problem that a protective layer is easy to fall off during chip packaging in the prior art is solved, and the practicability of the chip is improved. A plurality of pins are fixed on the periphery of the base, a first mounting groove is formed in the base, a second mounting groove is formed in the center of the first mounting groove, a chip body is fixed in the second mounting groove, a third mounting groove is formed in the side wall of the first mounting groove, and protective layers are arranged on the first mounting groove and the third mounting groove; the base body is also provided with a heat dissipation structure used for heat dissipation of the chip body. According to the utility model, the coated protective layer is restricted by the third mounting groove after solidification, and is not easy to separate from the base even if the protective layer is collided, so that the protection service life of the chip body is longer, and the practicability is stronger.

Description

Technical Field

[0001] This utility model relates to the field of chip technology, specifically to chip packaging structure. Background Technology

[0002] A chip package is a protective structure used to protect a chip from physical damage, contamination, and moisture. It provides connectivity to external circuits, helps the chip operate at a safe temperature, and facilitates chip installation.

[0003] The existing chip packaging structure is designed to reduce the impact of the external environment on the chip. Its processing involves first bonding and fixing the chip to the base, then connecting the chip and the pins of the base through leads, and finally coating the base and the chip with a protective layer.

[0004] While this achieves isolation between the chip and the external environment, the following problems still exist: if the chip surface is not cleaned properly when the protective layer is installed, or if the chip is bumped during transportation, the protective layer may detach from the chip surface, exposing the chip and affecting its normal use. Utility Model Content

[0005] This invention proposes a chip packaging structure that solves the problem of easy peeling off of the protective layer in existing chip packaging, thereby improving the practicality of the chip.

[0006] The technical solution of this utility model is as follows:

[0007] Chip packaging structure, including base,

[0008] The base has several pins fixed around its perimeter. The base has a first mounting slot, and a second mounting slot is located in the center of the first mounting slot. The chip body is fixed in the second mounting slot. A third mounting slot is located on the side wall of the first mounting slot. The first and third mounting slots are provided with a protective layer. The base body is also provided with a heat dissipation structure for dissipating heat from the chip body.

[0009] Furthermore, the vertical projection surface of the first mounting groove is a rectangular structure, the cross-section of the third mounting groove is a right-angled trapezoidal structure, and the hypotenuse of the cross-section of the third mounting groove is located near the second mounting groove.

[0010] Furthermore, the base is made of polyurethane material, and the protective layer is made of epoxy resin material.

[0011] Furthermore, the vertical projection surface of the second mounting groove is rectangular, and an adhesive layer is fixed to the bottom of the second mounting groove. The adhesive layer is made of polyurethane adhesive and is fixedly connected to the chip body. The height of the chip body is higher than the depth of the second mounting groove.

[0012] Furthermore, the bottom of the first mounting groove is also provided with a wire plating layer, which is made of nickel material. The wire plating layer is provided with a plurality of leads, and each lead is connected to the chip body and the pin on both sides, respectively. The leads are made of copper material.

[0013] Furthermore, several support feet are fixed around the base. Each support foot has a mounting hole with an internal thread on the upper inner wall of the mounting hole. A positioning bolt is installed inside the mounting hole, and an external thread is provided on the lower side of the positioning bolt. The positioning bolt is slidably connected to the mounting hole, and the external thread engages with the internal thread. The cross-sectional area of ​​the top of the support foot is larger than the cross-sectional area of ​​the bottom of the support foot.

[0014] Furthermore, the heat dissipation structure includes a plurality of heat dissipation fins, each of which is fixedly disposed at the bottom of the base body, and the cross-section of each heat dissipation fin is an isosceles trapezoidal structure.

[0015] The working principle and beneficial effects of this utility model are as follows:

[0016] The working process of this embodiment is as follows: First, an adhesive layer is coated on the second mounting groove of the base. Then, the chip body is placed on the adhesive layer and bonded to it. Next, a wire plating layer is coated on the first mounting groove. After the wire plating layer solidifies, an electroplating device is used to add leads to the wire plating layer to connect the chip body and the pins. After the leads solidify, a protective coating layer is added to the first and third mounting grooves to complete the chip packaging process.

[0017] This embodiment features a first mounting groove on a base, a second mounting groove within the first mounting groove, and a third mounting groove on the side wall of the first mounting groove. A protective layer is applied to the first and third mounting grooves to protect the chip body. This invention replaces the prior art design of directly coating the protective layer onto the chip body. The protective layer of this invention, after solidification, is constrained by the third mounting groove, preventing it from easily detaching from the base even upon impact. This embodiment provides longer protection for the chip body and has strong practicality. Attached Figure Description

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0019] Figure 1 This is a schematic diagram of the existing technology;

[0020] Figure 2 This is a schematic diagram of the overall structure of this embodiment. Figure 1 ;

[0021] Figure 3 This is a schematic diagram of the overall structure of this embodiment. Figure 2 ;

[0022] Figure 4 This is a schematic diagram of the structure without the protective layer installed in this embodiment;

[0023] Figure 5 This is a schematic diagram of the internal structure of this embodiment;

[0024] Figure 6 This is a schematic diagram of the structure of the third mounting slot and the first mounting slot in this embodiment;

[0025] Figure 7 This is a schematic diagram of the structure of the second mounting slot and the first mounting slot in this embodiment;

[0026] Figure 8 This is a schematic diagram of the connection structure between the positioning bolt and the base in this embodiment.

[0027] In the picture:

[0028] 1. Base; 11. First mounting slot; 111. Wire plating layer; 112. Second mounting slot; 113. Third mounting slot; 114. Adhesive layer; 2. Protective layer; 3. Support foot; 31. Mounting hole; 311. Internal thread; 4. Pin; 5. Chip body; 6. Heat sink fins; 7. Positioning bolt; 71. External thread. Detailed Implementation

[0029] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this utility model.

[0030] like Figures 2-8 As shown, this embodiment proposes a chip packaging structure, which includes a base 1. Several pins 4 are fixedly disposed around the base 1. A first mounting slot 11 is disposed on the base 1, a second mounting slot 112 is disposed at the center of the first mounting slot 11, the chip body 5 is fixedly disposed within the second mounting slot 112, a third mounting slot 113 is disposed on the sidewall of the first mounting slot 11, a protective layer 2 is disposed on the first mounting slot 11 and the third mounting slot 113, and a heat dissipation structure is disposed on the base 1 body to dissipate heat from the chip body 5.

[0031] In this embodiment, the base 1 is made of polyurethane, and the protective layer 2 is made of epoxy resin. The chip packaging structure, with the base 1 made of polyurethane and the protective layer 2 made of epoxy resin, offers the following advantages: Excellent mechanical properties: Polyurethane has good flexibility and toughness, effectively absorbing impact and vibration, protecting the chip from external pressure and mechanical stress; Chemical corrosion resistance: Epoxy resin has good chemical resistance, resisting the erosion of various chemicals, thus extending the package's lifespan; Excellent electrical insulation: Both materials have good electrical insulation properties, effectively preventing current leakage and short circuits, improving chip reliability; Thermal stability: Both polyurethane and epoxy resin have good thermal stability, maintaining stable performance within a certain temperature range, adapting to different working environments; Low water absorption: The low water absorption of these materials effectively prevents moisture from penetrating the package, reducing the impact of humid environments on chip performance; Ease of processing: After curing, epoxy resin forms a hard protective layer 2, facilitating complex packaging structures and also aiding in subsequent surface treatment and surface mount technology (SMT).

[0032] In this embodiment, the vertical projection surface of the first mounting groove 11 is rectangular, used to hold the protective layer 2 and prevent it from spreading and flowing out after being applied to the chip, thus affecting its solidification. The cross-section of the third mounting groove 113 is a right-angled trapezoid, with the hypotenuse of the cross-section located near the second mounting groove 112. This design of the third mounting groove 113 ensures that after the protective layer 2 solidifies, it will be held in place within the third mounting groove 113, preventing it from easily detaching from the first mounting groove 11 and improving the protection performance of the chip. Furthermore, the right-angled trapezoidal cross-section of the third mounting groove 113 satisfies the requirement of increasing the adhesion between the protective layer 2 and the first mounting groove 11 while minimizing the volume of the third mounting groove 113 and reducing the amount of protective layer 2 used.

[0033] In this embodiment, the vertical projection surface of the second mounting groove 112 is rectangular. An adhesive layer 114, made of polyurethane adhesive, is fixedly disposed at the bottom of the second mounting groove 112. The adhesive layer 114 is fixedly connected to the chip body 5, and the height of the chip body 5 is greater than the depth of the second mounting groove 112. This design allows the chip body 5 to be positioned and fixed on the adhesive layer 114, facilitating its connection with the pins 4.

[0034] In this embodiment, the wire plating layer 111 is disposed at the bottom of the first mounting groove 11. The wire plating layer 111 is made of nickel, and several leads are disposed on the wire plating layer 111. Each lead is connected to the chip body 5 and the pin 4 on both sides, respectively. The leads are made of copper. The nickel wire plating layer 111 has good corrosion resistance, which can prevent damage caused by oxidation and environmental factors, and improve the reliability and durability of the package. The presence of the wire plating layer 111 provides a robust substrate, enhances the mechanical connection between the leads and the chip and pin 4, and reduces the risk of connection failure. The smooth and dense surface of the nickel plating helps to reduce contact resistance, improve overall electrical performance, and ensure efficient data transmission.

[0035] The heat dissipation structure in this embodiment includes several heat dissipation fins 6, each of which is fixedly disposed at the bottom of the base 1. The cross-section of each heat dissipation fin 6 is an isosceles trapezoidal structure. This design increases the contact area between the bottom and the outside, allowing more heat to be dissipated from the bottom of the base 1.

[0036] In this embodiment, several support feet 3 are fixedly arranged around the base 1. Mounting holes 31 are provided on the support feet 3. Internal threads 311 are provided on the upper inner wall of the mounting holes 31. Positioning bolts 7 are located inside the mounting holes 31, and external threads 71 ​​are provided on the lower side of the positioning bolts 7. The positioning bolts 7 are slidably connected to the mounting holes 31, and the external threads 71 ​​engage with the internal threads 311. The cross-sectional area of ​​the top of the support foot 3 is larger than the cross-sectional area of ​​the bottom of the support foot 3. This design ensures that when the chip needs to be removed, simply rotating the positioning bolts 7 will disengage the chip from its mounting position. Due to the action of the internal threads 311 and the external threads 71, the positioning bolts 7 will not disengage from the mounting holes 31. This effectively prevents the positioning bolts 7 from being lost during reinstallation after disengagement. When the positioning bolts 7 need to be replaced, simply engage the internal threads 311 with the external threads 71, and then continue rotating the positioning bolts 7 to disengage them from the mounting holes 31.

[0037] The working process of this embodiment is as follows: First, an adhesive layer 114 is coated on the second mounting groove 112 of the base 1. Then, the chip body 5 is placed on the adhesive layer 114 and bonded to the adhesive layer 114. Next, a wire plating layer 111 is coated on the first mounting groove 11. After the wire plating layer 111 solidifies, an electroplating device is used to add leads to the wire plating layer 111 to connect the chip body 5 and the pin 4. After the leads solidify, a protective coating layer 2 is added to the first mounting groove 11 and the third mounting groove 113 to complete the chip packaging process.

[0038] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A chip packaging structure, including a base (1), characterized in that, The base (1) has several pins (4) fixed around its perimeter. The base (1) has a first mounting groove (11) and a second mounting groove (112) at the center of the first mounting groove (11). The chip body (5) is fixed in the second mounting groove (112). The side wall of the first mounting groove (11) has a third mounting groove (113). The first mounting groove (11) and the third mounting groove (113) have a protective layer (2). The base (1) also has a heat dissipation structure for dissipating heat from the chip body (5).

2. The chip packaging structure according to claim 1, characterized in that, The vertical projection surface of the first mounting groove (11) is a rectangular structure, and the cross-section of the third mounting groove (113) is a right-angled trapezoidal structure. The hypotenuse of the cross-section of the third mounting groove (113) is located on the side close to the second mounting groove (112).

3. The chip packaging structure according to claim 1, characterized in that, The base (1) is made of polyurethane material, and the protective layer (2) is made of epoxy resin material.

4. The chip packaging structure according to claim 1, characterized in that, The vertical projection surface of the second mounting groove (112) is rectangular. An adhesive layer (114) is fixed at the bottom of the second mounting groove (112). The adhesive layer (114) is made of polyurethane adhesive. The adhesive layer (114) is fixedly connected to the chip body (5). The height of the chip body (5) is higher than the depth of the second mounting groove (112).

5. The chip packaging structure according to claim 4, characterized in that, The bottom of the first mounting groove (11) is also provided with a wire plating layer (111), which is made of nickel material. The wire plating layer (111) is provided with a plurality of leads, and each lead is connected to the chip body (5) and the pin (4) on both sides. The leads are made of copper material.

6. The chip packaging structure according to claim 1, characterized in that, The base (1) is also fixed with several support feet (3) around it. The support feet (3) are provided with mounting holes (31). The upper inner wall of the mounting hole (31) is provided with internal threads (311). The mounting hole (31) is provided with positioning bolts (7). The lower side of the positioning bolts (7) is provided with external threads (71). The positioning bolts (7) are slidably connected to the mounting holes (31). The external threads (71) and internal threads (311) are engaged. The cross-sectional area of ​​the top of the support foot (3) is greater than the cross-sectional area of ​​the bottom of the support foot (3).

7. The chip packaging structure according to claim 1, characterized in that, The heat dissipation structure includes several heat dissipation fins (6), each of which is fixedly disposed at the bottom of the base (1) body, and the cross-section of each heat dissipation fin (6) is an isosceles trapezoidal structure.

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