Potting assembly type filtering assembly and filter

Abstract

The utility model relates to the technical field of filters, and provides a potting assembly type filtering assembly and a filter, which comprises an insulating bottom shell, a magnetic core assembly, a PCB assembly and a copper bar assembly, a glue pouring groove is formed in the insulation bottom shell, at least part of the magnetic core assembly and at least part of the PCB assembly are arranged in the glue pouring groove, the copper bar assembly comprises a first copper bar and a second copper bar which are arranged in a spaced mode, the first copper bar and the second copper bar both penetrate through the magnetic core assembly, the middle of the first copper bar and the middle of the second copper bar are located in the glue pouring groove, and the glue pouring groove is filled with combination glue. According to the potting assembly type filtering assembly and the filter provided by the utility model, the glue pouring groove is arranged on the insulating bottom shell, at least parts of the magnetic core assembly, the PCB assembly and the copper bar assembly are arranged in the glue pouring groove, and the above components are integrally potting in the glue pouring groove through the bonding glue, so that an integral potting assembly type assembly is formed; and a plurality of elements can be encapsulated into a whole by only performing one-time glue pouring operation, the structure is compact, and the integrity is high.

Description

Technical Field

[0001] This utility model relates to the field of filter technology, and in particular to a potted assembly filter component and filter. Background Technology

[0002] The filter component is an important component in the vehicle electric drive system. Its main function is to provide the circuit system with the function of filtering out signals of specific frequencies, thereby ensuring the quality of the power supply signal.

[0003] In existing technologies, filter components typically employ a structure where a copper busbar is injection molded and bonded to a plastic housing to form a single, integrated part. Other components, such as magnetic cores, PCBs, and capacitors, are then mounted on this integrated component. However, this design has several drawbacks: First, after injection molding, the magnetic core, capacitors, and PCBs require multiple potting or dispensing processes for fixation, which is not only cumbersome but also inefficient. Second, the integrated injection molding structure of the copper busbar and plastic housing limits the placement and number of magnetic cores, thus affecting the overall performance of the filter component. Utility Model Content

[0004] This utility model provides a potting assembly filter component and filter to solve the defects of existing filter components, such as cumbersome injection molding process, low efficiency, and the integrated design of copper busbar and plastic shell, which limits the installation position and number of magnetic cores and affects the overall performance.

[0005] This utility model provides a potted assembly filter component, including: an insulating base shell, a magnetic core assembly, a PCB assembly, and a copper busbar assembly.

[0006] A potting groove is formed on the insulating base shell. At least a portion of the magnetic core assembly and at least a portion of the PCB assembly are disposed in the potting groove. The copper busbar assembly includes a first copper busbar and a second copper busbar that are spaced apart. The first copper busbar and the second copper busbar are both inserted through the magnetic core assembly, and the middle portions of the first copper busbar and the second copper busbar are located in the potting groove. The potting groove is filled with bonding adhesive.

[0007] According to the potting assembly filter component provided by this utility model, the potting groove is provided with baffle plates on both sides along the first direction, and the first copper busbar and the second copper busbar are both inserted through the baffle plates, and the first copper busbar and the second copper busbar are sealed with the baffle plates.

[0008] According to the potting assembly filter component provided by this utility model, a sealing ring is provided between the first copper busbar and the second copper busbar and the baffle plate.

[0009] According to the potting assembly filter component provided by this utility model, the baffle plate is snapped into the insulating base shell.

[0010] According to the potting assembly filter component provided by this utility model, at least one first conductive post is provided on the first side of the potting groove, and at least one second conductive post is provided on the second side of the potting groove. The first conductive post passes through the first copper busbar, and the second conductive post passes through the second copper busbar. The PCB assembly is threadedly connected to the first conductive post and the second conductive post respectively by conductive screws, so that the PCB assembly is electrically connected to the first copper busbar and the second copper busbar respectively by the conductive screws.

[0011] According to the potting assembly filter component provided by this utility model, the potting tank includes at least one magnetic core mounting slot, and the magnetic core components are respectively disposed in the magnetic core mounting slot.

[0012] According to the potting assembly filter component provided by this utility model, the potting tank includes two magnetic core mounting slots, and a PCB mounting slot is provided between the two magnetic core mounting slots, and the PCB assembly is disposed in the PCB mounting slot.

[0013] According to the potting assembly filter component provided by this utility model, the insulating bottom shell is provided with a first limiting groove and a second limiting groove, the middle part of the first copper busbar is located in the first limiting groove, and the middle part of the second copper busbar is located in the second limiting groove.

[0014] According to the potting assembly filter component provided by this utility model, the first limiting groove includes a plurality of first limiting segments spaced apart along a first direction, and the second limiting groove includes a plurality of second limiting segments spaced apart along a first direction.

[0015] Another aspect of this utility model provides a filter, including the potting assembly filter component as described in any of the preceding claims.

[0016] The potting assembly filter and filter provided by this utility model are formed by setting a potting groove on the insulating base shell, placing at least part of the magnetic core assembly, PCB assembly and copper busbar assembly in the potting groove, and potting the above components as a whole in the potting groove by bonding adhesive, so as to form an integral potting assembly. Multiple components can be potted into a whole by only one potting operation, and the structure is compact and highly integrated.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the potting assembly filter component provided in an embodiment of this utility model.

[0020] Figure 2 This is a schematic diagram of the insulating base shell in the potting assembly filter component provided in this embodiment of the utility model.

[0021] Figure 3 This is a schematic diagram of the copper busbar assembly installed on the insulating base shell in the potting assembly filter assembly provided in this embodiment of the utility model.

[0022] Figure 4 yes Figure 3 A magnified view of part A in the diagram.

[0023] Figure label:

[0024] 10. Insulating base shell; 110. Glue potting tank; 111. Magnetic core mounting slot; 112. PCB mounting slot; 113. First limiting slot; 114. Second limiting slot; 120. Glue baffle; 121. Buckle; 130. Slot; 140. First conductive post; 150. Second conductive post; 20. Magnetic core assembly; 30. PCB assembly; 40. Copper busbar assembly; 410. First copper busbar; 420. Second copper busbar. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0026] In the description of the embodiments of this utility model, it should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0027] In the description of the embodiments of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this utility model according to the specific circumstances.

[0028] In this embodiment of the utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0029] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0030] The following is combined Figures 1 to 4 This invention describes the potting assembly filter component and filter provided by this utility model.

[0031] See Figures 1 to 3 As shown, the potting assembly filter component provided in this embodiment of the present invention includes: an insulating base shell 10, a magnetic core assembly 20, a PCB assembly 30, and a copper busbar assembly 40.

[0032] An adhesive potting groove 110 is formed on the insulating base shell 10. At least a portion of the magnetic core assembly 20 and at least a portion of the PCB assembly 30 are disposed in the adhesive potting groove 110. The copper busbar assembly 40 includes a first copper busbar 410 and a second copper busbar 420 spaced apart. Both the first copper busbar 410 and the second copper busbar 420 pass through the magnetic core assembly 20, and the middle part of the first copper busbar 410 and the second copper busbar 420 is located in the adhesive potting groove 110. The adhesive potting groove 110 is filled with bonding adhesive.

[0033] The potting assembly filter and filter provided by this utility model are formed by setting a potting groove 110 on the insulating base shell 10, placing at least a portion of the magnetic core assembly 20, PCB assembly 30 and copper busbar assembly 40 in the potting groove 110, and potting the above components as a whole in the potting groove 110 by bonding adhesive, so as to form an integral potting assembly. Multiple components can be potted into a whole by only one potting operation, and the structure is compact and highly integrated.

[0034] Specifically, the insulating base shell 10 is made of insulating material, and an adhesive potting groove 110 is formed on the insulating base shell 10. The adhesive potting groove 110 can provide installation space for the magnetic core assembly 20, PCB assembly 30 and copper busbar assembly 40, etc. At the same time, after the magnetic core assembly 20, PCB assembly 30 and copper busbar assembly 40 are pre-fixed in the set position, the adhesive potting groove 110 is filled with bonding adhesive to encapsulate the magnetic core assembly 20, PCB assembly 30 and copper busbar assembly 40, etc.

[0035] At least a portion of the magnetic core assembly 20 and at least a portion of the PCB assembly 30 are disposed within the potting groove 110, indicating that at least a portion of the magnetic core assembly 20 and at least a portion of the PCB assembly 30 (such as...) Figure 1 As shown, the lower half of the magnetic core assembly 20 and the lower half of the PCB assembly 30 are located within the potting tank 110. After potting, the lower half of the magnetic core assembly 20 and the lower half of the PCB assembly 30 are submerged in the structural adhesive, thus securing the magnetic core assembly 20 and the PCB assembly 30. Alternatively, without affecting the performance of the magnetic core assembly 20 and the PCB assembly 30, both the magnetic core assembly 20 and the PCB assembly 30 can be completely located within the potting tank 110, and after potting, both will be completely submerged in the structural adhesive.

[0036] The first copper busbar 410 and the second copper busbar 420 are both inserted into the magnetic core assembly 20, and the middle part of the first copper busbar 410 and the second copper busbar 420 is located in the glue potting groove 110. After the glue is applied, the middle part of the first copper busbar 410 and the second copper busbar 420 can be fixed relative to the insulating bottom shell 10 by the bonding glue, thereby realizing the fixation of the copper busbar assembly 40.

[0037] The number of magnetic core assemblies 20 can be single or multiple. When the number of magnetic core assemblies 20 is multiple, the multiple magnetic core assemblies 20 are spaced apart along the length direction of the copper busbar assembly 40 (hereinafter the first direction), and the first copper busbar 410 and the second copper busbar 420 pass through all the magnetic core assemblies 20. In this embodiment, two magnetic core assemblies 20 are used as an example.

[0038] See Figures 1 to 3 As shown, according to some embodiments of the present invention, the glue-filling groove 110 is provided with glue-blocking plates 120 on both sides along the first direction, and the first copper busbar 410 and the second copper busbar 420 are both passed through the glue-blocking plates 120, and the first copper busbar 410 and the second copper busbar 420 are sealed with the glue-blocking plates 120.

[0039] By providing baffle plates 120 on both sides of the glue-filling tank 110 along the first direction, the two ends of the glue-filling tank 110 can be sealed by the baffle plates 120 to prevent the adhesive from overflowing to the outside. At the same time, by passing the first copper busbar 410 and the second copper busbar 420 through the baffle plate 120 and sealing them with the baffle plate 120, the copper busbar can remain straight and extend out of the glue-filling tank 110 without bending the ends, while ensuring the sealing performance of the glue-filling tank 110.

[0040] It should be noted that "first direction" specifically refers to Figure 3 The arrow in the diagram indicates the length direction of the copper busbar assembly.

[0041] See Figure 3 As shown, according to some embodiments of the present invention, a sealing ring 40 is provided between the first copper busbar 410 and the second copper busbar 420 and the baffle plate 120.

[0042] By providing sealing rings 40 between the first copper busbar 410 and the second copper busbar 420 and the baffle plate 120, the elastic deformation of the sealing rings 40 can fill the gap between the first copper busbar 410 and the second copper busbar 420 and the baffle plate 120, thereby sealing the mating parts. The structure is simple and easy to assemble.

[0043] Specifically, in this embodiment, the baffle plate 120 has clearance openings on both sides corresponding to the first copper busbar 410 and the second copper busbar 420, respectively. The first copper busbar 410 and the second copper busbar 420 pass through the clearance openings on the corresponding sides of the baffle plate 120, and the sealing ring 40 is located between the inner wall of the clearance opening and the outer wall of the copper busbar.

[0044] In practice, a positioning groove for positioning the sealing ring 40 can be provided on the inner wall of the clearance opening or the outer wall of the copper busbar.

[0045] See Figure 3 and Figure 4 As shown, according to some embodiments of the present invention, the baffle plate 120 and the insulating bottom shell 10 are snapped together.

[0046] By configuring the baffle plate 120 and the insulating base shell 10 in a snap-fit ​​configuration, the baffle plate 120 can be easily assembled and disassembled, thereby improving the maintainability and assembly efficiency of the component.

[0047] Specifically, in this embodiment, the insulating base shell 10 has slots 130 on both sides, and the baffle plate 120 has buckles 121 on both sides that engage with the slots 130. During assembly, only a pressing action needs to be applied to the baffle plate 120 to engage the buckles 121 on both sides with the corresponding slots 130.

[0048] See Figure 2 and Figure 3 As shown, according to some embodiments provided by this utility model, at least one first conductive post 140 is provided on the first side of the potting groove 110, and at least one second conductive post 150 is provided on the second side of the potting groove 110. The first conductive post 140 passes through the first copper busbar 410, and the second conductive post 150 passes through the second copper busbar 420. The PCB assembly 30 is threadedly connected to the first conductive post 140 and the second conductive post 150 respectively by conductive screws, so that the PCB assembly 30 is electrically connected to the first copper busbar 410 and the second copper busbar 420 respectively by conductive screws.

[0049] By setting the first conductive post 140 and the second conductive post 150 on both sides of the potting tank 110, the PCB assembly 30 can be fixed to the insulating base by the conductive screws, and the PCB assembly 30 can be electrically connected to the first copper busbar 410 and the second copper busbar 420 respectively, so as to complete the power supply of the PCB assembly 30. The process steps are simple, the structure is simple, and the space occupied is small.

[0050] Specifically, in this embodiment, both the first conductive post 140 and the second conductive post 150 are copper conductive posts, and each copper conductive post has a screw hole that matches the conductive screw. As an example, there are three of each of the first conductive post 140 and the second conductive post 150.

[0051] See Figure 1 and Figure 2 As shown, according to some embodiments of the present invention, the glue potting tank 110 includes at least one magnetic core mounting groove 111, and the magnetic core assemblies 20 are respectively disposed in the magnetic core mounting groove 111.

[0052] By providing a magnetic core mounting slot 111 in the glue potting tank 110, the magnetic core assembly 20 can be pre-positioned using the magnetic core mounting slot 111, thereby improving the stability of the magnetic core assembly 20 during glue potting and preventing it from deviating from the set position.

[0053] Specifically, when the magnetic core assembly 20 is located within the magnetic core mounting groove 111, the outer wall of the magnetic core assembly 20 abuts against the side wall of the magnetic core mounting groove 111, or there is a small gap between the outer wall of the magnetic core assembly 20 and the side wall of the magnetic core mounting groove 111, thereby enabling initial fixation of the magnetic core assembly 20. After potting, the adhesive fills the gap between the magnetic core assembly 20 and the magnetic core mounting groove 111, thereby stably fixing the magnetic core assembly 20 within the magnetic core mounting groove 111.

[0054] According to the potting assembly filter component provided by this utility model, the potting tank 110 includes two magnetic core mounting slots 111, and a PCB mounting slot 112 is provided between the two magnetic core mounting slots 111. The PCB assembly 30 is disposed in the PCB mounting slot 112.

[0055] By setting two magnetic core mounting slots 111 and a PCB mounting slot 112 between the two magnetic core mounting slots 111, the spatial layout of the filter components can be optimized and the compactness of the structure can be improved.

[0056] Specifically, since the PCB assembly 30 is relatively small in size while the magnetic core assembly 20 is relatively large in size, by setting the PCB assembly 30 in the middle position of the two magnetic core assemblies 20, the space of the potting groove 110 can be fully utilized, thereby improving the structural compactness.

[0057] See Figure 2 and Figure 3 As shown, according to some embodiments provided by this utility model, the insulating bottom shell 10 is provided with a first limiting groove 113 and a second limiting groove 114, the middle part of the first copper busbar 410 is located in the first limiting groove 113, and the middle part of the second copper busbar 420 is located in the second limiting groove 114.

[0058] By providing a first limiting groove 113 and a second limiting groove 114 on the insulating base shell 10, the first copper busbar 410 and the second copper busbar 420 can be limited by the first limiting groove 113 and the second limiting groove 114 respectively, preventing them from slipping and deviating from their initial positions during potting and subsequent use.

[0059] Specifically, the insulating base shell 10 is provided with multiple sets of protruding structures, and the opposing protruding structures form a first limiting groove 113 / a second limiting groove 114.

[0060] See Figure 2 and Figure 3As shown, according to some embodiments provided by this utility model, the first limiting groove 113 includes a plurality of first limiting segments spaced apart along the first direction, and the second limiting groove 114 includes a plurality of second limiting segments spaced apart along the first direction.

[0061] By configuring the limiting groove into multiple limiting segments spaced apart along the first direction, the copper busbar can be limited and fixed at different positions using multiple first limiting segments. While ensuring the stability of the copper busbar, the connection area between the copper busbar and the structural adhesive can also be increased, thereby improving the bonding strength of the copper busbar.

[0062] The filter provided by this utility model is described below. The filter described below can be referred to in correspondence with the potting assembly filter component described above.

[0063] The filter provided in this embodiment includes the potting assembly filter component as described in any of the preceding embodiments.

[0064] The filter provided by this utility model, due to the adoption of the above-mentioned potting and assembly filter components, also has the advantages of compact structure and high integration.

[0065] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A potted and assembled filter assembly, characterized in that, include: Insulating base shell, magnetic core assembly, PCB assembly and copper busbar assembly; A potting groove is formed on the insulating base shell. At least a portion of the magnetic core assembly and at least a portion of the PCB assembly are disposed in the potting groove. The copper busbar assembly includes a first copper busbar and a second copper busbar that are spaced apart. The first copper busbar and the second copper busbar are both inserted through the magnetic core assembly, and the middle portions of the first copper busbar and the second copper busbar are located in the potting groove. The potting groove is filled with bonding adhesive.

2. The potting assembly filter component according to claim 1, characterized in that, The glue-filling tank is provided with glue-blocking plates on both sides along the first direction. The first copper busbar and the second copper busbar are both inserted through the glue-blocking plates and are sealed to the glue-blocking plates.

3. The potting assembly filter component according to claim 2, characterized in that, Both the first copper busbar and the second copper busbar are provided with sealing rings between themselves and the baffle plate.

4. The potting assembly filter component according to claim 2, characterized in that, The baffle plate is engaged with the insulating bottom shell.

5. The potted assembly filter component according to any one of claims 1 to 4, characterized in that, The first side of the potting groove is provided with at least one first conductive post, and the second side of the potting groove is provided with at least one second conductive post. The first conductive post passes through the first copper busbar, and the second conductive post passes through the second copper busbar. The PCB assembly is threadedly connected to the first conductive post and the second conductive post respectively by conductive screws, so that the PCB assembly is electrically connected to the first copper busbar and the second copper busbar respectively by the conductive screws.

6. The potted assembly filter component according to any one of claims 1 to 4, characterized in that, The potting tank includes at least one magnetic core mounting slot, and the magnetic core assemblies are respectively disposed in the magnetic core mounting slot.

7. The potting assembly filter component according to claim 6, characterized in that, The potting tank includes two magnetic core mounting slots, and a PCB mounting slot is provided between the two magnetic core mounting slots. The PCB assembly is located in the PCB mounting slot.

8. The potted assembly filter component according to any one of claims 1 to 4, characterized in that, The insulating bottom shell is provided with a first limiting groove and a second limiting groove, the middle part of the first copper busbar is located in the first limiting groove, and the middle part of the second copper busbar is located in the second limiting groove.

9. The potting assembly filter component according to claim 8, characterized in that, The first limiting groove includes a plurality of first limiting segments spaced apart along a first direction, and the second limiting groove includes a plurality of second limiting segments spaced apart along a first direction.

10. A filter, characterized in that, Includes the potted assembly filter component as described in any one of claims 1 to 9.

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