Ethernet switch for 5G network optimization

Abstract

The utility model provides an Ethernet switch for 5G network optimization, and relates to the technical field of switches, the Ethernet switch comprises a switch main body and a control mainboard, the switch main body is internally provided with an installation separator plate, the surface of the installation separator plate is in screw connection with the control mainboard, the bottom of the installation separator plate is provided with a heat dissipation cavity, and the heat dissipation cavity is internally provided with a heat dissipation assembly. A positioning shaft is arranged in the center of the surface of the movable seat, a plurality of sets of heat dissipation hoses are connected to the surfaces of the heat dissipation fins, the heat dissipation hoses are wound around the surface of the positioning shaft, an L-shaped guide groove is formed in the surface of the mounting partition plate, the top end of the positioning shaft slides along the interior of the L-shaped guide groove, and the interior of the switch body is divided into different areas through the mounting partition plate. The heat dissipation assembly can be adjusted through the cooperation of the moving seat and the moving position of the positioning shaft, and the heat dissipation hose is filled with the phase change material for heat absorption, so that the interior of the whole switch main body can carry out centralized heat dissipation distinguishing and zoning heat dissipation through the movement of the moving seat, resources are saved, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of switch technology, and in particular to an Ethernet switch optimized for 5G networks. Background Technology

[0002] According to Chinese Publication No. CN109151618A, a network switch belongs to the field of network equipment technology. It includes a switch body with a network cable interface, a limiting device, and a slotted through-hole sequentially connected on the rear side. A spring, a fixing plate, a fixing rod, and a rubber pad are fixedly installed inside the limiting slot. A network cable connector is installed at the lower end of the rubber pad and is movably connected to the network cable interface. A fixing block is fixedly connected to the outside of the fixing plate and is disposed within the through-hole. This invention is easy to operate, has a simple structure, and can firmly hold the network cable in the network cable interface, preventing it from loosening, thus making the network connection more stable. The fan improves the switch's heat dissipation performance and slows down the aging of internal components. The rotating fixing bracket improves the switch's applicability, allowing it to be fixedly mounted on other objects when horizontal placement is inconvenient.

[0003] The aforementioned patent documents and existing technologies show that when dissipating heat inside a switch, a single heat dissipation window is generally set up in conjunction with a fan for heat dissipation. The heat dissipation position is fixed and cannot be adjusted, making it impossible to target and adjust the heat dissipation for high-heat areas, resulting in poor heat dissipation efficiency. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing switches, such as the inability to perform adjustable and targeted heat dissipation and low heat dissipation efficiency, and to propose a 5G network optimized Ethernet switch.

[0005] To achieve the above objectives, this utility model adopts the following technical solution: a 5G network optimized Ethernet switch, comprising a switch body and a control motherboard. The switch body has an internal mounting partition, and the control motherboard is screwed to the surface of the mounting partition. The bottom of the mounting partition has a heat dissipation cavity, and the heat dissipation cavity contains a heat dissipation assembly. The heat dissipation assembly includes heat dissipation fins and a movable base. A positioning shaft is located at the center of the movable base's surface. Multiple sets of heat dissipation hoses are connected to the surface of the heat dissipation fins and are wound around the surface of the positioning shaft. A limiting buckle that engages with the surface of the heat dissipation hoses is bolted to the surface of the movable base. An L-shaped guide groove is formed on the surface of the mounting partition, and the top end of the positioning shaft slides along the inside of the L-shaped guide groove.

[0006] Preferably, the bottom surface inside the heat dissipation cavity is provided with an adjustment groove corresponding to the L-shaped guide groove, and the bottom end of the movable seat is slidably connected to the inside of the adjustment groove. The external end of the switch body is provided with a transmission connection port.

[0007] Preferably, the switch body has a heat dissipation window at the position corresponding to the heat dissipation cavity on its side, and air guide channels are evenly distributed in an array between adjacent adjustment slides.

[0008] Preferably, a ventilation window is provided at the center of the surface of the mounting partition, and a mounting groove is provided on the surface of the mounting partition, through which the control main board is connected to the surface of the mounting partition.

[0009] Preferably, the top surface of the switch body is hinged with positioning cover plates on both sides, the end of the positioning cover plate is provided with a cover plate block, and the edge of the end of the positioning cover plate is provided with a positioning pin hole.

[0010] Preferably, the top surface of the positioning cover plate near the end that is hinged to the main body of the switch is provided with a pressing block, and the side of the pressing block is provided with a storage groove.

[0011] Preferably, the outer edges of the switch body are rounded, the mounting plate is connected to the inside of the switch body with screws, and the outer wall of the mounting plate abuts against the inner wall of the switch body.

[0012] Beneficial effects

[0013] In this invention, the interior of the switch body is divided into different areas by installing partitions. Heat dissipation is achieved using heat dissipation chambers and heat dissipation components. The internal heat dissipation components can be adjusted in position by moving the movable base in conjunction with the positioning shaft. Phase change material is filled inside the heat dissipation hoses to absorb heat. The entire interior of the switch body can be divided into centralized heat dissipation areas by moving the movable base. This allows for adjustment of the heat dissipation areas within the switch body, enabling different levels of heat dissipation for high-heat and low-heat areas. This zoned heat dissipation saves resources and improves heat dissipation efficiency.

[0014] In this utility model, the top surface of the switch body is sealed by positioning cover plates hinged at both ends, and the sides are opened by setting pressing blocks, so that the screws to be removed can be kept in the storage groove after the positioning cover plates are opened, preventing loss. Compared with the traditional snap-on flat structure, the side opening method makes it easier to quickly unfold the top of the switch body, which facilitates the display and maintenance of the internal space. At the same time, it avoids the lack of space when the positioning cover plates are completely removed. The structure is simple and facilitates the quick opening and closing of the top surface of the switch body. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a structural diagram of the positioning cover plate of this utility model when opened;

[0017] Figure 3This is a diagram showing the internal structure of the main body of the switch of this utility model;

[0018] Figure 4 This is a structural diagram of the internal partition of the switch body of this utility model;

[0019] Figure 5 This is a structural diagram of the internal structure of the heat dissipation cavity of this utility model;

[0020] Figure 6 This is a partial structural diagram of the heat dissipation component of this utility model.

[0021] Legend:

[0022] 1. Switch body; 2. Transmission connection port; 3. Positioning cover; 4. Cover block; 5. Positioning pin hole; 6. Pressing block; 7. Storage groove; 8. Mounting partition; 9. Control main board; 10. L-shaped guide groove; 11. Ventilation window; 12. Mounting groove; 13. Heat dissipation cavity; 14. Heat dissipation window; 15. Air guide channel; 16. Adjustment slide; 17. Heat dissipation assembly; 1701. Heat dissipation fins; 1702. Movable base; 1703. Positioning shaft; 1704. Limiting buckle; 1705. Heat dissipation hose. Detailed Implementation

[0023] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0024] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Specific Implementation Example 1:

[0026] Reference Figure 1-6A 5G network-optimized Ethernet switch includes a switch body 1 and a control motherboard 9. The switch body 1 has an internal mounting partition 8, and the control motherboard 9 is screwed to the surface of the mounting partition 8. The bottom of the mounting partition 8 has a heat dissipation cavity 13, and a ventilation window 11 is located at the center of its surface. The mounting partition 8 also has a mounting groove 12, through which the control motherboard 9 is connected to the surface of the mounting partition 8. The mounting partition 8 is fixed inside the switch body 1 by screws, and the control motherboard 9 is screwed to the surface of the mounting partition 8. The mounting partition 8 divides the interior of the switch body 1 into different areas, with the bottom forming the heat dissipation cavity 13. During operation, the control motherboard 9 generates heat, which is transferred to the mounting partition 8. The heat generated by the control motherboard 9 can be transferred to the heat dissipation cavity 13 more quickly through the ventilation window 11. The mounting groove 12 is used for accurate positioning and installation of the control motherboard 9, ensuring good contact between the control motherboard 9 and the mounting partition 8, facilitating heat conduction. The ventilation window 11 increases the heat transfer channels and improves the efficiency of heat conduction. The size and shape of the mounting slot 12 match the control motherboard 9. The mechanical structure design enables precise installation of the control motherboard 9. The mounting partition 8 provides a stable mounting position for the control motherboard 9, ensuring that it will not shake or shift inside the switch body 1. It effectively separates the control motherboard 9 from the heat dissipation cavity 13, while also conducting heat to the heat dissipation cavity 13 for heat dissipation, thus improving the targeting and efficiency of heat dissipation.

[0027] When the switch body 1 is used for internal heat dissipation, the heat dissipation cavity 13 is equipped with a heat dissipation assembly 17. The heat dissipation assembly 17 includes heat dissipation fins 1701 and a movable base 1702. A positioning shaft 1703 is located at the center of the surface of the movable base 1702. Multiple sets of heat dissipation hoses 1705 are connected to the surface of the heat dissipation fins 1701, and the heat dissipation hoses 1705 are wound around the surface of the positioning shaft 1703. A limiting buckle 1704 that engages with the surface of the heat dissipation hoses 1705 is bolted to the surface of the movable base 1702. An L-shaped guide groove 10 is opened on the surface of the mounting partition 8. The top end of the positioning shaft 1703 slides along the inside of the L-shaped guide groove 10. An adjustment mechanism is provided on the bottom surface of the heat dissipation cavity 13 at a position corresponding to the L-shaped guide groove 10. The sliding groove 16 is connected to the bottom of the movable seat 1702. When the heat dissipation position needs to be adjusted, the movable seat 1702 is moved in the sliding groove 16 by the movable positioning shaft 1703, thereby changing the position of the heat dissipation component 17 in the heat dissipation cavity 13. The heat dissipation hose 1705 is filled with phase change material. After absorbing heat, the phase change material will undergo a phase change, thereby absorbing the heat transferred from the control motherboard 9. The heat dissipation fins 1701 are usually made of materials with high thermal conductivity, such as aluminum or copper, which can quickly dissipate heat to the surrounding environment. The phase change material inside the heat dissipation hose 1705 uses its heat absorption characteristics during the phase change process to absorb heat and achieve efficient heat transfer. The design of the L-shaped guide groove and the adjusting slide 16 is similar to a guide rail structure. By limiting the movement trajectory of the positioning shaft 1703 and the moving seat 1702, the position of the heat dissipation component 17 can be precisely adjusted. The adjustability of the heat dissipation component 17 allows the internal heat dissipation of the switch body 1 to be differentiated according to different heat conditions, which improves the flexibility and efficiency of heat dissipation. The use of phase change material enhances the heat absorption capacity, which can more effectively reduce the temperature of the control motherboard 9 and ensure its stable operation. The combination of heat dissipation fins 1701 and heat dissipation hoses 1705 increases the heat dissipation area and heat dissipation effect, which helps to dissipate heat quickly.

[0028] A heat dissipation window 14 is provided on the side of the switch body 1 at a position corresponding to the heat dissipation cavity 13. Air guide channels 15 are evenly distributed between adjacent adjustment slides 16. The heat dissipation window 14 provides an exhaust channel for hot air within the heat dissipation cavity 13. The air guide channels 15 guide the flow direction of hot air, promote air convection, and accelerate heat dissipation. The design of the heat dissipation window 14 utilizes the principles of hot air rising and air convection, allowing hot air to naturally escape from the switch body 1. The design of the air guide channels 15 optimizes the airflow structure, reduces airflow resistance, and improves airflow speed and efficiency, helping to maintain temperature balance within the heat dissipation cavity 13, preventing localized overheating, and further improving the stability and reliability of the switch. A transmission connection port 2 is provided at the external end of the switch body 1, through which lines are connected. The control motherboard 9 processes the signals for transmission and exchange.

[0029] Positioning covers 3 are hinged to both sides of the top surface of the switch body 1. A cover plate block 4 is located at the end of each positioning cover 3, and a positioning pin hole 5 is provided at the edge of the end of the positioning cover 3. The positioning cover 3 can be opened or closed for convenient maintenance and operation of the switch's internal components. A pressing block 6 is used to open or close the positioning cover 3. A storage recess 7 can be used to store small tools or spare parts. A pressing block 6 is located on the top surface of the positioning cover 3 near the end hinged to the switch body 1, and a storage recess 7 is provided on the side of the pressing block 6. The outer edges of the switch body 1 are all rounded to reduce potential injury to users from sharp corners and to enhance the switch's appearance. A mounting partition 8 is screwed into the interior of the switch body 1, and the outer wall of the mounting partition 8 abuts against the inner wall of the switch body 1. The hinged structure allows the positioning cover 3 to rotate flexibly, enabling opening and closing operations. The pressing block 6 is ergonomically designed, allowing users to easily apply force to open or close the cover. The storage recess 7 utilizes the space of the positioning cover 3, increasing the functionality of the switch.

[0030] The interior of the switch body 1 is divided into different areas by installing partitions 8. Heat dissipation is achieved using heat dissipation chambers 13 and heat dissipation components 17. The adjustability of the heat dissipation components 17 and the use of phase change materials improve heat dissipation efficiency. The design of structures such as heat dissipation windows 14, air ducts 15, and ventilation windows 11 enhances airflow and heat transfer. The positioning cover 3 facilitates maintenance and operation, while the rounded corners and overall structural design improve safety and stability. These designs work together to effectively reduce the internal temperature of the switch, ensuring the stable operation of the control motherboard 9 and improving the switch's performance, reliability, and maintainability. Specific Implementation Example 2:

[0032] Reference Figure 1-6 Based on the content of the above specific embodiments, the following content is further disclosed:

[0033] In practical use, to improve heat dissipation efficiency, a corresponding fan structure can be added around the heat dissipation fins 1701 to accelerate airflow.

[0034] The heat dissipation hose 1705 is filled with phase change material. When the Ethernet switch is operating, the control board 9 generates heat, which is conducted to the heat dissipation cavity 13 through the mounting partition 8. The phase change material inside the heat dissipation hose 1705 in the heat dissipation cavity 13 begins to absorb heat. When the temperature is below the phase change temperature, the phase change material is in a solid state. As the temperature rises, when the phase change temperature is reached, the phase change material begins to change from a solid state to a liquid state, absorbing a large amount of heat. In this process, the phase change material can effectively reduce the temperature of the surrounding environment, thereby reducing the temperature of the control board 9. When the switch stops working or the temperature drops, the phase change material will change from a liquid state to a solid state again, releasing the absorbed heat. This process is reversible, and the phase change material can be reused repeatedly, providing a continuous cooling effect for the switch.

[0035] The following materials can be selected based on their type of phase change material and their suitability for use in switches:

[0036] Paraffin-based phase change materials: Paraffin is a common phase change material with high latent heat and a suitable phase change temperature range. It has good chemical stability, is non-toxic and odorless, and is relatively inexpensive. In Ethernet switches, paraffin-based phase change materials can be selected and formulated according to the operating temperature requirements of the control motherboard. For example, paraffins with different melting points can be mixed to obtain a phase change material suitable for the switch's operating temperature. The disadvantage of paraffin-based phase change materials is their relatively low thermal conductivity, which may require combination with other materials with high thermal conductivity to improve heat dissipation.

[0037] Fatty acid phase change materials (PCTs): Fatty acid PCTs also possess high latent heat and suitable phase change temperatures. They typically exhibit good thermal and chemical stability, and the phase change temperature can be controlled by adjusting the type and ratio of fatty acids. In switches, fatty acid PCTs can be used in conjunction with heat-conducting components such as 1701 heat sink fins to improve heat transfer efficiency. They can also be composited with other materials to improve their thermal conductivity and mechanical properties. A drawback of fatty acid PCTs is their potential corrosiveness, requiring appropriate encapsulation and protection.

[0038] Metal alloy phase change materials (PCMs): These materials possess high thermal conductivity and latent heat, and exhibit a wide phase change temperature range. For example, some low-melting-point metal alloys, such as bismuth-tin alloys, can undergo phase changes at relatively low temperatures, making them suitable for heat dissipation in electronic devices. In Ethernet switches, PCMs can provide highly efficient heat dissipation, rapidly absorbing and transferring heat. They typically require encapsulation to prevent chemical reactions between the metal and other components. The disadvantages of PCMs include relatively high cost and potential volume changes during the phase change process, necessitating consideration of the encapsulation material's suitability.

[0039] To ensure the stable operation and safety of phase change materials in switches, they need to be properly encapsulated.

[0040] Encapsulation materials: Materials with good thermal conductivity and mechanical strength can be selected as encapsulation materials, such as metal shells, plastic shells, or silicone. The encapsulation material should be able to withstand the volume changes and pressure of the phase change material during the phase change process, while preventing leakage of the phase change material. For metal shell encapsulation, welding, sealant, or other methods can be used for sealing; for plastic shells or silicone encapsulation, injection molding, compression molding, or other processes can be used for molding.

[0041] Installation method: The phase change material can be installed inside the heat dissipation hose 1705 by filling, potting, or other methods. During installation, ensure that the phase change material is in full contact with the inner wall of the heat dissipation hose 1705 to improve heat transfer efficiency.

[0042] The heat dissipation hose 1705 can be made of flexible material to better adapt to the internal space layout and heat dissipation requirements of the switch. At the same time, both ends of the heat dissipation hose 1705 should be well connected to heat-conducting components such as the heat sink fins 1701 to ensure smooth heat transfer. Specific Implementation Example 3:

[0044] Reference Figure 1-6 Based on the content of the above specific embodiments, the following content is further disclosed:

[0045] In summary:

[0046] 1. The interior of the switch body 1 is divided into different areas by installing partitions 8. Heat dissipation is achieved using heat dissipation chambers 13 and heat dissipation components 17. The heat dissipation components 17 can be adjusted by moving the movable base 1702 in conjunction with the positioning shaft 1703. Phase change material is filled inside the heat dissipation hose 1705 to absorb heat. The entire interior of the switch body 1 can be divided into centralized heat dissipation areas by moving the movable base 1702. This allows for adjustment of the heat dissipation areas within the switch body 1, enabling different levels of heat dissipation for high-heat and low-heat areas. This zoned heat dissipation saves resources and improves heat dissipation efficiency.

[0047] 2. The top surface of the switch body 1 is sealed by positioning covers 3 hinged at both ends. Pressing blocks 6 allow for opening from both sides, preventing the removal of screws from being stored in the storage recesses 7 after the positioning covers 3 are opened, thus preventing loss. Compared to traditional snap-on flat structures, this side-opening method facilitates the quick unfolding of the top of the switch body 1, making it easier to view and maintain the internal space. It also avoids the lack of space when all positioning covers 3 are removed, resulting in a simple structure.

[0048] It facilitates quick opening and closing of the top surface of the switch body 1.

[0049] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0050] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A 5G network optimized Ethernet switch, comprising a switch body (1) and a control motherboard (9), characterized in that: The switch body (1) has an internal mounting partition (8). A control motherboard (9) is screwed onto the surface of the mounting partition (8). A heat dissipation cavity (13) is provided at the bottom of the mounting partition (8). A heat dissipation component (17) is provided inside the heat dissipation cavity (13). The heat dissipation component (17) includes heat dissipation fins (1701) and a movable base (1702). A positioning shaft (1703) is provided at the center of the surface of the movable base (1702). Multiple sets of heat dissipation hoses (1705) are connected to the surface of the heat dissipation fins (1701), and the heat dissipation hoses (1705) are wound around the surface of the positioning shaft (1703). A limiting buckle (1704) that engages with the surface of the heat dissipation hoses (1705) is bolted onto the surface of the movable base (1702). An L-shaped guide groove (10) is provided on the surface of the mounting partition (8). The top end of the positioning shaft (1703) slides along the inside of the L-shaped guide groove (10).

2. The Ethernet switch optimized for 5G networks according to claim 1, characterized in that: The bottom surface of the heat dissipation cavity (13) is provided with an adjustment groove (16) corresponding to the L-shaped guide groove (10), and the bottom end of the movable seat (1702) is slidably connected to the adjustment groove (16). The external end of the switch body (1) is provided with a transmission connection port (2).

3. The Ethernet switch optimized for 5G networks according to claim 2, characterized in that: The main body (1) of the switch is provided with a heat dissipation window (14) at the position corresponding to the heat dissipation cavity (13) on the side, and air guide channels (15) are evenly distributed between adjacent adjustment slides (16).

4. The Ethernet switch optimized for 5G networks according to claim 1, characterized in that: A ventilation window (11) is provided at the center of the surface of the mounting partition (8), and a mounting groove (12) is provided on the surface of the mounting partition (8). The control main board (9) is connected to the surface of the mounting partition (8) through the mounting groove (12).

5. The Ethernet switch optimized for 5G networks according to claim 1, characterized in that: The main body (1) of the switch is hinged to both sides of the top surface and is provided with positioning cover plates (3). The end of the positioning cover plate (3) is provided with a cover plate block (4). The edge of the end of the positioning cover plate (3) is provided with a positioning pin hole (5).

6. A 5G network optimized Ethernet switch according to claim 5, characterized in that: The positioning cover (3) has a pressing block (6) on the top surface of one end that is hinged to the main body (1) of the switch, and a storage groove (7) is provided on the side of the pressing block (6).

7. A 5G network optimized Ethernet switch according to claim 1, characterized in that: The outer edges of the switch body (1) are all rounded. The mounting partition (8) is connected to the inside of the switch body (1) by screws, and the outer wall of the mounting partition (8) abuts against the inner wall of the switch body (1).

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