High-conductivity easy-to-clean circuit board

Abstract

The utility model discloses a circuit board with strong conductivity and easy to clean, which relates to the field of circuit boards and comprises a circuit board body and a mounting seat, the circuit board body comprises a substrate, a conductive layer is fixedly mounted at the top of the substrate, and a power supply layer is fixedly connected at the top of the conductive layer; a signal layer is fixedly mounted at the top of the power supply layer, an insulating layer is fixedly connected to the top of the signal layer, a bonding pad layer is fixedly mounted at the top of the insulating layer, and an antifouling coating is fixedly connected to the upper surface of the bonding pad layer; and a circuit board body is arranged at the top of the mounting seat. According to the circuit board, the substrate, the conductive layer and the signal layer are arranged, so that the circuit board has high conductivity and excellent anti-oxidation effect, the insulating layer is arranged, so that the circuit board has good heat resistance, the clamping plate and the spring are arranged, the circuit board can be quickly disassembled and assembled, and meanwhile, the antifouling coating is arranged, so that the circuit board can be easily cleaned.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board technical field, concretely is an easy clean circuit board with strong conductivity. BACKGROUND

[0002] Circuit board is an indispensable component in modern electronic equipment, which carries electronic components and provides circuit connection, supports the normal operation of electronic equipment, and is widely used in various electronic equipment, such as consumer electronics, automotive electronics, industrial control, medical electronics and other fields.

[0003] The existing circuit board is usually propelled by a cylinder during use, so it is not easy to control the propulsion force, and a large force may cause the drill bit to be stuck, and a small force may affect the drilling efficiency.

[0004] In order to overcome the above defects, the prior art (application number: 202022922456.7, application date: 2020.12.09 Chinese patent) discloses an integrated circuit board with good weather resistance, which can improve the overall fire resistance, waterproofness, corrosion resistance and antistatic property of the board body through the first protective layer of ATO antistatic coating, polytetrafluoroethylene coating and hafnium dioxide coating, and can improve the overall wear resistance, oxidation resistance and mildew resistance of the board body by setting the second protective layer including ceramic coating, aluminum oxide coating and sodium pentachlorophenol coating. The above structure effectively improves the overall weather resistance of the integrated circuit board, thereby prolonging its service life.

[0005] Although the prior art can solve the problem of weather resistance of the integrated circuit board, the multi-layer protective layer does not directly affect the conductivity of the circuit board, but also does not directly contribute to the conductivity of the circuit board. With the increase of use time, the coating and components on the circuit board may gradually age or be damaged, resulting in a decrease in the conductivity of the circuit board, so that the conductivity of the integrated circuit board is not good, and the oxidation resistance effect cannot be effectively achieved. Moreover, the circuit board cannot be quickly disassembled and installed, and the difficulty of the circuit board is increased.

[0006] Therefore, we propose an easy-to-clean circuit board with strong conductivity to solve the above problems. Utility model content

[0007] The utility model discloses a purpose lies in providing a kind of easy cleaning circuit board of strong conductivity to solve the problem of the integrated circuit board in the market in the above background technology in use, but although multiple protective layers have no direct influence on the conductivity of circuit board, but also have no direct contribution to the conductivity of circuit board, with the increase of use time, coating and element on circuit board can gradually age or be damaged, leading to its conductivity performance decline, so that the conductivity of integrated circuit board is not good, and unable to effectively achieve the problem of anti-oxidation effect, and unable to quickly disassemble and install circuit board, simultaneously increase the difficulty of circuit board.

[0008] To achieve the above object, the utility model provides the following technical scheme: a kind of easy cleaning circuit board of strong conductivity, including circuit board body and mounting seat, the circuit board body includes substrate, the top of the substrate is fixedly installed with conductive layer, the top of the conductive layer is fixedly connected with power layer;

[0009] Further include: the top of the power layer is fixedly installed with signal layer, the top of the signal layer is fixedly connected with insulating layer, the top of the insulating layer is fixedly installed with solder pad layer, the upper surface of the solder pad layer is fixedly connected with anti-fouling coating;

[0010] The top of the mounting seat is provided with circuit board body, recesses are symmetrically provided on the two sides of the mounting seat, and positioning bolts are symmetrically screw-connected in the interiors of the two sides of the mounting seat.

[0011] As the preferred technical scheme of the present application, cavities are provided in the interiors of the two sides of the mounting seat, and four guide rods are fixedly installed in the interiors of the cavities, the outer walls of the guide rods are movably connected with moving plates, the moving plates penetrate through the recesses at top ends, a plurality of springs are fixedly connected to the left sides of the moving plates, and clamping plates are fixedly installed on the top of the moving plates.

[0012] As the preferred technical scheme of the present application, the conductive layer is electrically connected between the substrate and the power layer, and the conductive layer is made of copper foil, the substrate is made of glass fiber reinforced plate material, the conductive layer made of copper foil is connected through the substrate, has excellent electrical conductivity, can ensure efficient and stable signal transmission on the circuit board, and improve the efficiency of signal conduction.

[0013] As the preferred technical scheme of the present application, the number of insulating layers is two, and the two insulating layers are tightly attached between the signal layer and the substrate, the insulating layer is made of glass fiber epoxy resin, and the outer surface of the signal layer is provided with a silver plating layer, the insulating layer made of glass fiber epoxy resin has good heat resistance, plays a role in isolation and protection in the circuit board, and prevents short circuit between the conductive layers.

[0014] As a preferred technical solution of this application, the pad layer is bonded to the insulating layer and the anti-fouling coating, and the pad layer is made of solder resist ink material. The anti-fouling coating is a fluoride coating. With the presence of the anti-fouling coating, when the circuit board body is removed for cleaning, the surface contaminants can be removed more easily, which not only improves the cleaning efficiency, but also reduces the risk of damage to the circuit board during the cleaning process.

[0015] As a preferred technical solution of this application, the groove and the cavity are connected, the groove and the cavity are slidably connected to the moving plate, and the moving plate is movably connected to the guide rod. By manually moving the two clamping plates outward, the clamping plates drive the moving plate to slide outward in the corresponding groove and cavity.

[0016] As a preferred technical solution of this application, the two ends of the spring are fixedly connected to the moving plate and the inner wall of the cavity, the moving plate and the clamping plate are tightly fitted, and the inside of the clamping plate is provided with a rubber protective layer. The moving plate is driven to slide inward in the groove and cavity by the rebound force of the compressed spring, so that the moving plate drives the clamping plate to move until it is fitted to the outer wall of the circuit board body.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] This highly conductive and easy-to-clean circuit board, through the inclusion of a substrate, conductive layer, and signal layer, provides strong conductivity and excellent oxidation resistance. The addition of an insulating layer ensures good heat resistance, while the inclusion of a clamping plate and springs allows for quick disassembly and assembly. Furthermore, an anti-fouling coating facilitates easy cleaning. Details are as follows:

[0019] 1. A substrate and a conductive layer are provided. Through the cooperation between the substrate and the conductive layer, the signal transmission on the circuit board can be ensured to be efficient and stable, the signal conduction efficiency can be improved, and the conductivity of the circuit board can be strengthened.

[0020] Furthermore, a signal layer is set up. By setting up the signal layer, the conductivity of the circuit board can be further improved, and a protective film can be formed on the surface of the circuit board to prevent oxidation reaction and thus improve the oxidation resistance of the circuit board.

[0021] Furthermore, an insulating layer is provided, made of glass fiber epoxy resin, to prevent short circuits between conductive layers, while also being able to withstand high-temperature environments, ensuring that the circuit board can work normally under high-temperature conditions.

[0022] 2. A clamping plate and spring are provided. The clamping plate, moving plate, groove, cavity, guide rod, spring and mounting base work together to facilitate quick disassembly and installation of the circuit board;

[0023] Furthermore, an anti-fouling coating is provided. The anti-fouling coating, made of fluoride coating, is applied to the upper surface of the pad layer on the circuit board body. This coating can easily remove surface contaminants, which not only improves cleaning efficiency but also reduces the risk of damage to the circuit board during the cleaning process, making the circuit board easy to clean. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the main structure of this utility model;

[0025] Figure 2 This is a partial structural diagram of the circuit board body of this utility model;

[0026] Figure 3 This is a partial structural diagram of the mounting base of this utility model;

[0027] Figure 4 This is a partial cross-sectional structural diagram of the mounting base of this utility model;

[0028] Figure 5 This is a partial structural diagram of the movable plate and clamping plate of this utility model;

[0029] Figure 6 This utility model Figure 2 Enlarged structural diagram at point A in the middle;

[0030] Figure 7 This utility model Figure 4 Enlarged structural diagram at point B.

[0031] In the diagram: 1. Circuit board body; 2. Mounting base; 3. Positioning bolt; 4. Groove; 5. Guide rod; 6. Moving plate; 7. Spring; 8. Clamping plate; 9. Substrate; 10. Conductive layer; 11. Power layer; 12. Signal layer; 13. Insulating layer; 14. Pad layer; 15. Anti-fouling coating. Detailed Implementation

[0032] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0033] Please see Figures 1-7 The present invention provides the following technical solution:

[0034] Example 1: To address the issue that while multiple protective layers on commercially available integrated circuit boards do not directly affect or contribute to conductivity, over time, the coatings and components on the board may gradually age or deteriorate, leading to decreased conductivity and consequently poor conductivity, and the inability to effectively achieve antioxidant effects, please refer to the attached... Figure 1 - Appendix Figure 2 and attached Figure 5 - Appendix Figure 6 The circuit board includes a circuit board body 1 and a mounting base 2. The circuit board body 1 includes a substrate 9, a conductive layer 10 fixedly mounted on the top of the substrate 9, and a power layer 11 fixedly connected to the top of the conductive layer 10. It also includes a signal layer 12 fixedly mounted on the top of the power layer 11, an insulating layer 13 fixedly connected to the top of the signal layer 12, a pad layer 14 fixedly mounted on the top of the insulating layer 13, and an anti-fouling coating 15 fixedly connected to the upper surface of the pad layer 14. The conductive layer 10 is electrically connected to the substrate 9 and the power layer 11, and the conductive layer 10 is made of copper foil. The substrate 9 is made of glass fiber reinforced board. There are two insulating layers 13, and both insulating layers 13 are tightly bonded to the signal layer 12 and the substrate 9. The insulating layers 13 are made of glass fiber epoxy resin, and the outer surface of the signal layer 12 is provided with a silver plating layer. The pad layer 14 is adhesively connected to the insulating layer 13 and the anti-fouling coating 15, and the pad layer 14 is made of solder resist ink material. The anti-fouling coating 15 is a fluoride coating.

[0035] The circuit board body 1 uses a substrate 9 made of glass fiber reinforced board as the base component, which has high insulation performance and mechanical strength, as well as good heat resistance, providing a stable foundation for the circuit board and making the circuit board highly conductive. The conductive layer 10 made of copper foil connected to the substrate 9 has excellent conductivity, which can ensure efficient and stable signal transmission on the circuit board and improve the efficiency of signal conduction. The outer surface of the signal layer 12 is provided with a silver plating layer, which can further improve the conductivity of the circuit board and form a protective film on the surface of the circuit board to prevent oxidation reaction, thereby improving the oxidation resistance of the circuit board. The insulating layer 13 made of glass fiber epoxy resin has good heat resistance and plays the role of isolation and protection in the circuit board, preventing short circuits between conductive layers 10, while being able to withstand high temperature environment, ensuring that the circuit board can work normally under high temperature conditions. This makes the easy-to-clean circuit board highly conductive, with good heat resistance and excellent oxidation resistance.

[0036] Example 2: The circuit board can be easily cleaned; please refer to the attached document. Figure 1 - Appendix Figure 4The mounting base 2 has a circuit board body 1 on its top. Grooves 4 are symmetrically formed on both sides of the mounting base 2, and positioning bolts 3 are symmetrically threaded onto the interior of both sides. Cavities are formed inside both sides of the mounting base 2, and four guide rods 5 are fixedly installed inside these cavities. A movable plate 6 is movably connected to the outer wall of each guide rod 5, and the top of the movable plate 6 passes through the grooves 4. Several springs 7 are fixedly connected to the left side of the movable plate 6, and a clamping plate 8 is fixedly installed on the top of the movable plate 6. The grooves 4 and cavities are interconnected, and both grooves 4 and cavities are slidably connected to the movable plate 6. The movable plate 6 is movably connected to the guide rods 5. The two ends of the springs 7 are fixedly connected to the movable plate 6 and the inner wall of the cavities. The movable plate 6 and the clamping plate 8 are tightly fitted together, and the clamping plate 8 has a rubber protective layer inside.

[0037] When the circuit board body 1 needs cleaning, the two clamping plates 8 are manually moved outward, causing the clamping plates 8 to drive the moving plate 6 to slide outward in the corresponding groove 4 and cavity. Thus, the moving plate 6 moves on the corresponding guide rod 5. At the same time, the moving plate 6 compresses the connected spring 7, increasing the stability of the moving plate 6. After the clamping plates 8 are released from the circuit board body 1, the circuit board body 1 is no longer clamped, and the circuit board body 1 can be quickly removed manually. The anti-fouling coating 15 made of fluoride coating on the upper surface of the solder pad layer 14 of the circuit board body 1 has excellent anti-fouling performance and provides a protective film. Due to the presence of the anti-fouling coating 15, when the circuit board body 1 is removed for cleaning, the surface contaminants can be removed more easily. This not only improves the cleaning efficiency but also reduces the risk of damage to the circuit board during the cleaning process, making it easy to quickly disassemble and clean the circuit board.

[0038] When cleaning is complete or a new circuit board needs to be installed, manually place the circuit board body 1 on the mounting base 2, release the pulled clamping plate 8, and let the rebound force of the compressed spring 7 drive the moving plate 6 to slide inward in the groove 4 and cavity. Thus, the moving plate 6 drives the clamping plate 8 to move until it fits against the outer wall of the circuit board body 1, thereby quickly installing the circuit board.

[0039] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0040] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A highly conductive and easy-to-clean circuit board, comprising a circuit board body (1) and a mounting base (2), wherein the circuit board body (1) comprises a substrate (9), a conductive layer (10) is fixedly mounted on the top of the substrate (9), and a power layer (11) is fixedly connected to the top of the conductive layer (10). Its features are, Also includes: A signal layer (12) is fixedly installed on the top of the power layer (11), an insulating layer (13) is fixedly connected to the top of the signal layer (12), a pad layer (14) is fixedly installed on the top of the insulating layer (13), and an anti-fouling coating (15) is fixedly connected to the upper surface of the pad layer (14). The top of the mounting base (2) is provided with a circuit board body (1), and the two sides of the mounting base (2) are symmetrically provided with grooves (4). The two sides of the mounting base (2) are symmetrically connected with positioning bolts (3).

2. The easily cleanable circuit board with high conductivity according to claim 1, characterized in that: The mounting base (2) has cavities on both sides, and four guide rods (5) are fixedly installed inside the cavities. A movable plate (6) is movably connected to the outer wall of the guide rods (5), and the top of the movable plate (6) passes through the groove (4). Several springs (7) are fixedly connected to the left side of the movable plate (6), and a clamping plate (8) is fixedly installed on the top of the movable plate (6).

3. The easily cleanable circuit board with high conductivity according to claim 1, characterized in that: The conductive layer (10) is electrically connected to the substrate (9) and the power layer (11), and the conductive layer (10) is made of copper foil, while the substrate (9) is made of glass fiber reinforced board.

4. The easily cleanable circuit board with high conductivity according to claim 1, characterized in that: There are two insulating layers (13), and both insulating layers (13) are tightly bonded to the signal layer (12) and the substrate (9). The insulating layer (13) is made of glass fiber epoxy resin, and the outer surface of the signal layer (12) is provided with a silver plating layer.

5. The easily cleanable circuit board with high conductivity according to claim 1, characterized in that: The pad layer (14) is bonded to the insulating layer (13) and the anti-fouling coating (15), and the pad layer (14) is made of solder resist ink material, and the anti-fouling coating (15) is a fluoride coating.

6. The easily cleanable circuit board with high conductivity according to claim 2, characterized in that: The groove (4) and the cavity are connected, and the groove (4) and the cavity are slidably connected to the moving plate (6). The moving plate (6) and the guide rod (5) are movably connected.

7. The easily cleanable circuit board with high conductivity according to claim 2, characterized in that: The two ends of the spring (7) are fixedly connected to the moving plate (6) and the inner wall of the cavity. The moving plate (6) and the clamping plate (8) are tightly fitted together, and the clamping plate (8) has a rubber protective layer inside.

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