Chip embedded circuit board assembly
By setting protruding heat dissipation fins and a double-layer cooler on the chip-embedded circuit board, the heat dissipation problem of highly integrated circuit boards is solved, achieving a highly efficient cooling effect, which is suitable for the half-bridge power module of inverters.
Patent Information
- Application Number
- CN202423005049.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-12-05
AI Technical Summary
In existing technologies, the heat dissipation effect of highly integrated circuit boards is limited, and they cannot effectively solve the heat dissipation problem of chip-embedded circuit boards.
The device employs protruding heat dissipation fins combined with a dual-layer cooler, including an oil-cooled cavity and a water-cooled cavity. The heat dissipation fins contact the oil-cooled cavity, and the heat dissipation fins are cooled by cooling oil. The oil is cooled by the water-cooled cavity, thereby achieving insulation protection and efficient heat dissipation for the chip packaging unit.
It improves heat dissipation area and efficiency, ensures cooling medium circulation, and achieves efficient cooling of chip packaging units and circuit boards, making it suitable for high-power operation of inverters.
Smart Images
Figure CN223515096U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board technical field, concretely, relates to chip embedded circuit board assembly. BACKGROUND
[0002] Chip embedded circuit board refers to embedding chip unit in circuit board to improve the integration of circuit board. With the improvement of integration, the heat dissipation problem of circuit board is more and more serious. At present, the heat dissipation glue is usually used in the heat dissipation area of circuit board to dissipate heat, but the heat dissipation effect is very limited, and the effective heat dissipation of high integration circuit board cannot be realized.
[0003] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the utility model, and therefore can include information that does not constitute prior art known to those skilled in the art. CONTENT OF THE UTILITY MODEL
[0004] The utility model provides chip embedded circuit board assembly, through the heat dissipation fin needle of external protruding cooperation double -layer cooler, realizes the effective heat dissipation of chip embedded circuit board.
[0005] According to one aspect of the utility model, a kind of chip embedded circuit board assembly is provided, comprising: preformed circuit board;Chip packaging unit is embedded in the preformed circuit board, the back of the chip packaging unit is provided with heat dissipation fin needle, the heat dissipation fin needle is protruding in the lower surface of the preformed circuit board;Double -layer cooler is arranged below the preformed circuit board, and the double -layer cooler includes the oil cooling cavity being contacted with the heat dissipation fin needle and the water cooling cavity being contacted with the oil cooling cavity, and the interface of the oil cooling cavity and the water cooling cavity is exposed to the preformed circuit board.
[0006] In some embodiments, the double -layer cooler includes heat exchange frame and the cover plate being arranged on the opposite sides of the heat exchange frame and being contacted with the heat exchange frame respectively to form the oil cooling cavity and the water cooling cavity;Wherein, the cover plate being contacted with the back of the chip packaging unit and the lower surface of the preformed circuit board is insulating cover plate.
[0007] In some embodiments, the surface of the heat exchange frame facing the oil cooling cavity and the water cooling cavity is provided with heat exchange fin needle.
[0008] In some embodiments, the insulating cover plate is sealingly connected with the back of the chip packaging unit and the lower surface of the preformed circuit board.
[0009] In some embodiments, the preformed circuit board includes: conductive layer;Multi-layer dielectric layer is stacked below the conductive layer, wherein the chip packaging unit is embedded in the conductive layer and the multi-layer dielectric layer, and the heat dissipation fin needle is protruding in the lower surface of the multi-layer dielectric layer.
[0010] In some embodiments, the pre-circuit board comprises: a first conductive layer; a dielectric layer arranged below the first conductive layer; a second conductive layer arranged below the dielectric layer, wherein the chip package unit is embedded in the first conductive layer, the dielectric layer and the second conductive layer, and the heat dissipation fin protrudes from the lower surface of the second conductive layer.
[0011] In some embodiments, the chip-embedded circuit board assembly further comprises: at least one dielectric film layer and at least one conductive film layer stacked above the pre-circuit board, and the electrodes of the chip package unit are led out to the upper surface of the top conductive film layer through the dielectric film layer and the conductive film layer.
[0012] In some embodiments, two chip package units are embedded in the pre-circuit board, wherein each chip package unit is connected with one double-layer cooler, and the oil cooling cavity and the water cooling cavity of the two double-layer coolers are connected in communication.
[0013] The beneficial effects of the present application compared with the prior art at least include:
[0014] The heat dissipation fin arranged on the back of the chip package unit increases the heat dissipation area and improves the heat dissipation performance, and the heat dissipation fin protrudes from the lower surface of the pre-circuit board, so that the double-layer cooler does not need to contact the heat dissipation fin through the embedded mode, and the interfaces of the oil cooling cavity and the water cooling cavity connected with the double-layer cooler are exposed to the pre-circuit board, so that the pipeline connection can realize the circulation of the cooling medium and accelerate the cooling. The double-layer cooler comprises the oil cooling cavity in contact with the heat dissipation fin and the water cooling cavity in contact with the oil cooling cavity, the cooling oil in the oil cooling cavity is used for cooling the heat dissipation fin and realizing the insulation protection of the chip package unit, the cooling water in the water cooling cavity is used for cooling the cooling oil, improving the heat conduction effect of the cooling oil, and further improving the cooling effect of the chip package unit and the pre-circuit board.
[0015] The chip-embedded circuit board assembly of the present application realizes the effective heat dissipation of the chip-embedded circuit board through the protruding heat dissipation fin and the double-layer cooler.
[0016] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS
[0017] The drawings incorporated into the specification and forming a part thereof, show embodiments consistent with the present application, and together with the specification serve to explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.
[0018] Figure 1 Fig. 1 shows a structural schematic diagram of a chip embedded circuit board assembly according to an embodiment of the present application;
[0019] Figure 2 Fig. 2 shows a structural schematic diagram of another chip embedded circuit board assembly according to an embodiment of the present application;
[0020] Figure 3 Fig. 3 shows a structural schematic diagram of still another chip embedded circuit board assembly according to an embodiment of the present application. DETAILED DESCRIPTION
[0021] Example implementations will now be described more fully with reference to the accompanying drawings. Example implementations may, however, be implemented in many different forms and should not be construed as limited to the implementations set forth herein. Rather, these implementations are provided as non-limiting examples, so that this disclosure will fully convey the scope of the application to those skilled in the art.
[0022] The accompanying drawings are included to provide a further understanding of the present application and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application. In the drawings:
[0023] The terms "first", "second", and similar terms do not denote any order, quantity, or importance, but are used to distinguish one element from another, and the terms "upper", "lower", and the like are used for the convenience of description and do not indicate or imply that a specific spatial orientation of the device or element is required for its operation. Therefore, it should not be construed as limiting the present application. In addition, in the description of the present application, when it is said that a certain device is "connected" to another device, it includes not only the case of direct connection, but also the case of indirect connection through other elements.
[0024] It should be noted that the features of the embodiments of the present application and the features in different embodiments can be combined with each other without conflict.
[0025] Figure 1 Fig. 1 shows a structural schematic diagram of a chip embedded circuit board assembly according to an embodiment of the present application; Figure 1 The chip embedded circuit board assembly provided by the embodiment of the present application comprises:
[0026] a preformed circuit board 10;
[0027] a chip packaging unit 20 embedded in the preformed circuit board 10, the back surface of the chip packaging unit 20 is provided with a heat dissipation fin 22, and the heat dissipation fin 22 protrudes outward from the lower surface of the preformed circuit board 10;
[0028] The double-layer cooler 30 is arranged below the pre-made circuit board 10, and the double-layer cooler 30 comprises an oil cooling cavity 31 in contact with the heat dissipation fin 22 and a water cooling cavity 32 in contact with the oil cooling cavity 31, and the interfaces of the oil cooling cavity 31 and the water cooling cavity 32 are exposed to the pre-made circuit board 10.
[0029] The heat dissipation fin 22 arranged on the back of the chip packaging unit 20 increases the heat dissipation area and improves the heat dissipation performance, and the heat dissipation fin 22 protrudes outward from the lower surface of the pre-made circuit board 10, so that the double-layer cooler 30 does not need to be in contact with the heat dissipation fin 22 in a built-in manner, and the interfaces of the oil cooling cavity 31 and the water cooling cavity 32 of the double-layer cooler 30 are exposed to the pre-made circuit board 10, so that the circulation of the cooling medium is realized through pipeline connection, and the cooling is accelerated. The double-layer cooler 30 comprises an oil cooling cavity 31 in contact with the heat dissipation fin 22 and a water cooling cavity 32 in contact with the oil cooling cavity 31, and the cooling oil in the oil cooling cavity 31 is used for cooling the heat dissipation fin 22 and realizing insulation protection of the chip packaging unit 20, and the cooling water in the water cooling cavity 32 is used for cooling the cooling oil, improving the heat conduction effect of the cooling oil, and further improving the cooling effect of the chip packaging unit 20 and the pre-made circuit board 10.
[0030] Therefore, the chip embedded circuit board assembly of the utility model realizes effective heat dissipation of the chip embedded circuit board through the protruding heat dissipation fin 22 and the double-layer cooler 30.
[0031] In some embodiments, the double-layer cooler 30 comprises a heat exchange frame 330 and cover plates 331 and 332 arranged on opposite sides of the heat exchange frame 330 and used for forming the oil cooling cavity 31 and the water cooling cavity 32 in cooperation with the heat exchange frame 330; and the cover plate 331 in contact with the back of the chip packaging unit 20 and the lower surface of the pre-made circuit board 10 is an insulating cover plate.
[0032] The heat exchange frame 330 is used for realizing heat exchange between the oil cooling cavity 31 and the water cooling cavity 32, so that the cooling water in the water cooling cavity 32 is used to take away the heat of the cooling oil in the oil cooling cavity 31 through the heat exchange frame 330, and the cooling effect of the cooling oil on the chip packaging unit 20 is improved. The cover plate 331 in contact with the back of the chip packaging unit 20 is an insulating cover plate, and insulation protection of the chip packaging unit 20 is realized.
[0033] For example, the heat exchange frame 330 is an aluminum alloy frame, the cover plate 331 in contact with the back of the chip packaging unit 20 and the lower surface of the pre-made circuit board 10 is a plastic cover plate, and the cover plate 332 used for forming the water cooling cavity 32 is a plastic or metal cover plate, but the utility model is not limited thereto.
[0034] In some embodiments, the surface of the heat exchange frame 330 facing the oil cooling cavity 31 and the water cooling cavity 32 is provided with heat exchange fins 333. The heat exchange fins 333 increase the contact area with the cooling oil and cooling water, improve the heat exchange efficiency between the oil cooling cavity 31 and the water cooling cavity 32, and thus improve the cooling effect of the dual-layer cooler 30 on the chip packaging unit 20 and the prefabricated circuit board 10.
[0035] In some embodiments, the insulating cover is sealed to the back of the chip packaging unit 20 and the lower surface of the prefabricated circuit board 10. Specifically, the insulating cover can be sealed to the back of the chip packaging unit 20 and the lower surface of the prefabricated circuit board 10 by means of adhesive bonding, welding, or other methods.
[0036] In some embodiments, the prefabricated circuit board 10 includes: a conductive layer 11; and a multilayer dielectric layer 12 stacked below the conductive layer 11, wherein the chip packaging unit 20 is embedded in the conductive layer 11 and the multilayer dielectric layer 12, and the heat dissipation pins 22 protrude from the lower surface of the multilayer dielectric layer 12.
[0037] A conductive layer 11 is provided on the upper surface of the prefabricated circuit board 10 to enable electrical connection with the chip packaging unit 20; the dielectric layer 12 is used for support and insulation.
[0038] Figure 2 This diagram illustrates the structure of yet another type of chip-embedded circuit board assembly, with reference to... Figure 2 and combined Figure 1 As shown, in some embodiments, the prefabricated circuit board 10 includes: a first conductive layer 15; a dielectric layer 16 disposed below the first conductive layer 15; and a second conductive layer 17 disposed below the dielectric layer 16, wherein the chip packaging unit 20 is embedded in the first conductive layer 15, the dielectric layer 16 and the second conductive layer 17, and the heat dissipation pins 22 protrude from the lower surface of the second conductive layer 17.
[0039] and Figure 1 Compared to the embodiments shown, in this embodiment, a second conductive layer 17 is provided on the lower surface of the prefabricated circuit board 10, which can enhance the electrical performance of the prefabricated circuit board 10. Figure 2 and Figure 1 The same reference numerals indicate the same parts, so they will not be described again.
[0040] Furthermore, combined Figure 1 and Figure 2 As shown, in some embodiments, the chip embedded circuit board assembly further includes at least one dielectric film layer 41 and at least one conductive film layer 42, stacked on top of the prefabricated circuit board 10, and the electrodes of the chip packaging unit 20 are led out to the upper surface of the top conductive film layer through the dielectric film layer 41 and the conductive film layer 42.
[0041] Above the electrode leads 24 of the chip packaging unit 20, a pad 51 can be provided for connection with other electronic components, and an insulating protective layer 52 can be provided to provide insulation, corrosion protection and other protection for the chip embedded circuit board.
[0042] Figure 3 This diagram illustrates the structure of yet another type of chip-embedded circuit board assembly, with reference to... Figure 3 and combined Figure 1 As shown, in some embodiments, two chip packaging units 20 are embedded in the prefabricated circuit board 10, wherein each chip packaging unit 20 is connected to a double-layer cooler 30, and the oil cooling chambers 31 of the two double-layer coolers 30 are connected and the water cooling chambers 32 are connected.
[0043] Thus, the two dual-layer coolers 30 only need to be equipped with a pair of oil cooling interfaces 310 and a pair of water cooling interfaces 320, which simplifies the piping connection and the configuration of the chip embedded circuit board assembly.
[0044] Figure 3 and Figure 1 The same reference numerals indicate the same parts, so they will not be described again.
[0045] Figure 3 The chip-embedded circuit board assembly shown can be used as a half-bridge power module of an inverter. The chip packaging unit 20 is efficiently cooled by the dual circulation of the cooling medium in the dual-layer cooler 30. The protruding heat dissipation fins 22 increase the heat dissipation area and facilitate the pipeline connection of the dual-layer cooler 30, thereby achieving efficient and convenient cooling of the chip-embedded circuit board and adapting to the high-power operating conditions of the inverter.
[0046] The manufacturing process of the chip embedded circuit board assembly provided in this embodiment of the utility model includes:
[0047] Prefabricated circuit board 10 is provided.
[0048] A chip packaging unit 20 is embedded in the prefabricated circuit board 10, wherein a heat dissipation fin 22 is provided on the back of the chip packaging unit 20, and the heat dissipation fin 22 protrudes outward from the lower surface of the prefabricated circuit board 10.
[0049] A double-layer cooler 30 is provided below the prefabricated circuit board 10, such that the oil cooling cavity 31 of the double-layer cooler 30 contacts the heat dissipation fins 22 and the water cooling cavity 32 contacts the oil cooling cavity 31, and the interface of the oil cooling cavity 31 and the water cooling cavity 32 is exposed on the prefabricated circuit board 10.
[0050] The heat dissipation fins 22 arranged on the back of the chip packaging unit 20 increase the heat dissipation area and improve the heat dissipation performance, and the heat dissipation fins 22 protrude outward from the lower surface of the prefabricated circuit board 10, so that the double-layer cooler 30 does not need to be embedded, and the interfaces of the oil cooling cavity 31 and the water cooling cavity 32 are exposed to the prefabricated circuit board 10, so that the pipeline connection can realize the circulation of the cooling medium and accelerate the cooling. The double-layer cooler 30 includes the oil cooling cavity 31 in contact with the heat dissipation fins 22 and the water cooling cavity 32 in contact with the oil cooling cavity 31, the cooling oil in the oil cooling cavity 31 is used to cool the heat dissipation fins 22 and realize the insulation protection of the chip packaging unit 20, and the cooling water in the water cooling cavity 32 is used to cool the cooling oil, improve the heat conduction effect of the cooling oil, and further improve the cooling effect of the chip packaging unit 20 and the prefabricated circuit board 10. In this way, the chip-embedded circuit board assembly formed by the protruding heat dissipation fins 22 cooperates with the double-layer cooler 30 to realize effective heat dissipation of the chip-embedded circuit board.
[0051] Further, the manufacturing process of the chip-embedded circuit board assembly further includes:
[0052] At least one dielectric film layer 41 and at least one conductive film layer 42 are stacked above the prefabricated circuit board 10, and the electrodes of the chip packaging unit 20 are led out to the upper surface of the top conductive film layer through the dielectric film layer 41 and the conductive film layer 42.
[0053] After the electrode lead-out wire 24 of the chip packaging unit 20 is formed, the solder pad 51 and the insulation protection layer 52 can be further arranged above.
[0054] The order of the manufacturing process of the lower surface of the prefabricated circuit board 10 and the manufacturing process of the upper surface can be interchanged according to actual needs. If the manufacturing process of the upper surface of the prefabricated circuit board 10 is performed after the heat dissipation fins 22 are formed, the prefabricated circuit board 10 can be placed on the base plate, so that the lower surface of the prefabricated circuit board 10 is attached to the base plate and the heat dissipation fins 22 are accommodated in the accommodation groove of the base plate, thereby protecting the heat dissipation fins 22 and avoiding damage.
[0055] The above is a further detailed description of the present application in combination with specific preferred embodiments, and cannot be regarded as a limitation of the specific implementation of the present application. For ordinary skilled persons in the technical field to which the present application belongs, without departing from the concept of the present application, a number of simple deductions or substitutions can be made, which should be regarded as falling within the protection scope of the present application.
Claims
1. A chip-embedded circuit board assembly, characterized in that, The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board.
2. The chip-in-board assembly of claim 1, wherein, The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board.
3. The chip-in-board assembly of claim 2, wherein, The application relates to a double-layer cooler for a pre-made circuit board.
4. The chip embedded circuit board assembly of claim 2, wherein, The application relates to a double-layer cooler for a pre-made circuit board.
5. The chip-in-board assembly of claim 1, wherein, The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board.
6. The chip embedded circuit board assembly of claim 1, wherein, The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board.
7. The chip-in-board assembly of claim 1, wherein, The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board.
8. The chip-in-board assembly of any of claims 1-7, wherein, The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. The application relates to a double-layer cooler for a pre-made circuit board. 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