Composite radiator
By combining phase change materials, semiconductor cooling chips, and thermoelectric conversion modules, the problems of low efficiency, large size, and high cost of traditional heat sinks are solved, achieving a heat sink design that is efficient in heat dissipation, lightweight, and low in cost.
Patent Information
- Application Number
- CN202422318024.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2034-09-23
AI Technical Summary
Traditional heat sinks are inefficient, bulky, heavy, and expensive, failing to meet the high-efficiency heat dissipation requirements of modern electronic devices.
It adopts a combined structure of phase change material, semiconductor cooling chip, thermoelectric conversion module and multi-layer heat sink. The phase change material absorbs heat, the semiconductor cooling chip cools down the temperature, the thermoelectric conversion module converts waste heat into electrical energy, and the multi-layer heat sink accelerates heat dissipation.
It improves heat dissipation efficiency, reduces equipment temperature, enhances equipment stability and reliability, and at the same time reduces size and cost.
Smart Images
Figure CN223515181U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation technical field, specifically relates to a composite radiator. BACKGROUND
[0002] The rapid development of electronic equipment makes its power density continuously improve, and the concentration of high heat influences the performance and life of the equipment. In order to reduce the equipment temperature, improve the stability and reliability of the equipment, it is necessary to adopt the radiator to rapidly dissipate the heat generated in the equipment.
[0003] The traditional radiator usually adopts metal material to dissipate heat, but this heat dissipation mode has some shortcomings. First, the heat dissipation efficiency of the traditional radiator is limited, which cannot well meet the demand of modern electronic equipment for high-efficiency heat dissipation; second, the volume and weight of the traditional radiator are large, which brings inconvenience to the carrying and use of the equipment; finally, the manufacturing cost of the traditional radiator is high, which is not conducive to large-scale application.
[0004] Therefore, it is necessary to propose a composite radiator, which can effectively improve the heat dissipation efficiency, reduce the equipment temperature, improve the stability and reliability of the equipment, and has the advantages of small volume, light weight and low manufacturing cost. UTILITY MODEL CONTENT
[0005] The utility model aims at overcoming the defects of prior art, and proposes a composite radiator to meet the demand of modern electronic equipment for high performance and high stability.
[0006] The utility model aims at overcoming the defects of prior art, and proposes a composite radiator to meet the demand of modern electronic equipment for high performance and high stability.
[0007] The heat insulation pad is arranged between the cold end and the hot end of the semiconductor refrigeration sheet.
[0008] The first heat sink is arranged close to the semiconductor refrigeration sheet and is used for rapidly transferring the heat generated by the semiconductor refrigeration sheet to the outside.
[0009] The thermoelectric conversion module is arranged close to the semiconductor refrigeration sheet and is used for converting the waste heat released by the phase change material into electric energy output.
[0010] The heat insulation material is arranged between the thermoelectric conversion module and the phase change material.
[0011] The second heat sink is arranged close to the thermoelectric conversion module and is used for dissipating the heat generated by the thermoelectric conversion module.
[0012] The utility model has the advantages of:
[0013] (1) Through the cooperation among the phase change material, the thermoelectric conversion module and the semiconductor refrigeration sheet, the heat dissipation efficiency can be effectively improved, the equipment temperature can be reduced, and the stability and reliability of the equipment are improved.
[0014] (2) Compared with the traditional radiator, the composite radiator has smaller volume and lighter weight.
[0015] (3) The component material adopted by the utility model is generally easy to obtain and has low cost, so that the manufacturing cost can be reduced and large-scale application can be promoted. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 is a schematic view of the utility model;
[0017] Figure 2 is a principle diagram of the utility model;
[0018] In the figure, 1, phase change material; 2, heat insulation material; 3, thermoelectric conversion module; 4, semiconductor refrigeration sheet; 5, first heat dissipation fin; 6, second heat dissipation fin. DETAILED DESCRIPTION
[0019] The technical scheme of the utility model will be clearly and completely described below in combination with embodiments. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.
[0020] It is explained that the orientation concepts of "left", "right", "up", "down", "front", "back", "inner" and "outer" in the following schemes are relative directions, which will not be listed one by one.
[0021] A composite radiator, referring to Figure 1 , comprises a phase change material 1. The phase change material 1 is selected from materials with good phase change characteristics and stability, such as paraffin, for absorbing a large amount of heat generated inside the equipment and realizing phase change, so as to reduce the equipment temperature.
[0022] A semiconductor refrigeration sheet 4 is arranged on the left side of the phase change material 1. The semiconductor refrigeration sheet 4 further reduces the temperature of the equipment by generating a refrigeration effect, so as to improve the heat dissipation efficiency. Heat insulation pads are arranged between the hot end and the cold end of the semiconductor refrigeration sheet 4 to avoid direct heat transfer in the semiconductor, which affects the heat dissipation efficiency and the refrigeration efficiency. The first heat dissipation fin 5 is arranged in close contact with the left side of the semiconductor refrigeration sheet 4. The first heat dissipation fin 5 quickly transfers the heat generated by the semiconductor refrigeration sheet 4 to the external environment to reduce the equipment temperature. In order to achieve faster heat transfer, a heat pipe or liquid cooling can be used to bring it to a farther place.
[0023] A thermoelectric conversion module 3 is located on the right side of the phase change material 1. The thermoelectric conversion module 3 converts the waste heat released by the phase change material 1 into electrical energy output, realizing waste heat reuse. A heat insulation material 2 is placed between the thermoelectric conversion module 3 and the phase change material 1 to prevent the thermoelectric conversion module 3 from starting to operate before the phase change material 1 has fully released its heat, thus affecting the efficiency of the electrical energy output. A second heat sink 6 is attached to the right side of the thermoelectric conversion module 3. The second heat sink 6 is used for heat dissipation to ensure the normal operation of the cold end of the thermoelectric conversion module 3. To improve the heat dissipation efficiency of the cold end, heat pipes or liquid cooling can also be used to dissipate the heat to a more distant location.
[0024] refer to Figure 2 When electronic devices generate heat, phase change material 1 absorbs a large amount of heat generated inside the device to achieve phase change, thereby reducing the device temperature; thermoelectric conversion module 3 can convert the waste heat released by phase change material 1 into electrical energy output, realizing the reuse of waste heat; semiconductor cooling chip 4 can further reduce the device temperature by generating a cooling effect, thereby improving heat dissipation efficiency.
[0025] In this process, the thermal insulation material 2 is placed between the phase change material 1 and the thermoelectric conversion module 3 mainly to prevent the thermoelectric conversion module 3 from starting to work before the phase change material 1 has fully released its heat, thus affecting the efficiency of power output. Meanwhile, the cold end of the semiconductor cooling chip 4 is in close contact with the phase change material 1 and generates a cooling effect by absorbing the heat released by the phase change material 1. At the same time, the hot end of the semiconductor cooling chip 4 is in close contact with the first heat sink 5, which quickly transfers the heat generated by the semiconductor cooling chip 4 to the external environment.
[0026] The above description is merely a preferred embodiment of this utility model. It should be understood that this utility model is not limited to the form disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above description or the technology or knowledge in related fields. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of this utility model should be protected within the scope of the appended claims.
Claims
1. A composite radiator, characterized in that, It includes a phase change material for absorbing large amounts of heat, and a semiconductor cooling chip is disposed on one side of the phase change material; A heat insulation pad is provided between the cold end and the hot end of the semiconductor refrigeration chip; The semiconductor cooling chip is closely fitted with a first heat sink for quickly transferring the heat it generates to the outside. A thermoelectric conversion module is provided on the side of the phase change material away from the semiconductor refrigeration chip to convert the waste heat released by the phase change material into electrical energy output. A heat insulation material is provided between the thermoelectric conversion module and the phase change material; The thermoelectric conversion module has a second heat sink attached to the side away from the phase change material.