Transfer device of chip sorting equipment

Abstract

The utility model belongs to the technical field of chip production, and particularly relates to a transfer device of chip sorting equipment, which comprises a conveying table, supporting plates are arranged on two sides of the tail end of the conveying table, guide seats are arranged at the upper ends of the supporting plates, a suction cup mechanism is arranged under the guide seats, the suction cup mechanism is used for grabbing chips conveyed by the conveying table, and the suction cup mechanism is used for clamping the chips conveyed by the conveying table. The high-precision chip sorting device further comprises a driving mechanism, the driving mechanism is arranged on the guide base, the driving mechanism is used for moving the suction cup mechanism on the guide base, the chips are prevented from being damaged easily in the transferring process, and therefore the requirement for high-precision chip sorting is met.

Description

TECHNICAL FIELD

[0001] The utility model belongs to chip production technical field especially relates to a chip sorting equipment's transfer device. BACKGROUND

[0002] In the semiconductor manufacturing and packaging process, chip sorting is a crucial link. With the continuous miniaturization and integration of electronic products, the precision and efficiency of chip sorting are increasingly required. The traditional chip sorting method often has low sorting precision, low sorting efficiency and easy damage to chips, therefore, a new type of chip sorting equipment and its transfer device are needed to solve these problems.

[0003] At present, there are some chip sorting equipment on the market, most of these devices use mechanical arms or conveyors to transfer and sort chips. However, when these devices transfer chips, the stability and precision of the transfer mechanism are often insufficient, resulting in damage to the chips during transfer, which cannot meet the needs of high-precision chip sorting. UTILITY MODEL CONTENTS

[0004] The utility model aims at the above-mentioned technical problem, provides a chip sorting equipment's transfer device, achieves avoiding chip in the transfer process easy to be damaged, thereby satisfies the demand of high-precision chip sorting.

[0005] Therefore, the utility model provides a chip sorting equipment's transfer device, which includes: a conveying table, characterized in that the conveying table is provided with support plates at both ends, the support plates are provided with guide seats at the top, the guide seats are provided with suction cup mechanisms below, the suction cup mechanisms are used to grab the chips conveyed by the conveying table, and a driving mechanism is arranged on the guide seat and used to move the suction cup mechanism on the guide seat.

[0006] In the technical scheme, in the initial state, the suction cup mechanism is located directly below the guide seat, waiting to receive the chips from the conveying table, the conveying table conveys the chips to be sorted to the designated position, the chips conveyed by the conveying table are adsorbed by the suction cup mechanism, then the driving mechanism drives the suction cup mechanism to move to the left, and the chips are placed into the storage box on one side of the conveying table. The suction cup mechanism adsorbs the materials on the suction cup by negative pressure, without using physical grabbing blocks or clamps, so as to avoid scratching or damaging the surface of the materials during grabbing.

[0007] In the above technical scheme, further, the suction cup mechanism includes:

[0008] The first electric telescopic rod is connected with a fixed cylinder at the output end, the fixed cylinder is fixed to the bottom end of the fixed seat, and a plurality of first suction cups are arranged at the bottom end of the fixed seat.

[0009] A second suction cup device is arranged on the outer periphery of the fixing base.

[0010] In the technical solution, the suction cup mechanism is in standby state, the first electric telescopic rod is retracted, so that the fixing cylinder and the fixing base (and the first suction cup and the second suction cup device thereon) are slightly higher than the surface of the conveying table. When the conveying table conveys the chip to the designated position, the first electric telescopic rod is started, and the output end is extended downward, so that the fixing cylinder and the fixing base (and the first suction cup and the second suction cup device) contact and adsorb the chip. At this time, the first suction cup and the second suction cup device work simultaneously, and the chip is firmly adsorbed on the suction cup mechanism by negative pressure or magnetic force.

[0011] In the above technical solution, further, the second suction cup device comprises:

[0012] Four fixing plates are arranged on the outer periphery of the fixing base in a circumferential direction, and adjusting grooves are arranged on the four fixing plates. Adjusting blocks are slidably arranged in the adjusting grooves, and second suction cups are arranged at the bottom ends of the adjusting blocks.

[0013] An adjusting assembly is arranged for adjusting the distance between the second suction cup and the first suction cup.

[0014] In the technical solution, the distance between the second suction cup and the first suction cup can be flexibly adjusted by the adjusting assembly, so that the suction cup mechanism can adapt to chips of different sizes, and ensure that the chip is stably adsorbed during the transfer process, reducing the risk of sliding or displacement.

[0015] In the above technical solution, further, the adjusting assembly comprises a second electric telescopic rod arranged in the fixing cylinder, and a connecting base connected to the output end of the second electric telescopic rod. Four hinge plates are hingedly connected to the lower surface of the connecting base, and the upper surfaces of the four hinge plates are hingedly connected to the adjusting blocks on the four fixing plates.

[0016] In the technical solution, the height of the connecting base can be accurately adjusted by the telescopic movement of the second electric telescopic rod, and the positions of the four adjusting blocks in the adjusting grooves can be changed through the transmission action of the hinge plates, so as to accurately adjust the distance between the second suction cup and the first suction cup. The flexibility and adaptability of the suction cup mechanism are improved, so that it can better meet the chip sorting requirements of different sizes and shapes.

[0017] In the above technical solution, further, a notch is arranged around the lower end of the fixing cylinder, and the hinge plates are slidably arranged on the inner side of the notch.

[0018] In the above technical solution, further, a sliding groove is arranged through the guide base, and a sliding block is slidably arranged in the sliding groove. The lower end of the sliding block is connected to the first electric telescopic rod.

[0019] In the above technical scheme, further, the driving mechanism comprises: a threaded rod rotatably arranged at both ends of the sliding groove, and the sliding block is sleeved on the outer wall of the threaded rod and is in threaded connection with the threaded rod;

[0020] A driving motor is horizontally mounted on the side wall of the guide base, and the output shaft of the driving motor is fixedly connected with the threaded rod through the guide base.

[0021] The chip sorting equipment has the advantages that:

[0022] 1. In the initial state, the suction cup mechanism is located directly below the guide base, waiting to receive the chips from the conveying table, the conveying table conveys the chips to be sorted to the designated position, the chips conveyed by the conveying table are adsorbed by the suction cup mechanism, and then the suction cup mechanism is driven to move left by the driving mechanism, and the chips are placed into the storage box on the side of the conveying table. The suction cup mechanism adsorbs the material on the suction cup by negative pressure, without using physical grabbing blocks or clamps, thereby avoiding scratching or damaging the surface of the material during grabbing.

[0023] 2. The height of the connecting seat can be accurately adjusted through the telescopic movement of the second electric telescopic rod, and then the positions of the four adjusting blocks in the adjusting grooves are changed through the transmission action of the hinge plate, so that the distance between the second suction cup and the first suction cup is accurately adjusted, the flexibility and adaptability of the suction cup mechanism are improved, and the chip sorting requirements of different sizes and shapes can be better met. BRIEF DESCRIPTION OF DRAWINGS

[0024] Fig. 1 is a structural schematic view of the transferring device of the chip sorting equipment of the utility model;

[0025] Fig. 2 is a sectional view of the transferring device of the chip sorting equipment of the utility model;

[0026] Fig. 3 is a structural schematic view of the suction cup mechanism of the transferring device of the chip sorting equipment of the utility model;

[0027] The marks in the figure represent:

[0028] 1, conveying table; 2, supporting plate; 3, guide base; 4, sliding groove; 5, driving mechanism; 501, driving motor; 502, threaded rod; 503, sliding block; 6, suction cup mechanism; 601, first electric telescopic rod; 602, fixed cylinder; 603, fixed seat; 604, first suction cup; 7, second suction cup device; 701, fixed plate; 702, second suction cup; 703, adjusting groove; 704, adjusting block; 8, adjusting assembly; 801, second electric telescopic rod; 802, connecting seat; 803, hinge plate; 9, slot. DETAILED DESCRIPTION

[0029] The technical solutions in the embodiments of the present application will be clearly described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art belong to the scope of protection of the present application.

[0030] In the description of the present application, it should be noted that the terms used herein are only intended to describe the specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For the convenience of description, the sizes of the various parts shown in the drawings are not drawn in accordance with the actual proportional relationship. The techniques, methods and devices known to those of ordinary skill in the relevant art can not be discussed in detail, but should be considered as part of the authorized description. In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, and not as a limitation. Therefore, other examples of exemplary embodiments can have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so further discussion is not needed in subsequent drawings once an item is defined in one drawing.

[0031] It should be noted that the terms "first", "second", and the like in the specification and claims of the present application are used to distinguish similar objects, and are not intended to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually a class, not limited to the number of objects, for example, the first object can be one or more. In addition, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / ", generally indicates that the front and rear associated objects are in an "or" relationship.

[0032] It should be noted that in the description of the present application, the orientation terms such as "front, rear, upper, lower, left, right", "transverse, vertical, perpendicular, horizontal" and "top, bottom" and the like indicate the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present application and simplifying the description, and in the absence of contrary indications, these orientation terms do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the scope of protection of the present application; the orientation terms "inner, outer" refer to the inner and outer relative to the contour of each component.

[0033] It should be noted that, in this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0034] Example 1:

[0035] Depend on Figs. 1-3 As shown, this embodiment provides a transfer device for a chip sorting equipment, including: a conveyor table 1, with support plates 2 on both sides of the end of the conveyor table 1, a guide seat 3 on the upper end of the support plate 2, and a suction cup mechanism 6 directly below the guide seat 3. The suction cup mechanism 6 is used to grip the chips conveyed by the conveyor table 1. It also includes: a driving mechanism, which is mounted on the guide seat 3 and used to move the suction cup mechanism 6 on the guide seat 3. In the initial state, the suction cup mechanism 6 is located directly below the guide seat 3, waiting to receive chips from the conveyor table 1. The conveyor table 1 transports the chips to be sorted to a designated position, and the suction cup mechanism 6 adsorbs the chips conveyed by the conveyor table 1. Then, the driving mechanism moves the suction cup mechanism 6 to the left, placing it into a storage box (not shown in the figure) located on one side of the conveyor table 1. The suction cup mechanism 6 uses negative pressure to adsorb the material onto the suction cup, eliminating the need for physical gripping blocks or claws, thus avoiding scratches or damage to the material surface during the gripping process.

[0036] Further, the suction disc mechanism 6 comprises: a first electric telescopic rod 601, a fixed cylinder 602 connected to the output end of the first electric telescopic rod 601, a fixed seat 603 at the bottom end of the fixed cylinder 602, and a plurality of first suction discs 604 at the bottom end of the fixed seat 603. A second suction disc device 7 is arranged on the outer periphery of the fixed seat 603. When the suction disc mechanism 6 is in standby state, the first electric telescopic rod 601 is retracted, so that the fixed cylinder 602 and the fixed seat 603 (as well as the first suction discs 604 and the second suction disc device 7 thereon) are slightly higher than the surface of the conveying table 1. When the conveying table 1 conveys the chip to the designated position, the first electric telescopic rod 601 is started, and the output end is extended downward to make the fixed cylinder 602 and the fixed seat 603 (as well as the first suction discs 604 and the second suction disc device 7) contact and adsorb the chip. At this time, the first suction discs 604 and the second suction disc device 7 work simultaneously to firmly adsorb the chip on the suction disc mechanism 6 by negative pressure or magnetic force.

[0037] Further, the second suction disc device 7 comprises: four fixed plates 701 arranged on the outer periphery of the fixed seat 603, adjustment grooves 703 arranged on the four fixed plates 701, adjustment blocks 704 slidingly arranged in the adjustment grooves 703, and second suction discs 702 arranged at the bottom end of the adjustment blocks 704. An adjustment assembly 8 is arranged for adjusting the distance between the second suction discs 702 and the first suction discs 604. Through the adjustment assembly 8, the distance between the second suction discs 702 and the first suction discs 604 can be flexibly adjusted, so that the suction disc mechanism 6 can adapt to chips of different sizes, ensure that the chip is stably adsorbed during the transfer process, and reduce the risk of sliding or displacement.

[0038] Further, the adjustment assembly 8 comprises: a second electric telescopic rod 801 arranged in the fixed cylinder 602, a connecting seat 802 connected to the output end of the second electric telescopic rod 801, four hinge plates 803 hingedly connected to the lower surface of the connecting seat 802, and the upper surfaces of the four adjustment blocks 704 on the four fixed plates 701. Through the telescopic movement of the second electric telescopic rod 801, the height of the connecting seat 802 can be accurately adjusted, and then through the transmission action of the hinge plates 803, the positions of the four adjustment blocks 704 in the adjustment grooves 703 are changed, so as to accurately adjust the distance between the second suction discs 702 and the first suction discs 604, improve the flexibility and adaptability of the suction disc mechanism 6, and better meet the chip sorting requirements of different sizes and shapes.

[0039] Further, grooves 9 are arranged around the lower end of the fixed cylinder 602, and the hinge plates 803 slide on the inner side of the grooves 9.

[0040] Further, a sliding groove 4 is formed through the guide base 3, and a sliding block 503 is slidably arranged in the sliding groove 4, and the lower end of the sliding block 503 is connected with a first electric telescopic rod 601.

[0041] Further, the driving mechanism 5 comprises a threaded rod 502 rotatably arranged at both ends of the sliding groove 4, the sliding block 503 is sleeved on the outer wall of the threaded rod 502 and is threadedly connected with the threaded rod 502; a driving motor 501 is horizontally arranged on the side wall of the guide base 3, and the output shaft of the driving motor 501 is fixedly connected with the threaded rod 502 through the guide base 3.

[0042] After the chip is adsorbed, if it is needed to move the suction disc mechanism 6, the driving motor 501 can be started, the output shaft of the driving motor 501 is rotated to drive the threaded rod 502 fixedly connected with the output shaft to rotate, since the sliding block 503 is sleeved on the outer wall of the threaded rod 502 and is threadedly connected with the threaded rod 502, the rotation of the threaded rod 502 drives the sliding block 503 to move in the sliding groove 4 along the threaded direction, during the moving process, the first electric telescopic rod 601 can keep a certain extension state to ensure that the chip keeps a sufficient distance from the conveying table 1 to avoid collision or scratching, when the suction disc mechanism 6 moves above the storage box, the first electric telescopic rod 601 starts to contract to gradually lower the fixed cylinder 602 and the fixed seat 603 (and the first suction disc 604 and the second suction disc device 7), until the chip is safely placed in the storage box. At this time, the first suction disc 604 and the second suction disc device 7 stop working at the same time to release the chip, after the chip is placed, the driving motor 501 is reversely rotated to reversely rotate the threaded rod 502, thereby driving the sliding block 503 to return to the initial position along the sliding groove 4. At the same time, the first electric telescopic rod 601 and the second electric telescopic rod 801 also reset to the initial state. At this time, the suction disc mechanism 6 is ready for the next chip sorting and moving action.

[0043] The embodiments of the present application are described above in combination with the drawings, the embodiments and the features in the embodiments in the present application can be combined with each other without conflict, the present application is not limited to the above-mentioned specific embodiments, the above-mentioned specific embodiments are only illustrative, but not limited, the ordinary skilled in the art can make many forms without departing from the purpose of the present application and the scope protected by the claims under the inspiration of the present application, all of which belong to the protection of the present application.

Claims

1. A transfer device for a chip sorting apparatus, comprising: The utility model provides a conveying table (1), its characterized in be equipped with support plate (2) on both sides of the conveying table (1) end, be equipped with guide seat (3) on support plate (2) top, be equipped with sucking disc mechanism (6) below guide seat (3), sucking disc mechanism (6) is used for the chip of conveying table (1) conveying to carry out the capture, still include: drive mechanism (5), drive mechanism (5) locates on guide seat (3), drive mechanism (5) is used for sucking disc mechanism (6) moves on guide seat (3). The sucking disc mechanism (6) includes: First electric telescopic link (601), first electric telescopic link (601) output end is connected with fixed cylinder (602), fixed cylinder (602) bottom end fixed seat (603), fixed seat (603) bottom end is equipped with a plurality of first sucking disc (604); Second sucking disc device (7), second sucking disc device (7) is located at the outer periphery of fixed seat (603); The guide seat (3) is provided with a sliding groove (4) penetrating through, and the sliding groove (4) is provided with a sliding block (503) slidingly arranged in the sliding groove (4), and the lower end of the sliding block (503) is connected with the first electric telescopic link (601). The drive mechanism (5) includes: a threaded rod (502) rotatably arranged at both ends of the sliding groove (4), the sliding block (503) is sleeved on the outer wall of the threaded rod (502) and is in threaded connection with the threaded rod (502). A drive motor (501) is horizontally mounted on the side wall of the guide seat (3), and the output shaft of the drive motor (501) penetrates through the guide seat (3) and is fixedly connected with the threaded rod (502).

2. A transfer device for a chip sorting apparatus according to claim 1, wherein: The second sucking disc device (7) includes: Four fixed plates (701) are circumferentially arranged on the outer periphery of the fixed seat (603), and the four fixed plates (701) are provided with adjusting grooves (703), the adjusting grooves (703) are provided with adjusting blocks (704) slidingly arranged in the adjusting grooves (703), and the second sucking discs (702) are arranged on the bottom ends of the adjusting blocks (704). An adjusting assembly (8) is arranged for adjusting the distance between the second sucking discs (702) and the first sucking discs (604).

3. A transfer device for a chip sorting apparatus according to claim 2, wherein: The adjusting assembly (8) includes: a second electric telescopic link (801) arranged in the fixed cylinder (602), a connecting seat (802) connected with the output end of the second electric telescopic link (801), four hinge plates (803) hingedly connected to the lower surface of the connecting seat (802), and the upper surfaces of the four hinge plates (803) are hingedly connected with the adjusting blocks (704) on the four fixed plates (701).

4. A transfer device for a chip sorting apparatus as claimed in claim 3, wherein: Grooves (9) are formed around the lower end of the fixed cylinder (602), and the hinge plates (803) slide on the inner sides of the grooves (9).

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