Liquid supply module, scrubbing assembly and semiconductor manufacturing equipment

Abstract

The utility model provides a liquid supply module, a scrubbing assembly and semiconductor manufacturing equipment. The liquid supply module comprises a mixing cavity and at least two liquid supply pipelines, different cleaning liquids respectively circulate in the liquid supply pipelines; the liquid outlets of the at least two liquid supply pipelines are respectively communicated with the mixing cavity, and the cleaning liquid flowing in the liquid supply pipelines is mixed in the mixing cavity; the mixing cavity is connected with a first nozzle, and the first nozzle is used for spraying a mixed liquid agent to a crystal face area of the wafer; at least one liquid supply pipeline is further provided with a liquid supply branch, the liquid supply branch is connected with a second nozzle, and the second nozzle is used for spraying corresponding cleaning liquid to the wafer back area of the wafer; wherein the flow of the cleaning liquid in the liquid supply pipeline provided with the liquid supply branch is larger than the flow of the cleaning liquid in the other liquid supply pipelines. According to the configuration, the liquid supply branch is additionally arranged and is connected with the second nozzle, so that the cleaning liquid sprayed to the wafer back area of the wafer is changed into single cleaning liquid, the use amount of the corresponding cleaning liquid can be saved, and the production cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing, especially a liquid supply module, a brushing assembly and a semiconductor manufacturing equipment. BACKGROUND

[0002] Chemical mechanical polish (CMP) is a technology that removes excess material on the surface by using chemical oxidation and mechanical grinding to achieve high level of flatness of product surface, which is widely used in semiconductor manufacturing process to selectively remove material to achieve flatness of topography and formation of device structure.

[0003] After the wafer is polished, it enters a cleaning program, usually using a brushing module to brush the surface of the wafer, and a nozzle is used to spray a fixed proportion of diluted cleaning liquid on the wafer surface / back to achieve cleaning. However, most of the remaining polishing liquid and abrasive are left on the wafer surface, which causes waste of chemical liquid sprayed on the wafer back.

[0004] Therefore, how to reduce the waste of chemical liquid sprayed on the wafer back without affecting the cleaning effect has become a technical problem to be solved by those skilled in the art. SUMMARY

[0005] The utility model discloses a liquid supply module, a brushing assembly and a semiconductor manufacturing equipment to reduce the waste of chemical liquid sprayed on the wafer back while ensuring the cleaning effect.

[0006] To achieve the above purpose, the utility model provides a liquid supply module, comprising: a mixing cavity and at least two liquid supply pipelines;

[0007] Different cleaning liquids flow through the liquid supply pipelines respectively;

[0008] The liquid outlets of the at least two liquid supply pipelines are respectively communicated with the mixing cavity, so that the cleaning liquids flowing through the liquid supply pipelines are mixed in the mixing cavity to form a mixed liquid agent; the mixing cavity is connected with a first nozzle, and the first nozzle is used to spray the mixed liquid agent to the wafer surface area;

[0009] At least one of the liquid supply pipelines is further provided with a liquid supply branch, the liquid supply branch is connected with a second nozzle, and the second nozzle is used to spray the corresponding cleaning liquid to the wafer back area;

[0010] Among them, the cleaning liquid flow in the liquid supply pipeline provided with the liquid supply branch is greater than that in the remaining liquid supply pipelines.

[0011] Optionally, a flow controller is arranged on any of the liquid supply lines, and the flow controller is configured to adjust the flow of cleaning liquid in the corresponding liquid supply line.

[0012] Optionally, a pressure regulating valve is arranged on the liquid supply branch, and the pressure regulating valve is in an open state during the process of the liquid supply module delivering cleaning liquid, and is configured to adjust the flow of cleaning liquid in the liquid supply branch.

[0013] Optionally, the liquid supply module comprises a first liquid supply line and a second liquid supply line.

[0014] The first liquid supply line is configured to supply deionized water, and the second liquid supply line is configured to supply chemical liquid agent; the liquid supply branch is arranged on the first liquid supply line, and the second nozzle is configured to spray the deionized water to the back region of the wafer, wherein the flow of the deionized water is greater than the flow of the chemical liquid agent.

[0015] To achieve the above purpose, the utility model also provides a brush washing assembly, which comprises a first nozzle, a first brush washing part, a second nozzle, a second brush washing part and the liquid supply module as described above.

[0016] The first nozzle and the first brush washing part are arranged close to the surface region of the wafer, the first nozzle is configured to spray the mixed liquid agent formed in the mixing cavity to the surface region of the wafer, and the first brush washing part is configured to brush the surface region of the wafer.

[0017] The second nozzle and the second brush washing part are arranged close to the back region of the wafer, the second nozzle is configured to spray the cleaning liquid circulating in the liquid supply branch to the back region of the wafer, and the second brush washing part is configured to brush the back region of the wafer.

[0018] Optionally, the brush washing assembly further comprises a first connecting line and a second connecting line.

[0019] The first connecting line is in communication with the mixing cavity, and a plurality of first nozzles are arranged on the first connecting line, the plurality of first nozzles are arranged at intervals along the extension direction of the first connecting line and are arranged to extend towards the surface region of the wafer.

[0020] The second connecting line is in communication with the liquid supply branch, and a plurality of second nozzles are arranged on the second connecting line, the plurality of second nozzles are arranged at intervals along the extension direction of the second connecting line and are arranged to extend towards the back region of the wafer.

[0021] Optionally, the brush washing assembly further comprises a brush washing part driving device.

[0022] The brush cleaning piece driving device is arranged in one-to-one correspondence with the first brush cleaning piece and the second brush cleaning piece, and is used for driving the first brush cleaning piece and the second brush cleaning piece to rotate around an axis, so as to realize brush cleaning of the wafer surface.

[0023] Optionally, the brush cleaning assembly further comprises a wafer driving device.

[0024] The wafer driving device is in contact with the edge of the wafer, and is used for driving the wafer to rotate.

[0025] Optionally, the number of the wafer driving devices is multiple, and the multiple wafer driving devices are arranged at intervals around the edge of the wafer.

[0026] In order to achieve the above purpose, the utility model further provides a semiconductor manufacturing equipment, including the brush cleaning assembly as above.

[0027] Compared with the existing brush cleaning tool, the liquid supply module, the brush cleaning assembly and the semiconductor manufacturing equipment provided by the application have the following advantages:

[0028] The liquid supply module provided by the application adds a liquid supply branch and connects the liquid supply branch with the second nozzle, so that the cleaning liquid sprayed to the back region of the wafer is changed from the original mixed liquid agent to a single cleaning liquid. Since most of the residues are located in the wafer surface region in the polishing process, spraying a single cleaning liquid to the back region of the wafer will not affect the cleaning effect, and the amount of the corresponding cleaning liquid can be saved, thereby reducing the production cost.

[0029] The brush cleaning assembly provided by the application can reduce the amount of cleaning liquid without affecting the cleaning effect of the wafer by using the above-mentioned liquid supply module, thereby reducing the production cost and avoiding the waste of cleaning liquid.

[0030] The semiconductor manufacturing equipment provided by the application can reduce the amount of cleaning liquid without affecting the cleaning effect of the wafer by using the above-mentioned brush cleaning assembly, thereby reducing the production cost and avoiding the waste of cleaning liquid. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 It is a schematic diagram of the liquid supply pipeline in the prior art;

[0032] Figure 2 It is a schematic diagram of the liquid supply module provided by the embodiment of the utility model;

[0033] Figure 3 It is a structural schematic diagram of the brush cleaning assembly provided by the embodiment of the utility model;

[0034] Among them, the explanation of each figure mark is as follows:

[0035] 10 - first liquid supply line; 11 - second liquid supply line; 12 - mixing chamber; 13 - flow controller; 100 - liquid supply branch; 101 - pressure regulating valve;

[0036] 20 - first nozzle; 21 - first brush cleaning member; 22 - second nozzle; 23 - second brush cleaning member; 24 - first connecting line; 25 - second connecting line; 26 - wafer driving device;

[0037] 30 - wafer; 40 - conveying line; 50 - front surface nozzle; 60 - back surface nozzle. DETAILED DESCRIPTION

[0038] In order to make the purpose, advantages and characteristics of the present application more clear, the present application will be further described in detail below in combination with the drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn in proportion, and are only used to facilitate and clearly assist the purpose of explaining the embodiments of the present application. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing needs to be different, and sometimes different proportions are used.

[0039] As used in this specification, the singular forms "a," "an" and "the" include plural referents unless the context clearly dictates otherwise. The term "or" is generally employed in its sense including "and / or" unless the context clearly dictates otherwise. The term "and / or" means "and" or "or," i.e., "and / or" will be interpreted to mean one or all of words it connects. The term "at least two" is generally employed in its sense including "two or more" unless the context clearly dictates otherwise. The terms "first," "second," "third," etc. are used only to describe different instances and do not imply or suggest relative importance or an exact number of the technical features indicated. Thus, features defined with "first," "second," "third" can explicitly or implicitly include one or at least two of the features. The terms "one end" and "the other end" and "proximal end" and "distal end" generally refer to two parts corresponding to each other, which not only includes the end points, and the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication or interaction of two elements. In addition, as used in this specification, a component disposed in another component generally only indicates a connection, coupling, cooperation or transmission relationship between the two components, and the two components can be directly or indirectly connected, coupled, cooperated or transmitted through an intermediate component, and cannot be understood as indicating or suggesting the spatial positional relationship between the two components, i.e. one component can be in any position inside, outside, above, below or one side of another component, unless the content is otherwise clearly indicated. The terms "up", "down", "top", "bottom" are generally arranged in the direction of gravity; the terms "vertical direction" generally refer to the direction along the gravity, which is generally perpendicular to the ground, and the terms "horizontal direction" generally refer to the direction parallel to the ground; the specific meaning of the above terms in this specification can be understood according to the specific circumstances by those skilled in the art.

[0040] The utility model discloses a liquid supply module, a brushing assembly and a semiconductor manufacturing equipment, to reduce the waste caused by the chemical liquid agent sprayed on the wafer back under the premise of ensuring the cleaning effect.

[0041] As can be understood by those skilled in the art, after the chemical mechanical polishing process is completed, the wafer needs to be cleaned to remove the residues on the surface. The conventional method is to spray diluted cleaning liquid to the wafer surface and wafer back through a nozzle, and to brush the wafer surface through a brushing piece, so as to wash the residues on the wafer surface clean. Figure 1As shown, the DIW and the chemical liquid agent are delivered into the mixing chamber 12 through two different delivery pipelines 40, and after mixing and dilution in the mixing chamber 12, are sprayed onto the wafer surface through the front side nozzle 50 and the back side nozzle 60 respectively. However, in actual production, most of the polishing liquid and abrasive remain on the front side of the wafer, so spraying the cleaning liquid containing chemicals on the back side of the wafer results in waste of the chemical liquid agent, thereby increasing the production cost. Based on this, the present embodiment provides a liquid supply module, a cleaning assembly and a semiconductor manufacturing device, by adding a liquid supply branch on the original liquid supply pipeline, the cleaning liquid sprayed on the back side area is changed from a mixed liquid agent to a single cleaning liquid, which can save the amount of corresponding chemical liquid agent under the premise of maintaining the cleaning effect, thereby reducing the production cost.

[0042] Please refer to Figure 2 The utility model provides a kind of liquid supply module, comprising: mixing chamber 12 and at least two liquid supply pipelines;Different cleaning liquids flow in the liquid supply pipeline respectively;The outlet of at least two liquid supply pipelines is communicated with mixing chamber 12 respectively, to make the cleaning liquid that flows in the liquid supply pipeline mixes in mixing chamber 12, forms mixed liquid agent;Mixing chamber 12 is connected with first nozzle 20, and first nozzle 20 is used to spray mixed liquid agent to the front side area of wafer 30;At least one liquid supply pipeline is further equipped with liquid supply branch 100, and liquid supply branch 100 is connected with second nozzle 22, and second nozzle 22 is used to spray corresponding cleaning liquid to the back side area of wafer 30;Wherein, the cleaning liquid flow in the liquid supply pipeline that is equipped with liquid supply branch 100 is greater than the cleaning liquid flow in the rest liquid supply pipeline. As an optional embodiment, to Figure 2For example, the liquid supply module is provided with a first liquid supply pipeline 10 and a second liquid supply pipeline 11, the first liquid supply pipeline 10 is used for the flow of deionized water, and the second liquid supply pipeline 11 is used for the flow of chemical liquid agent. The liquid outlets of the first liquid supply pipeline 10 and the second liquid supply pipeline 11 are connected with the mixing cavity 12, so that the deionized water and the chemical liquid agent are mixed in the mixing cavity 12 to form a mixed liquid agent for spraying by the first nozzle 20 to the wafer 30. At the same time, the liquid supply branch 100 is arranged on the first liquid supply pipeline 10 and is communicated with the second nozzle 22, so that the second nozzle 22 can spray deionized water without chemical liquid agent to the back surface area of the wafer 30. Since the back surface area usually has less polishing liquid and abrasive, spraying only deionized water can meet the cleaning needs of the back surface area and reduce the use of chemical liquid agent, thereby saving production costs. In other embodiments, the liquid supply module can also be provided with three, four or even more liquid supply pipelines. Those skilled in the art can select appropriate multiple chemical liquid agents according to the composition of the polishing liquid and the abrasive to ensure the cleaning effect. At the same time, the liquid supply branch 100 can be arranged on the multiple liquid supply pipelines to form a mixed liquid agent suitable for the back surface area, which can be directly sprayed by the second nozzle 22, or an additional mixing cavity 12 can be arranged for mixing. Those skilled in the art can reasonably configure the liquid supply branch 100 according to the actual situation.

[0043] In this way, by adding the liquid supply branch 100 and connecting the liquid supply branch 100 with the second nozzle 22, the cleaning liquid sprayed to the back surface area of the wafer 30 is changed from the original mixed liquid agent to a single cleaning liquid. Since most of the residues are located in the wafer 30 during the polishing process, spraying a single cleaning liquid to the back surface area of the wafer 30 will not affect the cleaning effect, and the use of the corresponding cleaning liquid can be saved, thereby reducing the production cost.

[0044] Please continue to refer to Figure 2 As an optional embodiment, the flow controller 13 is arranged on any liquid supply pipeline, and the flow controller 13 is used for adjusting the flow of the cleaning liquid in the corresponding liquid supply pipeline. Those skilled in the art can understand that the flow controller 13 is a multi-hole plate combined linkage device, which is mostly composed of a flow setting adjustment valve and a dynamic adjustment device composed of two valve petals, a spring and a diaphragm. The operator can set the flow value by adjusting the flow setting adjustment valve, thereby realizing precise control of the flow of the cleaning liquid flowing in the liquid supply pipeline. In other embodiments, the flow controller 13 can also be replaced by a mass flow controller 13 (MFC) or other elements with flow control function. The present embodiment does not limit this.

[0045] Further, the supply liquid branch 100 is provided with a pressure regulating valve 101, which is in a normally open state during the process of the supply liquid module delivering cleaning liquid, and is used for adjusting the cleaning liquid flow in the supply liquid branch 100. Those skilled in the art can understand that the pressure regulating valve 101 is also called a pressure reducing valve, which reduces the inlet pressure to a certain determined outlet pressure through the local resistance of the valve flow channel, and relies on the energy of the medium itself to automatically maintain the stability of the outlet pressure. In the embodiment, the deionized water flowing in the first supply liquid pipeline 10 is directly mixed with the chemical liquid agent flowing in the second supply liquid pipeline 11 in the mixing chamber 12, and the other part of the deionized water is directly sprayed to the back region of the wafer 30 through the second nozzle 22 in the supply liquid branch 100. The setting of the pressure regulating valve 101 enables the operator to further control the flow rate and flow of the deionized water in the supply liquid branch 100, and further improves the practical performance of the supply liquid module.

[0046] Please refer to Figure 3 In another embodiment, the utility model also provides a brushing assembly, which comprises a first nozzle 20, a first brushing piece 21, a second nozzle 22, a second brushing piece 23 and the above-mentioned supply liquid module; the first nozzle 20 and the first brushing piece 21 are arranged close to the front region of the wafer 30, the first nozzle 20 is used for spraying the mixed liquid agent formed in the mixing chamber 12 to the front region of the wafer 30, and the first brushing piece 21 is used for brushing the front region of the wafer 30; the second nozzle 22 and the second brushing piece 23 are arranged close to the back region of the wafer 30, the second nozzle 22 is used for spraying the cleaning liquid flowing in the supply liquid branch 100 to the back region of the wafer 30, and the second brushing piece 23 is used for brushing the back region of the wafer 30. As an alternative embodiment, the first nozzle 20 sprays the mixed liquid agent diluted in a certain proportion to the front region of the wafer 30, and at the same time, the first brushing piece 21 brushes the front region of the wafer 30 to remove the polishing liquid and abrasive remaining in the front region of the wafer 30; the second nozzle 22 sprays deionized water to the back region of the wafer 30, and at the same time, the second brushing piece 23 brushes the back region of the wafer 30 to clean the back region of the wafer 30. The above-mentioned brushing assembly can clean the front region and the back region of the wafer 30 at the same time, and by using the above-mentioned supply liquid module, the amount of cleaning liquid can be reduced without affecting the cleaning effect of the wafer 30, which reduces the production cost and also avoids the waste of cleaning liquid.

[0047] Please continue to refer to Figure 3The brush cleaning assembly further comprises a first connecting pipeline 24 and a second connecting pipeline 25. The first connecting pipeline 24 is in communication with the mixing cavity 12, and a plurality of first nozzles 20 are arranged on the first connecting pipeline 24. The plurality of first nozzles 20 are arranged at intervals along the extension direction of the first connecting pipeline 24 and are arranged to extend towards the wafer surface area of the wafer 30. The second connecting pipeline 25 is in communication with the liquid supply branch 100, and a plurality of second nozzles 22 are arranged on the second connecting pipeline 25. The plurality of second nozzles 22 are arranged at intervals along the extension direction of the second connecting pipeline 25 and are arranged to extend towards the wafer back area of the wafer 30. It should be noted that, in Figure 3 In the exemplary embodiment shown, the first connecting pipeline 24 and the second connecting pipeline 25 are both straight pipes and are arranged on the two sides of the wafer 30, respectively. The first nozzles 20 and the second nozzles 22 are both arranged in one-to-one correspondence and are arranged in three. In other embodiments, the first connecting pipeline 24 and the second connecting pipeline 25 can also be arc-shaped pipes, and the number of the first nozzles 20 and the second nozzles 22 can also be other reasonable numbers. The arrangement of the first nozzles 20 and the second nozzles 22 can also be non-uniform random arrangement, as long as the spray range of the nozzles can cover the entire surface of the wafer 30. The present embodiment does not limit this.

[0048] As an optional embodiment, the brush cleaning assembly further comprises a brush cleaning member driving device (not shown in the figure). The brush cleaning member driving device is arranged in one-to-one correspondence with the first brush cleaning member 21 and the second brush cleaning member 23, respectively, and is used to drive the first brush cleaning member 21 and the second brush cleaning member 23 to rotate around the shaft to realize the brush cleaning of the surface of the wafer 30. Figure 3 In the embodiment shown, the brush cleaning member driving device can be a rotating shaft which can rotate around the shaft. The brush cleaning member can be wrapped around the periphery of the rotating shaft. In this way, the brush cleaning member can rotate around the shaft under the driving of the rotating shaft, thereby realizing the contact and sweeping of the surface of the wafer 30. In other embodiments, the brush cleaning member driving device can also be a motor which can directly drive the brush cleaning member to rotate and move to complete the cleaning of the surface of the wafer 30.

[0049] As another optional embodiment, please continue to refer to Figure 3The brush washing assembly further comprises wafer driving devices 26, which are in contact with the edge of the wafer 30 and used to drive the wafer 30 to rotate. Further, the wafer driving devices 26 are multiple in number and are arranged at intervals around the edge of the wafer 30. It is to be noted that, in the embodiment, the wafer driving devices 26 are disc-shaped and are provided with accommodating grooves (not shown in the figure) with a size suitable for the thickness of the wafer 30 along the circumferential direction, the edge of the wafer 30 is placed in the accommodating grooves, and the wafer driving devices 26 rotate around the shaft, thereby driving the wafer 30 to rotate, so that the cleaning liquid sprayed by the nozzle can cover the entire surface of the wafer 30, and the brush washing member rotating around the shaft can scrub the entire surface of the wafer 30. Meanwhile, the multiple wafer driving devices 26 arranged at intervals around the edge of the wafer 30 can ensure the stability of the wafer 30 during rotation.

[0050] In another embodiment, the utility model also provides a semiconductor manufacturing equipment, including the brush washing assembly as above. It is to be noted that, in the embodiment, the semiconductor manufacturing equipment can be a chemical mechanical polishing equipment, so that, by using the brush washing assembly, the amount of cleaning liquid can be reduced without affecting the cleaning effect of the wafer 30, thereby reducing the production cost and avoiding the waste of cleaning liquid.

[0051] In summary, in the liquid supply module, the brush washing assembly and the semiconductor manufacturing equipment provided by the embodiments of the utility model, the liquid supply module comprises a mixing cavity and at least two liquid supply pipelines, different cleaning liquids flow in the liquid supply pipelines respectively, the liquid outlets of the at least two liquid supply pipelines are communicated with the mixing cavity respectively, so that the cleaning liquids flowing in the liquid supply pipelines are mixed in the mixing cavity to form a mixed liquid agent, the mixing cavity is connected with a first nozzle, the first nozzle is used to spray the mixed liquid agent to the wafer surface area, at least one liquid supply pipeline is further provided with a liquid supply branch, the liquid supply branch is connected with a second nozzle, the second nozzle is used to spray corresponding cleaning liquid to the wafer back area, and the flow of the cleaning liquid in the liquid supply pipeline provided with the liquid supply branch is greater than that in the remaining liquid supply pipelines.

[0052] In this way, by additionally arranging the liquid supply branch and connecting the liquid supply branch with the second nozzle, the cleaning liquid sprayed to the wafer back area is changed from the original mixed liquid agent to a single cleaning liquid. Since most of the residues are located in the wafer surface area in the polishing process, spraying a single cleaning liquid to the wafer back area will not affect the cleaning effect, and the amount of the corresponding cleaning liquid can be saved, thereby reducing the production cost.

[0053] The above description is only a description of the preferred embodiments of the utility model and does not limit the scope of the utility model in any way. Any modification or modification of the utility model made by a person skilled in the art according to the above disclosure is within the protection scope of the claims.

Claims

1. A liquid supply module, characterized by, The application relates to a liquid supply module for a wafer cleaning device. The liquid supply module comprises a mixing cavity and at least two liquid supply pipes; Different cleaning liquids flow through the liquid supply pipes respectively; The liquid outlets of the at least two liquid supply pipes are respectively communicated with the mixing cavity, so that the cleaning liquids flowing through the liquid supply pipes are mixed in the mixing cavity to form a mixed liquid agent; the mixing cavity is connected with a first nozzle, and the first nozzle is used for spraying the mixed liquid agent to a wafer surface area of a wafer; At least one of the liquid supply pipes is further provided with a liquid supply branch, the liquid supply branch is connected with a second nozzle, and the second nozzle is used for spraying the corresponding cleaning liquid to a wafer back area of the wafer; The flow rate of the cleaning liquid in the liquid supply pipe provided with the liquid supply branch is greater than that in the other liquid supply pipes.

2. The liquid supply module of claim 1, wherein, Flow controllers are arranged on any of the liquid supply pipes, and the flow controllers are used for adjusting the flow rate of the cleaning liquid in the corresponding liquid supply pipe.

3. The liquid supply module of claim 1, wherein, A pressure regulating valve is arranged on the liquid supply branch, and the pressure regulating valve is in an open state during the process of conveying the cleaning liquid by the liquid supply module, and is used for adjusting the flow rate of the cleaning liquid in the liquid supply branch.

4. The liquid supply module according to any one of claims 1 to 3, wherein The liquid supply module comprises a first liquid supply pipe and a second liquid supply pipe; The first liquid supply pipe is used for flowing through deionized water, and the second liquid supply pipe is used for flowing through a chemical liquid agent; the liquid supply branch is arranged on the first liquid supply pipe, and the second nozzle is used for spraying the deionized water to the wafer back area of the wafer, wherein the flow rate of the deionized water is greater than that of the chemical liquid agent.

5. A brushing assembly characterized by, The application relates to a wafer cleaning device. The first nozzle and the first brush cleaning part are arranged close to a wafer surface area of a wafer, the first nozzle is used for spraying the mixed liquid agent formed in the mixing cavity to the wafer surface area of the wafer, and the first brush cleaning part is used for brushing the wafer surface area; The second nozzle and the second brush cleaning part are arranged close to a wafer back area of the wafer, the second nozzle is used for spraying the cleaning liquid flowing through the liquid supply branch to the wafer back area of the wafer, and the second brush cleaning part is used for brushing the wafer back area. The brush cleaning assembly further comprises a first connecting pipe and a second connecting pipe; 6. The brushing assembly of claim 5, wherein, The first connecting pipe is communicated with the mixing cavity, a plurality of the first nozzles are arranged on the first connecting pipe, the plurality of the first nozzles are arranged at intervals along the extension direction of the first connecting pipe, and the plurality of the first nozzles are arranged to stretch out towards the wafer surface area; The second connecting pipe is communicated with the liquid supply branch, a plurality of the second nozzles are arranged on the second connecting pipe, the plurality of the second nozzles are arranged at intervals along the extension direction of the second connecting pipe, and the plurality of the second nozzles are arranged to stretch out towards the wafer back area. The brush cleaning assembly further comprises a brush cleaning part driving device; 7. The brushing assembly of claim 5, wherein, The brush cleaning part driving device is arranged in one-to-one correspondence with the first brush cleaning part and the second brush cleaning part respectively, and is used for driving the first brush cleaning part and the second brush cleaning part to rotate around the shaft to realize the brushing of the wafer surface. The brush cleaning assembly further comprises a wafer driving device; 8. The brushing assembly of claim 5, wherein, ​ The wafer driving device is in contact with the edge of the wafer and is used to drive the wafer to rotate.

9. The brushing assembly of claim 8, wherein, The number of the wafer driving devices is multiple, and the multiple wafer driving devices are arranged at intervals around the edge of the wafer.

10. A semiconductor manufacturing apparatus, characterized by comprising: A brushing assembly comprising any one of claims 5 to 9.

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