Intelligent cleaning mechanism for wafer production and processing
By designing an intelligent cleaning mechanism that combines a telescopic motor and a moving base structure, efficient wafer cleaning is achieved, solving the problem of poor cleaning effect in existing equipment and ensuring wafer integrity and cleaning effectiveness.
Patent Information
- Application Number
- CN202422886460.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-26
AI Technical Summary
Existing wafer cleaning equipment cannot effectively improve the cleaning effect during use. Ultrasonic cleaning may cause wafer breakage, conductive adhesive cracking, and cleaning fluid seepage, affecting wafer performance and reliability.
An intelligent cleaning mechanism was designed, comprising a housing, side frame, operating table, telescopic motor, back frame, movable seat structure, water tank and slide. The telescopic motor drives the multi-dimensional movement of fine brushes and spray heads, and combined with water guide pipes and reciprocating screws, it achieves precise positioning and comprehensive spray cleaning.
It achieves efficient and intelligent wafer cleaning, improves cleaning efficiency and effectiveness, avoids wafer damage, and ensures timely discharge of wastewater and impurities after cleaning.
Smart Images

Figure CN223518227U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer processing and cleaning equipment technical field, concretely relates to a kind of intelligent cleaning mechanism for wafer production and processing. BACKGROUND
[0002] Wafer refers to the silicon wafer used for silicon semiconductor integrated circuit manufacturing, since its shape is circular, it is called silicon wafer, it is the substrate of built-in microelectronic device in wafer and on wafer, and it is the basic material for manufacturing chip and various electronic components, and these semiconductor chips are widely used in computer, smart phone, tablet computer, automobile, watch, electrical appliance and solar panel field.
[0003] The existing wafer cleaning equipment cannot effectively improve the cleaning effect in use, for example, a wafer cleaning machine is disclosed in application No. CN201621063171.X. The existing wafer cleaning equipment is usually cleaned by ultrasonic vibration in use, the high-frequency vibration and impact force generated by ultrasonic wave can cause wafer breakage or loosening, thereby affecting the performance and reliability of wafer, the cleaning liquid may penetrate into the wafer during ultrasonic cleaning process, causing failure or short circuit, which not only affects the performance of wafer, but also may cause permanent damage to its internal structure, the wafer on the wafer is usually connected by conductive glue, and the ultrasonic high-frequency oscillation may cause the conductive glue to be cracked, thereby causing the problem of open circuit, which causes the wafer to work abnormally, thereby reflecting the problem of low efficiency of wafer cleaning equipment.
[0004] Therefore, it is necessary to invent an intelligent cleaning mechanism for wafer production and processing to solve the above problems. UTILITY MODEL CONTENT
[0005] The utility model aims at providing an intelligent cleaning mechanism for wafer production and processing to solve the problem that the technology cannot effectively improve the cleaning effect in use.
[0006] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme: an intelligent cleaning mechanism for wafer production and processing, including box, side frame, operation platform, telescopic motor, back frame, mobile seat structure, water storage tank and sliding seat, the surface both sides edges of the box are provided with side frame, the surface of the box is installed with operation platform, the outside one side of the operation platform is provided with telescopic motor, the telescopic motor is located below the outside middle part of one side side frame, the edge between two side frames is installed with back frame, the back frame is located on the surface of the box, the front side upper side of the back frame is installed with mobile seat structure, one corner of the surface of the box is fixedly installed with water storage tank, the lower side of the mobile seat structure is installed with sliding seat, one end of the sliding seat is fixed on the front wall of back frame respectively.
[0007] Preferably, a first water outlet is arranged at a lower corner of the rear side of the box, a second water outlet is arranged at a lower side of a wall of the box, and a mobile wheel is installed at each of the four corners of the bottom surface of the box.
[0008] Preferably, a delivery platform is arranged inside the box, and the delivery platform is arranged in a stepped manner.
[0009] Preferably, a placing groove is arranged at each of the two sides and the middle of the inner bottom surface of the operation platform, a hand buckle groove is arranged at the top edge of the placing groove, a wafer body is arranged inside the placing groove, and the inner bottom surface of the operation platform is arranged in a meshed manner.
[0010] Preferably, a telescopic rod is connected to the output end of the telescopic motor, the telescopic rod penetrates through the middle of the side frame, a push plate is fixedly welded to the output end of the telescopic rod, and a fine brush is arranged on the bottom surface of the push plate.
[0011] Preferably, the mobile seat structure comprises a machine base, a fixed seat, a horizontal moving seat and a vertical moving seat, the machine base is fixedly installed on the front side of the back frame, the fixed seat is installed on one side of the machine base, the horizontal moving seat is installed on the outer top of the fixed seat, and the vertical moving seat is installed below the horizontal moving seat.
[0012] Preferably, a spraying head is arranged on the bottom of the vertical moving seat, water spraying holes are arranged around and in the middle of the bottom surface of the spraying head, a water guide pipe is installed on one side of the connection between the spraying head and the vertical moving seat, and the water guide pipe is connected to the outer wall of a water storage tank outside the box.
[0013] Preferably, a moving groove is arranged in the middle of the surface of the sliding seat, a reciprocating screw rod is installed inside the moving groove, a driving motor is connected to one end of the reciprocating screw rod, a sliding block that is slidably matched with the moving groove is installed on the bottom of the mobile seat structure, the reciprocating screw rod penetrates through the middle of the sliding block, and the reciprocating screw rod drives the upper mobile seat structure to move as a whole through the driving of the driving motor.
[0014] In the above technical solution, the technical effects and advantages of the utility model are as follows:
[0015] The intelligent cleaning mechanism for wafer production and processing realizes efficient and intelligent cleaning of wafers, the rear lower corner of the box and the lower side of the wall of the box are respectively provided with a first water outlet and a second water outlet, which facilitates the discharge of waste water after cleaning, the four corners of the bottom surface of the box are provided with mobile wheels, and each mobile wheel is provided with a bottom fixing part on one side, so that the whole cleaning mechanism can be conveniently moved and fixed, and the delivery platform arranged in the box in a stepped manner facilitates the discharge of waste water and improves the drainage efficiency.
[0016] The output end of the telescopic motor is connected with a telescopic rod, the telescopic rod penetrates through the side frame and is fixedly welded with a push plate, the bottom surface of the push plate is provided with a fine brush, through the driving of the telescopic motor, the fine brush can clean the wafer in detail, remove the stains and impurities on the surface, the moving seat structure comprises a base, a fixed seat, a horizontal moving seat and a vertical moving seat, these parts jointly realize the multi-dimensional movement of the spray head, the bottom surface of the spray head is provided with water spray holes around and in the middle, through the water guide pipe connected with the water storage tank, the wafer can be fully sprayed and cleaned, the middle part of the surface of the sliding seat is provided with a moving groove, the reciprocating lead screw is installed in the moving groove, and one end of the reciprocating lead screw is connected with the driving motor. BRIEF DESCRIPTION OF DRAWINGS
[0017] Fig. 1 It is the whole structure schematic view of the utility model;
[0018] Fig. 2 It is the operation platform structure schematic view of the utility model;
[0019] Fig. 3 It is the moving seat structure side view structure schematic view of the utility model;
[0020] Fig. 4 It is the moving seat structure side view structure schematic view of the utility model;
[0021] Fig. 5 It is the box internal structure schematic view of the utility model;
[0022] Fig. 6 It is the box side view structure schematic view of the utility model.
[0023] BRIEF DESCRIPTION OF DRAWINGS:
[0024] 1, box;101, the interface platform;2, side frame;3, operation platform;301, the placement groove;302, hand buckle groove;303, wafer body;4, telescopic motor;401, telescopic rod;402, push plate;403, fine brush;5, back frame;6, moving seat structure;601, base;602, fixed seat;603, horizontal moving seat;604, vertical moving seat;605, spray head;606, water spray hole;607, water guide pipe;7, water storage tank;8, sliding seat;801, moving groove;802, reciprocating lead screw;803, driving motor;9, first water outlet;10, second water outlet;11, moving wheel;12, fixed part. DETAILED DESCRIPTION
[0025] In order to make the technical personnel of the prior art better understand the technical scheme of the present application, the present application will be further described in detail below with reference to the drawings.
[0026] The utility model provides a kind of Figs. 1-6 As shown in a kind of intelligent cleaning mechanism for wafer production and processing, including box 1, side frame 2, operation table 3, telescopic motor 4 and back frame 5, the inside of box 1 is connected table 101, and the connected table 101 is arranged in echelon, and the surface of box 1 is provided with side frame 2 on both sides edge, and the surface of box 1 is provided with operation table 3, and the inner bottom surface of operation table 3 is provided with placing groove 301 on both sides and middle part, and the top edge of placing groove 301 is provided with hand buckle groove 302, and the inside of placing groove 301 is placed with wafer body 303, and the output end of telescopic motor 4 is connected with telescopic rod 401, and telescopic rod 401 penetrates the middle part of side frame 2, and the output end of telescopic rod 401 is fixedly welded with push plate 402, and the bottom surface of push plate 402 is provided with fine brush 403, and the inner bottom surface of operation table 3 is provided with net, and the outside one side of operation table 3 is provided with telescopic motor 4, and telescopic motor 4 is located at the outside middle part below one side side frame 2, and back frame 5 is installed between the edge of two side frames 2, and back frame 5 is located on the surface of box 1;
[0027] The front side of back frame 5 is provided with moving seat structure 6, and moving seat structure 6 includes base 601, fixed seat 602, horizontal moving seat 603 and longitudinal moving seat 604, base 601 is fixedly installed on the front side of back frame 5, one side of base 601 is provided with fixed seat 602, the outside upper side of fixed seat 602 is provided with horizontal moving seat 603, the lower side of horizontal moving seat 603 is provided with longitudinal moving seat 604, the bottom of longitudinal moving seat 604 is provided with spray head 605, the bottom surface of spray head 605 is provided with water spraying hole 606 on all around and middle part, and one side of the connecting place between spray head 605 and longitudinal moving seat 604 is provided with water guide pipe 607, water guide pipe 607 is connected with the outer wall of water storage tank 7 outside box 1, water storage tank 7 is fixedly installed on the corner of the surface of box 1, the bottom of moving seat structure 6 is provided with sliding seat 8 on both sides, one end of sliding seat 8 is fixed on the front wall of back frame 5 respectively, and the surface middle part of sliding seat 8 is provided with moving groove 801, and reciprocating lead screw 802 is installed in the inside of moving groove 801, one end of reciprocating lead screw 802 is connected with driving motor 803, the bottom of moving seat structure 6 is provided with sliding block matched with moving groove 801, and reciprocating lead screw 802 penetrates the middle part of sliding block, reciprocating lead screw 802 drives the overall movement of the upper moving seat structure 6 by driving motor 803, and the corner of the rear side below box 1 is provided with first water outlet 9, and the outside one side below box 1 is provided with second water outlet 10, and moving wheel 11 is installed on the bottom surface of each moving wheel 11.
[0028] The utility work principle:
[0029] Refer to the accompanying drawings Figs. 1-6 With reference to the accompanying drawings
[0030] In use of the device, first place the wafer in the placement slot 301 of the operation table 3, ensure the wafer is placed steadily and will not slip, turn on the power of the cleaning mechanism, start the telescopic motor 4, push the wafer to the appropriate position, then start the drive motor 803, drive the reciprocating lead screw 802 to drive the moving seat structure 6 and the shower head 605 to move reciprocally, at the same time open the valve of the water storage tank 7, make the cleaning liquid enter the shower head 605 through the water guide pipe 607 to clean, in the cleaning process, the water spraying intensity and moving speed of the shower head 605 can be adjusted according to the cleaning condition of the wafer surface to achieve the best cleaning effect, when the wafer surface is cleaned, turn off the drive motor 803 and the telescopic motor 4, stop the water spraying of the shower head 605, then close the valve of the water storage tank 7, open the first water outlet 9 or the second water outlet 10, discharge the waste water from the box 1, after the cleaning is finished, turn off the power, after the cleaning mechanism stops running completely, open the hand buckle slot 302 of the operation table 3, take out the cleaned wafer, periodically maintain and maintain the cleaning mechanism, including cleaning the shower head 605, checking the running condition of the drive motor 803 and the telescopic motor 4, replacing the worn parts, etc., to ensure the normal running of the cleaning mechanism and prolong the service life.
Claims
1. An intelligent cleaning mechanism for wafer production and processing, comprising a box body (1), a side frame (2), an operation table (3), a telescopic motor (4), a back frame (5), a moving seat structure (6), a water storage tank (7) and a sliding seat (8), characterized in that, The surface of the box (1) is provided with side frame (2), the surface of the box (1) is provided with operation platform (3), the outside of operation platform (3) is provided with telescopic motor (4), telescopic motor (4) is located in the lower part of the outside of one side of side frame (2), back frame (5) is installed between the edges of two side frame (2), back frame (5) is located on the surface of box (1), mobile seat structure (6) is installed on the top of the front side of back frame (5), water storage tank (7) is fixedly installed on one corner of the surface of box (1), slide (8) is installed on the lower side of mobile seat structure (6), one end of slide (8) is fixed on the front wall of back frame (5) respectively.
2. The intelligent cleaning mechanism for wafer production and processing according to claim 1, characterized in that: The lower corner of the rear side of the box (1) is provided with a first water outlet (9), and the lower side of the outer wall of the box (1) is provided with a second water outlet (10). The bottom surface of the box (1) is provided with a movable wheel (11) at each corner. One side of each movable wheel (11) is provided with a bottom fixing member (12). 3.The intelligent cleaning mechanism for wafer production and processing according to claim 1, characterized in that: The inside of the box (1) is provided with a delivery platform (101), which is arranged in a stepped manner.
4. The intelligent cleaning mechanism for wafer production and processing according to claim 1, characterized in that: The inner bottom surface of the operation platform (3) is provided with a placing groove (301) on both sides and in the middle. The top edge of the placing groove (301) is provided with a hand buckle groove (302). The inside of the placing groove (301) is provided with a wafer body (303). The inner bottom surface of the operation platform (3) is provided in a net shape.
5. The intelligent cleaning mechanism for wafer production and processing according to claim 1, characterized in that: The output end of the telescopic motor (4) is connected with a telescopic rod (401), the telescopic rod (401) penetrates through the middle part of the side frame (2), the output end of the telescopic rod (401) is fixedly welded with a push plate (402), the bottom surface of the push plate (402) is provided with a fine brush (403). 6.The intelligent cleaning mechanism for wafer production and processing according to claim 1, characterized in that: The mobile seat structure (6) comprises a machine base (601), a fixed seat (602), a horizontal moving seat (603) and a vertical moving seat (604). The machine base (601) is fixedly installed on the front side of the back frame (5). One side of the machine base (601) is provided with a fixed seat (602). The outer top of the fixed seat (602) is provided with a horizontal moving seat (603). The lower part of the horizontal moving seat (603) is provided with a vertical moving seat (604). 7.The intelligent cleaning mechanism for wafer production and processing according to claim 6, characterized in that: The bottom of the vertical moving seat (604) is provided with a spray head (605). The bottom surface and the middle part of the spray head (605) are provided with water spray holes (606). One side of the connection between the spray head (605) and the vertical moving seat (604) is provided with a water guide pipe (607). The water guide pipe (607) is connected with the outer wall of the water storage tank (7) outside the box (1). 8.The intelligent cleaning mechanism for wafer production and processing according to claim 1, characterized in that: The surface of the sliding seat (8) is provided with a moving groove (801) in the middle, the inside of the moving groove (801) is provided with a reciprocating screw (802), one end of the reciprocating screw (802) is connected with a driving motor (803), the bottom of the moving seat structure (6) is provided with a sliding block matched with the moving groove (801), and the reciprocating screw (802) penetrates the middle of the sliding block, the reciprocating screw (802) drives the upper moving seat structure (6) to move as a whole through the driving of the driving motor (803).
Citation Information
Patent Citations
Wafer cleaning machine
CN206382286U