Invisible silicon wafer cutting machine

Abstract

The utility model provides a silicon wafer invisible cutting machine which comprises a portal frame, a vertical moving mechanism arranged on the portal frame, a laser mechanism partially arranged on the vertical moving mechanism, a camera assembly, a rotating mechanism and a horizontal moving mechanism driving the rotating mechanism to move below the laser mechanism. The rotating mechanism comprises a motor, a rotating seat, a rotating platform and a rotating limiting assembly which are sequentially arranged from bottom to top, the motor drives the rotating seat and the rotating platform to rotate horizontally, and the silicon wafer is arranged on the rotating platform; the rotary limiting assembly comprises a linear guide rail, a sliding block arranged on the linear guide rail in a sliding mode, a check block arranged on the sliding block and a sensor assembly used for sensing displacement of the check block, an elastic piece is connected between the sliding block and the linear guide rail, and a protruding part connected with the check block in a matched and abutting mode is arranged on one side of the rotary platform.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially relates to a silicon wafer invisible cutting machine. BACKGROUND

[0002] The process of laser invisible cutting machine cutting wafer mainly involves the following key steps: firstly, laser focusing and energy absorption process, the laser beam is focused to the inside of wafer through optical system, when the laser beam is focused in the inside of wafer, its high energy density will cause material local absorption of a large amount of energy.For silicon wafer, because it has certain permeability to infrared light, therefore laser can penetrate wafer surface and form focusing area inside.Secondly, the modification layer forming step, in the area of laser focusing, due to the high concentration of energy, the wafer material will occur multi-photon absorption nonlinear absorption effect, causing material deformation and crack.These cracks will gradually expand under the action of laser pulse, form modification layer.The material molecular combination in modification layer is destroyed, and the connection of material is weakened, so that wafer becomes easier to separate in this area.Further for microcrack expansion and chip separation, after the formation of modification layer, by externally applying certain tensile stress (such as using tensile bearing film), microcrack in modification layer can be further extended upwards and downwards, finally realize the separation of wafer.Because the whole cutting process occurs in the material inside, therefore can avoid the mechanical stress, debris and thermal influence etc.

[0003] The existing laser invisible cutting machine generally controls the movement of laser head through programmable multi-axis motion controller, and then cuts different positions of wafer.In this way, although multi-axis motion controller can realize high-precision control, but its response speed may be limited, especially when processing high-speed motion or complex trajectory, may cause cutting efficiency to reduce;In addition, the cost of equipment is higher, increases the investment cost of overall system.

[0004] Therefore, it is necessary to design a silicon wafer invisible cutting machine to solve the above problems. Utility model content

[0005] The utility model aims at providing a silicon wafer invisible cutting machine that gives consideration to cutting precision, cutting efficiency and equipment cost.

[0006] To achieve the above object, the utility model discloses the following technical scheme: a silicon wafer invisible cutting machine is used for laser cutting to silicon wafer, and it includes portal frame, the vertical movement mechanism of being arranged on the portal frame, the laser mechanism of being partially arranged on the vertical movement mechanism, camera assembly, rotating mechanism and horizontal movement mechanism that drives the rotating mechanism moves below the laser mechanism, the rotating mechanism includes the motor that sets gradually from below to above, rotating seat, rotating platform and rotating limiting component, the motor drives rotating seat and rotating platform horizontal rotation, the silicon wafer is arranged on the rotating platform, the rotating limiting component includes linear guide rail, the slider of sliding and being arranged on the linear guide rail, the baffle of being arranged on slider, the sensor component for inducting the displacement of baffle, the elastic member is connected between the slider and the linear guide rail, and one side of the rotating platform is equipped with the convex part that cooperates with the abutment of baffle.

[0007] As a further improved technical scheme of the utility model, the sensor component includes a sensor strip on the slider and photoelectric sensors at both ends of the linear guide rail, the slider drives the sensor strip to move along the linear guide rail, and the front end and the rear end of the sensor strip are in contact with the photoelectric sensors at both ends of the linear guide rail respectively.

[0008] As a further improved technical scheme of the utility model, the elastic member includes two springs, and the slider is connected with the front end and the rear end of the linear guide rail by the two springs respectively.

[0009] As a further improved technical scheme of the utility model, the rotating mechanism further includes a suction cup assembly, the suction cup assembly includes a plurality of suction cup seats arranged on the outer periphery of the rotating seat and vacuum suction cups, and the suction surface of the vacuum suction cup is flush with the upper surface of the rotating platform.

[0010] As a further improved technical scheme of the utility model, the motor is a torque motor, an air duct is formed in the rotating seat and communicates with the suction cups, a rotating body quick connector that rotates synchronously with the rotating seat is arranged in the hollow shaft of the motor, and the air duct is connected with the rotating body quick connector through an air tube.

[0011] As a further improved technical scheme of the utility model, the laser mechanism includes a laser, a collimator, a mirror and a focusing mirror arranged in sequence, the mirror and the focusing mirror are arranged on the vertical movement mechanism, and the camera assembly is arranged on the vertical movement mechanism.

[0012] As a further improved technical scheme of the utility model, the camera assembly includes a CCD camera, and the laser is a picosecond infrared laser.

[0013] As a further improvement of the present invention, the horizontal moving mechanism includes a Y-axis linear module and an X-axis linear module disposed on the Y-axis linear module, and the rotating mechanism is disposed on the X-axis linear module. The horizontal moving mechanism drives the rotating mechanism to move in the X-axis direction and the Y-axis direction.

[0014] As can be seen from the above technical solutions, the silicon wafer stealth dicing machine of this utility model has the following advantages:

[0015] The rotary limiting component uses a spring-loaded slider. When the rotating platform rotates to the point where the protrusion engages with the stop, the slider continues to move a certain distance. The elastic contact between the stop and the protrusion provides a buffering effect when the rotating platform approaches the limiting position, reducing vibration and noise caused by rapid stops or sudden impacts, and extending the equipment's service life. Furthermore, the rotation angle of the rotating platform can be precisely controlled by adjusting the elastic force and movement distance of the slider, ensuring the stability and accuracy of the equipment's operation. The design of the rotating platform and rotary limiting component allows the silicon wafer to automatically adjust its angle during the cutting process, avoiding manual intervention, reducing operational difficulty and labor intensity, and achieving a high degree of automation. Real-time monitoring of the silicon wafer's position and orientation via a camera component, combined with precise control of the vertical and horizontal movement mechanisms, enables high-precision positioning and cutting of the silicon wafer. In addition, this equipment is suitable for cutting silicon wafers of different sizes and shapes, demonstrating strong adaptability. Attached Figure Description

[0016] Figure 1 This is a perspective view of a silicon wafer stealth dicing machine according to an embodiment of the present invention.

[0017] Figure 2 for Figure 1 A three-dimensional view of the rotating mechanism.

[0018] Figure 3 for Figure 2 A three-dimensional view of the rotating limit component.

[0019] Figure 4 for Figure 3 A perspective view of the rotating limiting component from another direction. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] Please refer to Figure 1As shown, the utility model provides a kind of silicon wafer invisible cutting machine, for laser cutting to silicon wafer, it includes base 10, be set on the portal frame 20 of base 10, be set on the vertical movement mechanism 30 of portal frame 20, part be set on the laser mechanism 40 of vertical movement mechanism 30, camera assembly 70, horizontal movement mechanism 60 and be set on its rotating mechanism 50.

[0022] Laser mechanism 40 includes laser 41, collimator 42, reflecting mirror 43 and focusing mirror 44 that are sequentially arranged, reflecting mirror 43 and focusing mirror 44 are set on vertical movement mechanism 30, and are moved up and down under the driving of vertical movement mechanism 30.Laser 41 is used to generate high-energy laser beam, and laser 41 is preferably picosecond infrared laser, which has the characteristics of high coherence, good directionality and narrow wavelength, and can maintain good directionality and focusing during transmission.The light beam generated by laser 41 becomes parallel light or approximately parallel light after passing through collimator 42, and collimator 42 adjusts the propagation direction and angle of the light beam through the internal lenses or prisms and other optical elements, so that the light beam is more parallel, and the directionality of the light beam is ensured before reaching focusing mirror 44.Reflecting mirror 43 is used to reflect the laser beam after collimation to focusing mirror 44.Focusing mirror 44 is used to focus the parallel laser beam into a point, and the energy density of the laser beam is significantly improved, so that a high-temperature area can be generated on the workpiece surface to realize material cutting.

[0023] Camera assembly 70 is arranged side by side with focusing mirror 44 on vertical movement mechanism 30.The camera assembly includes a CCD camera, which monitors and corrects the position of the product in real time to ensure the accuracy of the product position during cutting.

[0024] Vertical movement mechanism 30 can use motor linear module in the prior art, and the specific structure is not described in detail.Horizontal movement mechanism 60 is used to drive the whole rotating mechanism 50 to move horizontally.Specifically, horizontal movement mechanism 60 includes Y-axis linear module and X-axis linear module arranged on the Y-axis linear module, and rotating mechanism 50 is arranged on the X-axis linear module.Horizontal movement mechanism 60 drives rotating mechanism 50 to move in X-axis direction and Y-axis direction.Both Y-axis linear module and X-axis linear module can use motor linear module in the prior art, and the specific structure is not described in detail.

[0025] Please refer to Figure 2 As shown, rotating mechanism 50 includes base 51, motor 52, rotating seat 53 and rotating platform 55 arranged from bottom to top in sequence, and suction cup assembly 56 and rotating limiting assembly 54.Motor 52 drives rotating seat 53 and rotating platform 55 to rotate horizontally, and motor 52 is preferably a torque motor.

[0026] Please refer to Figure 3 And Figure 4As shown, the rotation limiting assembly 54 comprises a support 541, a linear guide rail 542 arranged on the support 541, a sliding block 543 slidingly arranged on the linear guide rail 542, a stopper 544 arranged on the sliding block 543, and a sensor assembly for sensing the displacement of the stopper 544. The sliding block 543 is connected with the linear guide rail 542 through an elastic member, and one side of the rotating platform 55 is provided with a protruding portion abutting with the stopper 544.

[0027] The sensor assembly comprises a sensing sheet 545 arranged on the sliding block 543 and photoelectric sensors 547 arranged at two ends of the linear guide rail 542, the sliding block 543 drives the sensing sheet 545 to move along the linear guide rail 542, and the front end and the rear end of the sensing sheet 547 are in contact with the photoelectric sensors 547 at the two ends of the linear guide rail 542 respectively. The elastic member comprises two springs 549, the two springs are connected with the front end and the rear end of the linear guide rail 542 through the sliding block 543 respectively, specifically, the middle part of the sensing sheet 545 is provided with a mounting sheet 548, the two ends of the linear guide rail 542 are respectively provided with mounting sheets 546, and the two springs 549 are connected with the mounting sheet 548 and the mounting sheet 549 respectively.

[0028] The suction cup assembly 56 comprises a plurality of suction cup seats 561 arranged on the outer periphery of the rotating seat 53 and vacuum suction cups 562, and the suction surface of the vacuum suction cup 562 is flush with the upper surface of the rotating platform 55. The silicon wafer is placed on the rotating platform 55, and the edge of the silicon wafer is fixed by the vacuum suction cup 562.

[0029] The rotating seat 53 is provided with a ventilation pipeline communicated with the suction cup 562, the hollow shaft of the motor 52 is provided with a rotating body quick connector rotating synchronously with the rotating seat 53, the ventilation pipeline is connected with the rotating body quick connector through an air pipe, the rotating body quick connector is communicated with an external vacuum equipment, and the vacuum suction cup 562 is vacuumized.

[0030] The terms such as "upper", "lower", "front", "back" and the like used herein to indicate spatial relative positions are used for the purpose of facilitating the description to describe the relationship between one feature relative to another feature as shown in the drawings. It can be understood that the spatial relative position terms can be intended to include different positions other than the positions shown in the drawings, and should not be understood as limiting the claims.

[0031] In addition, the above embodiments are only used to illustrate the technical solutions described in the present application and not to limit the technical solutions described in the present application. The understanding of the specification should be based on the technical personnel in the art. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that the technical personnel in the art can still modify or equivalently replace the present application, and all technical solutions and improvements which do not deviate from the spirit and scope of the present application should be covered in the claim range of the present application.

Claims

1. A silicon wafer stealth dicing machine for laser dicing silicon wafers, characterized in that: The gantry, the vertical movement mechanism arranged on the gantry, the laser mechanism arranged on the vertical movement mechanism, the camera assembly, the rotating mechanism, and the horizontal movement mechanism for driving the rotating mechanism to move below the laser mechanism, the rotating mechanism comprises a motor, a rotating seat, a rotating platform, and a rotating limiting assembly arranged in sequence from bottom to top, the motor drives the rotating seat and the rotating platform to rotate horizontally, the silicon wafer is arranged on the rotating platform, the rotating limiting assembly comprises a linear guide rail, a sliding block arranged on the linear guide rail, a stop block arranged on the sliding block, and a sensor assembly for sensing the displacement of the stop block, the sliding block and the linear guide rail are connected with an elastic member, and one side of the rotating platform is provided with a protruding portion which abuts against the stop block.

2. The silicon wafer stealth dicing machine of claim 1, wherein: The sensor assembly comprises a sensing sheet arranged on the sliding block and a photoelectric sensor arranged at both ends of the linear guide rail, the sliding block drives the sensing sheet to move along the linear guide rail, and the front end and the rear end of the sensing sheet are in contact with the photoelectric sensors arranged at both ends of the linear guide rail.

3. The silicon wafer stealth dicing machine of claim 2, wherein: The elastic member comprises two springs, and the two springs are connected with the front end and the rear end of the linear guide rail respectively.

4. The silicon wafer stealth dicing machine of claim 1, wherein: The rotating mechanism further comprises a suction disc assembly, the suction disc assembly comprises a plurality of suction disc seats arranged on the outer periphery of the rotating seat and a vacuum suction disc, and the suction surface of the vacuum suction disc is flush with the upper surface of the rotating platform.

5. The silicon wafer stealth dicing machine of claim 4, wherein: The motor is a torque motor, an air duct is arranged on the rotating seat and communicates with the suction disc, a rotating body quick connector which rotates synchronously with the rotating seat is arranged in the hollow shaft of the motor, and the air duct is connected with the rotating body quick connector through an air tube.

6. The silicon wafer stealth dicing machine of claim 1, wherein: The laser mechanism comprises a laser, a collimator, a mirror, and a focusing mirror arranged in sequence, the mirror and the focusing mirror are arranged on the vertical movement mechanism, and the camera assembly is arranged on the vertical movement mechanism.

7. The silicon wafer stealth dicing machine of claim 6, wherein: The camera assembly comprises a CCD camera, and the laser is a picosecond infrared laser.

8. The silicon wafer stealth dicing machine of claim 1, wherein: The horizontal movement mechanism comprises a Y-axis linear module and an X-axis linear module arranged on the Y-axis linear module, the rotating mechanism is arranged on the X-axis linear module, and the horizontal movement mechanism drives the rotating mechanism to move in the X-axis direction and the Y-axis direction.

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