Wafer excessive glue trimming equipment and cutter device thereof

Abstract

The utility model discloses wafer glue overflow trimming equipment and a cutter device thereof, the cutter device is arranged at the periphery of a rotary adsorption device of the trimming equipment, the rotary adsorption device is used for adsorbing and fixing a wafer, and the cutter device is used for trimming the wafer; the tool device comprises a moving assembly, a rotating assembly and a floating tool bit assembly, the floating tool bit assembly can conduct front-back telescopic movement in a self-adaptive mode, and the rotating assembly is used for adjusting the horizontal rotating angle and the horizontal inclination angle of the floating tool bit assembly. The moving assembly is used for driving the rotating assembly and the floating tool bit assembly to move in the horizontal transverse and longitudinal direction. Therefore, the trimming equipment provided by the utility model has high flexibility, can realize the real-time following of the distance between the cutter and the wafer, and can realize the automatic glue removal of the notch and the internal trimming of the excessive glue.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor production, especially relates to a wafer overflow glue trimming device and tool device thereof. BACKGROUND

[0002] With the continuous development of wafer processing technology, wafer bonding process is applied more and more widely. Before wafer bonding, the overflow glue of wafer lamination needs to be trimmed, and the overflow glue of wafer edge can easily cause uneven alignment of the upper and lower wafers in the wafer bonding process, and difficult alignment of the notch. At present, in order to effectively solve the problem of wafer overflow glue after lamination, manual trimming of wafer edge overflow glue and notch is carried out by using blades, which has high labor intensity, uneven stress on wafers, easy appearance of hidden cracks and safety hazards.

[0003] Therefore, a wafer overflow glue trimming device and method are disclosed in Chinese patent CN 115213974 B; in the scheme, a rotating adsorption jig, a positioning clamp and a glue trimming knife mechanism are provided, the wafer is positioned on the rotating adsorption jig by the positioning clamp, and the wafer rotates at the same speed by the rotating adsorption device, and the trimming is realized by cooperating with the feed of the glue trimming knife mechanism.

[0004] However, in the scheme, the angle of the glue trimming knife mechanism is fixed, and only the outer edge of the wafer overflow glue can be modified, and the inner trimming of the wafer overflow glue (i.e. the overflow glue is smaller than the wafer diameter after trimming) cannot be realized. Moreover, the notch cannot be trimmed automatically in the scheme, and manual trimming is still needed. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a wafer overflow glue trimming device and tool device thereof, which can be trimmed internally, ensure that the overflow glue does not protrude from the wafer edge, and improve the yield of wafer bonding.

[0006] In order to achieve the above purpose, the solution of the utility model is as follows:

[0007] A tool device of a wafer overflow glue trimming device, the tool device is arranged on the outer periphery of a rotating adsorption device of the trimming device, the rotating adsorption device is used for adsorbing and fixing the wafer, and the tool device is used for trimming the wafer;

[0008] The tool device comprises a moving assembly, a rotating assembly and a floating tool head assembly, the floating tool head assembly can be flexibly extended and retracted forward and backward, the rotating assembly is used for adjusting the horizontal rotation angle and the horizontal inclination angle of the floating tool head assembly, and the moving assembly is used for driving the rotating assembly and the floating tool head assembly to move along the horizontal transverse and longitudinal directions.

[0009] Further, the rotating assembly comprises a mounting plate, a rotating base, a horizontal rotating driver, a cutter mounting base and an inclined rotating driver; the mounting plate is mounted on the moving assembly, the rotating base and the horizontal rotating driver are both mounted on the mounting plate, and the horizontal rotating driver drives the rotating base to rotate horizontally on the mounting plate; the inclined rotating driver and the cutter mounting base are both mounted on the rotating base, and the inclined rotating driver drives the cutter mounting base to rotate obliquely to the horizontal plane on the rotating base; and the floating cutter head assembly is mounted on the cutter mounting base.

[0010] Further, the floating cutter head assembly comprises a cutter head, a cutter head base and a cutter head spring; the cutter head is detachably mounted on one end of the cutter head base close to the rotating adsorption device, the other end of the cutter head base is reciprocally slidably mounted on the cutter mounting base, and the cutter head spring is arranged between the end face of the cutter head base away from the cutter head and the cutter mounting base.

[0011] Further, the one end of the cutter head base close to the rotating adsorption device is provided with a pressing groove and a pressing block, and the pressing block is detachably locked in the pressing groove; and the inner end of the cutter head is fixedly pressed by the pressing block and the pressing groove.

[0012] Further, the horizontal rotating driver and the inclined rotating driver are motors, and the rotating base and the cutter mounting base are both in the shape of 'L'.

[0013] Further, the moving device is an XY moving assembly, and the XY moving assembly is used for driving the rotating assembly and the floating cutter head assembly to move horizontally in the XY direction.

[0014] Further, the floating cutter head assembly is further provided with a chip deflector cover; the chip deflector cover is arranged on the side of the floating cutter head assembly away from the rotating adsorption device to form a chip guiding cavity, and the bottom of the chip guiding cavity is open, and the cutter head has a through hole in the inside to communicate with the chip guiding cavity.

[0015] The utility model further provides a wafer glue overflow trimming equipment, including rotating adsorption device and the cutter device.

[0016] Further, the rotating adsorption device comprises a wafer carrier, an adsorption platform, a carrier rotating assembly and a vacuum adsorption assembly; the wafer carrier is rotatably mounted on the top of the adsorption platform, and the carrier rotating assembly is used for driving the wafer carrier to rotate; and the vacuum adsorption assembly comprises a vacuum pipeline communicated with the top surface of the wafer carrier.

[0017] By adopting the technical scheme, the mobile assembly, the rotating assembly and the floating cutter head assembly are arranged. The height flexibility is achieved. The distance between the cutter and the wafer can be followed in time by using the mobile assembly. The wafer is not damaged by the trimming cutter head by using the floating cutter head assembly. The overflow glue trimming is uniform. The automatic glue removal of the notch is achieved. Meanwhile, the inclination angle of the floating cutter head assembly can be adjusted. The overflow glue trimming inside can be achieved. The overflow glue is ensured not to protrude from the wafer edge. The yield of wafer bonding is improved. The safety hazard is avoided. Compared with manual trimming, the damage and pollution of the wafer caused by uneven force of manual trimming are avoided. The production efficiency and the yield of products are effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a perspective view of the trimming device in the embodiment of the utility model;

[0019] Figure 2 It is a perspective view of the embodiment of the utility model;

[0020] Figure 3 It is a structural schematic view of the rotating assembly and the floating cutter head assembly of the embodiment of the utility model;

[0021] Figure 4 It is Figure 1 the enlarged view of A;

[0022] Figure 5 It is a perspective view of the rotating adsorption device of the embodiment of the utility model.

[0023] Label explanation: trimming device 100, rotating adsorption device 10, wafer carrier 11, adsorption platform 12, carrier rotating assembly 13, sensor 14, cutter device 20, rotating assembly 21, mounting plate 211, rotating seat 212, horizontal rotating driver 213, cutter mounting seat 214, inclined rotating driver 215, floating cutter head assembly 22, cutter head 221, cutter head seat 222, pressing groove 2221, pressing block 2222, cutter head spring 223, sliding block 224, through hole 225, mobile assembly 23, mobile sliding block 231, chip removal cover 51, wafer 200, notch 201. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.

[0025] As Figures 1 to 4As shown, the wafer overflow glue trimming device 100 of the embodiment includes a rotating adsorption device 10 and a cutter device 20.

[0026] As shown, Figure 1 The cutter device 20 is arranged at the outer periphery of the rotating adsorption device 10 of the trimming device 100, the rotating adsorption device 10 is used for adsorbing and fixing the wafer 200, and the cutter device 20 is used for trimming the wafer 200.

[0027] Specifically, the rotating adsorption device 10 can include a wafer carrier 11 for adsorbing and driving the wafer 200 to rotate, and the diameter of the wafer carrier 11 is smaller than that of the wafer 200; the rotating adsorption device 10 can adopt a vacuum adsorption mode to fix the wafer 200, and of course other modes can also be adopted, as long as the outer edge of the wafer 200 with a larger diameter is located outside the wafer carrier 11.

[0028] Specifically referring to Figure 5 , the rotating adsorption device 10 further includes an adsorption platform 12, a carrier rotating assembly 13 and a vacuum adsorption assembly (not shown in the figure); the wafer carrier 11 is rotatably installed on the top of the adsorption platform 12, the carrier rotating assembly 13 can be a motor installed inside the adsorption platform 12, used for driving the wafer carrier 11 to rotate; the vacuum adsorption assembly includes a vacuum pipeline communicated with the top surface of the wafer carrier 11, used for providing a vacuum adsorption force. The side surface of the adsorption platform 12 can also be provided with a sensor 14, used for identifying whether the wafer 200 is placed.

[0029] As shown, Figures 1 to 3 The cutter device 20 includes a moving assembly 23, a rotating assembly 21 and a floating cutter head assembly 22.

[0030] The floating cutter head assembly 22 can be adaptively telescoped forward and backward to avoid damage to the wafer 200 caused by the hard contact between the cutter and the wafer 200 itself; the rotating assembly 21 is used for adjusting the horizontal rotation angle and the horizontal inclination angle of the floating cutter head assembly 22; thereby adjusting the contact position between the floating cutter head assembly 22 and the outer edge of the wafer 200, and also adjusting the inclination angle of the floating cutter head assembly 22 to adjust the included angle between the floating cutter head assembly 22 and the top surface of the wafer 200, so as to realize the inner trimming of the wafer and ensure that the overflow glue does not protrude from the edge of the wafer.

[0031] The moving assembly 23 is used for driving the rotating assembly 21 and the floating cutter head assembly 22 to move along the horizontal transverse and longitudinal directions to approach or move away from the wafer 200 periphery on the wafer carrier 11; thereby, when the wafer carrier 11 drives the wafer 200 to rotate, the cutter device 20 approaches the wafer 200 periphery to realize the removal of the overflow glue.

[0032] The moving assembly 23 is located at the outer periphery of the rotary adsorption device 10. In this embodiment, the moving assembly 23 can be a common XY moving assembly, which is used to drive the rotary assembly 21 and the floating tool head assembly 22 to reciprocate along the XY direction.

[0033] Specifically, the rotary assembly 21 of the tool device 20 includes a mounting plate 211, a rotary seat 212, a horizontal rotary driver 213, a tool mounting seat 214, and an inclined rotary driver 215. The mounting plate 211 can be mounted on the moving slider 231 of the moving assembly 23. The rotary seat 212 and the horizontal rotary driver 213 are both mounted on the mounting plate 211, and the horizontal rotary driver 213 drives the rotary seat 212 to rotate horizontally on the mounting plate 211. The inclined rotary driver 215 and the tool mounting seat 214 are both mounted on the rotary seat 212, and the inclined rotary driver 215 drives the tool mounting seat 214 to rotate obliquely to the horizontal plane on the rotary seat 212. The floating tool head assembly 22 is mounted on the tool mounting seat 214.

[0034] In this embodiment, the horizontal rotary driver 213 and the inclined rotary driver 215 can be motors, and the rotary seat 212 and the tool mounting seat 214 can both be in the shape of “L”.

[0035] As shown in Figure 2 and Figure 3 , the floating tool head assembly 22 includes a tool head 221, a tool head seat 222, and a tool head spring 223. The tool head 221 is detachably mounted on the tool head seat 222 near one end of the wafer table 11. This end can be provided with a pressing groove 2221 and a pressing block 2222, and the pressing block 2222 is detachably locked in the pressing groove 2221. The inner end of the tool head 221 is fixed by the combined pressing of the pressing block 2222 and the pressing groove 2221.

[0036] The other end of the tool head seat 222 is reciprocally and slidably mounted on the tool mounting seat 214. A sliding block 224 can be provided on the tool mounting seat 214, and a sliding groove (not shown) is provided on the tool head seat 222 to match and be clamped on the sliding block 224. The tool head spring 223 is provided between the end face of the tool head seat 222 away from the tool head 221 and the tool mounting seat 214. The tool head spring 223 provides an elastic force to make the tool head 221 and the tool head seat 222 slide outward, and also allows the tool head 221 and the tool head seat 222 to retreat and give way on the tool mounting seat 214, so as to avoid hard contact between the tool head 221 and the wafer 200 and damage to the wafer 200.

[0037] As shown in Figure 1As shown, the floating cutter head assembly 22 is further provided with a chip guard 51, the chip guard 51 is provided on the side of the floating cutter head assembly 22 away from the wafer carrier 11 to form a chip guide cavity 511, and the bottom of the chip guide cavity 511 is open, while the cutter head 221 has a through hole 225 inside to communicate with the chip guide cavity 511; the chip guard 51 can shield the glue chips cut by the cutter head 221, prevent the glue chips from flying around, and ensure the cleanliness of the equipment working environment.

[0038] Therefore, the cutter device of the embodiment is provided with the moving assembly 23, the rotating assembly 21 and the floating cutter head assembly 22, which has high flexibility. The moving assembly 23 can realize that the distance between the cutter and the wafer 200 always follows, the floating cutter head assembly 22 can make the trimming cutter head 221 not damage the wafer 200, the overflow glue trimming is uniform, the cutter head 221 wear is controllable, and the automatic glue removal of the notch 201 (see Figure 4 ) can be realized, which is convenient for the positioning of the wafer 200 in the subsequent process. Compared with manual trimming, the damage and pollution of the wafer 200 caused by uneven force of manual trimming can be avoided, and the production efficiency and product yield can be effectively improved.

[0039] Specifically, by using the cutter device structure of the trimming equipment, the wafer overflow glue trimming method of the embodiment can adopt the following steps.

[0040] Firstly, wafer feeding; the wafer 200 is placed on the wafer carrier 11 of the rotating adsorption device 10 by manual or mechanical hand, and the wafer 200 is adsorbed on the wafer carrier 11; specifically, the wafer 200 can be fixed by vacuum adsorption.

[0041] Secondly, cutter device trimming preparation; the rotating angle and the inclination angle of the floating cutter head assembly 22 are adjusted by the rotating assembly 21 of the cutter device 20, after the angles are adjusted, the floating cutter head assembly 22 is moved to the wafer trimming starting point by the moving assembly 23.

[0042] Then, the wafer overflow glue is trimmed by the cutter device following; the wafer 200 rotates and moves at least one circle of circular or cam trajectory under the driving of the wafer carrier 11 (after feeding, when the wafer 200 is concentric with the wafer carrier 11, the wafer 200 moves in a circular trajectory, but in actual use, most of the wafers 200 will be eccentric with the wafer carrier 11, and the wafer 200 moves in a cam trajectory), specifically, the wafer 200 rotates at least 360°; correspondingly, the moving assembly 23 drives the cutter device 20 to follow the trajectory of the wafer 200 to adaptively move, which is used to keep the cutter head 221 of the floating cutter head assembly 22 always close to the edge of the wafer 200, ensure that the distance between them is always consistent, for example, the distance is 0, so as to realize the accurate trimming of the wafer 200 edge overflow glue, without damaging the wafer 200 itself.

[0043] And in the trimming process, the wafer carrier 11 of the rotary adsorption device 10 can also rotate the notch 201 to the preset notch trimming starting position, and then the cutter device 20 adjusts the angle of the floating cutter head assembly 22, and drives the floating cutter head assembly 22 to approach the notch trimming starting position through the moving assembly 23 to make the notch 201 profiling action, so as to remove the overflow glue in the notch 201 along the shape of the notch 201; the automatic removal of the overflow glue in the notch 201 can be conveniently and quickly realized.

[0044] Finally, the wafer is discharged; after the overflow glue is completely removed, the rotary adsorption device 10 is disconnected from the adsorption of the wafer 200, and the wafer 200 after the overflow glue is removed is taken away by manual or mechanical hand.

[0045] Therefore, in the trimming process of the cutter device, the inclination angle of the floating cutter head assembly 22 can be adjusted as needed, the inner trimming of the wafer is realized, the overflow glue is ensured not to protrude from the edge of the wafer, the edge overflow glue of the wafer 200 is accurately removed, the moving assembly 23 can drive the cutter head 221 to follow the trimming, and the automatic trimming of the overflow glue of the notch 201 can also be realized.

[0046] In summary, the embodiments of the utility model also have at least the following advantages:

[0047] (1) The utility model discloses a moving assembly 23 and cutter device 20 with rotary assembly 21, and the blade has high flexibility, can follow the rotary adsorption device 10.

[0048] (2) The utility model discloses the cutter head 221 wear condition controllable, and the replacement is convenient, can avoid the cutter head 221 damage wafer 200.

[0049] (3) The utility model discloses that when trimming, the cutter head 221 and wafer 200 follow the movement of time, and the cutter head 221 always keeps a safe distance from the wafer 200, and does not damage the wafer 200.

[0050] The preferred embodiments of the utility model are described above, and the protection scope of the utility model is not limited to the above-mentioned embodiments, and any technical scheme falling within the concept of the utility model belongs to the protection scope of the utility model.

[0051] In the description of the embodiments of the present application, it needs to be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the application is used, or the orientation or positional relationship commonly understood by those skilled in the art, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

Claims

1. A tool device of a wafer glue overflow trimming equipment, the tool device is arranged on the outer periphery of a rotating chucking device of the trimming equipment, the rotating chucking device is used for chucking and fixing a wafer, and the tool device is used for trimming the wafer; characterized in that: the tool device comprises a moving assembly, a rotating assembly and a floating tool head assembly, the floating tool head assembly is capable of being adaptively telescoped forward and backward, the rotating assembly is used for adjusting the horizontal rotation angle and the horizontal inclination angle of the floating tool head assembly, and the moving assembly is used for driving the rotating assembly and the floating tool head assembly to move along the horizontal transverse and longitudinal directions. 2.The tool device of a wafer glue overflow trimming equipment according to claim 1, characterized in that: the rotating assembly comprises a mounting plate, a rotating seat, a horizontal rotation driver, a tool mounting seat and an inclination rotation driver; the mounting plate is mounted on the moving assembly, the rotating seat and the horizontal rotation driver are both mounted on the mounting plate, and the horizontal rotation driver drives the rotating seat to rotate horizontally on the mounting plate; the inclination rotation driver and the tool mounting seat are both mounted on the rotating seat, and the inclination rotation driver drives the tool mounting seat to rotate obliquely to the horizontal plane on the rotating seat; and the floating tool head assembly is mounted on the tool mounting seat. 3.The tool device of a wafer glue overflow trimming equipment according to claim 2, characterized in that: the floating tool head assembly comprises a tool head, a tool head seat and a tool head spring; the tool head is detachably mounted on one end of the tool head seat close to the rotating chucking device, the other end of the tool head seat is capable of reciprocatingly slidingly mounted on the tool mounting seat, and the tool head spring is arranged between the end face of the tool head seat away from the tool head and the tool mounting seat. A pressing groove and a pressing block are arranged on the end of the tool head seat close to the rotating chucking device, and the pressing block is detachably locked in the pressing groove; and the inner end of the tool head is fixed by the joint pressing of the pressing block and the pressing groove. The horizontal rotation driver and the inclination rotation driver are motors, and the rotating seat and the tool mounting seat are both in the shape of "L". The moving device is an XY moving assembly, which is used for driving the rotating assembly and the floating tool head assembly to move horizontally along the transverse and longitudinal directions.

4. The knife device of the wafer excess adhesive trimming apparatus according to claim 3, wherein: A chip blocking cover is further arranged on the floating tool head assembly; the chip blocking cover is arranged on the side of the tool head of the floating tool head assembly away from the rotating chucking device to form a chip guiding cavity, and the bottom of the chip guiding cavity is open, and the tool head has a through hole communicating with the chip guiding cavity.

5. The knife device of the wafer excess adhesive trimming apparatus according to claim 2, wherein: The rotating chucking device and the tool device according to any one of claims 1-7 are comprised.

6. The tool apparatus of claim 1, wherein: The rotating chucking device comprises a wafer carrier, a chucking platform, a carrier rotating assembly and a vacuum chucking assembly; the wafer carrier is rotatably mounted on the top of the chucking platform, the carrier rotating assembly is used for driving the wafer carrier to rotate, and the vacuum chucking assembly comprises a vacuum pipeline communicated with the top surface of the wafer carrier.

7. The tool apparatus of claim 1, wherein: ​ 8. A wafer glue spill trim device, characterized by: ​ 9. The wafer excess adhesive trimming apparatus of claim 8, wherein: ​

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