Electroplating device for production and processing of semiconductors

By introducing cleaning and mixing components into the electroplating apparatus, uniform stirring and convenient cleaning of the electroplating solution are achieved, solving the problems of low electroplating and cleaning efficiency in existing technologies and improving the performance and quality consistency of semiconductor products.

CN223522706UActive Publication Date: 2025-11-07ASE (KUNSHAN) INC
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Patent Information

Application Number
CN202423070618.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-12
Publication Date
2025-11-07
Estimated Expiration
2034-12-12

AI Technical Summary

Technical Problem

Existing semiconductor manufacturing electroplating equipment cannot effectively agitate metal ions in the electroplating solution, resulting in poor product performance and quality consistency. Furthermore, the cleaning brushes are inconvenient to replace, affecting electroplating and cleaning efficiency.

Method used

An electroplating apparatus was designed, comprising a cleaning component and a mixing component. The cleaning component uses a threaded rod to drive a cleaning brush to scrape away impurities from the inner wall, while the mixing component uses a chain-driven stirring blade to agitate the electroplating solution, achieving uniform distribution of metal ions. The cleaning brush can be manually replaced.

Benefits of technology

It improves the uniform distribution of metal ions in the electroplating solution, ensures the stability of the metal layer quality on the semiconductor surface, improves product performance and quality consistency, shortens processing time, and simplifies the replacement process of cleaning brushes.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of semiconductors, and discloses a semiconductor production processing electroplating device which comprises a cleaning assembly and a mixing assembly, the cleaning assembly is arranged above the mixing assembly, the cleaning assembly comprises an electroplating box, the lower end of the electroplating box is connected with fixed supporting legs, the upper end of the electroplating box is connected with a cleaning motor, and the cleaning motor is connected with the mixing assembly. The output end of the cleaning motor is fixedly connected with a threaded rod, and the threaded rod is connected with a fixing frame. According to the utility model, during electroplating, solutes such as various metal ions and the like are more uniformly distributed in a solution, so that the quality of a metal layer deposited on the surface of a semiconductor is more stable and uniform, and the performance and quality consistency of semiconductor products can be improved, thereby improving the electroplating efficiency, shortening the processing time, facilitating the replacement of the cleaning brush, and reducing the cost. The cleaning brush can be directly and manually pulled out without a tool, so that the time for replacing the cleaning brush is shortened, and the speed for replacing the cleaning brush is increased.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field, concretely is a kind of production and processing electroplating device of semiconductor. BACKGROUND

[0002] In modern semiconductor manufacturing industry, electroplating technology is one of the key surface treatment processes, widely used in the production and processing of semiconductor components, electroplating can not only improve the conductivity, corrosion resistance of semiconductor components, but also enhance its mechanical properties and aesthetics.

[0003] The existing semiconductor production and processing electroplating device still has some shortcomings in use: the existing semiconductor production and processing electroplating device is often unable to stir and mix various metal ions and other solutes in the electroplating solution, which is not conducive to improving the performance and quality consistency of semiconductor products, thereby reducing the efficiency of electroplating, and the existing semiconductor production and processing electroplating device is often inconvenient to replace the cleaning brush when cleaning the inner wall of the electroplating tank, and the replacement time is long. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the shortcomings in the prior art and provides a semiconductor production and processing electroplating device.

[0005] To achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor production and processing electroplating device, comprising a cleaning assembly and a mixing assembly, the cleaning assembly is arranged above the mixing assembly, and the cleaning assembly comprises an electroplating tank, and the lower end of the electroplating tank is connected with a fixed support leg, the upper end of the electroplating tank is connected with a cleaning motor, the output end of the cleaning motor is fixedly connected with a threaded rod, the threaded rod is connected with a fixed frame, one side of the fixed frame is connected with a fixed column, a sliding groove is arranged on the fixed frame, a cleaning brush is connected in the sliding groove, and the upper end of the cleaning brush is connected with a limiting block, and a rubber plug is arranged on one side of the electroplating tank.

[0006] The mixing assembly comprises a mixing motor, the output end of the mixing motor is fixedly connected with a rotating column, the rotating column is connected with a first sprocket, the first sprocket is connected with a chain, one end of the chain is connected with a second sprocket, an internal thread is arranged on the rotating column, the internal thread is connected with an external thread, the external thread is connected with a mixing column, one end of the mixing column is connected with a hexagonal block, and the mixing column is connected with a stirring blade on one side.

[0007] Further description of the above technical scheme:

[0008] The upper end of the fixed support leg is fixedly connected to the lower end of the electroplating tank, the cleaning motor is fixedly connected to the electroplating tank through a support, and the threaded rod is rotatably connected to the support arranged on the electroplating tank.

[0009] As a further description of the above technical solutions:

[0010] One side of the fixed frame is threadedly connected to a threaded rod, and the end of the fixed frame away from the threaded rod is slidingly connected to a fixed column, and the fixed column is fixedly connected to the electroplating tank.

[0011] As a further description of the above technical solutions:

[0012] The chute is arranged on one side of the fixed frame, the cleaning brush is slidingly connected to the chute, the limiting block is fixedly connected to the upper end of the cleaning brush, and the rubber plug is arranged on one side of the electroplating tank.

[0013] As a further description of the above technical solutions:

[0014] The mixing motor is fixedly connected to the electroplating tank through the support, and the first sprocket is fixedly connected to the rotating column, and one end of the rotating column is rotatably connected to the electroplating tank.

[0015] As a further description of the above technical solutions:

[0016] The first sprocket is engaged with the chain, and one end of the chain away from the first sprocket is engaged with the second sprocket.

[0017] As a further description of the above technical solutions:

[0018] The internal thread is arranged on one end of the rotating column away from the first sprocket, the external thread is threadedly connected to the internal thread, and the external thread is arranged on one end of the mixing column.

[0019] As a further description of the above technical solutions:

[0020] The hexagonal block is fixedly connected to one end of the mixing column, one end of the stirring blade is fixedly connected to the outer ring of the mixing column, and the stirring blade is provided with the through hole.

[0021] The utility model has the advantages of:

[0022] 1. By starting the mixing motor, the mixing motor drives the rotating column to rotate, thereby driving the second sprocket to rotate through the chain, and further making the mixing column rotate to drive the stirring blade to rotate to stir the electroplating solution in the electroplating tank, manually rotating the hexagonal block, and sliding out the external thread from the internal thread, so that the mixing column and the stirring blade can be removed, so that the solutes such as various metal ions are more uniformly distributed in the solution during electroplating, the quality of the metal layer deposited on the surface of the semiconductor is more stable and uniform, which is beneficial to improving the performance and quality consistency of the semiconductor product, thereby improving the electroplating efficiency and shortening the processing time.

[0023] 2, by starting the cleaning motor, the cleaning motor drives the threaded rod to rotate, the threaded rod drives the fixed frame to move, thereby driving the cleaning brush placed on the fixed frame to move to scrape off the impurities remaining on the inner wall of the electroplating box, manually pulling the limiting block, the cleaning brush can be taken out from the sliding groove for replacement, so that the cleaning brush is replaced, without borrowing tools, the cleaning brush can be directly manually pulled out, thereby reducing the time required for replacing the cleaning brush and improving the speed of replacing the cleaning brush. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 A three-dimensional structural schematic view of the semiconductor production and processing electroplating device is provided for the utility model;

[0025] Figure 2 A partial explosion structural schematic view of the semiconductor production and processing electroplating device is provided for the utility model Figure One ;

[0026] Figure 3 A partial structural schematic view of the semiconductor production and processing electroplating device is provided for the utility model;

[0027] Figure 4 A partial explosion structural schematic view of the semiconductor production and processing electroplating device is provided for the utility model Figure Two .

[0028] LEGEND:

[0029] 1, cleaning assembly; 2, mixing assembly; 101, electroplating box; 102, fixed support leg; 103, cleaning motor; 104, threaded rod; 105, fixed frame; 106, fixed column; 107, sliding groove; 108, cleaning brush; 109, limiting block; 110, rubber plug; 201, mixing motor; 202, rotating column; 203, first sprocket; 204, chain; 205, second sprocket; 206, internal thread; 207, external thread; 208, mixing column; 209, hexagonal block; 210, stirring blade. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0031] WITH REFERENCE Figures 1-4 , the utility model provides a kind of semiconductor production and processing electroplating device, comprising: cleaning assembly 1 and mixing assembly 2.

[0032] Specifically, the cleaning assembly 1 is arranged above the mixing assembly 2, and the cleaning assembly 1 comprises an electroplating tank 101, and a fixed supporting leg 102 is connected to the lower end of the electroplating tank 101, a cleaning motor 103 is connected to the upper end of the electroplating tank 101, a threaded rod 104 is fixedly connected to the output end of the cleaning motor 103, and a fixed frame 105 is connected to the threaded rod 104, one side of the fixed frame 105 is connected with a fixed column 106, a sliding groove 107 is arranged on the fixed frame 105, and a cleaning brush 108 is connected in the sliding groove 107, and a limiting block 109 is connected to the upper end of the cleaning brush 108, and a rubber plug 110 is arranged on one side of the electroplating tank 101.

[0033] The mixing assembly 2 comprises a mixing motor 201, and a rotating column 202 is fixedly connected to the output end of the mixing motor 201, a first chain wheel 203 is connected to the rotating column 202, a chain 204 is connected to the first chain wheel 203, one end of the chain 204 is connected with a second chain wheel 205, an internal thread 206 is arranged on the rotating column 202, the internal thread 206 is connected with an external thread 207, the external thread 207 is connected with a mixing column 208, one end of the mixing column 208 is connected with a hexagonal block 209, and a stirring blade 210 is connected to one side of the mixing column 208.

[0034] In the embodiment, the cleaning assembly 1 and the mixing assembly 2 constitute the electroplating device for producing and processing semiconductors, and the electroplating of the semiconductor processing workpiece is realized.

[0035] In the embodiment, the electroplating device for producing and processing semiconductors is related.

[0036] In the embodiment, the four fixed supporting legs 102 are fixedly connected to the corners of the electroplating tank 101, and are used for supporting the electroplating tank 101.

[0037] It should be noted that the bottom of the fixed frame 105 is provided with a scraper for scraping off the impurities remaining on the bottom of the electroplating tank 101.

[0038] Specifically, the upper end of the fixed supporting leg 102 is fixedly connected to the lower end of the electroplating tank 101, the cleaning motor 103 is fixedly connected to the electroplating tank 101 through a support, the threaded rod 104 is rotatably connected to the support arranged on the electroplating tank 101, one side of the fixed frame 105 is threadedly connected to the threaded rod 104, one end of the fixed frame 105 away from the threaded rod 104 is slidably connected to the fixed column 106, the fixed column 106 is fixedly connected to the electroplating tank 101, the sliding groove 107 is arranged on one side of the fixed frame 105, the cleaning brush 108 is slidably connected to the sliding groove 107, the limiting block 109 is fixedly connected to the upper end of the cleaning brush 108, and the rubber plug 110 is arranged on one side of the electroplating tank 101.

[0039] As a preferable implementation, the cleaning brush 108 is symmetrically provided with two groups, and the cleaning brush 108 is slidably connected to the inner wall of the electroplating tank 101, so that the residual impurities on the inner wall of the electroplating tank 101 can be scraped.

[0040] As a preferable implementation, the two ends of the fixed column 106 are respectively fixedly connected to the upper end of the electroplating tank 101 through the support, so that the fixed frame 105 is limited when the threaded rod 104 drives the fixed frame 105 to move, preventing the fixed frame 105 from rotating with the threaded rod 104.

[0041] Specifically, the mixing motor 201 is fixedly connected to the electroplating tank 101 through the support, the first sprocket 203 is fixedly connected to the rotating column 202, one end of the rotating column 202 is rotatably connected to the electroplating tank 101, the first sprocket 203 is engaged with the chain 204, one end of the chain 204 away from the first sprocket 203 is engaged with the second sprocket 205, the internal thread 206 is arranged on one end of the rotating column 202 away from the first sprocket 203, the external thread 207 is threadedly connected to the internal thread 206, and the external thread 207 is arranged on one end of the mixing column 208, the hexagonal block 209 is fixedly connected to one end of the mixing column 208, one end of the stirring blade 210 is fixedly connected to the outer ring of the mixing column 208, and the stirring blade 210 is provided with a through hole.

[0042] As a preferable implementation, the rotating direction of the rotating column 202 is opposite to the thread direction of the internal thread 206, so that the external thread 207 can be prevented from falling off from the internal thread 206 when the rotating column 202 rotates.

[0043] It should be noted that the stirring blade 210 is provided with multiple groups, and the multiple groups of stirring blades 210 are provided with through holes, so that the resistance can be reduced during stirring and mixing, and the possibility of damage to the stirring blade 210 can be reduced.

[0044] In use, when the semiconductor production and processing electroplating device is used, the staff starts the mixing motor, the mixing motor drives the rotating column to rotate, the rotating column drives the first sprocket to rotate, thereby driving the second sprocket to rotate through the chain, and the rotating column also drives the mixing column to rotate, the mixing column drives the stirring blade to rotate to stir the electroplating solution in the electroplating tank, then the hexagonal block is manually rotated, the external thread is slid out of the internal thread, the mixing column and the stirring blade can be taken down, then after the electroplating is completed, the rubber plug is taken off from the electroplating tank, the electroplating solution is discharged, the cleaning motor is started, the cleaning motor drives the threaded rod to rotate, the threaded rod drives the fixed frame to move, thereby driving the fixed frame to slide on the fixed column, and further driving the cleaning brush placed on the fixed frame to move to scrape and clean the residual impurities on the inner wall of the electroplating tank, if the cleaning brush needs to be replaced, the limiting block can be manually pulled to take out the cleaning brush from the sliding groove for replacement.

[0045] The production and processing electroplating device of the semiconductor is more uniform in distribution of various metal ions and other solutes in the solution during electroplating, can ensure that the quality of the metal layer deposited on the surface of the semiconductor is more stable and uniform, is conducive to improving the performance and quality consistency of the semiconductor product, thereby improving the electroplating efficiency, shortening the processing time, and facilitating replacement of the cleaning brush, without the need for borrowed tools, the cleaning brush can be directly manually pulled out, thereby reducing the time required for replacement of the cleaning brush and improving the speed of replacement of the cleaning brush.

[0046] It should be noted that the electrical components in this document are all connected with the main controller and 220V mains electricity from the outside world, and the main controller can be a conventional known device controlled by a computer, etc., and the detailed description of known functions and known components is omitted in the specific embodiments of the present disclosure. In order to ensure the compatibility of the device, the operation means adopted is consistent with the parameters of the market appliances.

[0047] Finally, it should be pointed out that: the above only describes the preferred embodiments of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A semiconductor manufacturing electroplating apparatus, characterized in that: The utility model provides a cleaning component (1) and mixing component (2) are included, the cleaning component (1) is located the upper of mixing component (2), and cleaning component (1) includes electroplating box (101), and the lower end of electroplating box (101) is connected with fixed support leg (102), the upper end of electroplating box (101) is connected with cleaning motor (103), and the output of cleaning motor (103) is fixedly connected with threaded rod (104), and threaded rod (104) is connected with fixed frame (105), one side of fixed frame (105) is connected with fixed column (106), and fixed frame (105) is equipped with sliding slot (107), and sliding slot (107) is connected with cleaning brush (108) in, while the upper end of cleaning brush (108) is connected with limit block (109), one side of electroplating box (101) is equipped with rubber plug (110), The mixing component (2) includes mixing motor (201), and the output of mixing motor (201) is fixedly connected with rotating column (202), and rotating column (202) is connected with first sprocket (203), first sprocket (203) is connected with chain (204), and one end of chain (204) is connected with second sprocket (205), rotating column (202) is equipped with internal thread (206), and internal thread (206) is connected with external thread (207), and external thread (207) is connected with mixing column (208), one end of mixing column (208) is connected with hexagonal block (209), and one side of mixing column (208) is connected with stirring blade (210).

2. The electroplating apparatus for semiconductor manufacturing according to claim 1, wherein: The upper end of the fixed support leg (102) is fixedly connected to the lower end of the electroplating box (101), and the cleaning motor (103) is fixedly connected to the electroplating box (101) through a support, and the threaded rod (104) is rotatably connected to the support provided on the electroplating box (101).

3. The electroplating apparatus for semiconductor manufacturing according to claim 2, wherein: One side of the fixed frame (105) is threadedly connected to the threaded rod (104), and the end of the fixed frame (105) away from the threaded rod (104) is slidably connected to the fixed column (106), and the fixed column (106) is fixedly connected to the electroplating box (101).

4. The electroplating apparatus for semiconductor manufacturing according to claim 3, wherein: The sliding slot (107) is provided on one side of the fixed frame (105), and the cleaning brush (108) is slidably connected to the sliding slot (107), and the limit block (109) is fixedly connected to the upper end of the cleaning brush (108), and the rubber plug (110) is provided on one side of the electroplating box (101).

5. The apparatus according to claim 4, wherein: The mixing motor (201) is fixedly connected to the electroplating box (101) through a support, and the first sprocket (203) is fixedly connected to the rotating column (202), and one end of the rotating column (202) is rotatably connected to the electroplating box (101).

6. The electroplating apparatus for semiconductor manufacturing according to claim 5, wherein: The first sprocket (203) is engaged with the chain (204), and one end of the chain (204) away from the first sprocket (203) is engaged with the second sprocket (205).

7. The apparatus according to claim 6, wherein the apparatus is characterized by: The internal thread (206) is provided on one end of the rotating column (202) away from the first sprocket (203), the external thread (207) is threadedly connected to the internal thread (206), and the external thread (207) is provided on one end of the mixing column (208).

8. The apparatus according to claim 7, wherein: The hexagonal block (209) is fixed on one end of the mixing column (208), and one end of the stirring blade (210) is fixed on the outer ring of the mixing column (208), and the stirring blade (210) is provided with a through port.