Main-grid-free 0BB detection mechanism

By combining a lifting bracket and a linear module with a gold wire stage and copper disk structure, the problem of main gateless silicon wafer testing was solved, achieving efficient electrical performance testing and reducing the breakage rate.

CN223526443UActive Publication Date: 2025-11-07FOLUNGWIN AUTOMATIC EQUIP CO LTD
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Patent Information

Application Number
CN202422488246.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-10-14
Publication Date
2025-11-07
Estimated Expiration
2034-10-14

AI Technical Summary

Technical Problem

The removal of the front-side main gate line in existing silicon wafers makes quality inspection difficult and affects the yield rate.

Method used

The structure employs a lifting bracket and a linear module in conjunction with a gold wire platform and a copper plate, achieving electrical performance testing through gold wire pressing and copper plate lifting.

Benefits of technology

This technology enables the testing of the electrical properties of gateless silicon wafers, reducing the breakage rate and improving production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a main grid-free 0BB detection mechanism, which comprises a lifting support, an upper mounting frame, a lower mounting frame, a gold thread table and a lower copper seat, an upper linear module and a lower linear module are mounted on the lifting support, the upper linear module is connected with the side edge of the upper mounting frame, the gold thread table is adjusted back and forth along the upper mounting frame, two sides of the gold thread table are provided with tension springs, and the tension springs are connected with the lower copper seat. Gold wires are straightened between the tension springs, the outer side of the lower installation frame is adjusted to the driving end of the lower linear module in the front-back direction, the lower copper base is located in the middle of the lower installation frame, copper discs are arranged in the middle of the lower copper base, and the upper ends of the copper discs are in an upwards-bent arc shape. According to the main-grid-free 0BB detection mechanism, the gold wire is pressed down from the upper part and is matched with the copper disc jacked up from the lower part, so that the electrical performance detection of the auxiliary grid on the 0BB silicon wafer is realized, and the fragment rate is reduced while the cost is reduced and the efficiency is improved during the production of the 0BB silicon wafer.
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Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of silicon wafer production, especially to a 0BB detection mechanism for no main grid. BACKGROUND

[0002] Photovoltaic solar silicon wafer (hereinafter referred to as silicon wafer) is the core part of the solar power generation system, and is also the highest value part in the solar power generation system. The role of the silicon wafer is to convert solar energy into electric energy, which is stored by the storage battery or directly loaded for work. In the existing silicon wafer, the front surface has a main grid line, which will shield the surface of the solar cell, affect the light absorption of the cell piece, and further affect the power generation efficiency. In the subsequent new type of silicon wafer, the front surface main grid line is cancelled, which leads to the difficulty in quality detection during the production process of the silicon wafer, and affects the detection of the yield. UTILITY MODEL CONTENTS

[0003] One purpose of the utility model is to provide a 0BB detection mechanism for no main grid, which can reduce the cost and increase the efficiency of OBB silicon wafer in the use process of the silicon wafer. The copper disc is lifted by the arc-shaped protrusion below, and the gold wire is pressed by the elastic contact above, so that the electrical performance detection is realized, and the fragment rate is reduced.

[0004] To achieve this purpose, the utility model adopts the following technical scheme:

[0005] A 0BB detection mechanism for no main grid, comprising a lifting support, an upper mounting frame, a lower mounting frame, a gold wire table and a lower copper seat, the lifting support is provided with an upper linear module and a lower linear module, the upper linear module is connected with the side of the upper mounting frame, the gold wire table is adjusted along the front and back of the upper mounting frame, the two sides of the gold wire table are provided with tension springs, the gold wire is straight between the tension springs, the outer side of the lower mounting frame is adjusted on the driving end of the lower linear module along the front and back direction, the lower copper seat is located in the middle part of the lower mounting frame, the copper disc is arranged in the middle part of the lower copper seat, and the upper end of the copper disc is bent in an arc shape upward.

[0006] As a preferred technical scheme, the middle part of the upper mounting frame is provided with an upper frame opening, the gold wire table moves in the upper frame opening, the side of the upper frame opening is provided with a circuit board, the circuit board is in conduction with the end of the gold wire, and the outer side of the circuit board is connected with a first lead wire.

[0007] As a preferred technical scheme, the upper mounting frame is provided with a guide optical axis along the front and back direction, the side of the gold wire table is connected with a guide sliding block, and the guide sliding block slides on the guide optical axis.

[0008] As a preferred technical scheme, the middle part of the lower mounting frame is provided with a lower frame opening, both sides of the lower frame opening are provided with a mounting groove and a pressing strip, the outer side of the copper disc is locked in the mounting groove, the pressing strip is pressed above the outer side of the copper disc, and the two sides of the copper disc are connected with second wires.

[0009] As a preferred technical scheme, the driving end of the lower linear module is connected with a guide groove, and the side edge position of the lower mounting frame is adjusted in the guide groove.

[0010] As a preferred technical scheme, the vertical guide rail is fixed on the lifting support, the vertical sliding block is connected with the guide groove and the upper mounting frame, and the vertical sliding block slides in the vertical guide rail in the vertical direction.

[0011] As a preferred technical scheme, the lower linear module comprises a lower motor, a lower lead screw and a lower nut, the lower motor is connected with the upper end of the lower lead screw, the lower lead screw is in threaded connection with the lower nut, and the guide groove is fixedly connected with the lower nut after penetrating through the lifting support.

[0012] As a preferred technical scheme, the upper linear module comprises an upper motor, an upper lead screw and an upper nut, the upper motor is connected with the lower end of the upper lead screw, the upper lead screw is in threaded connection with the upper nut, and the upper mounting frame is fixedly connected with the upper nut after penetrating through the lifting support.

[0013] The 0BB detection mechanism for the main grid-free 0BB detection mechanism has the advantages that the upper gold wire is pressed down, the copper disc is lifted up, the electrical performance detection of the 0BB silicon wafer is realized, the electrical performance detection of the silicon wafer is realized, the use of silver paste on the silicon wafer is reduced, the production capacity is improved, and the fragment rate is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0014] The utility model will be further explained in detail in the basis of drawings and embodiments.

[0015] Figure 1 The whole structure schematic view of the 0BB detection mechanism for the main grid-free 0BB detection mechanism is described in the embodiment.

[0016] Figure 2 The perspective structure view of the upper mounting frame is described in the embodiment.

[0017] Figure 3 The front view of the upper mounting frame is described in the embodiment.

[0018] Figure 4 The perspective structure view of the lower copper seat is described in the embodiment.

[0019] Figures 1 to 4 In the present embodiment, a 0BB detection mechanism for a non-main grid comprises a lifting support 1, an upper mounting frame 2, a lower mounting frame 3, a gold wire platform 4 and a lower copper base 5. The lifting support 1 is provided with an upper linear module and a lower linear module. The upper linear module is connected to the side of the upper mounting frame 2. The gold wire platform 4 is adjusted along the front and back of the upper mounting frame 2. The gold wire platform 4 is provided with a pull spring 6 on both sides. The gold wire 7 is pulled straight between the pull springs 6. The outer side of the lower mounting frame 3 is adjusted along the front and back of the driving end of the lower linear module. The lower copper base 5 is located in the middle of the lower mounting frame 3. The lower copper base 5 is arranged with a copper disc 8 in the middle. The upper end of the copper disc 8 is bent in an arc shape upward.

[0020] 1. lifting support; 2. upper mounting frame; 3. lower mounting frame; 4. gold wire platform; 5. lower copper base; 6. pull spring; 7. gold wire; 8. copper disc; 9. upper frame opening; 10. circuit board; 11. first lead wire; 12. guide optical axis; 13. guide sliding block; 14. lower frame opening; 15. pressing strip; 16. second lead wire; 17. guide groove; 18. vertical guide rail; 19. vertical sliding block; 20. lower motor; 21. lower lead screw; 22. lower nut; 23. upper motor; 24. upper nut. DETAILED DESCRIPTION

[0021] The technical scheme of the present application will be further illustrated below in combination with the drawings and through specific embodiments.

[0022] As shown in the present embodiment, a 0BB detection mechanism for a non-main grid comprises a lifting support 1, an upper mounting frame 2, a lower mounting frame 3, a gold wire platform 4 and a lower copper base 5. The lifting support 1 is provided with an upper linear module and a lower linear module. The upper linear module is connected to the side of the upper mounting frame 2. The gold wire platform 4 is adjusted along the front and back of the upper mounting frame 2. The gold wire platform 4 is provided with a pull spring 6 on both sides. The gold wire 7 is pulled straight between the pull springs 6. The outer side of the lower mounting frame 3 is adjusted along the front and back of the driving end of the lower linear module. The lower copper base 5 is located in the middle of the lower mounting frame 3. The lower copper base 5 is arranged with a copper disc 8 in the middle. The upper end of the copper disc 8 is bent in an arc shape upward. Figures 1 to 4 When the 0BB silicon wafer comes to the detection mechanism, the upper linear module on both sides of the lifting support 1 controls the gold wire platform 4 on the upper mounting frame 2 to move downward, while the lower linear module controls the lower copper base 5 on the lower mounting frame 3 to rise upward. The copper disc 8 is in the middle of the arc-shaped protrusion, which is on the auxiliary grid in the 0BB silicon wafer. Since the gold wire platform 4 is provided with a pull spring 6, the gold wire 7 is pressed on the auxiliary grid, which will be in an elastic state. The pull spring 6 is stretched by being screwed on both sides of the gold wire platform 4, which is convenient for being attached to the auxiliary grid. The gold wire 7 and the copper disc 8 form a passage for the position of the auxiliary grid, so that the electrical performance detection can be carried out. At the same time, the detection mechanism can adjust the front and back direction according to the specific position of the current 0BB silicon wafer. The gold wire platform 4 on the upper side moves along the front and back of the upper mounting frame 2. The copper disc 8 on the lower side moves along the front and back of the position of the lower mounting frame 3 fixed on the lower copper base 5 on the lifting support 1.

[0023] The middle of the upper mounting frame 2 is provided with an upper frame opening 9, and the gold wire platform 4 is movably arranged in the upper frame opening 9. The side of the upper frame opening 9 is provided with a circuit board 10, and the circuit board 10 is in conductive communication with the end of the gold wire 7. The outer side of the circuit board 10 is connected with a first lead wire 11, which is in communication with the gold wire 7 connected to the circuit board 10. When the gold wire 7 is pressed on the auxiliary grid, the 0BB silicon wafer can be connected.

[0024]

[0025] The upper mounting frame 2 is provided with a guide light axis 12 along the front-rear direction, and the side edge of the gold wire platform 4 is connected with a guide sliding block 13 which slides on the guide light axis 12, according to the front-rear position of the 0BB silicon wafer position, the gold wire platform 4 can be adjusted in position by sliding on the guide light axis 12 in cooperation with the left and right guide sliding blocks 13, and then locked by the screws on the guide sliding blocks 13.

[0026] The middle part of the lower mounting frame 3 is provided with a lower frame opening 14, and the both sides of the lower frame opening 14 are provided with mounting grooves and pressing strips 15, the outer side of the copper disc 8 is locked in the mounting grooves, and the pressing strips 15 are pressed above the outer side of the copper disc 8, the both sides of the copper disc 8 are connected with second guide wires 16, in the installation process, the both sides of the copper disc 8 are inserted into the mounting grooves, and the pressing strips 15 are pressed downward, so that the position of the copper disc 8 cannot be changed relative to the lower mounting frame 3.

[0027] The driving end of the lower linear module is connected with a guide groove 17, and the side edge position of the lower mounting frame 3 is adjusted in the guide groove 17, the lower linear module comprises a lower motor 20, a lower lead screw 21 and a lower nut 22, the lower motor 20 is connected with the upper end of the lower lead screw 21, the lower lead screw 21 is threadedly connected with the lower nut 22, the guide groove 17 is fixedly connected with the lower nut 22 after passing through the lifting support 1, and the lower motor 20 is connected with the lower nut 22 through the lower lead screw 21, so that the guide groove 17 moves up and down at the lower end of the lifting support 1, that is, the lifting of the lower mounting frame 3 is ensured, and the copper disc 8 driven by the lower mounting frame 3 can be adjusted in the front-rear position due to the existence of the guide groove 17.

[0028] The lifting support 1 is fixedly provided with a vertical guide rail 18, and the upper mounting frame 2 and the guide groove 17 are both connected with a vertical sliding block 19 which slides in the vertical guide rail 18 in the vertical direction, and the gold wire platform 4 and the lower copper seat 5 are vertically moved through the guidance of the vertical guide rail 18, no matter the upper linear module or the lower linear module.

[0029] The upper linear module comprises an upper motor 23, an upper lead screw and an upper nut 24, the upper motor 23 is connected with the lower end of the upper lead screw, the upper lead screw is threadedly connected with the upper nut 24, the upper mounting frame 2 is fixedly connected with the upper nut 24 after passing through the lifting support 1, and the upper motor 23 is connected with the upper nut 24 through the upper lead screw, so that the upper mounting frame 2 can move up and down along the lifting support 1 and drive the gold wire platform 4 to contact the 0BB silicon wafer.

[0030] It should be noted that the above specific embodiments are only the preferred embodiments of the present application and the technical principles applied, and any changes or replacements easily thought by those skilled in the art within the technical range disclosed by the present application should be covered in the protection range of the present application.

Claims

1. A 0BB detection mechanism for a gridless needle, characterized by, Including lifting support, upper installation frame, lower installation frame, gold line platform and lower copper base, the lifting support is installed with upper linear module and lower linear module, the upper linear module is connected with the side of the upper installation frame, the gold line platform is adjusted along the front and back of the upper installation frame, both sides of the gold line platform are provided with tension spring, the gold line is straightened between the tension spring, the outside of the lower installation frame is adjusted on the driving end of the lower linear module along the front and back direction, the lower copper base is located in the middle of the lower installation frame, the copper disc is arranged in the middle of the lower copper base, the upper end of the copper disc is bent into arc shape upward.

2. A 0BB detection mechanism for a no-mast grid according to claim 1, wherein, The middle of the upper installation frame is provided with upper frame opening, the gold line platform is movable in the upper frame opening, the side of the upper frame opening is installed with circuit board, the circuit board is in conduction with the end of the gold line, the outside of the circuit board is connected with first lead wire.

3. The 0BB detection mechanism for a no-mast grid according to claim 1, wherein, The upper installation frame is provided with guide optical axis along the front and back direction, the side of the gold line platform is connected with guide sliding block, the guide sliding block is slid on the guide optical axis.

4. The 0BB detection mechanism for a no-mast grid according to claim 1, wherein, The middle of the lower installation frame is provided with lower frame opening, the both sides of the lower frame opening are provided with installation groove and pressing strip, the outside of the copper disc is locked in the installation groove, the pressing strip is pressed above the outside of the copper disc, the both sides of the copper disc are connected with second lead wire.

5. The 0BB detection mechanism for a no-mast grid according to claim 1, wherein, The driving end of the lower linear module is connected with guide groove, the side of the lower installation frame is adjusted in the guide groove.

6. A 0BB detection mechanism for a no-mast grid according to claim 5, wherein, The lifting support is fixed with vertical guide rail, the upper installation frame and the guide groove are connected with vertical sliding block, the vertical sliding block is slid in the vertical guide rail along the vertical direction.

7. A 0BB detection mechanism for a no-mast grid according to claim 5, wherein, The lower linear module includes lower motor, lower lead screw and lower nut, the lower motor is connected with the upper end of the lower lead screw, the lower lead screw is threadedly connected with the lower nut, the guide groove is fixedly connected with the lower nut after passing through the lifting support.

8. The 0BB detection mechanism for a no-mast grid of claim 1, wherein, The upper linear module includes upper motor, upper lead screw and upper nut, the upper motor is connected with the lower end of the upper lead screw, the upper lead screw is threadedly connected with the upper nut, the upper installation frame is fixedly connected with the upper nut after passing through the lifting support.