Big data processing server with cooling and dedusting functions

Abstract

The utility model relates to the technical field of processing servers, and discloses a big data processing server with cooling and dedusting functions, which comprises a shell, a server is arranged in the shell, and high-speed fans are arranged on two sides of the upper end in the shell; the ion wind bars are arranged on the two sides of the upper end of the server; the heat conduction pads are arranged on the two sides of the exterior of the server, first heat conduction plates are arranged on the exteriors of the heat conduction pads, and first heat conduction fins are arranged on one sides of the exteriors of the first heat conduction plates; the second heat conducting plate is arranged outside the first heat conducting fins, a semiconductor cooler is arranged outside the second heat conducting plate, and the cooling end of the semiconductor cooler is attached to the second heat conducting plate. The server is cooled through refrigeration of the semiconductor cooler and air flow generated by the high-speed fan, and dust removal is carried out in cooperation with the ion wind bar.

Description

TECHNICAL FIELD

[0001] The utility model relates to handle server technical field, concretely is a big data processing server with cooling dust removal function. BACKGROUND

[0002] Big data processing servers are specialized servers designed to store and process large-scale data. They typically have high-performance hardware configurations, large-capacity storage spaces, distributed computing architectures, high scalability, and specialized software support to meet the needs of rapidly and efficiently processing massive amounts of data.

[0003] Big data processing servers generate a large amount of heat during operation, and the accumulation of dust can hinder heat dissipation, leading to server overheating, affecting performance, and even causing hardware damage. Therefore, a big data processing server with cooling and dust removal function is proposed. UTILITY MODEL CONTENT

[0004] (I) Technical problem solved

[0005] In view of the deficiencies of the prior art, the utility model provides a big data processing server with cooling and dust removal function to solve the problems raised in the background art.

[0006] (II) Technical solution

[0007] To achieve the above purpose, the utility model provides the following technical scheme: a big data processing server with cooling and dust removal function, comprising:

[0008] A shell is provided with a server assembly inside, and high-speed fans are provided on both sides of the upper end inside the shell.

[0009] Ion wind sticks are provided on both sides of the upper end of the server assembly.

[0010] Thermal pads are provided on both sides of the outside of the server assembly, the outside of the thermal pad is provided with a first heat dissipation plate, and the outside of the first heat dissipation plate is provided with a first heat dissipation fin.

[0011] A second heat dissipation plate is provided outside the first heat dissipation fin, the outside of the second heat dissipation plate is provided with a semiconductor refrigerator, and the cooling end of the semiconductor refrigerator is attached to the second heat dissipation plate.

[0012] Preferably, one side of the upper end of the shell is provided with an air inlet hole, and the air inlet hole is provided with a first dustproof net inside.

[0013] Preferably, second dustproof nets are provided on both sides of the lower end of the shell, and the second dustproof nets are connected with the shell.

[0014] Preferably, one side of the lower end of the ion wind rod is provided with a guide vane, and the guide vane is connected with the ion wind rod, and the guide vane is used for guiding the direction of air flow.

[0015] Preferably, one end of the semiconductor refrigerator outside the shell penetrates and extends to the outside of the shell, and the heating end of the semiconductor refrigerator outside the shell is provided with a third heat conduction plate, and the outside of the third heat conduction plate is provided with a second heat conduction fin, and the second heat conduction fin is used for increasing the heat exchange area and accelerating the heat dissipation through the contact with air.

[0016] Preferably, the outside of the second heat conduction fin is provided with a cooling fan, and the cooling fan is connected with the second heat conduction fin, and the cooling fan is used for cooling the second heat conduction fin.

[0017] (Three) beneficial effects

[0018] Compared with the prior art, the utility model provides a big data processing server with cooling and dust removal functions, has the following beneficial effects:

[0019] The utility model discloses a heat dissipation fin and heat conduction plate are used to heat conduction, cooperate high -speed fan and produce air current and semiconductor refrigerator refrigeration, cool big data processing server assembly, and combine ion wind rod and carry out dust removal to solve the problem of background art. ACCURACY OF DRAWINGS

[0020] Figure 1 It is the overall structure perspective drawing of the utility model;

[0021] Figure 2 It is the internal structure perspective drawing of the utility model;

[0022] Figure 3 It is the internal structure perspective drawing of the utility model; Figure 2 It is the local enlarged view of A area in the middle.

[0023] In the drawing: 1, shell;2, air inlet hole;3, first dust screen;4, high -speed fan;5, server assembly;6, ion wind rod;7, guide vane;8, second dust screen;9, heat conduction pad;10, first heat conduction plate;11, first heat conduction fin;12, second heat conduction plate;13, semiconductor refrigerator;14, third heat conduction plate;15, second heat conduction fin;16, cooling fan. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of the present application.

[0025] The present application provides a technical scheme, a big data processing server with cooling and dust removal functions, please refer to Figure 1 、 Figure 2 and Figure 3 , comprising:

[0026] The shell 1 is internally provided with a server assembly 5, in the present scheme, the server assembly 5 is the main functional module in the internal server product of the prior art, including a mainboard, a processor, a memory, a storage device, a network interface card, a power supply, etc., which is not the main improvement direction of the present scheme, and will not be described here. The two sides of the upper end of the shell 1 are provided with high-speed fans 4;

[0027] The ion wind rod 6 is arranged on the two sides of the upper end of the server assembly 5;

[0028] The heat-conducting pad 9 is arranged on the two sides of the external server assembly 5, the external heat-conducting pad 9 is provided with a first heat-conducting plate 10, and the external side of the first heat-conducting plate 10 is provided with a first heat-conducting fin 11;

[0029] The second heat-conducting plate 12 is arranged outside the first heat-conducting fin 11, the external second heat-conducting plate 12 is provided with a semiconductor refrigerator 13, and the refrigeration end of the semiconductor refrigerator 13 is attached to the second heat-conducting plate 12.

[0030] Please refer to Figure 1 and Figure 2 , one side of the upper end of the shell 1 is provided with an air inlet hole 2, and the internal first dust screen 3 is mounted in the air inlet hole 2.

[0031] Please refer to Figure 1 and Figure 2 , the two sides of the lower end of the shell 1 are provided with second dust screens 8, and the second dust screens 8 are connected with the shell 1.

[0032] Please refer to Figure 2 , one side of the lower end of the ion wind rod 6 is provided with a wind deflector 7, and the wind deflector 7 is connected with the ion wind rod 6, and the wind deflector 7 is used for guiding the airflow direction.

[0033] Please refer to Figure 1 、 Figure 2 and Figure 3, one end of the semiconductor refrigerator 13 outside the shell 1 is penetrated and extended to the outside of the shell 1, the third heat-conducting plate 14 is installed at the heating end of the semiconductor refrigerator 13 outside the shell 1, the second heat-conducting fin 15 is arranged outside the third heat-conducting plate 14, and the second heat-conducting fin 15 is used to increase the heat exchange area and accelerate the heat dissipation through the contact with air.

[0034] Please refer to Figure 1 and Figure 2 The second heat-conducting fin 15 is arranged outside the third heat-conducting plate 14, and the second heat-conducting fin 15 is used to increase the heat exchange area and accelerate the heat dissipation through the contact with air.

[0035] The present scheme: start the high-speed fan 4 and the semiconductor refrigerator 13, the heat generated by the server assembly 5 is transmitted to the first heat-conducting plate 10 through the heat-conducting pad 9 and then transmitted to the first heat-conducting fin 11, the airflow generated by the high-speed fan 4 passes through the first heat-conducting fin 11 to cool down, the semiconductor refrigerator 13 refrigerates and transmits the coldness to the first heat-conducting fin 11 through the second heat-conducting plate 12 to cool down, and the cooling effect is improved, the ion wind stick 6 is started, ions are generated through the high-voltage generator inside the ion wind stick 6, and the ions are blown out through the built-in fan or compressed air, which is used to eliminate the static electricity and adsorbed dust on the surface of the object.

[0036] It should be noted that, in this document, the relationship terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment.

[0037] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A big data processing server with cooling and dust removal functions, characterized in that, Include: The shell (1), the inside of the shell (1) is provided with server components (5), both sides of the upper end of the shell (1) inside are provided with high-speed fan (4); Ion wind stick (6), set in the upper end of the server components (5) both sides; Thermal pad (9), set in the two sides of the server components (5) outside, the outside of the thermal pad (9) is provided with the first heat dissipation plate (10), one side of the first heat dissipation plate (10) outside is provided with the first heat dissipation fin (11); Second heat dissipation plate (12), set in the outside of the first heat dissipation fin (11), the outside of the second heat dissipation plate (12) is provided with semiconductor refrigerator (13), and the cooling end of the semiconductor refrigerator (13) is combined with the second heat dissipation plate (12).

2. The big data processing server with cooling and dust removal functions according to claim 1, characterized in that: One side of the upper end of the shell (1) is provided with air inlet hole (2), the inside of the air inlet hole (2) is installed with the first dustproof net (3).

3. The big data processing server with cooling and dust removal functions according to claim 1, characterized in that: Both sides of the lower end of the shell (1) are provided with the second dustproof net (8), and the second dustproof net (8) is connected with the shell (1).

4. The big data processing server with cooling and dust removal functions according to claim 1, characterized in that: One side of the lower end of the ion wind stick (6) is installed with the wind deflector (7), and the wind deflector (7) is connected with the ion wind stick (6).

5. The big data processing server with cooling and dust removal functions according to claim 1, characterized in that: One end of the outside of the semiconductor refrigerator (13) penetrates and extends to the outside of the shell (1), the heating end of the semiconductor refrigerator (13) located in the outside of the shell (1) is installed with the third heat dissipation plate (14), the outside of the third heat dissipation plate (14) is provided with the second heat dissipation fin (15). 6.The big data processing server with cooling and dust removal functions of claim 5, wherein: The outside of the second heat dissipation fin (15) is provided with the cooling fan (16), and the cooling fan (16) is connected with the second heat dissipation fin (15).

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