Wind scooper, heat dissipation device and electronic equipment

Abstract

The embodiment of the utility model provides a wind scooper. The wind scooper is used for covering the main board. A first heating piece and a second heating piece are arranged on the same side of the main board at intervals. The air guide cover comprises a first air guide cavity and a second air guide cavity. The first air guide cavity comprises an air inlet, an air outlet and a first air guide channel communicating the air inlet with the air outlet, the first heating piece and the second heating piece are located in the first air guide channel. The second air guide cavity comprises a cover opening, a ventilation opening and a second air guide channel, wherein the cover opening and the ventilation opening are opposite, and the second air guide channel communicates with the cover opening and the ventilation opening. The cover opening is used for covering the second heating piece. The first air guide channel and the second air guide channel are communicated with each other, and the second air guide channel is partially bent so that air at the air inlet can be exhausted from the air outlet through the first air guide channel. The embodiment of the utility model further provides a heat dissipation device and electronic equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology of electronic equipment, and in particular to a wind deflector, a heat dissipation device comprising the wind deflector, and an electronic equipment comprising the heat dissipation device. BACKGROUND

[0002] With the rapid development of information technology, electronic equipment (such as desktop computers) is constantly updated and is playing an increasingly important role in daily work and life. Since electronic equipment uses a large number of integrated circuits, high temperature not only causes the system to run unstably and shortens the service life, but also can even burn some components. For the host of a computer, the heat causing high temperature mainly comes from the central processing unit (CPU) and memory bar in the computer case. How to improve the heat dissipation capacity of electronic equipment to improve the reliability of electronic equipment is a problem to be solved at present. CONTENT OF THE INVENTION

[0003] The first aspect of the present application provides a wind deflector for covering a mainboard, the same side of the mainboard being provided with a first heat generating member and a second heat generating member at intervals, the wind deflector comprising:

[0004] a first air deflection cavity comprising opposite air inlets and air outlets and a first air deflection channel connecting the air inlets and the air outlets, the first heat generating member and the second heat generating member being provided in the first air deflection channel at intervals; and

[0005] a second air deflection cavity comprising opposite cover inlets and air vents and a second air deflection channel connecting the cover inlets and the air vents, the cover inlets being used for covering the second heat generating member;

[0006] wherein the first air deflection channel and the second air deflection channel are connected to each other, and the second air deflection channel is partially curved, so that the air at the air inlets can be discharged from the air outlets through the first air deflection channel;

[0007] when the second heat generating member is located on the side of the first heat generating member close to the air inlets, part of the air at the air inlets is discharged from the air outlets after passing through the first heat generating member and the second heat generating member in the first air deflection channel, and the other part is discharged from the air vents after passing through the second heat generating member in the second air deflection channel;

[0008] when the second heat generating member is located on the side of the first heat generating member close to the air outlets, the air at the air vents is discharged from the air outlets after passing through the second heat generating member in the second air deflection channel.

[0009] The second heat-generating element is partially isolated from the first heat-generating element by the second air guide cavity, the second air guide cavity increases the contact area between the second heat-generating element and the air field, so that the temperature of the second heat-generating element is more easily reduced. Moreover, the second air guide channel formed by the second air guide cavity is partially curved, and the design of the curved second air guide cavity has less effect on the ventilation volume in the first air guide channel formed by the first air guide cavity. Therefore, the second air guide cavity arranged on the second heat-generating element can not only increase the air volume flowing through the second heat-generating element, but also has less effect on the ventilation volume of the first air guide channel, thereby improving the overall heat dissipation efficiency of the air guide cover.

[0010] Further, the first air guide cavity includes a first side wall and a second side wall arranged opposite to each other, and a third side wall located between the first side wall and the second side wall and connected to the first side wall and the second side wall respectively, and the first heat-generating element and the second heat-generating element are arranged between the first side wall and the second side wall.

[0011] Further, the second air guide cavity includes a first cavity part and a second cavity part, the first cavity part includes two fourth side walls arranged opposite to each other, and a fifth side wall located between the two fourth side walls and connected to the two fourth side walls respectively, each of the fourth side walls is further connected to the first side wall and the third side wall, and the fifth side wall is further connected to the third side wall; the ventilation port is formed on the third side wall;

[0012] The second cavity part includes two sixth side walls arranged opposite to each other, and a top wall located between the two sixth side walls and connected to the two sixth side walls respectively, the two sixth side walls are connected to the two fourth side walls away from the ventilation port respectively, one side of the top wall is connected to the fifth side wall away from the ventilation port, and the other side of the top wall is arranged opposite to the second side wall, so that the second air guide channel is communicated with the first air guide channel; the cover port is located on the side of the top wall away from the third side wall.

[0013] Further, the fifth side wall includes a bending part and a straight part, the straight part is connected to the third side wall, and the bending part is connected to one end of the straight part away from the third side wall and curved towards the first side wall.

[0014] Further, the air guide cover further includes a plurality of flow separation partitions, the plurality of flow separation partitions are arranged opposite to each other on the side of the fifth side wall close to the first side wall, the arrangement direction of the plurality of flow separation partitions is perpendicular to the direction in which the cover port points to the ventilation port, and the plurality of flow separation partitions are used to uniform the wind energy density of the air field in the second air guide channel.

[0015] Further, one of the sixth side walls is directly connected with the corresponding fourth side wall, and another of the sixth side walls is connected with the corresponding fourth side wall through a wind guide slope.

[0016] The second aspect of the present application provides a heat dissipation device, comprising:

[0017] The wind deflector according to any one of the above; and

[0018] A plurality of fans are located at a part of the wind deflector which is in communication with the outside, and some of the fans are used to make cold air enter the wind deflector, and the other fans are used to discharge hot air in the wind deflector.

[0019] For the heat dissipation device, the wind deflector according to any one of the above is integrated, and all the beneficial effects of the wind deflector can be achieved.

[0020] The third aspect of the present application provides an electronic device, comprising:

[0021] The heat dissipation device according to the above; and

[0022] A plurality of heat generating components, including the first heat generating component and the second heat generating component, are located in the heat dissipation device.

[0023] For the electronic device, the wind deflector according to any one of the above is arranged in the electronic device, and all the beneficial effects of the wind deflector can be achieved.

[0024] Further, the first heat generating component is a central processing unit, and the second heat generating component includes a plurality of memory banks.

[0025] Further, the number of the second wind deflection cavities is the same as the number of the second heat generating components. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 Part structure schematic diagram of the electronic device of the embodiment of the present application.

[0027] Figure 2 Part structure schematic diagram of the electronic device of the embodiment of the present application. Figure 1

[0028] Part structure schematic diagram of the electronic device of the embodiment of the present application. Figure 3 Figure 1 Part structure schematic diagram of the electronic device of the embodiment of the present application.

[0029] Figure 4 Figure 3 Part structure schematic diagram of the electronic device of the embodiment of the present application.

[0030] Figure 5 Part structure schematic diagram of the electronic device of the embodiment of the present application. Figure 3 ​​Structure diagram of the wind deflector without the second side wall.

[0031] Explanation of main component symbols

[0032] Electronic device: 1000

[0033] Heat dissipation device: 1

[0034] Wind deflector: 100

[0035] First wind deflection cavity: 10

[0036] First wind deflection passage: 101

[0037] Air inlet: 102

[0038] Air outlet: 103

[0039] First side wall: 11

[0040] Second side wall: 12

[0041] Third side wall: 13

[0042] Second wind deflection cavity: 20, 20a, 20b

[0043] Second wind deflection passage: 201, 201a, 201b

[0044] Cover opening: 202, 202a, 202b

[0045] Vent: 203, 203a, 203b

[0046] First cavity portion: 21

[0047] Fourth side wall: 211

[0048] Fifth side wall: 212

[0049] Straight portion: 212a

[0050] Bent portion: 212b

[0051] Flow separation partition: 213

[0052] Second cavity portion: 22

[0053] Sixth side wall: 221

[0054] Top wall: 222

[0055] Wedge: 223

[0056] Wind deflection slope: 223a

[0057] Fan: 300

[0058] First heat-generating component: 2

[0059] Heat dissipation member: 2a

[0060] Second heat generating member: 3, 3a, 3b

[0061] Mainboard: 4

[0062] Slot: 5

[0063] The following detailed description will further illustrate the present application in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0064] The present embodiment provides a wind guide cover applied in an electronic device (such as a computer case). The wind guide cover is arranged on a part of heat generating members which are prone to high temperature, and a separate wind guiding area is provided for the part of heat generating members, so as to increase the heat reduction speed of the part of heat generating members, thereby improving the overall heat dissipation efficiency of the computer case.

[0065] Please refer to Figure 1 and Figure 2 The electronic device 1000 of the present embodiment comprises a heat dissipation device 1 and a plurality of heat generating members. The plurality of heat generating members comprises a first heat generating member 2 and a second heat generating member 3, and the first heat generating member 2 and the second heat generating member 3 are both located in the heat dissipation device 1. The electronic device 1000 further comprises a mainboard 4, and the first heat generating member 2 and the second heat generating member 3 are arranged on the same side of the mainboard 4. A wind guide cover 100 in the heat dissipation device 1 is arranged on the first heat generating member 2 and the second heat generating member 3, and is used for discharging the heat of the first heat generating member 2 and the second heat generating member 3 out of the electronic device 1000.

[0066] Please refer to Figure 3 The heat dissipation device 1 of the present embodiment comprises a wind guide cover 100 and a plurality of fans 300. The plurality of fans 300 are all located inside the wind guide cover 100 and are in communication with the outside. Some of the fans 300 are used for making cold air enter the wind guide cover 300, and the other fans 300 are used for discharging hot air in the wind guide cover 300.

[0067] Please refer to Figure 4 and Figure 5 In the present embodiment, the plurality of heat generating members covered by the wind guide cover 100 comprises a first heat generating member 2 and two second heat generating members 3. The first heat generating member 2 is a central processing unit, and a heat dissipation member 2a is arranged on the central processing unit, which is used for helping the central processing unit dissipate heat. Each second heat generating member 3 comprises a plurality of memory banks.

[0068] The air guide cover 100 of the embodiment of the present application comprises a first air guide cavity 10 and a second air guide cavity 20. The first air guide cavity 10 comprises opposite air inlet 102 and air outlet 103, and first air guide channel 101 connecting the air inlet 102 and the air outlet 103, the first heating element 2 and the two second heating elements 3 are arranged in the first air guide channel 101, the direction of the air inlet 102 pointing to the air outlet 103 is consistent with the arrangement direction of the second heating element 3a, the first heating element 2 and the second heating element 3b. The second air guide cavity 20 comprises opposite cover opening 202 and ventilation opening 203, and second air guide channel 201 connecting the cover opening 202 and the ventilation opening 203, the cover opening 202 is used for covering the second heating element 3.

[0069] The first air guide channel 101 and the second air guide channel 201 are connected with each other, and the second air guide channel 201 is partially curved, so that the air at the air inlet 102 can be discharged from the air outlet 103 through the first air guide channel 101.

[0070] In the embodiment, the air guide cover 100 comprises two second air guide cavities 20a and 20b, respectively covering two second heating elements 3. One second heating element 3a is located on the side of the first heating element 2 close to the air inlet 102, and the ventilation opening 203a of the second air guide cavity 20a corresponding to the second heating element 3a is used for discharging the hot air in the second air guide channel 201a. When the air enters the air guide cover 100 through the air inlet 102, part of the air passes through the second heating element 3a, the first heating element 2 and the second heating element 3b in the first air guide channel 101 in turn, and exchanges heat with the second heating element 3a, the first heating element 2 and the second heating element 3b, and then is discharged from the air outlet 103, and the other part of the air passes through the second heating element 3a in the second air guide channel 201a, and exchanges heat with the second heating element 3a, and then is discharged from the ventilation opening 203a.

[0071] The other second heating element 3b is located on the side of the first heating element 1 close to the air outlet 103, and the ventilation opening 203b of the second air guide cavity 20b is used for guiding the cold air into the second air guide channel 201b, so that the air at the ventilation opening 203b passes through the second heating element 3b in the second air guide channel 201b, and exchanges heat with the second heating element 3b, and then is discharged from the air outlet 103.

[0072] Please refer to Figure 5 The first air guide cavity 10 comprises first side wall 11 and second side wall 12 arranged opposite to each other, and third side wall 13 located between the first side wall 11 and the second side wall 12 and fixedly connected with the first side wall 11 and the second side wall 12 respectively, and the third side wall 13 is perpendicular to the two first side walls 11 at the same time. The first heating element 2 and the two second heating elements 3 are arranged between the first side wall 11 and the second side wall 12.

[0073] The second air guiding cavity 20 comprises a first cavity part 21 and a second cavity part 22. The first cavity part 21 comprises two fourth side walls 211 arranged opposite to each other, and a fifth side wall 212 arranged between the two fourth side walls 211 and fixedly connected with the two fourth side walls 211 respectively. Each fourth side wall 211 is also fixedly connected with the first side wall 11 and the third side wall 13, and the fifth side wall 212 is also fixedly connected with the third side wall 12. The air vent 203 is formed on the third side wall 13.

[0074] The fifth side wall 212 comprises a straight part 212a and a bent part 212b. The straight part 212a is fixedly connected with the third side wall 13 perpendicularly. The bent part 212b is fixedly connected with the end of the straight part 212a away from the third side wall 13, and is curved towards the first side wall 11. When the first heat generating element 2 is arranged on the side of the second air guiding cavity 20 close to the air outlet 103, since the first cavity part 21 is partially curved towards the first side wall 11, most of the air at the air inlet 102 can pass through the first air guiding passage 101 to exchange heat with the first heat generating element 2 and then be discharged from the air outlet 103. That is, the first cavity part 21 has less influence on the air volume of the first air guiding passage 101.

[0075] Please refer to Figure 4 In the embodiment, the air guiding cover 100 further comprises a plurality of shunt baffles 213 arranged parallel and spaced apart on the side of the fifth side wall 212 close to the first side wall 11. The arrangement direction of the plurality of shunt baffles 213 is perpendicular to the direction in which the cover opening 202 points to the air vent 203. When air passes through the second air guiding passage 201, the plurality of shunt baffles 213 are used to shunt the air field in the second air guiding passage 201, so as to uniform the wind energy density of the air field in the second air guiding passage 201.

[0076] A plurality of slots 5 are arranged in the second cavity part 22, and a plurality of memory bars (second heat generating elements 3) are placed in the plurality of slots 5. The arrangement direction of the plurality of slots 5 is the same as that of the plurality of shunt baffles 213, and the positions of the plurality of shunt baffles 213 correspond to the positions of the side walls of the slots 5. When the air in the first cavity part 21 flows into the second cavity part 22, the plurality of shunt baffles 213 shunt the air field in the first cavity part 21, so that the sizes of the air fields entering the plurality of slots 5 are basically the same, avoiding that the sizes of the air fields entering the plurality of slots 5 are too different, which causes that the temperature difference between the plurality of memory bars is too large, and the second heat generating elements 3 generate local temperature too high.

[0077] The second cavity portion 22 comprises two sixth side walls 221 arranged opposite to each other, and a top wall 222 arranged between the two sixth side walls 221 and fixedly connected with the two sixth side walls 221 respectively. The two sixth side walls 221 are fixedly connected with the two fourth side walls 211 respectively and away from the air vent 203. One side of the top wall 222 is fixedly connected with the fifth side wall 212 and away from the air vent 203, and the other side of the top wall 222 is arranged away from the second side wall 12, so that the second air guide channel 201 is communicated with the first air guide channel 101. The cover opening 202 is arranged on the side of the top wall 222 away from the third side wall 13.

[0078] The second cavity portion 22 is fixedly connected with the first cavity portion 21, and the interior of the second cavity portion 22 is communicated with the interior of the first cavity portion 21. When the second cavity portion 22 is connected with the first cavity portion 21, one sixth side wall 221 is fixedly connected with the corresponding fourth side wall 211, and the other sixth side wall 221 is fixedly connected with the corresponding fourth side wall 211 through the air guide inclined surface 223a on the wedge-shaped block 223. That is, the sixth side wall 221 is fixedly connected with the fourth side wall 211 through the wedge-shaped block 223, and the right angle side of the wedge-shaped block 223 is arranged on the side of the air guide inclined surface 223a away from the second air guide channel 201. By connecting the air guide inclined surface 223a between the sixth side wall 221 and the fourth side wall 211, the impedance of the air in the first cavity portion 21 entering the second cavity portion 22 is reduced, so that the air in the first cavity portion 21 flows smoothly into the second cavity portion 22.

[0079] Please refer to Figure 5 In the embodiment, the central processor and the heat-dissipating piece 2a (the first heat-generating piece 2) are arranged between the second air guide cavity 20a and the second air guide cavity 20b, and the two groups of memory banks (the second heat-generating piece 3a and the second heat-generating piece 3b) are arranged in the plurality of slots 5 of the second cavity portion 22 respectively.

[0080] In the embodiment, the main flow direction of the air field in the air guide cover 100 is as follows: part of the cold air enters the first air guide channel 101 from the air inlet 102 and flows to the air outlet 103. Part of the cold air entering from the air inlet 102 exchanges heat with part of the surface of the second heat-generating piece 3a when passing through the second cavity portion 22, and then passes through the heat-dissipating piece 2a and the first heat-generating piece 2, exchanges heat with the first heat-generating piece 2, and becomes hot air, which is discharged from the air outlet 103. Another part of the cold air entering from the air inlet 102 enters the second cavity portion 22 from the gap between the top wall 222 and the second side wall 12 when passing through the second cavity portion 22, and then passes through the second cavity portion 22 and the first cavity portion 21 in sequence, exchanges heat with the second heat-generating piece 3a, and becomes hot air, which is discharged from the air vent 203a.

[0081] Part of the cold air enters the second air guide channel 201b from the air vent 203b, sequentially passes through the first cavity part 21 and the second cavity part 22, and becomes hot air after heat exchange with the second heating element 3b, and then flows out of the second air guide channel 201 from the gap between the top wall 222 and the second side wall 12, enters the first air guide channel 201, and finally is discharged from the air outlet 103 of the first air guide cavity 10.

[0082] In summary, the first air guide cavity 10 of the air guide cover 100 is provided with the second air guide cavity 20, the second cavity part 22 of the second air guide cavity 20 is covered on the second heating element 3, so that the second heating element 3 is located in a containing space surrounded by the second cavity part 22 and the mainboard 4 of the electronic device 1000, and the containing space is in communication with the first air guide channel 101. When the cold air passes through the first air guide channel 101, part of the cold air will enter the containing space and be discharged from the second air guide channel 201 after heat exchange with the second heating element 3. That is, this part of the cold air alone reduces the temperature of the second heating element 3. Covering the second cavity part 22 on the second heating element 3 is conducive to unblocking the flow field of the air passing through the second heating element 3, so that more cold air exchanges heat with the second heating element 3 and is discharged from the second air guide channel 201, thereby increasing the speed of reducing the heat of the second heating element 3. Moreover, the second air guide cavity 20 is partially bent towards the first side wall 11, so that the air can flow smoothly through the first air guide channel 101, and the air flow of the first air guide channel 101 is less affected. Therefore, by arranging the second air guide cavity 20 in the first air guide cavity 10, the air flow through the second heating element 3 is increased, and the air flow of the first air guide channel 101 is less affected, thereby improving the overall heat dissipation efficiency of the air guide cover 100.

[0083] Meanwhile, covering the air guide cover 100 on the first heating element 2 and the second heating element 3 can isolate the first heating element 2 and the second heating element 3 from other elements in the electronic device 1000, which is conducive to preventing the first heating element 2 and the second heating element 3 from affecting other elements when the temperature is too high, and improving the product performance of the electronic device 1000.

[0084] The number of the second air guide cavities 20 is not limited in the embodiments of the present application, and the number of the second air guide cavities 20 can be one, two or more. The second cavity part 22 in each second air guide cavity 20 is covered on the second heating element 3, and the number of the second air guide cavities 20 is the same as the number of the second heating elements 3.

[0085] Those skilled in the art should understand that the above embodiments are only used to illustrate the present application, and are not used as a limitation to the present application. Any appropriate changes and modifications made to the above embodiments within the spirit and principles of the present application fall within the scope of the present application.

Claims

1. A fan guide cover for mounting on a motherboard, wherein a first heating element and a second heating element are spaced apart on the same side of the motherboard, characterized in that, The air guide cover comprises: a first air guide cavity comprising opposite air inlet and air outlet and a first air guide channel connecting the air inlet and the air outlet, the first heat generating component and the second heat generating component being arranged in the first air guide channel; and a second air guide cavity comprising opposite cover opening and air vent and a second air guide channel connecting the cover opening and the air vent, the cover opening being used for covering the second heat generating component; wherein the first air guide channel and the second air guide channel are connected to each other, and the second air guide channel is partially curved, so that the air at the air inlet can be discharged from the air outlet through the first air guide channel; when the second heat generating component is located at the side of the first heat generating component close to the air inlet, part of the air at the air inlet is discharged from the air outlet after passing through the first heat generating component and the second heat generating component in the first air guide channel, and the other part is discharged from the air vent after passing through the second heat generating component in the second air guide channel; when the second heat generating component is located at the side of the first heat generating component close to the air outlet, the air at the air vent is discharged from the air outlet after passing through the second heat generating component in the second air guide channel.

2. The wind deflector of claim 1, wherein The first air guide cavity comprises first and second side walls arranged opposite to each other, and a third side wall located between the first and second side walls and connected to the first and second side walls respectively, and the first and second heat generating components are arranged between the first and second side walls.

3. The wind cone of claim 2, wherein, The second air guide cavity comprises a first cavity part and a second cavity part, The first cavity part comprises two fourth side walls arranged opposite to each other, and a fifth side wall located between the two fourth side walls and connected to the two fourth side walls respectively, and each of the fourth side walls is further connected to the first and third side walls, and the fifth side wall is further connected to the third side wall; and the air vent is formed on the third side wall; The second cavity part comprises two sixth side walls arranged opposite to each other, and a top wall located between the two sixth side walls and connected to the two sixth side walls respectively, and the two sixth side walls are respectively connected to the two fourth side walls away from the air vent, and one side of the top wall is connected to the fifth side wall away from the air vent, and the other side of the top wall is arranged away from the second side wall, so that the second air guide channel is connected to the first air guide channel; and the cover opening is located at the side of the top wall away from the third side wall.

4. The wind cone of claim 3, wherein, The fifth side wall comprises a bending part and a straight part, the straight part is connected to the third side wall, and the bending part is connected to one end of the straight part away from the third side wall and curved towards the first side wall.

5. The wind cone of claim 3, wherein, The air guide cover further comprises a plurality of flow separation partitions, the plurality of flow separation partitions are arranged parallel to each other at the side of the fifth side wall close to the first side wall, the arrangement direction of the plurality of flow separation partitions is perpendicular to the direction of the cover opening pointing to the air vent, and the plurality of flow separation partitions are used for uniformizing the wind energy density of the air field in the second air guide channel.

6. The wind cone of claim 3, wherein, One of the sixth side walls is directly connected to the corresponding fourth side wall, and another of the sixth side walls is connected to the corresponding fourth side wall through a wind guide slope.

7. A heat dissipating device characterized by comprising: The application further relates to a heat dissipation device comprising the air guide cover. The application further relates to a heat dissipation device comprising the air guide cover. The application further relates to a heat dissipation device comprising the air guide cover. The application further relates to a heat dissipation device comprising the air guide cover.

8. An electronic device, comprising: The application further relates to a heat dissipation device comprising the air guide cover. The first heat generating component is a central processing unit, and the second heat generating component comprises a plurality of memory banks. The number of the second air guide cavities is the same as the number of the second heat generating components. ​ 9. The electronic device of claim 8, wherein, ​ 10. The electronic device of claim 8, wherein, ​

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