Phase change memory

Abstract

The utility model relates to the technical field of phase change memories, and discloses a phase change memory which comprises a temperature control device, and one end of the temperature control device is provided with a temperature sensor. According to the phase change memory, the temperatures of the memory body and the frame are monitored in real time through the arranged temperature sensor, and the temperature of the memory body is controlled in real time by framing the memory body through the frame, so that the conduit can heat the memory body to a phase change reaction critical value through the frame; the internal medium can perform phase change reaction at any time when the memory body is started, the storage reaction speed of the memory body is improved, the frame and the memory body can be cooled by wind power through the arranged radiator, and internal electronic components are prevented from being damaged due to high-temperature overheating operation of the memory body. It is guaranteed that the memory body is in a low-temperature stable state during operation, the highest temperature and the lowest temperature of the memory body are controlled, and the memory body is located at the phase change reaction adaptive temperature in real time.

Description

TECHNICAL FIELD

[0001] The utility model relates to phase change memory technical field especially relates to a kind of phase change memory. BACKGROUND

[0002] Phase change memory is a kind of special storage device, when writing data, it needs to be heated to a high enough temperature to make it change phase, its feature is that storage content can be dynamically changed according to external signal or internal logic, this kind of memory not only has the data storage function of traditional memory, more importantly, it can update or modify the stored data in real time as needed.

[0003] The existing phase change memory in actual application, it needs to be preheated to improve internal temperature to heat internal medium to specified temperature, in the process of stopping to starting, the temperature increasing process causes certain influence to its starting process, reduces the reaction speed of high-temperature medium phase change process, influence memory storage speed, and phase change memory is not provided with cooling structure, so that it is easy to run in high-temperature process, causes data loss damage, cannot guarantee that it is in phase change temperature controllable range at any time. UTILITY MODEL CONTENT

[0004] The technical problem to be solved by the utility model is that the existing technology cannot control the phase change reaction temperature in real time, therefore, a phase change memory is provided.

[0005] In order to achieve the above purpose, the following technical scheme is adopted in the present application: a phase change memory, comprising a temperature control device, one end of the temperature control device is provided with a temperature sensor, one side of the temperature control device is provided with a conduit, the other end of the conduit is fixedly connected with a frame, the bottom of the frame is provided with a memory body, one side of the temperature control device is fixedly connected with a shell, the inner wall of the shell is fixedly connected with a support, the center point of the support is provided with a radiator, and the radiator is arranged on the top of the frame and the memory body.

[0006] Preferably, a plurality of ventilation holes are formed in the top of the shell, and exhaust holes are formed in the front end and the left and right sides of the shell.

[0007] Preferably, a plurality of filter screens are fixedly connected to the inner wall of the support, and a plurality of long grooves are formed in the surface of the shell.

[0008] Preferably, support rods are fixedly connected to the periphery of the bottom of the shell, and the other end of the support rod is fixedly connected to the top of the frame.

[0009] Preferably, heat-conducting silica gels are fixedly connected to the two sides of the bottom of the frame, and the surface of the heat-conducting silica gels is attached to the surface of the memory body.

[0010] Preferably, the material of the frame is made of pure copper.

[0011] The technical effects and advantages of the present application are as follows:

[0012] In the present application, the temperature of the memory body and the frame is monitored in real time by the temperature sensor, and the temperature of the memory body is controlled in real time by the frame, so that the conduit can heat the memory body to its critical value of phase change reaction through the frame, ensuring that the internal medium of the memory body can react at any time when the memory body is started, improving the storage reaction speed of the memory body, and the frame and the memory body can be cooled by the radiator, preventing the memory body from overheating and damaging the internal electronic components, ensuring that the memory body is in a low-temperature stable state when operating, controlling the highest and lowest temperatures of the memory body, and realizing that the memory body is in a phase change reaction adaptive temperature in real time. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 It is a front view structural schematic diagram of the present application.

[0014] Figure 2 It is a vertical cross-section structural sectional view of the present application.

[0015] Figure 3 It is a bottom structure schematic diagram of the present application.

[0016] Legend: 1, temperature control equipment; 2, temperature sensor; 3, conduit; 4, frame; 5, memory body; 6, shell; 7, support; 8, radiator; 9, ventilation hole; 10, exhaust hole; 11, filter screen; 12, long groove; 13, support rod; 14, heat-conducting silica gel. DETAILED DESCRIPTION

[0017] The present application will now be further described in detail with reference to the accompanying drawings and preferred embodiments, which are simplified schematic diagrams and only illustrate the basic structure of the present application in a schematic manner, and therefore only show the components related to the present application.

[0018] Reference Figure 1 - Figure 3As shown, the utility model provides a technical scheme: a phase change memory, including temperature control equipment 1, temperature control equipment 1 one end is equipped with temperature sensor 2, temperature control equipment 1 one side is equipped with the pipe 3, the other end of pipe 3 is fixedly connected with frame 4, the bottom of frame 4 is equipped with memory body 5, temperature control equipment 1 one side is fixedly connected with shell 6, the inner wall of shell 6 is fixedly connected with support 7, the center point of support 7 is equipped with radiator 8, radiator 8 is placed in frame 4 and the top of memory body 5, through the temperature sensor 2 of setting frame 4 and memory body 5 temperature real-time monitoring, through temperature control equipment 1 with pipe 3 makes frame 4 can be heated to specified temperature, in through frame 4 frame memory body 5, realize frame 4 to memory body 5 heat transfer, the real-time temperature of memory body 5 is in constant temperature range, so that memory body 5 can enter heating state at any time memory phase change, when memory body 5 runs temperature is too high, through temperature sensor 2 and monitor high temperature upper limit, close to the heating of pipe 3 to frame 4, start radiator 8 and produce downward wind power, frame 4 and memory body 5 are cooled, the real-time temperature of memory body 5 is controlled, prevent memory body 5 temperature is too high or too low, guarantee memory body 5 temperature reaches the critical value of phase change processing, improve the reaction speed of memory body 5 when using.

[0019] Referring to Figure 2 With Figure 3 As shown in the embodiment: the top of shell 6 is provided with a plurality of ventilation holes 9, the front end and the left and right sides of shell 6 are provided with exhaust holes 10, the ventilation holes 9 and the exhaust holes 10 are arranged, so that the air blown downward by the radiator 8 can enter the surface of the memory body 5 through the ventilation holes 9 and then be discharged through the exhaust holes 10, forming a complete air flow direction, ensuring the inflow of cold air and the discharge of hot air, and improving the cooling effect of air cooling on the memory body 5.

[0020] Referring to Figure 1 - Figure 3 As shown in the embodiment: the inner wall of the support 7 is fixedly connected with a plurality of filter screens 11, and a plurality of long grooves 12 are formed on the surface of the shell 6. The filter screens 11 and the long grooves 12 are arranged, so that the filter screens 11 protect the top of the radiator 8 and prevent dust from entering the inside of the frame 4 along the airflow. At the same time, the long grooves 12 are arranged to ensure that external air can be sucked into the shell 6, ensure the flowability of the air in the shell 6, and enable the radiator 8 to stably suck external air for air cooling.

[0021] Referring to Figure 1As shown, in the embodiment: the bottom of the shell 6 is fixedly connected with support rods 13 around, the other end of the support rod 13 is fixedly connected with the top of the frame 4, the frame 4 and the shell 6 are connected through the support rod 13, the position of the shell 6 and the frame 4 is reinforced, the shell 6 is prevented from bending outwardly downward, the shell 6 and the frame 4 are ensured to be in the same horizontal plane, the position of the shell 6 and the frame 4 is prevented from being inclined to cause the position of the radiator 8 to deviate, and the flow direction of the air-cooled airflow is affected.

[0022] With reference to Figures 1-3 As shown, in the embodiment: the bottom of the frame 4 is fixedly connected with heat-conducting silica gel 14 on both sides, one side of the heat-conducting silica gel 14 is attached to the surface of the memory body 5, the high temperature generated during the efficient operation of the memory body 5 is heat-conducted through the attachment of the heat-conducting silica gel 14 and the memory body 5, the temperature inside the memory body 5 is absorbed, the heat inside the memory body 5 can be discharged faster, the heat dissipation effect of the memory body 5 is improved, and the element loss caused by the long-term overheating operation of the memory body 5 is reduced.

[0023] With reference to Figure 1 - Figure 3 As shown, in the embodiment: the frame 4 is made of pure copper, the frame 4 has high temperature conductivity by using pure copper material, the frame 4 can be cooled or heated faster, the response speed of the frame 4 to temperature control is improved, the pure copper material is corrosion-resistant and easy to process, so that the device can be used for a long time without being damaged, and the pure copper material has a lower price than other temperature-conducting materials, so that the processing cost of the structure is reduced.

[0024] Working principle: through the temperature sensor 2 set to frame 4 and memory body 5 real-time monitoring of temperature, through temperature control equipment 1 and pipe 3 so that frame 4 can be heated to the specified temperature, and then through the frame 4 frame memory body 5, realize the heat transfer of frame 4 to the memory body 5, the real-time temperature of memory body 5 is in the constant temperature range, so that the memory body 5 can enter the heating state at any time to change the memory, when the temperature of memory body 5 is too high, the temperature sensor 2 detects the high temperature upper limit, the heating of frame 4 by pipe 3 is turned off, and the radiator 8 generates downward air flow to cool frame 4 and memory body 5. The real-time temperature of memory body 5 is controlled to prevent the temperature of memory body 5 from being too high or too low, and to ensure that the temperature of memory body 5 reaches the critical value of phase change processing, so as to improve the reaction speed of memory body 5 in use. Through the setting of air vent 9 and exhaust hole 10, the air flow generated by radiator 8 can enter the surface of memory body 5 through air vent 9, and then be discharged through exhaust hole 10, forming a complete air flow direction, ensuring the inflow of cold air and the discharge of hot air, improving the cooling effect of air cooling on memory body 5. Through the setting of filter screen 11 and long slot 12, the filter screen 11 protects the top of radiator 8, preventing dust from entering the inside of frame 4 along with the air flow. At the same time, the long slot 12 is provided to ensure that external air can be sucked into the shell 6, ensuring the air permeability of the shell 6, so that the radiator 8 can stably suck the external air for air cooling. The support rod 13 connects the frame 4 and the shell 6, and reinforces the position of the shell 6 and the frame 4, preventing the shell 6 from bending downward, ensuring that the shell 6 and the frame 4 are in the same horizontal plane, preventing the position of the shell 6 and the frame 4 from being inclined, causing the position of the radiator 8 to deviate, affecting the flow direction of the air cooling air flow. The heat-conducting silicone 14 is set to be in contact with the memory body 5 to conduct heat generated by the high-efficiency operation of the memory body 5, absorb the temperature inside the memory body 5, so that the heat in the memory body 5 can be discharged faster, improve the heat dissipation effect of the memory body 5, and reduce the element loss caused by long-term overheating operation of the memory body 5. The frame 4 is made of pure copper material, which has high temperature conductivity and can cool down or heat up faster, improving the response speed of the frame 4 to temperature control. The pure copper material is corrosion resistant and easy to process, so the device can be used for a long time without being damaged. The price of pure copper material is lower than that of other temperature conducting materials, reducing the processing cost of the structure.

[0025] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A phase change memory comprising a temperature control device (1), characterized in that: One end of the temperature control equipment (1) is provided with a temperature sensor (2), one side of the temperature control equipment (1) is provided with a catheter (3), the other end of the catheter (3) is fixedly connected with a frame (4), the bottom of the frame (4) is provided with a memory body (5), one side of the temperature control equipment (1) is fixedly connected with a shell (6), the inner wall of the shell (6) is fixedly connected with a support (7), the center point of the support (7) is provided with a radiator (8), and the radiator (8) is placed on the top of the frame (4) and the memory body (5).

2. The phase change memory of claim 1, wherein: The top of the shell (6) is provided with a plurality of ventilation holes (9), and the front end and the left and right sides of the shell (6) are provided with exhaust holes (10).

3. The phase change memory of claim 1, wherein: The inner wall of the support (7) is fixedly connected with a plurality of filter screens (11), and the surface of the shell (6) is provided with a plurality of long grooves (12).

4. The phase change memory of claim 1, wherein: The bottom of the shell (6) is fixedly connected with a support rod (13) around, and the other end of the support rod (13) is fixedly connected with the top of the frame (4).

5. The phase change memory of claim 1, wherein: The bottom of the frame (4) is fixedly connected with heat-conducting silica gel (14) on both sides, and one side of the heat-conducting silica gel (14) is attached to the surface of the memory body (5).

6. The phase change memory of claim 1, wherein: The material of the frame (4) is made of pure copper.

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