High-precision COP flexible bonding device

Abstract

The utility model discloses a high precision COP flexible bonding device, relates to the bonding device technical field, the high precision COP flexible bonding device comprises a bonding machine body, the bonding machine body is provided with a processing groove, the inner wall of the processing groove is provided with a first sliding groove, the first sliding groove is internally provided with a fast carrying mechanism, and the fast carrying mechanism is provided with a second sliding groove. The rapid carrying mechanism is fixedly connected with a feeding plate, the feeding plate is provided with a through groove extending out of the surface of the lower side of the feeding plate, the bottom wall of the machining groove is fixedly connected with a substrate, the substrate is provided with a groove matched with a chip, the surface of the lower side of the feeding plate is fixedly connected with two mounting plates, and the mounting plates are fixedly connected with the bottom wall of the machining groove. A rotating shaft is rotatably connected between the two mounting plates, and through the rotatable baffle, after the feeding plate moves to a destination, the chip can be unloaded through rotation of the baffle, so that the step of placing after adsorption in a traditional structure is omitted, the processing time is saved, and meanwhile, the cost can be reduced to a certain extent.

Description

TECHNICAL FIELD

[0001] The utility model relates to a bonding device technical field, especially in a kind of high-precision COP flexible bonding device. BACKGROUND

[0002] IC bonding machine is a kind of equipment for connecting integrated circuit (IC) with pin or substrate in semiconductor packaging process. This kind of equipment can carry out various types of bonding, including COP (Chip On Plastic) flexible bonding, and COP flexible bonding refers to the chip is directly mounted on flexible plastic substrate, and this technology is widely used in flexible circuit board and certain types of packaging.

[0003] As the Chinese utility model patent with patent publication number CN219917107U, including protective bonding mechanism, conduction positioning mechanism and fast mounting mechanism, the middle part of the protective bonding mechanism is provided with conduction positioning mechanism, and the bottom side of the conduction positioning mechanism is provided with fast mounting mechanism, the conduction positioning mechanism includes guide rail frame, transmission cylinder, positioning end, feeding plate, slot and IC circuit, the patent is conveyed by transmission cylinder of feeding plate connection cooperation guide rail frame, so that feeding plate conduction enters the inside of dust cover, and the position of feeding plate is aligned with the position of plastic base platform below by the limiting of positioning end of one end of transmission cylinder, and then bonding process is carried out, the alignment of feeding structure and the positioning of down-pressing process are assisted to achieve the purpose of high-stable IC chip bonding processing, without material suction and transmission re-bonding process, save steps, improve processing alignment stability, thereby reducing chip bonding displacement and unstable quality problems.

[0004] But after the chip is sent into the inside of dust cover by feeding plate, it is still necessary to place again after adsorbing the chip, the cost of whole bonding device is increased after increasing adsorption pressure head, it is not conducive to mass production, and the processing time is also increased after adsorbing and placing again, there is certain deficiency, in view of this, we provide a kind of high-precision COP flexible bonding device. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of high-precision COP flexible bonding device to solve the problems raised in the above background.

[0006] To achieve the above object, the utility model provides the following technical scheme: A high accuracy COP flexible bonding device, including bonding machine body, the bonding machine body is opened with processing groove, the inner wall of processing groove is opened with first sliding slot, the inside of first sliding slot is provided with quick loading mechanism, the quick loading mechanism is fixedly connected with the feeding plate on, the feeding plate is opened with the through groove of extending its downside surface, the bottom wall of processing groove is fixedly connected with the base plate, the base plate is opened with the recess groove of being suitable for chip, the downside surface of feeding plate is fixedly connected with two mounting plates, the rotatory shaft is rotatably connected between two mounting plates, the outer surface of rotatory shaft is equipped with the baffle, the downside surface of feeding plate is fixedly connected with the limit sleeve, the downside of feeding plate is provided with L shaped baffle, the transverse plate of L shaped baffle is slidably equipped in the inside of limit sleeve, and the feeding assembly is provided on the limit sleeve.

[0007] Preferably, the feeding assembly includes a vertical plate, the vertical plate is fixedly connected to the downside surface of the limit sleeve, the right side surface of the vertical plate is fixedly connected to the limit rod, and the vertical plate of the L-shaped baffle is slidably equipped on the outer surface of the limit rod.

[0008] Preferably, the vertical plate and the vertical plate of the L-shaped baffle are fixedly connected with a spring, and the bottom wall of the processing groove is provided with a limit groove.

[0009] Preferably, the inside of the processing groove is provided with a material plate, and the downside surface of the material plate is fixedly connected with a protrusion matched with the limit groove.

[0010] Preferably, the upside surface of the material plate is provided with a material groove, and the inner walls of the upper and lower sides of the processing groove are respectively provided with second sliding grooves.

[0011] Preferably, the inside of the processing groove is provided with a dust cover.

[0012] Preferably, the upper and lower side surfaces of the dust cover are respectively provided with sliding protrusions matched with the second sliding grooves.

[0013] Preferably, the rear inner wall of the processing groove is fixedly connected with a magnet, the rear surface of the dust cover is also fixedly connected with a magnet, and the two magnets are of opposite polarity.

[0014] Compared with the prior art, the utility model has the advantages that:

[0015] 1. The high-precision COP flexible bonding device can unload the chip by rotating the baffle after the feeding plate moves to the destination, thereby eliminating the step of placing the chip after adsorption in the traditional structure, saving processing time, and reducing costs to some extent.

[0016] 2. The high-precision COP flexible bonding device, through the setting of two magnets, can easily disassemble the dust cover when the pressing head is maintained, and the stability after the installation of the dust cover can be guaranteed by the cooperation of the second sliding groove and the sliding protrusion. BRIEF DESCRIPTION OF DRAWINGS

[0017] The utility model will be further explained in connection with the drawings and embodiments:

[0018] Figure 1 It is the structure schematic diagram of a high-precision COP flexible bonding device of the utility model;

[0019] Figure 2 It is dust cover separation schematic diagram of the utility model;

[0020] Figure 3 It is the bottom schematic diagram of the utility model feeding plate;

[0021] Figure 4 It is Figure 3 It is the enlarged view of A in the middle.

[0022] Reference signs: 1, bonding machine body; 2, processing groove; 3, first sliding groove; 4, quick mounting mechanism; 5, feeding plate; 6, through groove; 7, base plate; 8, recess; 9, mounting plate; 10, rotating shaft; 11, baffle; 12, limit sleeve; 13, L-shaped baffle; 14, vertical plate; 15, limit rod; 16, spring; 17, limit groove; 18, material plate; 19, protrusion; 20, material groove; 21, second sliding groove; 22, dust cover; 23, sliding protrusion; 24, magnet. DETAILED DESCRIPTION

[0023] This part will describe the specific embodiments of the utility model in detail, and the preferred embodiments of the utility model are shown in the drawings, and the drawings are used to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the utility model, but it cannot be understood as the limitation of the protection scope of the utility model.

[0024] Please refer to Figures 1-4The utility model provides a technical scheme: A high accuracy COP flexible bonding device, including bonding machine body 1, is set up with processing groove 2 on bonding machine body 1, and the inner wall of processing groove is set up with first sliding slot 3, and the inside of first sliding slot 3 is provided with quick mounting mechanism 4, and quick mounting mechanism 4 is fixedly connected with feeding plate 5, and the lower side surface of feeding plate 5 is set up with through groove 6 extending out, the bottom wall of processing groove 2 is fixedly connected with base plate 7, and the recess 8 of the chip is set up on base plate 7, and the lower side surface of feeding plate 5 is fixedly connected with two mounting plates 9, and the rotary shaft 10 is rotatably connected between the two mounting plates 9, and the outer surface of rotary shaft 10 is sleeved with baffle 11, and the lower side surface of feeding plate 5 is fixedly connected with limit sleeve 12, and the lower side of feeding plate 5 is provided with L-shaped baffle 13, and the horizontal plate of L-shaped baffle 13 is slidably sleeved in the inside of limit sleeve 12, and the feeding assembly is set up on limit sleeve 12, through rotatable baffle 11, after feeding plate 5 moves to the destination, the chip can be unloaded through the rotation of baffle 11, so that the step of placing after adsorbing in the traditional structure is saved, the processing time is saved, and the cost can also be reduced to a certain extent.

[0025] Further, the feeding assembly includes a vertical plate 14 fixedly connected to the lower side surface of the limit sleeve 12, a limit rod 15 fixedly connected to the right side surface of the vertical plate 14, the vertical plate of the L-shaped baffle 13 slidably sleeved on the outer surface of the limit rod 15, a spring 16 fixedly connected between the vertical plate of the vertical plate 14 and the L-shaped baffle 13, a limit groove 17 opened on the bottom wall of the processing groove 2, a material plate 18 provided inside the processing groove 2, a protrusion 19 fixedly connected to the lower side surface of the material plate 18 and matched with the limit groove 17, a material groove 20 opened on the upper side surface of the material plate 18, a second sliding groove 21 respectively opened on the inner walls of the upper and lower sides of the processing groove 2, a dust cover 22 provided inside the processing groove 2, a sliding protrusion 23 respectively opened on the upper and lower side surfaces of the dust cover 22 and matched with the second sliding groove 21, a magnet 24 fixedly connected to the rear inner wall of the processing groove 2, and the rear surface of the dust cover 22 is also fixedly connected with a magnet 24. The two magnets 24 are of opposite polarity. Through the arrangement of the two magnets 24, the dust cover 22 can be easily disassembled when the pressure head is maintained, and the stability after installing the dust cover 22 can be ensured by the cooperation of the second sliding groove 21 and the sliding protrusion 23.

[0026] The quick mounting mechanism 4 described in the text is of existing structure, and specific reference can be made to patent publication number CN219917107U.

[0027] Working principle: when feeding the chip, the chip is placed in the through slot 6 on the feeding plate 5, and the chip is blocked by the baffle 11, then the feeding plate 5 is driven to move by the quick mounting mechanism 4, after the feeding plate 5 enters the inside of the dust cover 22, the vertical plate of the L-shaped baffle 13 contacts with the right side surface of the base plate 7, at this time the feeding plate 5 continues to move and the L-shaped baffle 13 stops moving, forming the movement difference stretching spring 16, when the through slot 6 moves to align with the trough 20, the plate horizontal plate of the L-shaped baffle 13 separates from the baffle 11, under the action of gravity, the baffle 11 drives the rotating shaft 10 to rotate, after the baffle 11 rotates, the chip lacks blocking and falls into the inside of the trough 20, at this time the feeding plate 5 resets, under the action of the spring 16, the L-shaped baffle 13 gradually resets, when the L-shaped baffle 13 resets, the baffle 11 is reset, thereby completing the feeding, placing and resetting of the chip, and when maintaining the pressure head, the dust cover 22 can be directly pulled to make the two magnets 24 separate, that is, the dust cover 22 can be removed.

[0028] The above embodiment of the utility model is described in detail in combination with the drawings, but the utility model is not limited to the above embodiment, within the knowledge range of ordinary skilled in the art, various changes can be made without departing from the purpose of the utility model.

Claims

1. A high-precision COP flexible bonding device, comprising a bonding machine body (1), characterized in that: The quick mounting mechanism (4) is fixedly connected with the feeding plate (5), the feeding plate (5) is provided with a through groove (6) extending out of the lower surface thereof, the bottom wall of the processing groove (2) is fixedly connected with a base plate (7), the base plate (7) is provided with a groove (8) matched with the chip, the lower surface of the feeding plate (5) is fixedly connected with two mounting plates (9), the two mounting plates (9) are rotatably connected with a rotating shaft (10), the outer surface of the rotating shaft (10) is sleeved with a baffle (11), the lower surface of the feeding plate (5) is fixedly connected with a limiting sleeve (12), the lower side of the feeding plate (5) is provided with an L-shaped baffle (13), the horizontal plate of the L-shaped baffle (13) is slidably sleeved in the limiting sleeve (12), and the limiting sleeve (12) is provided with a feeding assembly.

2. A high-precision COP flexible bonding device according to claim 1, characterized in that: The feeding assembly comprises a vertical plate (14), the vertical plate (14) is fixedly connected to the lower surface of the limiting sleeve (12), the right side surface of the vertical plate (14) is fixedly connected with a limiting rod (15), and the vertical plate of the L-shaped baffle (13) is slidably sleeved on the outer surface of the limiting rod (15).

3. A high precision COP flexible bonding device according to claim 2, characterized in that: The vertical plate (14) and the vertical plate of the L-shaped baffle (13) are fixedly connected with a spring (16), and the bottom wall of the processing groove (2) is provided with a limiting groove (17).

4. The high-precision COP flexible bonding device according to claim 1, characterized in that: The inside of the processing groove (2) is provided with a material plate (18), and the lower surface of the material plate (18) is fixedly connected with a protrusion (19) matched with the limiting groove (17).

5. A high precision COP flexible bonding device according to claim 4, characterized in that: The upper surface of the material plate (18) is provided with a material groove (20), and the upper and lower inner walls of the processing groove (2) are respectively provided with a second sliding groove (21).

6. A high precision COP flexible bonding device according to claim 4, characterized in that: The inside of the processing groove (2) is provided with a dust cover (22).

7. A high precision COP flexible bonding device according to claim 6, characterized in that: The upper and lower surfaces of the dust cover (22) are respectively provided with a sliding protrusion (23) matched with the second sliding groove (21).

8. The high precision COP flexible bonding device of claim 6, wherein: The rear inner wall of the processing groove (2) is fixedly connected with a magnet (24), the rear surface of the dust cover (22) is also fixedly connected with a magnet (24), and the two magnets (24) are oppositely arranged.

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