Wafer chuck size identification device

Abstract

The utility model discloses a wafer chuck size identification device, which comprises a bottom plate, an air bag ring, a pair of microswitches and a chuck, the air bag ring is embedded in the bottom plate, the chuck is detachably arranged in the bottom plate and is positioned below the air bag ring, the pair of microswitches is respectively arranged at the top and the bottom of the bottom plate, and the microswitches are respectively arranged at the top and the bottom of the bottom plate. According to the utility model, the pair of microswitches is arranged, the corresponding wafer size and the corresponding air bag ring are detected in the upper cavity and the lower cavity, and the program set by the wafer is replaced according to the detection result, so that compared with the traditional mode that accessories are replaced firstly and then the program is switched, the manual error can be avoided in operation, and the working efficiency is improved. The service life of equipment is prolonged, the product yield is increased, the production efficiency can be improved through butt joint of automatic equipment, the chuck is fixed to the sliding clamping block on the bottom plate, and stable arrangement of the chuck is achieved through the clamping mechanisms arranged in a circumferential array mode.

Description

TECHNICAL FIELD

[0001] The utility model belongs to wafer technology field, concretely relates to a wafer chuck size identification device. BACKGROUND

[0002] Wafer film sticking equipment, often need to switch 8 inch and 12 inch wafers in production, and the equipment needs to switch 8 / 12 inch gas bag, and the chuck plate in the lower cavity also needs to switch size, and the operator needs to manually set the switching program in the system of the machine. Workers are easy to forget to switch the program in actual production, causing damage to the equipment and the product.

[0003] The Chinese patent with application number 202323155726.6 provides a multi-size compatible wafer suction chuck device, which includes a chuck body, a plurality of circular arc-shaped suction grooves are formed on the surface of the chuck body, a vacuum groove is formed on the back, a plurality of installation holes are formed in the vacuum groove and are in fixed communication with the suction grooves, a vacuum logic valve is threadedly connected in the installation hole, and a sealing mechanism is fixedly installed on the vacuum groove to seal it. The patent can adsorb commonly used two-inch, four-inch, six-inch, eight-inch, ten-inch and twelve-inch wafers on the market through the plurality of suction grooves, and the threaded straight pipes, vacuum grooves and sealing mechanisms cooperated with each other can extract air. Although this technical solution can adsorb wafer chucks of different sizes in the form of adsorption, the gas bag ring and the chuck size still need to be manually checked after switching the wafer chucks of different sizes, and the program needs to be switched, so it needs to be changed. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a wafer chuck size identification device, and the technical problem to be solved is that the wafer chuck in the prior art cannot switch different programs by identifying different wafer chucks when switching different sizes.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] The utility model provides a wafer chuck size identification device, which includes a bottom plate, a gas bag ring, a pair of microswitches and a chuck, the gas bag ring is embedded in the bottom plate, the chuck is detachably arranged in the bottom plate and located below the gas bag ring, and a pair of microswitches are arranged on the top and bottom of the bottom plate respectively to detect the size of the gas bag ring and the chuck.

[0007] By setting a pair of microswitches, the corresponding wafer size and airbag ring in the upper cavity and the lower cavity are detected, and the wafer setting program is replaced according to the detection result, compared with the traditional replacement of accessories and then switching the program, the operation can avoid human error, thereby improving the equipment life and product yield, and the automatic equipment can also improve the production efficiency.

[0008] Optionally, the bottom plate is sequentially provided with an upper cavity and a lower cavity from top to bottom, the chuck is placed in the lower cavity, and the airbag ring is placed in the upper cavity, and the chuck and the airbag ring are placed correspondingly by arranging the upper cavity and the lower cavity.

[0009] Optionally, a detection hole is formed in the top of the bottom plate and communicates with the upper cavity, each microswitch probe for detection is arranged at the end of the microswitch, the microswitch probe of the microswitch located at the top of the bottom plate is inserted into the detection hole, the microswitch probe is arranged in the detection hole by arranging the detection hole, and the size of the airbag ring is identified by the microswitch probe.

[0010] Optionally, the microswitch at the bottom of the bottom plate penetrates upward into the upper cavity, and the microswitch probe of the microswitch identifies the size of the chuck, the size of the chuck in the lower cavity is identified by the microswitch probe by arranging the microswitch at the bottom, the size of the airbag ring and the size of the chuck are compared, and information is transmitted to the wafer equipment to switch the program.

[0011] Optionally, the surface of the chuck is provided with a plurality of vacuum grooves, each vacuum groove communicates with a vacuum hole arranged on the side of the bottom plate, and the vacuum grooves and the corresponding vacuum holes are arranged, and the vacuum grooves are used for adsorbing and limiting the wafer.

[0012] Optionally, the top of the bottom plate is further provided with a clamping mechanism, the clamping mechanism comprises clamping plates, sliding clamping blocks and fixing columns, the clamping plates are arranged in an array outside the chuck, the sliding clamping blocks are slidingly engaged on the clamping plates, and the fixing columns are connected with the sliding clamping blocks at the outer side ends of the clamping plates, the clamping mechanism is arranged to fix and clamp the chuck, and the sliding clamping blocks are slidingly connected with the clamping plates through the sliding grooves, the fixing columns extend to the outside of the clamping plates, the fixing columns are provided with abutting springs at the lower parts and limiting springs at the upper parts, and the limiting springs are provided with nuts and are threadedly connected with the fixing columns.

[0013] Optionally, the clamping plates are provided with sliding grooves, the sliding clamping blocks are slidingly connected with the clamping plates through the sliding grooves, the fixing columns extend to the outside of the clamping plates, the fixing columns are provided with abutting springs at the lower parts and limiting springs at the upper parts, and the limiting springs are provided with nuts and are threadedly connected with the fixing columns.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] 1. The wafer chuck size identification device of the utility model discloses a pair of microswitches are set, the corresponding wafer size and airbag ring in the upper cavity and lower cavity are detected, according to the detection result, the program of wafer setting is replaced, compared with the traditional replacement of spare parts before switching the program, it can avoid human error when operating, and then improve the equipment life and product yield, and the docking automation equipment can also improve the production efficiency.

[0016] 2. The wafer chuck size identification device of the utility model discloses a detection hole is set, the microswitch probe is set in it, and the size of the airbag ring is identified by the microswitch probe. The chuck size in the lower cavity is identified by the microswitch probe, and the airbag ring and the chuck size identified are compared, and information is transmitted to the wafer equipment to switch the program. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is the structure schematic diagram of the utility model;

[0018] Figure 2 It is the overhead structure schematic diagram of the utility model;

[0019] Figure 3 It is the overhead structure schematic diagram of the utility model; Figure 2 A-A section view in;

[0020] Figure 4 It is the overhead enlarged structure schematic diagram of the utility model;

[0021] Figure 5 It is the overhead structure schematic diagram of the utility model; Figure 4 A-A section view in;

[0022] Figure 6 It is the clamping mechanism installation structure schematic diagram of the utility model;

[0023] Figure 7 It is the clamping mechanism method structure schematic diagram of the utility model.

[0024] In the drawing: 1-bottom plate, 2-supporting rod, 3-upper cavity, 4-airbag ring, 5-microswitch, 6-microswitch probe, 7-detection hole, 8-lower cavity, 9-chuck, 10-vacuum groove, 11-vacuum hole, 12-cooling groove, 13-clamping mechanism, 131-clamping plate, 132-sliding slot, 133-sliding clamping block, 134-fixing column, 135-abutment spring, 136-nut, 137-limit spring. DETAILED DESCRIPTION

[0025] The utility model will be further described below in conjunction with the drawings. The following examples are only used to more clearly illustrate the technical scheme of the utility model, and cannot limit the protection scope of the utility model.

[0026] One embodiment, such as Figures 1 to 7 As shown, a wafer chuck size identification device is provided, including a base plate 1, an airbag ring 4, micro switches 5, and a chuck 9. The base plate 1 is fixedly supported by four support rods 2 at the bottom. The base plate 1 has an upper cavity 3 and a lower cavity 8 from top to bottom. In this embodiment, the airbag ring 4 is disposed in the upper cavity 3, and the chuck 9 is disposed in the lower cavity 8. In this embodiment, the micro switches 5 are preferably a pair, and the pair of micro switches 5 are respectively disposed at the top and bottom of the base plate 1.

[0027] In use, the micro switch 5 located at the top of the base plate 1 identifies the size of the airbag ring 4 in the upper cavity 3, and the micro switch 5 located at the bottom of the base plate 1 identifies the size of the chuck 9 in the lower cavity 8. Based on the identification results, the signal is transmitted to the wafer device. In this embodiment, the signal transmission, wafer device and program switching are all directly using existing technology, so they will not be described in detail here.

[0028] In this embodiment, the chuck 9 is preferably 8 inches or 12 inches in size. The size of the airbag ring 4 is adapted to the 8-inch chuck 9 and the 12-inch chuck 9. In this embodiment, the chuck 9 is placed in the lower cavity 8 and the airbag ring 4 is placed in the upper cavity 3. In this embodiment, the micro switch 5 is provided with a micro switch probe 6 at its end. The micro switch probe 6 at the bottom of the base plate 1 is inserted into the upper cavity 3. At this time, the micro switch 5 determines whether the size of the chuck 9 in the lower cavity 8 is 8 inches or 12 inches. A detection hole 7 is provided at the top of the base plate 1. The diameter of the detection hole 7 is larger than the diameter of the micro switch probe 6. In this embodiment, the detection hole 7 is preferably opened downward and communicates with the upper cavity 3.

[0029] In use, the micro switch 5 identifies the size of the chuck 9 in the lower cavity 8 and determines it to be 8 inches or 12 inches. The micro switch probe 6 in the upper cavity identifies the size of the airbag ring 4 therein and determines it to be 8 inches or 12 inches. It is worth noting that in this embodiment, in order to avoid the micro switch probe 6 from identifying both 8-inch and 12-inch airbag rings 4 at the same time, it is preferable to have a clearance hole on the 8-inch airbag ring 4 to avoid it being detected by the micro switch 5 and causing a program error.

[0030] During use, if the currently detected airbag ring 4 and chuck 9 are both 8 inches, and the previous running program was for 12-inch airbag ring 4 and chuck 9, then the corresponding 8-inch running program will be automatically switched. If the currently detected airbag ring 4 and chuck 9 are both 12 inches, and the previous running program was also for 12-inch airbag ring 4 and chuck 9, then the running program will not be switched. If the detected airbag ring 4 and chuck 9 are inconsistent in size, the program will be terminated, an alarm will be triggered, and the operator will be reminded to perform maintenance.

[0031] refer to Figure 4As shown, the top of the chuck 9 is provided with a plurality of vacuum grooves 10, wherein the vacuum grooves 10 are preferably annular structures, and each vacuum groove 10 is in communication with a vacuum hole 11 arranged on the side of the bottom plate 1.

[0032] Referring to Figure 6 As shown, the top of the chuck 9 is also provided with a cooling groove 12, wherein the cooling groove 12 is preferably open towards the side.

[0033] In use, the vacuum hole 11 is externally connected with the vacuum extraction equipment in the prior art, so that the vacuum groove 10 is in a vacuum state, thereby realizing the adsorption and fixation of the wafer on the chuck 9, and through the arrangement of the cooling groove 12, the water generated after cooling is discharged during use.

[0034] Referring to Figure 6 and Figure 7 As shown, the top of the bottom plate 1 is also provided with a clamping mechanism 13, wherein the clamping mechanism 13 comprises a clamping plate 131, and the clamping plate 131 is preferably an arc-shaped piece structure in the embodiment, and the clamping plate 131 is preferably four circumferentially arrayed and fixed on the outer periphery of the chuck 9, and in the embodiment, each clamping plate 131 is provided with a sliding groove 132, and a sliding clamp block 133 is slidingly connected in each sliding groove 132.

[0035] Referring to Figure 7 As shown, the sliding clamp block 133 extends to the outside of the sliding groove 132 at both ends, and is clamped to the outside of the sliding groove 132 at both ends, and in the embodiment, the end of the sliding clamp block 133 located on the inner side of the clamping plate 131 is provided with a notch, which is matched with the thickness of the chuck 9, and the end of the sliding clamp block 133 located on the outer side of the clamping plate 131 is fixed with a fixed column 134, and in the embodiment, the fixed column 134 extends through the fixed clamp block 133 at both ends, wherein one end of the fixed column 134 is fixedly connected with the bottom plate 1, and the other end is an integrally formed circular disc-shaped end.

[0036] In the embodiment, the fixed column 134 is provided with an abutting spring 135 at the bottom, wherein one end of the abutting spring 135 abuts against the end of the fixed column 134, and the other end abuts against the sliding clamp block 133, and in the embodiment, the fixed column 134 is preferably a threaded column, wherein the top of the sliding clamp block 133 is threadedly connected with a nut 136 on the fixed column 134, and in the embodiment, the upper part of the fixed column 134 is provided with a limiting spring 137, wherein one end of the limiting spring 137 abuts against the nut 136, and the other end abuts against the top of the fixed column 134.

[0037] In use, the chuck 9 is fixed on the sliding clamp block 133, the chuck 9 is stably limited through the four clamping mechanisms 13 arranged in a circumferential array, the sliding clamp block 133 is adjusted in the vertical direction through the nut 136, and the sliding clamp block 133 is limited in the vertical direction through the limiting spring 137 and the abutting spring 135, so that looseness is reduced.

[0038] Working principle:

[0039] In use, the micro switch 5 identifies the size of the chuck 9 in the lower cavity 8 and judges whether it is 8 inches or 12 inches; the micro switch probe 6 in the upper cavity identifies the size of the air bag ring 4 and judges whether it is 8 inches or 12 inches; through comparison with the previously run program, it is automatically judged whether the corresponding chuck 9 size program needs to be switched; zero operation failure can be realized; better automatic operation can be realized; human error can be avoided in operation; the service life of the equipment and the product yield are improved; and the production efficiency of the automatic equipment is improved.

[0040] The embodiments of the utility model are described above in combination with the drawings, but the utility model is not limited to the specific implementation manners described above; the specific implementation manners described above are only illustrative but not restrictive; a person skilled in the art can make many forms under the inspiration of the utility model without departing from the scope of the utility model and the protection scope of the claims; and these all belong to the protection scope of the utility model.

Claims

1. A wafer chuck size identification apparatus, characterized by: Including the bottom plate (1), the air bag ring (4), a pair of micro switch (5) and chuck (9), the air bag ring (4) is embedded in the inside of bottom plate (1), the chuck (9) is detachably arranged in the inside of bottom plate (1), and is located below the air bag ring (4), a pair of micro switch (5) is arranged at the top and bottom of bottom plate (1) respectively, and the size identification detection is carried out to air bag ring (4) and chuck (9) respectively.

2. The wafer chuck size recognition device of claim 1, wherein: The bottom plate (1) is sequentially provided with an upper cavity (3) and a lower cavity (8) from top to bottom, the chuck (9) is placed in the lower cavity (8), and the air bag ring (4) is placed in the upper cavity (3). ​ 3. The wafer chuck size identification device of claim 2, wherein: The top of the bottom plate (1) is provided with a detection hole (7) in communication with the upper cavity (3), and each micro switch (5) is provided with a micro switch probe (6) for detection, and the micro switch probe (6) of the micro switch (5) located at the top of the bottom plate (1) is inserted into the detection hole (7). ​ 4. The wafer chuck size identification apparatus of claim 3, wherein: The micro switch (5) at the bottom of the bottom plate (1) penetrates upward into the upper cavity (3), and the micro switch probe (6) of the micro switch (5) identifies the size of the chuck (9).

5. The wafer chuck size identification apparatus of claim 4, wherein: The surface of the chuck (9) is provided with a plurality of vacuum grooves (10), and each vacuum groove (10) is in communication with a vacuum hole (11) provided on the side of the bottom plate (1). ​ 6. The wafer chuck size identification apparatus of claim 1, wherein: The top of the bottom plate (1) is further provided with a clamping mechanism (13), the clamping mechanism (13) comprises a clamping plate (131), a sliding clamping block (133) and a fixed column (134), the clamping plate (131) is arranged in an array on the outer periphery of the chuck (9), the sliding clamping block (133) is slidingly engaged on the clamping plate (131), and the fixed column (134) is connected with the sliding clamping block (133) on the outer side end of the clamping plate (131).

7. A method according to claim 6, wherein: The clamping plate (131) is provided with a sliding groove (132), the sliding clamping block (133) is slidingly connected with the clamping plate (131) through the sliding groove (132), the fixed column (134) extends to the outside of the clamping plate (131), the fixed column (134) is provided with an abutting spring (135) at the lower part, and a limiting spring (137) at the upper part, and the limiting spring (137) is provided with a nut (136) and is threadedly connected with the fixed column (134).

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