Electrostatic chuck copper electrode film laminating device
By using a combination structure of base plate, elastic support and pressure roller in the electrostatic chuck copper electrode film bonding device, the problems of inaccurate positioning and surface damage between the electrostatic chuck copper electrode film and the base are solved, and a high-precision bonding effect is achieved.
Patent Information
- Application Number
- CN202422646692.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-31
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-10-31
AI Technical Summary
In the prior art, the bonding of the copper electrode film of the electrostatic chuck to the base has problems such as inaccurate positioning, air bubbles, scratches on the base and damage to the film surface. Furthermore, the bonding of the different layers of the copper electrode film is prone to wrinkling and the adhesive bonding to the film first.
It adopts a combination structure of base plate, elastic support, pressing tool and pressure roller. Positioning is achieved by first pin and reserved plate, the elastic support controls the bonding height, and the pressing tool and pressure roller roll to achieve precise bonding.
This improved the bonding precision between the copper electrode film and the base, avoiding bubbles and surface damage, and ensuring perfect bonding and flatness.
Smart Images

Figure CN223527161U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor devices, especially to a static chuck copper electrode film laminating device. BACKGROUND
[0002] The static chuck copper electrode film laminating device comprises a static chuck base and a copper electrode film, and the copper electrode film is laminated in layers. The copper electrode film cannot be perfectly laminated with the base by the conventional lamination, which may cause the film and the base to be inaccurately positioned, generate air bubbles, scratch the base, and so on. When the copper electrode film is laminated in layers, the film may be wrinkled, the film surface may be damaged, air bubbles may be generated in the lamination, the glue may be first bonded with the film, and various factors may cause inaccurate positioning. SUMMARY
[0003] Therefore, the utility model provides a static chuck copper electrode film laminating device to solve the problems in the background art.
[0004] To achieve the above purpose, the utility model provides a static chuck copper electrode film laminating device, which comprises:
[0005] A bottom plate is provided with four first pins uniformly distributed on the top thereof;
[0006] An elastic support is arranged on the bottom plate, and the top of the elastic support is provided with four reserved plates corresponding to all the first pins in one-to-one correspondence. Each two reserved plates are respectively arranged on one side of the bottom plate, and each reserved plate is arranged on one first pin by being bent.
[0007] A base is detachably connected to the middle of the bottom plate;
[0008] A pressing tool is arranged above the base, and the pressing tool is provided with positioning holes matched with the first pins. A pressure roller is slidably connected to the pressing tool.
[0009] The pressing tool and the reserved plates press the copper electrode film. The copper electrode film and the base are overlapped by pressing the pressing tool. The pressure roller is rolled back and forth on the pressing tool to complete the lamination of the copper electrode film and the base.
[0010] Preferably, the elastic support comprises:
[0011] A first bent plate is provided with the reserved plates.
[0012] Two mounting grooves are arranged on the top of the bottom plate. Each mounting groove is slidably connected to the first bent plate. At least two springs are arranged in each mounting groove. The two ends of each spring are fixedly connected to the mounting groove and the bottom of the first bent plate.
[0013] Preferably, the pre-reserved plate comprises:
[0014] A fixed plate, one end of which is fixedly arranged on the first meander plate;
[0015] An active plate, one end of which is hingedly connected to the end of the fixed plate away from the first meander plate, and the active plate abuts against the fixed plate when the active plate is perpendicular to the fixed plate;
[0016] A U-shaped groove, which is arranged at the end of the active plate away from the fixed plate.
[0017] Preferably, the middle part of the bottom plate is fixedly provided with at least two second pins, and each second pin is inserted into the base.
[0018] Preferably, the pressing tool comprises a second meander plate, the bottom of the second meander plate is provided with four pressing blocks corresponding to all the first pins, the bottom of each pressing block is provided with a through hole penetrating through the second meander plate, and each through hole is sleeved on the first pin.
[0019] Preferably, the top of the second meander plate is slidably connected with a handle, and the pressing roller is rotatably connected in the interior of the handle, and the outer surface of the pressing roller is flush with the bottom of the pressing block.
[0020] The utility model discloses the beneficial effects: through setting up first pin on the bottom plate, positioning treatment is carried out to copper electrode film, improves the precision of sticking, avoids the bubble production, through setting up spring support piece and pre-reserved plate, determines the height of sticking, avoids that the adhesive layer contacts in advance. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical scheme in the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.
[0022] Fig. 1 It is the structure schematic diagram of the embodiment of the utility model as a whole.
[0023] Fig. 2 It is the three-dimensional structure schematic diagram of the bottom plate of the embodiment of the utility model.
[0024] Fig. 3 It is the structure schematic diagram of the base being polyurethane glue of the embodiment of the utility model.
[0025] Marked as in the drawing:
[0026] 1, bottom plate; 2, first pin; 3, base; 4, compression roller; 5, first return plate; 6, mounting groove; 7, spring; 8, fixed plate; 9, movable plate; 10, U-shaped groove; 11, second pin; 12, second return plate; 13, pressing block; 14, handle. DETAILED DESCRIPTION
[0027] In order to make the purpose, technical scheme and advantages of the utility model more clearly, the following will be further detailed in combination with specific embodiments.
[0028] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the utility model should be understood as the usual meaning by those skilled in the art to which the utility model belongs. The "first", "second" and similar words used in the utility model do not represent any order, quantity or importance, but are only used to distinguish different components. "Include" or "contain" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connection" or "connected" and similar words are not limited to physical or mechanical connection, but can include electrical connection, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to represent the relative positional relationship, which may change accordingly when the absolute position of the described object changes.
[0029] As shown in Figs. 1 to 3 An electrostatic chuck copper electrode film laminating device, comprising:
[0030] The bottom plate 1 is uniformly distributed with four first pins 2 on the top.
[0031] The elastic support is installed on the bottom plate 1, and the top of the elastic support is provided with four reserved plates corresponding to all the first pins 2, and each two reserved plates are respectively arranged on one side of the bottom plate 1, and each reserved plate is sleeved on one first pin 2 by bending.
[0032] The base 3 is detachably connected to the middle of the bottom plate 1.
[0033] The compression tool is arranged above the base 3, and the compression tool is provided with a positioning hole matched with the first pin 2, and the compression tool is slidably connected with a compression roller 4.
[0034] The compression tool cooperates with the reserved plate to compress the copper electrode film, the copper electrode film and the base 3 are overlapped by the compression tool, and the compression roller 4 is rolled back and forth on the compression tool to complete the lamination of the copper electrode film and the base 3.
[0035] For example, the copper electrode film is provided with a hole position corresponding to the first pin 2, and the copper electrode film is positioned by the first pin 2 to ensure the positioning accuracy during lamination. The elastic support and the reserved plate are used to avoid the contact between the glue and the bottom film, control the distance, and improve the flatness of the copper electrode film and the precision of lamination, so that the copper electrode film of the electrostatic chuck is laminated more perfectly. The base 3 includes a circular boss-shaped base 3 and a rectangular polyurethane glue base 3. The circular boss-shaped base 3 is used for lamination work after the copper electrode film is cut. At this time, the spring 7 support, the reserved plate, the compression tool and the compression roller 4 are used to assist the lamination work. The rectangular polyurethane glue base 3 is used for hierarchical lamination of the copper electrode film. At this time, only ordinary compression roller 4 is needed to assist, so that the surface of the film is cleaner.
[0036] As an optional embodiment, the elastic support includes:
[0037] The first bent plate 5, the reserved plate is fixedly arranged on the first bent plate 5;
[0038] Two mounting grooves 6 are arranged on the top of the bottom plate 1. Each mounting groove 6 is slidably connected with the first bent plate 5. Each mounting groove 6 is provided with at least two springs 7. Both ends of each spring 7 are fixedly connected with the mounting groove 6 and the bottom of the first bent plate 5.
[0039] As an optional embodiment, the reserved plate includes:
[0040] The fixed plate 8 is fixedly arranged at one end of the first bent plate 5;
[0041] The movable plate 9 is hingedly connected with the end of the fixed plate 8 away from the first bent plate 5. When the movable plate 9 is perpendicular to the fixed plate 8, the movable plate 9 abuts against the fixed plate 8.
[0042] The U-shaped groove 10 is arranged at the end of the movable plate 9 away from the fixed plate 8.
[0043] For example, when the copper electrode film is positioned on the first pin 2, the movable plate 9 is vertically rotated with the fixed plate 8, the movable plate 9 is sleeved on the first pin 2 through the U-shaped slot 10, at this time, the copper electrode film is attached to the movable plate 9, the copper electrode film is parallel to the base 3, the copper electrode film and the movable plate 9 are pushed downward by the pressing tool, the movable plate 9 pushes the fixed plate 8 to move downward, the fixed plate 8 pushes the first bent plate 5 to move downward in the mounting slot 6, the center cutting part of the copper electrode film is completely attached to the circular part of the base 3, finally, the copper electrode film and the base 3 are attached more accurately by rolling the pressure roller 4 back and forth, which facilitates the attachment, avoids the premature attachment of the glue to the base 3, and avoids damaging the film surface and scratching the base 3.
[0044] As an optional embodiment, the middle part of the bottom plate 1 is fixedly provided with at least two second pins 11, and each second pin 11 is inserted on the base 3.
[0045] For example, the second pin 11 is provided to accurately position the base 3, which ensures the positioning accuracy during the attachment.
[0046] As an optional embodiment, the pressing tool comprises a second bent plate 12, the bottom of the second bent plate 12 is provided with four pressing blocks 13 corresponding to all the first pins 2, the bottom of each pressing block 13 is provided with a through hole penetrating through the second bent plate 12, and each through hole is sleeved on the first pin 2.
[0047] As an optional embodiment, the top of the second bent plate 12 is slidingly connected with a handle 14, the pressure roller 4 is rotationally connected inside the handle 14, and the outer surface of the pressure roller 4 is flush with the bottom of the pressing block 13.
[0048] For example, the second bent plate 12 is pressed by the handle 14, the copper electrode film and the movable plate 9 are pressed by the second bent plate 12, the center cutting part of the copper electrode film is completely attached to the circular part of the base 3, at this time, the pressure roller 4 is attached to the copper electrode film, after the copper electrode film and the base 3 are attached, the pressure roller 4 is rolled back and forth on the second bent plate 12 by controlling the handle 14, so that the copper electrode film and the base 3 are attached more accurately, which facilitates the attachment, avoids the premature attachment of the glue to the base 3, and avoids damaging the film surface and scratching the base 3.
[0049] Those skilled in the art should understand that the above discussion of any embodiment is only exemplary, and is not intended to suggest that the present application is limited to these examples; under the idea of the present application, the above embodiments or technical features among different embodiments can also be combined, and the steps can be implemented in any order, and there are many other changes of different aspects of the present application as described above, which are not provided in details for the sake of brevity. Any omission, modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. An electrostatic chuck copper electrode thin film lamination device, characterized by, The utility model relates to a copper electrode film pressing device, including: The bottom plate (1) is uniformly distributed with four first pins (2) on the top; The elastic support is arranged on the bottom plate (1), and the top of the elastic support is provided with four reserved plates corresponding to all the first pins (2), every two reserved plates are respectively arranged on one side of the bottom plate (1), and every reserved plate is sleeved on one first pin (2) by bending respectively; The base (3) is detachably connected to the middle of the bottom plate (1); The pressing tool is arranged above the base (3), and the pressing tool is provided with positioning holes matched with the first pins (2), and the pressing tool is slidably connected with a compression roller (4); The pressing tool cooperates with the reserved plate to press the copper electrode film, the copper electrode film and the base (3) are overlapped by pressing the pressing tool, and the compression roller (4) rolls on the pressing tool to complete the lamination of the copper electrode film and the base (3).
2. The electrostatic chuck copper electrode thin film bonding device of claim 1, wherein, The elastic support includes: The first mezzanine (5) is fixed on the first mezzanine (5); Two installation grooves (6) are arranged on the top of the bottom plate (1), each installation groove (6) is slidably connected with the first mezzanine (5), and at least two springs (7) are arranged in each installation groove (6), and the two ends of each spring (7) are fixedly connected with the installation groove (6) and the bottom of the first mezzanine (5).
3. The electrostatic chuck copper electrode thin film bonding device of claim 2, wherein, The reserved plate includes: The fixed plate (8) is fixed on one end of the first mezzanine (5); The movable plate (9) is hingedly connected with one end of the fixed plate (8) away from the first mezzanine (5), and when the movable plate (9) is perpendicular to the fixed plate (8), the movable plate (9) abuts against the fixed plate (8); The U-shaped groove (10) is arranged on one end of the movable plate (9) away from the fixed plate (8).
4. The electrostatic chuck copper electrode thin film bonding device of claim 1, wherein, The middle of the bottom plate (1) is fixedly provided with at least two second pins (11), and each second pin (11) is inserted into the base (3).
5. The electrostatic chuck copper electrode thin film bonding device of claim 1, wherein, The pressing tool includes a second mezzanine (12), and the bottom of the second mezzanine (12) is provided with four pressing blocks (13) corresponding to all the first pins (2), the bottom of each pressing block (13) is provided with a through hole penetrating through the second mezzanine (12), and each through hole is sleeved on the first pin (2).
6. The electrostatic chuck copper electrode thin film bonding device of claim 5, wherein, The top of the second mezzanine (12) is slidably connected with a handle (14), the compression roller (4) is rotatably connected in the handle (14), and the outer surface of the compression roller (4) is flush with the bottom of the pressing block (13).