Efficient temperature control device

Abstract

The utility model belongs to the technical field of temperature control, and particularly relates to a high-efficiency temperature control device which comprises an internal semiconductor crystal grain assembly. Two circuit layers are respectively arranged on two sides of the semiconductor crystal grain assembly, two cover plates are arranged on one surfaces, far away from the semiconductor crystal grain assembly, of the two circuit layers, a heat dissipation piece is arranged on at least one cover plate, the heat dissipation piece and the cover plate share the same surface, a heat conduction insulating layer is arranged between the cover plate provided with the heat dissipation piece and the circuit layer, and the cover plate provided with the heat dissipation piece is made of metal. And the heat-conducting insulating layer is a high-heat-conducting insulating adhesive film. An existing ceramic cover plate is directly arranged to be a part of the heat dissipation piece, the problems that the ceramic cover plate is large in heat resistance, large in thickness and not high in heat conduction efficiency can be solved, and meanwhile the problems that the ceramic cover plate is prone to smudginess, brittle in structure, prone to edge breakage and incapable of being directly exposed are solved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to temperature control technical field, especially, relate to a high -efficient temperature control device. BACKGROUND

[0002] With the development of information technology, various electronic equipment is more and popular, many devices need to be cooled or heated to the most suitable temperature in the process of using to maintain high performance, at this moment, the help of temperature control device is needed, the existing temperature control device includes traditional thermoelectric refrigeration piece.

[0003] Traditional thermoelectric refrigeration piece must pass through ceramic cover plate, heat conduction interface material to reach radiator to transmit heat or cold, and the thermal resistance is large, the thickness is thick, and the efficiency is not high, and ceramic is porous medium, easy to dirty, and the structure is fragile, easy to collapse edge, and cannot be directly exposed. INVENTION CONTENTS

[0004] The utility model discloses a high -efficient temperature control device, and it aims at solving the technical problem of traditional thermoelectric refrigeration piece in the prior art, which must pass through ceramic cover plate, heat conduction interface material to reach radiator to transmit heat or cold, and the thermal resistance is large, the thickness is thick, and the efficiency is not high.

[0005] To achieve the above object, the utility model embodiment provides a kind of high -efficient temperature control device, including internal semiconductor grain component;Two circuit layers are respectively arranged on the two sides of the semiconductor grain component, and the side of the two circuit layers away from the semiconductor grain component is equipped with two cover plates, characterized in that, at least one cover plate is equipped with heat dissipation piece, the heat dissipation piece shares the same face with the cover plate, and the cover plate where the heat dissipation piece is arranged is equipped with heat-conducting insulating layer between the circuit layer, and the cover plate where the heat dissipation piece is arranged is metal.

[0006] Optionally, one of the cover plates is equipped with the heat dissipation piece, and the heat dissipation piece is a heat dissipation plate, and the heat dissipation plate shares the same face with the cover plate in contact with the heat dissipation plate.

[0007] Optionally, one of the cover plates is equipped with the heat dissipation piece, and the heat dissipation piece includes a bottom plate and a plurality of heat dissipation fins arranged on the bottom plate, and the bottom plate shares the same face with the cover plate in contact with the bottom plate.

[0008] Optionally, one of the cover plates is equipped with the heat dissipation piece, and the heat dissipation piece includes a liquid cooling plate, the bottom surface of the liquid cooling plate shares the same face with the cover plate in contact with the liquid cooling plate, the liquid cooling plate is internally provided with a cavity, and the cavity is filled with refrigerant.

[0009] Optionally, the liquid cooling plate is provided with an inlet hole and an outlet hole communicating with the cavity; the inlet hole and the outlet hole are connected with an external radiator through a pipe, and the refrigerant can be circulated and radiated between the cavity and the external radiator.

[0010] Optionally, a plurality of heat dissipation fins are arranged in the cavity.

[0011] Optionally, the material of the liquid cooling plate is metal.

[0012] Optionally, the cover plate is provided with the heat dissipation member, and the heat dissipation member comprises a piezoelectric ceramic fan, and a bottom surface of the piezoelectric ceramic fan and the cover plate are on the same plane.

[0013] Optionally, the cover plates are provided with heat dissipation members, and the heat dissipation members comprise a bottom plate and a plurality of heat dissipation fins arranged on the bottom plate, and the bottom plates and the cover plates are on the same plane.

[0014] Optionally, the cover plate without the heat dissipation member is made of ceramic or metal.

[0015] Compared with the prior art, the high-efficiency temperature control device provided by the embodiment of the present application has one or more of the following technical effects:

[0016] The existing ceramic cover plate is directly set as part of the heat dissipation member, which can solve the problems of large thermal resistance, thick thickness and low heat conduction efficiency of the ceramic cover plate, and solve the problems of easy dirt, fragile structure, easy edge collapse and direct exposure of the ceramic cover plate. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0018] Figure 1 It is a structural schematic diagram of the embodiment 1.

[0019] Figure 2 It is a structural schematic diagram of the embodiment 2.

[0020] Figure 3 It is a structural schematic diagram of the embodiment 3.

[0021] Figure 4 It is a structural schematic diagram of the embodiment 4.

[0022] Figure 5 is a structural schematic diagram of the embodiment 5.

[0023] In the drawings, various reference numbers refer to various identified parts:

[0024] 100, semiconductor die assembly; 200, circuit layer; 300, cover plate; 400, heat dissipation member; 410, heat dissipation plate; 420, bottom plate; 430, heat dissipation fin; 440, liquid cooling plate; 441, liquid inlet hole; 442, liquid outlet hole; 450, piezoelectric ceramic fan; 500, heat-conducting insulation layer. DETAILED DESCRIPTION

[0025] The embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numbers represent the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by reference to the drawings are exemplary and are intended to explain the embodiments of the present application, and cannot be understood as a limitation of the present application.

[0026] In the description of the embodiments of the present application, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0027] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0028] In the embodiments of the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0029] In one embodiment of the present application, according to Figures 1-5As shown, a high-efficiency temperature control device includes an internal semiconductor die assembly 100; two circuit layers 200 are respectively arranged on both sides of the semiconductor die assembly 100, and two cover plates 300 are arranged on the sides of the two circuit layers 200 away from the semiconductor die assembly 100, characterized in that at least one of the cover plates 300 is provided with a heat dissipation member 400, the heat dissipation member 400 shares the same surface with the cover plate 300, the cover plate 300 provided with the heat dissipation member 400 is made of metal, and a heat-conducting insulating layer 500 is arranged between the metal cover plate 300 and the circuit layer 200. The heat-conducting insulating layer 500 is a high-heat-conducting insulating adhesive film.

[0030] Specifically, the existing ceramic cover plate 300 is directly arranged as part of the heat dissipation member 400, which can solve the problems of large thermal resistance, thick thickness, and low heat conduction efficiency of the ceramic cover plate 300, and also solve the problems of easy dirt, fragile structure, easy edge collapse, and direct exposure of the ceramic cover plate 300.

[0031] It can be understood that the high-heat-conducting insulating adhesive film is a prior art. Because the heat-conducting insulating layer 500 is arranged between the cover plate 300 and the circuit layer 200, the metal cover plate 300 can be used. Because the metal plate conducts electricity, the high-heat-conducting insulating adhesive film solves the problem of insulation.

[0032] It can be understood that the cover plate 300 without the heat dissipation member 400 is made of ceramic or metal. If the cover plate 300 without the heat dissipation member 400 is made of ceramic, the heat-conducting insulating layer 500 does not need to be arranged between the ceramic cover plate 300 and the circuit layer 200. If the cover plate 300 without the heat dissipation member 400 is made of metal, the heat-conducting insulating layer 500 needs to be arranged between the ceramic cover plate 300 and the circuit layer 200.

[0033] Embodiment 1

[0034] According to Figure 1 As shown, one of the cover plates 300 is provided with a heat dissipation member 400, and the heat dissipation member 400 is a heat dissipation plate 410, which shares the same surface with the cover plate 300 in contact with it. Specifically, its application scenario is on ice compress products. The traditional ice compress product made of thermoelectric refrigeration pieces needs to be attached to a metal sheet through a heat-conducting interface material to achieve the cold end, which reduces the refrigeration effect, increases the thickness of the product, and has the risk of failure of the heat-conducting material. The heat dissipation member 400 and the cover plate 300 in contact with it share a surface, which can be simply understood as one-piece forming, and they are both a metal cover plate 300. At this time, compared with the traditional ceramic cover plate 300, the thickness is reduced, the thermal resistance is reduced, and the heat conduction is faster. At the same time, the problem of easy dirt, fragile structure, easy edge collapse, and direct exposure of the ceramic cover plate 300 is solved. At the same time, the shape of the ceramic cover plate 300 is limited, which is not as good as the metal cover plate 300 which can change its shape at will.

[0035] Embodiment 2

[0036] According to Figure 2 As shown in FIG. 4, the heat dissipation member 400 is arranged on the cover plate 300, and the heat dissipation member 400 includes a bottom plate 420 and a plurality of heat dissipation fins 430 arranged on the bottom plate 420. The bottom plate 420 shares the same surface with the cover plate 300 in contact with the bottom plate 420. Specifically, the heat source is arranged on the surface of the cover plate 300 away from the heat dissipation member 400, and the material of the cover plate 300 away from the heat dissipation member 400 can be ceramic or metal. The heat dissipation fins 430 arranged on the cover plate 300 (the bottom plate 420) can increase the heat dissipation area and improve the heat dissipation effect. It can be understood that the bottom plate 420 shares the same surface with the cover plate 300 in contact with the bottom plate 420, that is, the cover plate 300 in contact with the bottom plate 420 is the same surface.

[0037] Embodiment 3

[0038] According to Figure 3 As shown in FIG. 4, the heat dissipation member 400 is arranged on the cover plate 300, and the heat dissipation member 400 includes a bottom plate 420 and a plurality of heat dissipation fins 430 arranged on the bottom plate 420. The bottom plate 420 shares the same surface with the cover plate 300 in contact with the bottom plate 420. Specifically, the heat source is arranged on the surface of the cover plate 300 away from the heat dissipation member 400, and the material of the cover plate 300 away from the heat dissipation member 400 can be ceramic or metal. The heat dissipation fins 430 arranged on the cover plate 300 (the bottom plate 420) can increase the heat dissipation area and improve the heat dissipation effect. It can be understood that the bottom plate 420 shares the same surface with the cover plate 300 in contact with the bottom plate 420, that is, the cover plate 300 in contact with the bottom plate 420 is the same surface.

[0039] Embodiment 4

[0040] According to Figure 4 As shown in FIG. 4, the heat dissipation member 400 is arranged on the cover plate 300, and the heat dissipation member 400 includes a bottom plate 420 and a plurality of heat dissipation fins 430 arranged on the bottom plate 420. The bottom plate 420 shares the same surface with the cover plate 300 in contact with the bottom plate 420. Specifically, the heat source is arranged on the surface of the cover plate 300 away from the heat dissipation member 400, and the material of the cover plate 300 away from the heat dissipation member 400 can be ceramic or metal. The heat dissipation fins 430 arranged on the cover plate 300 (the bottom plate 420) can increase the heat dissipation area and improve the heat dissipation effect. It can be understood that the bottom plate 420 shares the same surface with the cover plate 300 in contact with the bottom plate 420, that is, the cover plate 300 in contact with the bottom plate 420 is the same surface.

[0041] Embodiment 5

[0042] According to Figure 5 As shown in FIG. 4, the two cover plates 300 are each provided with a heat dissipation member 400, and the two heat dissipation members 400 each include a bottom plate 420 and a plurality of heat dissipation fins 430 provided on the bottom plate 420. The two bottom plates 420 share the same surface with the cover plates 300 in contact with the bottom plates 420. Specifically, the application scenario is a vehicle-mounted refrigerator, the cold end is arranged in the interior of the refrigerator, and the hot end is arranged outside the refrigerator. The heat dissipation fins 430 arranged at the cold end can help to quickly cool down, and the heat dissipation fins 430 arranged at the hot end can help to quickly dissipate heat from the outside. It can be understood that the bottom plate 420 shares the same surface with the cover plate 300 in contact with the bottom plate 420, i.e., the bottom plate 420 shares the same surface with the cover plate 300 in contact with the bottom plate 420.

[0043] The above is a further detailed description of the present application in combination with specific preferred embodiments, and cannot be deemed to limit the specific implementation of the present application to these descriptions. For ordinary skilled persons in the technical field to which the present application belongs, the architecture form can be flexible and variable without departing from the concept of the present application, and a series of products can be derived. Any simple deduction or replacement should be deemed to belong to the patent protection range determined by the submitted claims.

Claims

1. A high-efficiency temperature-controlled device, comprising an internal semiconductor die assembly; two circuit layers are respectively arranged on both sides of the semiconductor die assembly; two cover plates are arranged on the sides of the two circuit layers away from the semiconductor die assembly, characterized in that, At least one of the cover plates is provided with a heat dissipation member, the heat dissipation member shares a same surface with the cover plate, the cover plate provided with the heat dissipation member is made of metal, and a heat-conducting insulating layer is arranged between the metal cover plate and the circuit layer.

2. The high efficiency temperature controlled device of claim 1, wherein, One of the cover plates is provided with the heat dissipation member, the heat dissipation member is a heat dissipation plate, and the heat dissipation plate shares a same surface with the cover plate in contact with the heat dissipation plate.

3. The high efficiency temperature controlled device of claim 1, wherein, One of the cover plates is provided with the heat dissipation member, the heat dissipation member includes a bottom plate and a plurality of heat dissipation fins arranged on the bottom plate, and the bottom plate shares a same surface with the cover plate in contact with the bottom plate.

4. The high efficiency temperature controlled device of claim 1, wherein, One of the cover plates is provided with the heat dissipation member, the heat dissipation member includes a liquid cooling plate, a bottom surface of the liquid cooling plate shares a same surface with the cover plate in contact with the bottom surface, the liquid cooling plate is internally provided with a cavity, and the cavity is filled with refrigerant liquid.

5. The high efficiency temperature controlled device of claim 4, wherein, The liquid cooling plate is provided with an inlet hole and an outlet hole communicating with the cavity, the inlet hole and the outlet hole are connected with an external heat sink through conduits, and the refrigerant liquid can be circulated between the cavity and the external heat sink for heat dissipation and cooling.

6. The high efficiency temperature controlled device of claim 5, wherein, A plurality of heat dissipation fins are arranged in the cavity.

7. The high efficiency temperature controlled device of claim 4, wherein, The liquid cooling plate is made of metal.

8. The high efficiency temperature controlled device of claim 1, wherein, One of the cover plates is provided with the heat dissipation member, the heat dissipation member includes a piezoelectric ceramic fan, and a bottom surface of the piezoelectric ceramic fan shares a same surface with the cover plate in contact with the bottom surface.

9. The high efficiency temperature controlled device of claim 1, wherein, Both of the cover plates are provided with heat dissipation members, both of the heat dissipation members include a bottom plate and a plurality of heat dissipation fins arranged on the bottom plate, and both of the bottom plates share a same surface with the cover plates in contact with the bottom plates.

10. The high efficiency temperature controlled device of any of claims 1-9, wherein, The cover plates not provided with the heat dissipation members are made of ceramic or metal.

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