Integrated circuit lead frame capable of rapidly dissipating heat

Abstract

The utility model discloses a fast heat dissipation integrated circuit lead frame, which belongs to the technical field of integrated circuit lead frames and comprises a lead frame body, a replacement assembly is arranged at the top of the lead frame body, an integrated circuit mounting table is mounted at the top of the replacement assembly, and heat dissipation mechanisms are arranged on the periphery of the integrated circuit mounting table. According to the utility model, the integrated circuit mounting table can be disassembled by arranging the replacement assembly and rotating the screw rod, the integrated circuit mounting table with a proper notch size can be selected for installation and use according to the size of a dust collection circuit, and the installation and positioning effects on dust collection circuits of different models can be better; according to the utility model, the dismounting assembly is arranged, the control block is moved to drive the clamping block to be separated from the clamping groove, and then under the sliding connection between the sliding block and the sliding groove, the heat dissipation mechanism can be pulled outwards to be dismounted, so that accumulated dust on the heat dissipation connecting grating can be cleaned conveniently, and the stable heat dissipation effect is achieved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to integrated circuit lead frame technical field, concretely relates to quick heat dissipation integrated circuit lead frame. BACKGROUND

[0002] Lead frame as the chip carrier of integrated circuit is a key structural member that realizes the electrical connection of the internal circuit lead-out end and external lead wire by means of bonding material (gold wire, aluminum wire, copper wire) and forms an electrical circuit, and integrated circuit generates a large amount of heat that needs to be discharged during high-load operation.

[0003] Chinese patent application No. 202323547913.9 discloses a quick heat dissipation integrated circuit lead frame, which comprises a lead frame, an integrated circuit mounting table and a pin. The pin is arranged inside the lead frame. The quick heat dissipation integrated circuit lead frame further comprises a connecting plate and a heat dissipation mechanism. The integrated circuit mounting table and the lead frame are connected through the connecting plate. The connecting portion of the integrated circuit mounting table and the lead frame is provided with the heat dissipation mechanism. The heat dissipation mechanism comprises an outer heat dissipation plate, a heat dissipation connecting grid and an inner heat dissipation plate. One end of the heat dissipation connecting grid is fixedly connected with the integrated circuit mounting table. One end of the heat dissipation connecting grid is fixedly connected with the outer heat dissipation plate. The outer heat dissipation plate is fixedly connected with the upper portion of the lead frame. The utility model belongs to the field of integrated circuit lead frames and specifically relates to a quick heat dissipation integrated circuit lead frame.

[0004] In the above-mentioned disclosed patent, the heat dissipation mechanism and the lead frame are in an integrated structure. In the use process, dust is easily accumulated inside the heat dissipation connecting grid of the heat dissipation mechanism, which is inconvenient to clean and affects the heat dissipation effect. The integrated circuit is connected with the mounting table through sealing glue. Because the size of the groove in the mounting table is fixed, it cannot be used to install integrated circuits of different sizes. UTILITY MODEL CONTENTS

[0005] To solve the problems in the above-mentioned background art, the utility model provides a quick heat dissipation integrated circuit lead frame, which has high applicability and good heat dissipation effect.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a quick heat dissipation integrated circuit lead frame, which comprises a lead frame body. The top of the lead frame body is provided with a replacement assembly. The top of the replacement assembly is provided with an integrated circuit mounting table. The periphery of the integrated circuit mounting table is provided with a heat dissipation mechanism. The top of the heat dissipation mechanism is provided with a heat dissipation connecting grid. The side surface of the heat dissipation mechanism is provided with a pin. The inside of the heat dissipation mechanism is embedded with a dismounting assembly.

[0007] Preferably, the replacement assembly comprises a limiting groove, an auxiliary assembly, a screw rod and a control groove, wherein the top of the lead frame body is provided with the auxiliary assembly, the inside of the integrated circuit mounting table is provided with the limiting groove, the inside of the limiting groove is embedded with the screw rod, the top end of the screw rod is provided with the control groove, and the top end of the screw rod is flush with the surface of the integrated circuit mounting table.

[0008] Preferably, the auxiliary assembly comprises a positioning block, a base and a ventilation groove, wherein the top of the lead frame body is provided with the base, the inside of the base is provided with the ventilation groove, the top of the base is connected with the positioning block, and the bottom of the integrated circuit mounting table is provided with a positioning groove.

[0009] Preferably, the dismounting assembly comprises a control block, a clamping block, a clamping groove, a sliding groove, a sliding block and a spring, wherein the inside of the heat dissipation mechanism is embedded with the spring, the side surface of the spring is connected with the control block, the side surface of the control block is connected with the clamping block, the inside of the lead frame body is provided with the clamping groove, the lower portion of the clamping groove is provided with the sliding groove, and the two sides of the heat dissipation mechanism are connected with the sliding block.

[0010] Preferably, the clamping block and the clamping groove are in a plug-in structure, and the heat dissipation mechanism and the lead frame body are in a split structure.

[0011] Preferably, the inner groove of the heat dissipation mechanism is in an L-shaped structure, and the surface of the control block is tightly attached to the inner groove wall of the heat dissipation mechanism.

[0012] Compared with the prior art, the utility model has the advantages that:

[0013] 1、The utility model discloses a replacement assembly is set up, and the meshing connection of screw rod is rotated in the control groove between screw rod and base, and the integrated circuit mounting table can be removed through the limiting groove of screw rod, and the integrated circuit mounting table with the size of the slot of the dust collecting circuit can be selected to install and use, so that the positioning effect of the dust collecting circuit of different models is better.

[0014] 2、The utility model discloses a dismounting assembly is set up, and the clamping groove is separated through the movement of control block and the clamping block, and then under the sliding connection between the sliding block and the sliding groove, the heat dissipation mechanism can be removed by pulling out to clean the dust on the heat dissipation connection grid, so that the stable heat dissipation effect is achieved, and the heat dissipation mechanism is installed and fixed through the close plug-in of the clamping groove under the elastic force of the spring. DRAWINGS

[0015] Figure 1 It is the front view of the utility model;

[0016] Figure 2 It is the front view of the replacement assembly of the utility model;

[0017] Figure 3 It is the front view of the auxiliary assembly of the utility model;

[0018] Figure 4 The main view of the dismounting assembly of the utility model.

[0019] In the figure: 1, lead frame body; 2, replacement assembly; 21, limiting groove; 22, auxiliary assembly; 221, positioning block; 222, base; 223, ventilation groove; 23, screw rod; 24, control groove; 3, heat dissipation mechanism; 4, integrated circuit mounting table; 5, dismounting assembly; 51, control block; 52, clamping block; 53, clamping groove; 54, sliding groove; 55, sliding block; 56, spring; 6, heat dissipation connecting grid; 7, pin. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0021] Embodiment 1

[0022] Please refer to Figures 1-4 The utility model provides the following technical scheme: a lead frame for integrated circuit with rapid heat dissipation, comprising a lead frame body 1, a replacement assembly 2 is arranged on the top of the lead frame body 1, an integrated circuit mounting table 4 is installed on the top of the replacement assembly 2, heat dissipation mechanisms 3 are arranged around the integrated circuit mounting table 4, a heat dissipation connecting grid 6 is installed on the top of the heat dissipation mechanism 3, pins 7 are arranged on the side surface of the heat dissipation mechanism 3, and a dismounting assembly 5 is embedded in the heat dissipation mechanism 3.

[0023] Specifically, the replacement assembly 2 comprises a limiting groove 21, an auxiliary assembly 22, a screw rod 23 and a control groove 24, the auxiliary assembly 22 is arranged on the top of the lead frame body 1, the limiting groove 21 is formed in the integrated circuit mounting table 4, the screw rod 23 is embedded in the limiting groove 21, the control groove 24 is formed on the top end of the screw rod 23, and the top end of the screw rod 23 is flush with the surface of the integrated circuit mounting table 4.

[0024] Through the above technical scheme, the screw rod 23 can be dismounted through the limiting groove 21 by rotating the screw rod 23 under the meshing connection between the screw rod 23 and the base 222 through the control groove 24, the integrated circuit mounting table 4 can be installed and used according to the size of the dust collecting circuit, and the installation and positioning effect on different models of dust collecting circuits can be better.

[0025] Specifically, the auxiliary assembly 22 comprises a positioning block 221, a base 222 and a ventilation groove 223, the top of the lead frame body 1 is provided with the base 222, the inside of the base 222 is provided with the ventilation groove 223, the top of the base 222 is connected with the positioning block 221, and the bottom of the integrated circuit mounting table 4 is provided with a positioning groove.

[0026] Through the above technical scheme, the ventilation groove 223 in the inside of the base 222 at the bottom of the integrated circuit mounting table 4 can be used for ventilation, which can better assist the integrated circuit in heat dissipation, and the positioning block 221 inserted into the integrated circuit mounting table 4 can position the integrated circuit mounting table 4.

[0027] In use, the pin 7 is arranged in the inside of the lead frame body 1, the lead frame body 1 is locked into a bolt through a corner lock hole to complete installation and fixation, the integrated circuit is fixed on the top of the integrated circuit mounting table 4 through sealing glue, the heat dissipation connection grid 6 in the heat dissipation mechanism 3 can play a good heat dissipation effect on the side of the integrated circuit mounting table 4, the ventilation groove 223 in the inside of the base 222 at the bottom of the integrated circuit mounting table 4 can be used for ventilation, which can better assist the integrated circuit in heat dissipation, and the positioning block 221 inserted into the integrated circuit mounting table 4 can position the integrated circuit mounting table 4, the screw rod 23 can be disassembled from the integrated circuit mounting table 4 through the limiting groove 21 under the meshing connection between the screw rod 23 and the base 222, the integrated circuit mounting table 4 with a suitable slot size can be selected according to the size of the integrated circuit to be installed and used, and the installation and positioning effect of different models of integrated circuits can be better.

[0028] Embodiment 2

[0029] The difference between the embodiment and the embodiment 1 is that the disassembly assembly 5 comprises a control block 51, a clamping block 52, a clamping groove 53, a sliding groove 54, a sliding block 55 and a spring 56, the inside of the heat dissipation mechanism 3 is embedded with the spring 56, the side of the spring 56 is connected with the control block 51, the side of the control block 51 is connected with the clamping block 52, the inside of the lead frame body 1 is provided with the clamping groove 53, the lower part of the clamping groove 53 is provided with the sliding groove 54, and the two sides of the heat dissipation mechanism 3 are connected with the sliding block 55.

[0030] Specifically, the clamping block 52 and the clamping groove 53 are in a plug-in structure, and the heat dissipation mechanism 3 and the lead frame body 1 are in a split structure.

[0031] Through the above technical scheme, the control block 51 is moved to drive the clamping block 52 to separate from the clamping groove 53, then under the sliding connection between the sliding block 55 and the sliding groove 54, the heat dissipation mechanism 3 can be pulled out to be disassembled, the accumulated dust on the heat dissipation connection grid 6 can be cleaned, and the stable heat dissipation effect can be achieved, and the clamping block 52 and the clamping groove 53 are tightly plugged under the elastic force of the spring 56, so that the heat dissipation mechanism 3 can be installed and fixed.

[0032] Specifically, the inner groove of the heat dissipation mechanism 3 is in an L-shaped structure, and the surface of the control block 51 is tightly attached to the inner groove wall of the heat dissipation mechanism 3.

[0033] By adopting the above technical scheme, the surface of the control block 51 is tightly attached to the inner groove wall of the heat dissipation mechanism 3, so that the insertion between the clamping block 52 and the clamping groove 53 is more stable and firm.

[0034] In use, the moving control block 51 drives the clamping block 52 to separate from the clamping groove 53, and then under the sliding connection between the sliding block 55 and the sliding groove 54, the heat dissipation mechanism 3 can be pulled out for disassembly, which is convenient for cleaning the dust on the heat dissipation connection grid 6, thereby achieving stable heat dissipation effect, and under the elastic force of the spring 56, the clamping block 52 and the clamping groove 53 are tightly inserted, so that the heat dissipation mechanism 3 is installed and fixed.

[0035] The structure and use principle of the lead frame body 1, the heat dissipation mechanism 3, the integrated circuit mounting table 4, the heat dissipation connection grid 6 and the pin 7 in the utility model have been disclosed in a kind of quick heat dissipation integrated circuit lead frame of Chinese patent application No.202323547913.9, and its working principle is that pin 7 is arranged inside lead frame body 1, lead frame body 1 is locked into bolt by the lock hole of corner, installation and fixation are completed, integrated circuit is fixed on the top of integrated circuit mounting table 4 by sealing glue, and heat dissipation connection grid 6 in heat dissipation mechanism 3 can play a good heat dissipation effect on integrated circuit mounting table 4.

[0036] The working principle and use process of the utility model: in use, pin 7 is arranged inside lead frame body 1, lead frame body 1 is locked into bolt by the lock hole of corner, installation and fixation are completed, integrated circuit is fixed on the top of integrated circuit mounting table 4 by sealing glue, and heat dissipation connection grid 6 in heat dissipation mechanism 3 can play a good heat dissipation effect on the side surface of integrated circuit mounting table 4, the internal ventilation groove 223 of the base 222 at the bottom of integrated circuit mounting table 4 can be used for ventilation, which can better assist integrated circuit to dissipate heat, positioning block 221 is inserted into integrated circuit mounting table 4, integrated circuit mounting table 4 can be positioned, through the meshing connection between screw rod 23 and base 222 under the rotation of control groove 24 screw rod 23, integrated circuit mounting table 4 can be disassembled by limiting groove 21, integrated circuit mounting table 4 with appropriate slot size can be selected according to the size of dust collecting circuit for installation and use, which can make the installation and positioning effect of different models of dust collecting circuit better, moving control block 51 drives clamping block 52 to separate from clamping groove 53, then under the sliding connection between sliding block 55 and sliding groove 54, heat dissipation mechanism 3 can be pulled out for disassembly, which is convenient for cleaning the dust on heat dissipation connection grid 6, thereby achieving stable heat dissipation effect, and under the elastic force of spring 56, clamping block 52 and clamping groove 53 are tightly inserted, so that heat dissipation mechanism 3 is installed and fixed.

[0037] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A leadframe for an integrated circuit which dissipates heat rapidly, comprising a leadframe body (1), characterized in that: The top of the lead frame body (1) is provided with a replacement assembly (2), the top of the replacement assembly (2) is provided with an integrated circuit mounting table (4), the periphery of the integrated circuit mounting table (4) is provided with a heat dissipation mechanism (3), the top of the heat dissipation mechanism (3) is provided with a heat dissipation connection grid (6), the side of the heat dissipation mechanism (3) is provided with a pin (7), and the inside of the heat dissipation mechanism (3) is embedded with a disassembly assembly (5).

2. The quick heat dissipation integrated circuit lead frame according to claim 1, wherein: The replacement assembly (2) comprises a limiting groove (21), an auxiliary assembly (22), a screw rod (23) and a control groove (24), wherein the top of the lead frame body (1) is provided with the auxiliary assembly (22), the inside of the integrated circuit mounting table (4) is provided with the limiting groove (21), the inside of the limiting groove (21) is embedded with the screw rod (23), the top end of the screw rod (23) is provided with the control groove (24), and the top end of the screw rod (23) is flush with the surface of the integrated circuit mounting table (4).

3. The quick heat dissipation integrated circuit lead frame according to claim 2, wherein: The auxiliary assembly (22) comprises a positioning block (221), a base (222) and a ventilation groove (223), wherein the top of the lead frame body (1) is provided with the base (222), the inside of the base (222) is provided with the ventilation groove (223), the top of the base (222) is connected with the positioning block (221), and the bottom of the integrated circuit mounting table (4) is provided with a positioning groove.

4. The quick heat dissipation integrated circuit lead frame according to claim 1, wherein: The disassembly assembly (5) comprises a control block (51), a clamping block (52), a clamping groove (53), a sliding groove (54), a sliding block (55) and a spring (56), wherein the inside of the heat dissipation mechanism (3) is embedded with the spring (56), the side of the spring (56) is connected with the control block (51), the side of the control block (51) is connected with the clamping block (52), the inside of the lead frame body (1) is provided with the clamping groove (53), the lower portion of the clamping groove (53) is provided with the sliding groove (54), and the two sides of the heat dissipation mechanism (3) are connected with the sliding block (55).

5. The quick heat dissipation integrated circuit lead frame according to claim 4, wherein: The clamping block (52) and the clamping groove (53) are in a plug-in structure, and the heat dissipation mechanism (3) and the lead frame body (1) are in a split structure.

6. The quick heat dissipation integrated circuit lead frame according to claim 4, wherein: The inner groove of the heat dissipation mechanism (3) is in an L-shaped structure, and the surface of the control block (51) is tightly attached to the inner groove wall of the heat dissipation mechanism (3). The inner groove of the heat dissipation mechanism (3) is in an L-shaped structure, and the surface of the control block (51) is tightly attached to the inner groove wall of the heat dissipation mechanism (3).

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