Laminated single-frequency omnidirectional chip antenna

Abstract

The utility model discloses a laminated single-frequency omnidirectional chip antenna. The stacked single-frequency omnidirectional chip antenna comprises three stacked substrates, a first S-shaped conductive wire is arranged between the upper substrate and the middle substrate, a second S-shaped conductive wire is arranged between the middle substrate and the bottom substrate, Z-direction projections of the first S-shaped conductive wire and the second S-shaped conductive wire are completely overlapped, bonding pads are arranged on two sides of the bottom surface of the bottom substrate, and the bonding pads are connected with the first S-shaped conductive wire and the second S-shaped conductive wire. The bonding pad on any side is connected with the end portion of one side of the second S-shaped conductive wire through the first conductive column, and the end portion of the other side of the second S-shaped conductive wire is connected with the end portion of one side of the first S-shaped conductive wire through the second conductive column. According to the utility model, the problem that the prior art does not accord with the product miniaturization trend is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to navigation communication technical field especially is related to a laminated single -frequency omnidirectional chip antenna. BACKGROUND

[0002] The utility model discloses a ceramic antenna for internet of things terminal device, and the utility model discloses a ceramic antenna for internet of things terminal device, including the substrate, the substrate includes upper surface, lower surface, left side and right side, the upper surface is printed and covers and radiates electrode, and the radiating electrode includes several rectangular metal wires, and several rectangular metal wires are arranged in the shape of a snake, and the radiating electrode formed by the rectangular metal wire arranged in the shape of a snake helps to increase the length of rectangular metal wire, so that the radiating electrode has better high frequency characteristic. SUMMARY

[0003] The utility model discloses a ceramic antenna for internet of things terminal device, and the utility model discloses a ceramic antenna for internet of things terminal device, including the substrate, the substrate includes upper surface, lower surface, left side and right side, the upper surface is printed and covers and radiates electrode, and the radiating electrode includes several rectangular metal wires, and several rectangular metal wires are arranged in the shape of a snake, and the radiating electrode formed by the rectangular metal wire arranged in the shape of a snake helps to increase the length of rectangular metal wire, so that the radiating electrode has better high frequency characteristic.

[0004] To achieve the above object, the utility model laminated single -frequency omnidirectional chip antenna adopts the technical scheme of:

[0005] A laminated single -frequency omnidirectional chip antenna, including three stacked base body, the first S type conducting wire is arranged between the upper layer and the middle layer base body, the second S type conducting wire is arranged between the middle layer and the bottom base body, the Z direction projection of first, second S type conducting wire is completely coincident, the bottom surface both sides of bottom base body are provided with the solder pad, and the solder pad of any one side is connected with the one side end of second S type conducting wire through the first conducting post, and the other side end of second S type conducting wire is connected with the one side end of first S type conducting wire through the second conducting post.

[0006] Preferably, the base body is a rectangular block, the length of the rectangular block is 9.8-10.2mm, the width is 2.8-3.2mm, and the height is 1.8-2.2mm.

[0007] Preferably, the base body is a ceramic material.

[0008] Preferably, the first and second S type conducting wires are made of metal conductors Ag, Cu, Au or other metal compound conductive bodies and are formed by printing or evaporation coating.

[0009] Preferably, the first conducting post penetrates the bottom base body, the second conducting post penetrates the middle layer base body, and the first and second conducting posts are formed by filling with conductive silver glue.

[0010] Compared with the prior art, the utility model has the following advantages:

[0011] The laminated base is provided, the first S-shaped conductive line is arranged directly above the second S-shaped conductive line, the first S-shaped conductive line is extended as the second S-shaped conductive line, the planar space occupied by the antenna is reduced on the basis of ensuring the antenna performance, the space where the antenna is arranged is fully utilized, the antenna is more miniaturized, and the trend of product miniaturization is met. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 It is a structural schematic diagram of a laminated single-frequency omnidirectional chip antenna.

[0013] Figure 2 It is a top view of the second S-shaped conductive line.

[0014] Figure 3 It is a return loss diagram of the utility model;

[0015] Figure 4 It is a Smith parameter diagram of the utility model.

[0016] Wherein, 1 base, 2 first S-shaped conductive line, 3 second S-shaped conductive line, 4 solder pad, 5 first conductive column, 6 second conductive column. DETAILED DESCRIPTION

[0017] The utility model is further illustrated below in combination with the drawings and specific embodiments, and it should be understood that these embodiments are only used for illustrating the utility model and are not used for limiting the scope of the utility model, and after reading the utility model, the modification of various equivalent forms of the utility model by the person skilled in the art all fall within the range defined in the claims attached to the present application.

[0018] As Figures 1-4 Indicated, a laminated single-frequency omnidirectional chip antenna includes three stacked bases 1, the base is ceramic material, the base is rectangular block, the length of rectangular block is 10mm, the width is 3mm, the height is 2mm, the first S-shaped conductive line 2 is arranged between the upper layer and the middle layer base, the first S-shaped conductive line is printed with metal conductor Ag on the bottom surface of the upper layer base, the second S-shaped conductive line 3 is arranged between the middle layer and the bottom layer base, the second S-shaped conductive line is printed with metal conductor Ag on the bottom surface of the middle layer base, the Z direction projection of the first and second S-shaped conductive lines is completely coincident, the solder pad 4 is arranged on the both sides of the bottom surface of the bottom layer base, the solder pad is also printed with metal conductor Ag on the both sides of the bottom surface of the bottom layer base, the left side solder pad is connected with the left side end of the second S-shaped conductive line through the first conductive column 5, the first conductive column penetrates the bottom layer base, the first conductive column is formed by conductive silver glue perfusion, and the right side end of the second S-shaped conductive line is connected with the right side end of the first S-shaped conductive line through the second conductive column 6, the second conductive column penetrates the bottom layer base, and the second conductive column is formed by conductive silver glue perfusion.

[0019] The specific working process and principle of the utility model discloses: left side pad as feed pad, right side pad as ground pad, feed pad access signal makes first, second S type conductive line produce radiation signal. The utility model discloses full three-dimensional space, sets up first S type conductive line in the direct upper side of second S type conductive line, and first S type conductive line as the extension of second S type conductive line, on the basis of guaranteeing antenna performance, reduces the planar space of antenna occupation, makes antenna more miniaturization, conforms to the trend of product miniaturization.

Claims

1. A stacked monopole omnidirectional chip antenna, characterized by: The three stacked substrates are provided with first S-shaped conductive lines between the upper and middle substrates, and second S-shaped conductive lines between the middle and bottom substrates, the Z-directional projections of the first and second S-shaped conductive lines completely coincide, the bottom surface of the bottom substrate is provided with pads on both sides, and any one side pad is connected with one side end of the second S-shaped conductive line through a first conductive column, and the other side end of the second S-shaped conductive line is connected with one side end of the first S-shaped conductive line through a second conductive column.

2. The stacked monopole omnidirectional chip antenna according to claim 1, wherein: The substrate is a rectangular block, the length of the rectangular block is 9.8-10.2 mm, the width is 2.8-3.2 mm, and the height is 1.8-2.2 mm.

3. The stacked monopole omnidirectional chip antenna according to claim 2, wherein: The substrate is made of ceramic material.

4. The stacked monopole omnidirectional chip antenna according to claim 1, wherein: The first and second S-shaped conductive lines are made of one of Ag, Cu and Au, and are formed by printing or evaporation coating.

5. The stacked monopole omnidirectional chip antenna according to claim 1, wherein: The first conductive column penetrates the bottom substrate, and the second conductive column penetrates the middle substrate, and the first and second conductive columns are formed by filling with conductive silver glue.

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