Circuit board structure capable of improving heat dissipation effect

Abstract

The utility model discloses a circuit board structure capable of improving a heat dissipation effect in the field of circuit board design, which comprises a heating device arranged on a circuit board, a heat dissipation solder paste area is arranged near the heating device, and a gap exists between the heat dissipation solder paste area and a bonding pad of the heating device. According to the utility model, the problems that the conventional circuit board is small in utilization space, limited in layout and incapable of adding radiating fins, so that the radiating effect of a device is poor, and the normal use of the circuit board is influenced are solved, and the radiating solder paste area is arranged near the heating device, so that the radiating effect is improved in the limited circuit board space, and the service life of the circuit board is prolonged. The heat dissipation solder paste area is coated with solder paste, the thickness of a circuit where a heating device is located is increased, the current-carrying capacity of the circuit is improved, meanwhile, the contact area between the circuit where the heating device is located and air is increased, accumulation of heat in the circuit board is reduced, and the heat dissipation speed is increased.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit board design technical field, specifically, relate to a circuit board structure of improving heat dissipation effect. BACKGROUND

[0002] In the circuit board design, some devices that produce high heat will be used. For example, in the power input part of the circuit board, some devices will produce high heat in work, which leads to unstable system operation and affects other circuit signals, and needs to be treated for heat dissipation.

[0003] In the prior art, in order to improve the heat dissipation effect, heat dissipation fins are usually added near the devices that produce high heat. The heat dissipation fins increase the heat exchange area, utilize the principle of air convection or heat conduction, effectively transfer heat from the device surface to the surrounding environment, and thus reduce the working temperature. However, with the development of electronic products towards miniaturization and integration, the space utilization of the circuit board becomes increasingly compact. For example, in some high-density and high-integration circuit board designs, the space utilization of the circuit board is small, and the layout is limited, so heat dissipation fins cannot be added, which affects the normal use of the circuit board.

[0004] The above defects need to be solved. UTILITY MODEL CONTENTS

[0005] In order to solve the problem that the space utilization of the existing circuit board is small, the layout is limited, heat dissipation fins cannot be added, the heat dissipation effect of the device is not good, and the normal use of the circuit board is affected, the utility model provides a circuit board structure for improving the heat dissipation effect.

[0006] The technical scheme of the utility model is as follows:

[0007] A circuit board structure for improving the heat dissipation effect, comprising a heat generating device arranged on a circuit board, a heat dissipation tin paste area arranged near the heat generating device, and a gap between the heat dissipation tin paste area and the solder pad of the heat generating device.

[0008] According to the utility model of the above scheme, the heat dissipation tin paste area comprises a first heat dissipation area and a second heat dissipation area, a plurality of vertical tin paste groups are arranged in the first heat dissipation area, a plurality of horizontal tin paste groups are arranged in the second heat dissipation area, and the length direction of the vertical tin paste group is perpendicular to the length direction of the horizontal tin paste group.

[0009] According to the utility model of the above scheme, the vertical tin paste group comprises a plurality of vertical tin paste monomers arranged in a linear form, and the vertical tin paste monomers in adjacent two vertical tin paste groups are arranged in a staggered manner.

[0010] The interval between two adjacent vertical solder paste groups is 0.3-0.7 mm.

[0011] The vertical solder paste monomers in each vertical solder paste group are arranged at equal intervals, and the shape of the vertical solder paste monomers is rectangular or kidney-shaped.

[0012] The length of the vertical solder paste monomers is 3-7 mm.

[0013] The horizontal solder paste group comprises a plurality of horizontal solder paste monomers arranged in a linear form, and the horizontal solder paste monomers in two adjacent horizontal solder paste groups are arranged side by side.

[0014] The horizontal solder paste monomers in each horizontal solder paste group are arranged at equal intervals, and the shape of the horizontal solder paste monomers is rectangular or kidney-shaped.

[0015] The length of the horizontal solder paste monomers is 3-7 mm.

[0016] The circuit board is provided with a solder mask window, and the heat dissipation solder paste area is arranged in the solder mask window.

[0017] The utility model has the advantages that:

[0018] In the circuit board structure with improved heat dissipation effect, the heat dissipation solder paste area is arranged near the heat generating device, so that the heat dissipation effect is improved in the limited space of the circuit board. The solder paste is applied on the heat dissipation solder paste area, which increases the thickness of the circuit where the heat generating device is arranged, increases the current carrying capacity of the circuit, and increases the contact area between the circuit where the heat generating device is arranged and the air, reduces the accumulation of heat in the circuit board, and accelerates the heat dissipation speed. In addition, there is a gap between the heat dissipation solder paste area and the pad of the heat generating device, which prevents the solder paste in the heat dissipation solder paste area from being connected with the heat generating pad, avoids the short circuit of the heat generating device, ensures the normal work of the heat generating device, and guarantees the stability and reliability of the entire electronic system. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structural schematic view of the utility model;

[0020] Figure 2 It is a second structural schematic view of the utility model.

[0021] In the figure, 1, heat generating device; 2, heat dissipation tin paste area; 21, first heat dissipation area; 211, vertical tin paste group; 2111, vertical tin paste unit; 22, second heat dissipation area; 221, horizontal tin paste group; 2211, horizontal tin paste unit. DETAILED DESCRIPTION

[0022] In order to make the technical problems, technical solutions and beneficial effects of the utility model to be solved more clear and obvious, the utility model is further described in detail below in combination with the drawings and examples. It should be understood that the specific examples described herein are only used to explain the utility model and not to limit the utility model.

[0023] As Figure 1 shown, the utility model provides a circuit board structure of improving heat dissipation effect, including setting in the heat generating device 1 of circuit board, the vicinity of heat generating device 1 is provided with heat dissipation tin paste area 2, ensure that in the limited circuit board space realizes the improvement heat dissipation effect, heat dissipation tin paste area 2 is daubed with tin paste, increased the thickness of the circuit of heat generating device 1, increased the current carrying capacity of circuit, also increased the contact area of the circuit of heat generating device 1 and air, reduced the accumulation of heat in the circuit board, accelerated the heat dissipation speed. In addition, the gap exists between heat dissipation tin paste area 2 and the solder pad of heat generating device 1, prevent the tin paste in heat dissipation tin paste area 2 from being connected with heat generating pad, avoid the short circuit of heat generating device 1, ensure the normal work of heat generating device 1, thereby guarantee the stability and reliability of entire electronic system.

[0024] In the embodiment, the solder mask window is provided on the circuit board, the solder mask window is the specific opening area of the surface protective layer (usually green oil or other solder mask ink) of the circuit board, guarantees the smooth operation of soldering, and protects the remaining part from pollution and damage that can be generated in the soldering process. In addition, the heat dissipation tin paste area 2 is arranged in the solder mask window, the heat dissipation tin paste area 2 is designed according to the size of the solder mask window, the heat dissipation tin paste area 2 avoids the solder pad of the heat generating device 1, ensures that the heat can be effectively dissipated, and guarantees the stability and reliability of the soldering point of the heat generating device 1.

[0025] As Figure 1 , Figure 2As shown in the embodiment, the heat dissipation tin paste area 2 includes a first heat dissipation area 21 and a second heat dissipation area 22, a plurality of vertical tin paste groups 211 are arranged in the first heat dissipation area 21, and a plurality of horizontal tin paste groups 221 are arranged in the second heat dissipation area 22. The length direction of the vertical tin paste group 211 is perpendicular to the length direction of the horizontal tin paste group 221. The heat dissipation device is arranged between the first heat dissipation area 21 and the second heat dissipation area 22, so that the heat dissipation capacity of the first heat dissipation area 21 and the second heat dissipation area 22 can be maximized, and the heat can be rapidly and uniformly dissipated to the surrounding environment. In addition, the first heat dissipation area 21 and the second heat dissipation area 22 can be designed as multiple, and multiple first heat dissipation areas 21 and multiple second heat dissipation areas 22 cooperate to surround the heat dissipation device, thereby further improving the heat dissipation effect.

[0026] As shown in the embodiment, Figure 1 , Figure 2 In the embodiment, the vertical tin paste group 211 includes a plurality of vertical tin paste monomers 2111 arranged in a linear form. The vertical tin paste monomers 2111 in adjacent two vertical tin paste groups 211 are arranged in a staggered manner, so that the heat can form a more complex flow path during conduction, thereby increasing the diffusion area of the heat on the circuit board and reducing the formation of local hot spots. When the heat is conducted from the heat generating device 1 to the vertical tin paste monomer 2111, due to the staggered arrangement between the monomers, the heat will spread to the surrounding along different paths, and finally achieve a more extensive heat dissipation effect.

[0027] In the embodiment, the adjacent two vertical tin paste groups 211 are arranged at intervals, and the interval between the adjacent two vertical tin paste groups 211 is 0.3mm-0.7mm. The interval between the adjacent two vertical tin paste groups 211 can be designed as any value in the interval of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, etc. In actual design, the interval between the adjacent two vertical tin paste groups 211 can be designed according to actual needs.

[0028] As shown in the embodiment, Figure 1 , Figure 2 In the embodiment, the vertical tin paste monomers 2111 in each vertical tin paste group 211 are arranged at intervals, that is, the vertical tin paste monomers 2111 in each vertical tin paste group 211 are arranged in a segmented manner. Each vertical monomer is coated with tin paste by using a steel mesh, so as to ensure that the tin paste on each vertical monomer is uniformly coated, avoid uneven and irregular tin paste coating, improve the flatness of the tin paste on each vertical monomer, and ensure the uniformity of heat dissipation. In addition, the shape of the vertical tin paste monomer 2111 is rectangular or waist-round, and the shape of the steel mesh is the same as that of the vertical tin paste monomer 2111, so as to ensure the uniformity of tin coating and also play a role in uniform heat dissipation.

[0029] In the embodiment, the length of the vertical solder paste monomer 2111 is 3mm-7mm, and the length of the vertical solder paste monomer 2111 can be designed as any value in the interval of 3mm, 4mm, 5mm, 6mm, 7mm, etc. In actual design, the length of the vertical solder paste monomer 2111 can be designed according to design needs. Preferably, the length of the vertical solder paste monomer 2111 can be designed as 5mm, and the width of the vertical solder paste monomer 2111 is 1mm.

[0030] As shown in Figure 1 , Figure 2 In the embodiment, the horizontal solder paste group 221 includes a plurality of horizontal solder paste monomers 2211 arranged in a linear shape. The horizontal solder paste monomers 2211 in adjacent two horizontal solder paste groups 221 are arranged side by side, further enhancing the thermal connectivity between the horizontal solder paste groups 221, so that heat can also be uniformly and quickly transferred in the horizontal direction. When the heat generating device 1 on the circuit board generates heat, the heat can be quickly dissipated through the horizontal solder paste monomers 2211, ensuring the maximum heat dissipation effect in the limited circuit board space.

[0031] In the embodiment, the adjacent two horizontal solder paste groups 221 are arranged at intervals, and the interval between the adjacent two horizontal solder paste groups 221 is 0.3mm-0.7mm. The interval between the adjacent two horizontal solder paste groups 221 can be designed as any value in the interval of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, etc. In actual design, the interval between the adjacent two horizontal solder paste groups 221 can be designed according to actual needs.

[0032] As shown in Figure 1 , Figure 2 In the embodiment, the horizontal solder paste monomers 2211 in each horizontal solder paste group 221 are arranged at intervals, that is, the horizontal solder paste monomers 2211 in each horizontal solder paste group 221 are segmented, and each horizontal monomer is coated with solder paste using a steel mesh. The solder paste on each horizontal monomer is evenly coated, which can avoid uneven and irregular coating of the solder paste, improve the flatness of the solder paste on each horizontal monomer, and ensure the uniformity of heat dissipation. In addition, the shape of the horizontal solder paste monomer 2211 is rectangular or waist-round, and the shape of the steel mesh is the same as that of the horizontal solder paste monomer 2211, which ensures the uniformity of the solder amount and also plays a role in uniform heat dissipation.

[0033] In the embodiment, the length of the horizontal solder paste monomer 2211 is 3mm-7mm, and the length of the horizontal solder paste monomer 2211 can be designed as any value in the interval of 3mm, 4mm, 5mm, 6mm, 7mm, etc. In actual design, the length of the horizontal solder paste monomer 2211 can be designed according to design needs. Preferably, the length of the horizontal solder paste monomer 2211 can be designed as 5mm, and the width of the horizontal solder paste monomer 2211 is 1mm.

[0034] It should be understood that, for those skilled in the art, improvements or changes can be made according to the above description, and all these improvements and changes shall belong to the protection scope of the appended claims of the utility model.

[0035] The utility model patent is described above in conjunction with the drawings, obviously, the implementation of the utility model patent is not limited by the above-mentioned mode, as long as various improvements are made by adopting the method concept and technical scheme of the utility model patent, or the concept and technical scheme of the utility model patent are directly applied to other occasions without improvement, all are within the protection scope of the utility model.

Claims

1. A circuit board structure for improving heat dissipation, characterized in that, The application relates to a circuit board comprising a heat-generating device arranged on the circuit board, wherein a heat-dissipating tin paste area is arranged near the heat-generating device, and a gap exists between the heat-dissipating tin paste area and a pad of the heat-generating device.

2. The circuit board structure according to claim 1, wherein The heat-dissipating tin paste area comprises a first heat-dissipating area and a second heat-dissipating area, a plurality of vertical tin paste groups are arranged in the first heat-dissipating area, a plurality of horizontal tin paste groups are arranged in the second heat-dissipating area, and the length direction of the vertical tin paste groups is perpendicular to the length direction of the horizontal tin paste groups.

3. The circuit board structure according to claim 2, wherein The vertical tin paste group comprises a plurality of vertical tin paste monomers arranged in a linear form, and the vertical tin paste monomers in adjacent two vertical tin paste groups are arranged in a staggered mode.

4. The circuit board structure according to claim 3, wherein The interval between the adjacent two vertical tin paste groups is 0.3mm-0.7mm.

5. The circuit board structure according to claim 3, wherein The vertical tin paste monomers in each vertical tin paste group are arranged at uniform intervals, and the shape of the vertical tin paste monomers is rectangular or kidney-shaped.

6. The circuit board structure according to claim 5, wherein The length of the vertical tin paste monomer is 3mm-7mm.

7. The circuit board structure according to claim 2, wherein The horizontal tin paste group comprises a plurality of horizontal tin paste monomers arranged in a linear form, and the horizontal tin paste monomers in adjacent two horizontal tin paste groups are arranged side by side.

8. The circuit board structure according to claim 7, wherein The horizontal tin paste monomers in each horizontal tin paste group are arranged at uniform intervals, and the shape of the horizontal tin paste monomers is rectangular or kidney-shaped.

9. The circuit board structure according to claim 8, wherein The length of the horizontal tin paste monomer is 3mm-7mm.

10. The circuit board structure according to Claim 1, wherein The circuit board is provided with a solder mask window, and the heat-dissipating tin paste area is arranged in the solder mask window.

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