Cable-free inductor
By integrating magnetic dielectric materials on the PCB board, the electromagnetic interference problem in high-power power supply systems is solved, achieving electromagnetic compatibility optimization and cost reduction. It is suitable for equipment such as photovoltaic inverters, wind power converters, and frequency converters.
Patent Information
- Application Number
- CN202422846199.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-21
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-11-21
AI Technical Summary
In high-power power supply systems, high-speed communication signals or high-frequency semiconductor device switching signals cause serious electromagnetic interference problems, which are difficult to solve effectively with existing technologies.
The inductor adopts a cable-free inductor structure, integrating the magnetic medium on the PCB board, including ferrite, amorphous, nanocrystal, magnetic powder core or silicon steel materials. It is connected to the power module and power module through the signal network module, directly suppressing interference signals.
It suppresses electromagnetic compatibility interference at the source, reduces the degree of electromagnetic interference, optimizes electromagnetic compatibility issues, and reduces production costs. It is suitable for equipment such as photovoltaic inverters, wind power converters, and frequency converters.
Smart Images
Figure CN223528349U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to inductance technical field, concretely relates to a cable-free inductance. BACKGROUND
[0002] With the increasingly serious environmental problems caused by non-renewable energy, new energy industry is accelerating development, and the energy density of high-power power supply is gradually enhanced, which also brings very serious electromagnetic compatibility (EMC) problem. In the high-power power supply system, high-speed communication signals or high-frequency semiconductor device switching signals will bring serious electromagnetic interference to the whole high-power power supply system. SUMMARY
[0003] The utility model embodiment provides a cable-free inductance, aims at optimizing electromagnetic compatibility problem, reduces the degree of electromagnetic interference.
[0004] The utility model embodiment provides a cable-free inductance, comprising:
[0005] PCB board;
[0006] Power module, be set up in the PCB board;
[0007] Power module, be set up in the PCB board and be located one side of the power module;
[0008] Magnetic medium, be set up in PCB board and be located one side of the power module, is used to suppress the interference signal generated by the power module;
[0009] Signal network module is used for connecting the power module and PCB board and the intercommunication power module and PCB board.
[0010] Further, the material of the magnetic medium includes any one of ferrite, amorphous, nanocrystalline, magnetic powder core and silicon steel.
[0011] Further, the shape of the magnetic medium includes any one of EE type, H type, UF type and UY type.
[0012] Further, the PCB board is provided with the mounting position that is adapted with the magnetic medium, and the magnetic medium is mounted on the mounting position.
[0013] Further, the PCB board and the magnetic medium are fixedly arranged, and the fixed arrangement mode includes any one of point gluing fixation, insulating buckle fixation or insulating bolt fixation.
[0014] Further, the signal network module comprises a first signal network line and a second signal network line, the first signal network line is connected with the power module and the function module and passes through below the magnetic medium, and the second signal network line is connected with the power module and passes through below the magnetic medium.
[0015] Further, the magnetic medium comprises a first sub magnetic medium, a second sub magnetic medium and a third sub magnetic medium.
[0016] The first sub magnetic medium is arranged around the first signal network line, the second sub magnetic medium is arranged around the second signal network line, and the third sub magnetic medium is arranged around the first signal network line and the second signal network line.
[0017] Further, the first signal network line passes through the three-dimensional center of the first sub magnetic medium, the second signal network line passes through the three-dimensional center of the second sub magnetic medium, and the first signal network line and the second signal network line pass through the three-dimensional center of the third sub magnetic medium together.
[0018] Further, the power module comprises a direct current power supply or an alternating current power supply.
[0019] Further, the power module comprises any one of an insulated gate bipolar transistor, an integrated gate-commutated thyristor and a metal-oxide-semiconductor field-effect transistor.
[0020] The utility model embodiment provides a cable -free inductance, include: PCB board, power module is arranged on the PCB board, power module is arranged on the PCB board and is located one side of power module, magnetic medium is arranged on the PCB board and is located one side of power module and is used to suppress the interference signal generated by power module, signal network module is used for connecting power module and PCB board and intercommunication power module and PCB board, the utility model embodiment can suppress the interference signal generated by power module by integrating and fixing magnetic medium on the PCB board of inductance, so as to suppress electromagnetic compatibility interference phenomenon from the source, reach the effect of optimizing electromagnetic compatibility problem, reduce electromagnetic interference degree. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the utility model embodiment technical scheme, the following will be needed to use the drawing in the embodiment description briefly introduced, obviously, the following description in the drawing is some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, still can obtain other drawings according to these drawings.
[0022] Figure 1A structure schematic diagram of the cable-free inductance provided by the utility model for an embodiment;
[0023] Figure 2 Another structure schematic diagram of the cable-free inductance provided by the utility model for an embodiment.
[0024] Identified in the figure:
[0025] 1, PCB board;
[0026] 2, power module;
[0027] 3, power module;
[0028] 4, magnetic medium; 41, first sub magnetic medium; 42, second sub magnetic medium; 43, third sub magnetic medium;
[0029] 5, signal network module; 51, first signal network line; 52, second signal network line. DETAILED DESCRIPTION
[0030] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.
[0031] It should be understood that, when used in the specification and the appended claims, the terms "comprise" and "include" indicate the presence of described features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or sets thereof.
[0032] It should also be understood that the terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. As used in the specification and the appended claims of the utility model, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include the plural forms.
[0033] It should be further understood that the term "and / or" used in the specification and the appended claims of the utility model means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.
[0034] Please see Figure 1 and Figure 2 The utility model embodiment provides a cable-free inductance, comprising:
[0035] PCB board 1;
[0036] Power module 2, disposed on the PCB board 1;
[0037] Power module 3, disposed on the PCB board 1 and located on one side of the power module 2;
[0038] Magnetic medium 4, disposed on the PCB board 1 and located on one side of the power module 3, for suppressing interference signals generated by the power module 3;
[0039] Signal network module 5 for connecting the power module 2 and the PCB board 1, and connecting the power module 3 and the PCB board 1.
[0040] In this embodiment, the cable-free inductor includes the PCB board 1, the power module 2, the power module 3, the magnetic medium 4, and the signal network module 5, wherein the power module 2 is responsible for providing power energy for the overall system (i.e., the system in which the cable-free inductor is located), the power module 3 is responsible for power conversion of the overall system, the signal network module 5 is responsible for connecting signals of the power module 2 or the power module 3 through electrical signals and transmitting the electrical signals to the lower-layer PCB board 1 or other structures, and the magnetic medium 4 is directly integrated on the PCB board 1 to directly suppress interference signals from the root source.
[0041] In this embodiment, the magnetic medium 4 is integrated and fixed on the PCB board 1 of the inductor, so that the interference signals generated by the power module 3 can be suppressed, thus suppressing the electromagnetic compatibility interference phenomenon from the source, achieving the effect of optimizing electromagnetic compatibility and reducing the degree of electromagnetic interference. Compared with the traditional structure for optimizing EMC (electromagnetic compatibility), the cable-free inductor provided in this embodiment has a more stable structure and can directly act on the EMC interference source. In some application scenarios, the PCB board 1 is a power PCB board 1, i.e., a PCB board 1 for processing high-power electronic components. When the magnetic medium 4 is integrated on the power PCB board 1, the common-mode inductor and differential-mode inductor and other devices on the power PCB board 1 can be cancelled, so as to reduce the overall production cost. In addition, the cable-free inductor provided in this embodiment is particularly suitable for use on photovoltaic inverters, wind power converters, frequency converters, energy storage devices, and the like.
[0042] In an embodiment, the material of the magnetic medium 4 includes any one of ferrite, amorphous, nanocrystalline, magnetic powder core, and silicon steel.
[0043] In this embodiment, the interference signals generated by the power module 3 are suppressed by using ferrite, amorphous, nanocrystalline, magnetic powder core, or silicon steel and the like. In this embodiment, the ferrite, amorphous, nanocrystalline, magnetic powder core, or silicon steel and the like are directly integrated on the power PCB board 1, so as to achieve the effect of suppressing EMC interference from the source.
[0044] The shape of the magnetic medium 4 includes any one of EE type, H type, UF type and UY type. That is, the shape of the magnetic medium 4 in the embodiment includes but is not limited to EE type, H type, UF type, UY type and the like. Among them, E type refers to the magnetic core in the shape of E, usually represented by E, H type refers to the magnetic core in the shape of H, usually represented by H, U type refers to the magnetic core in the shape of U, usually represented by U, F type refers to the magnetic core in the shape of F, usually represented by F, Y type refers to the magnetic core in the shape of Y, usually represented by Y, and correspondingly, EE type refers to two E types combined, UF type refers to U type and F type combined, and UY type refers to U type and Y type combined.
[0045] In an embodiment, the PCB board 1 is provided with a mounting position matched with the magnetic medium 4, and the magnetic medium 4 is mounted on the mounting position.
[0046] Specifically, the PCB board 1 is fixedly provided with the magnetic medium 4, and the fixedly provided manner includes any one of point gluing fixation, insulating buckle fixation or insulating bolt fixation.
[0047] In the embodiment, the mounting position is arranged on the PCB board 1, so that the magnetic medium 4 can be stably mounted on the PCB board 1. In the actual integrated process, the magnetic medium 4 can be mounted on the PCB board 1 by means of point gluing, buckle or bolt, and the like. For example, when fixed by point gluing, the magnetic medium 4 is first placed on the mounting position of the PCB board 1, and then the mounting position is subjected to point gluing operation to realize the mounting and fixation of the magnetic medium 4 and the PCB board 1. Of course, when fixed by buckle or bolt, the corresponding insulating material needs to be used to avoid affecting the cable-free inductance.
[0048] In addition, the number of layers, the size and thickness of the PCB board 1 and the shape of the board in the embodiment are not limited.
[0049] In an embodiment, the signal network module 5 includes a plurality of signal network lines, and the signal network module 5 connects the power module 2, the functional module and the PCB board 1 through the plurality of signal network lines. The material of the plurality of signal network lines can be copper or the like, and the thickness is relatively thin. The shape of the signal network line includes but is not limited to strip shape, circular shape, curved shape and irregular shape.
[0050] In a specific embodiment, the signal network module 5 includes a first signal network line 51 and a second signal network line 52. The power module 2 and the functional module are connected on the first signal network line 51, and the first signal network line 51 passes below the magnetic medium 4. The power module 2 is connected on the second signal network line 52, and the second signal network line 52 passes below the magnetic medium 4.
[0051] In addition, in another embodiment, the magnetic medium 4 comprises a first sub magnetic medium 41, a second sub magnetic medium 42 and a third sub magnetic medium 43.
[0052] The first sub magnetic medium 41 is arranged around the first signal network line 51, the second sub magnetic medium 42 is arranged around the second signal network line 52, and the third sub magnetic medium 43 is arranged around the first signal network line 51 and the second signal network line 52.
[0053] The first signal network line 51 passes through the three-dimensional center of the first sub magnetic medium 41, the second signal network line 52 passes through the three-dimensional center of the second sub magnetic medium 42, and the first signal network line 51 and the second signal network line 52 pass through the three-dimensional center of the third sub magnetic medium 43.
[0054] In combination Figure 1 It can be seen that the first sub magnetic medium 41 and the second sub magnetic medium 42 are integrated on the PCB board 1 where the first signal network line 51 and the second signal network line 52 are located, and the first sub magnetic medium 41 and the second sub magnetic medium 42 correspond to individually surround the first signal network line 51 and the second signal network line 52. Moreover, the first signal network line 51 and the second signal network line 52 correspond to pass through the three-dimensional center positions of the first sub magnetic medium 41 and the second sub magnetic medium 42, respectively.
[0055] In addition, the third sub magnetic medium 43 is integrated on the PCB board 1 where the two signal network lines are located, the third sub magnetic medium 43 simultaneously surrounds the first signal network line 51 and the second signal network line 52, and the first signal network line 51 and the second signal network line 52 pass through the three-dimensional center position of the third sub magnetic medium 43 at the same time.
[0056] In an embodiment, the power supply module 2 comprises a direct current power supply or an alternating current power supply.
[0057] In this embodiment, the power supply of the power supply module 2 includes but is not limited to a direct current power supply and an alternating current power supply, and the size and shape of the power supply module 2 are also not limited.
[0058] In an embodiment, the power module 3 is composed of any one of an insulated gate bipolar transistor, an integrated gate-commutated thyristor and a metal-oxide semiconductor field effect transistor.
[0059] In this embodiment, the power module 3 is composed of but not limited to IGBT (insulated gate bipolar transistor), IGCT (integrated gate-commutated thyristor) and MOSFET (metal-oxide semiconductor field effect transistor) and the like. At the same time, the product type and product performance of the power module 3 are also not limited.
[0060] The various embodiments described in the specification are presented for purposes of illustration and description. Each of the embodiments highlight a different aspect of the application. The embodiments are not mutually exclusive, and can be combined in various manners. The embodiments disclosed herein are not exhaustive of the ways in which the application can be practiced. Numerous modifications and adaptations will be apparent to those skilled in the art. The embodiments disclosed herein are merely exemplary in nature and are not intended to limit the scope of the application.
[0061] It is further noted that the specification and drawings are to be regarded in an illustrative rather than a restrictive sense. It is also to be noted that the terminology used in the specification is for the purpose of describing the particular embodiments only and is not intended to be limiting of the present application.
Claims
1. A cableless inductor, comprising: The application relates to a PCB board, a power module arranged on the PCB board, a power module arranged on the PCB board and located on one side of the power module, a magnetic medium arranged on the PCB board and located on one side of the power module and used for suppressing interference signals generated by the power module, and a signal network module used for connecting the power module and the PCB board and connecting the power module and the PCB board. The magnetic medium is made of any one of ferrite, amorphous, nanocrystalline, magnetic powder core and silicon steel. The magnetic medium has any one of EE type, H type, UF type and UY type. The PCB board is provided with a mounting position matched with the magnetic medium, and the magnetic medium is mounted on the mounting position. The PCB board and the magnetic medium are fixedly arranged, and the fixing arrangement mode includes any one of point gluing fixing, insulating buckle fixing or insulating bolt fixing. The signal network module includes a first signal network line and a second signal network line, the power module and the functional module are connected on the first signal network line, the first signal network line passes below the magnetic medium, the power module is connected on the second signal network line, and the second signal network line passes below the magnetic medium.
2. The cableless inductor of claim 1, wherein, The magnetic medium includes a first sub magnetic medium, a second sub magnetic medium and a third sub magnetic medium.
3. The cableless inductor of claim 1, wherein, The first sub magnetic medium surrounds the first signal network line, the second sub magnetic medium surrounds the second signal network line, and the third sub magnetic medium surrounds the first signal network line and the second signal network line.
4. The cableless inductor of claim 1, wherein, The first signal network line passes through the three-dimensional center of the first sub magnetic medium, the second signal network line passes through the three-dimensional center of the second sub magnetic medium, and the first signal network line and the second signal network line pass through the three-dimensional center of the third sub magnetic medium.
5. The cableless inductor of claim 1, wherein, The power module includes a direct-current power supply or an alternating-current power supply.
6. The cableless inductor of claim 1, wherein, The power module is made of any one of an insulated gate bipolar transistor, an integrated gate-commutated thyristor and a metal-oxide semiconductor field effect transistor.
7. The cableless inductor of claim 6, wherein, 8. The cableless inductor of claim 7, wherein, 9. The cableless inductor of claim 1, wherein, 10. The cableless inductor of claim 1, wherein,