Power supply device and formation and capacity grading equipment

Abstract

The utility model belongs to the field of lithium battery production equipment, and particularly relates to a power supply device and formation and capacity grading equipment. The power supply device provided by the utility model comprises a heat insulation box body, a heat exchange assembly, a power supply module and an air duct bracket, a containing space is formed in the heat insulation box body, the air duct support is arranged in the containing space and forms a containing cavity, and the containing cavity is communicated with the containing space. The heat exchange assembly and the power module are stacked in the first direction at intervals and are both arranged on the air duct support, the power module is arranged in the containing cavity, and at least part of the heat exchange assembly is arranged in the containing space; the heat exchange assembly is used for conducting heat exchange with air in the containing space and enabling air flow obtained after heat exchange to circulate between the containing cavity and the containing space. The power supply device provided by the utility model has a relatively high integration level, so that the occupied space is reduced, and the equipment is more compact and efficient.

Description

TECHNICAL FIELD

[0001] The application relates to the field of lithium battery production equipment, in particular to a power supply device and a formation and capacity equipment. BACKGROUND

[0002] Formation and capacity of a battery are important links in a battery production process, and the two processes are usually integrated in a formation and capacity equipment to realize efficient and accurate treatment of the battery.

[0003] In the process of battery formation and capacity, the battery is pressed by positive and negative probes in the press of the formation and capacity equipment for charging and discharging. The probes usually need to be powered by a DCDC power module. During the operation of the power module, the conversion and transmission of electric energy of the internal electronic elements of the power module will continuously generate heat, causing the temperature of the power module to rise, and further affecting the performance and stability of the power module. To this end, the existing technology usually configures a heat exchange component such as air cooling or water cooling near the power module for heat dissipation to inhibit the temperature rise of the power module during operation. However, the heat exchange component in the existing technology has poor integration with the power module, and the power module configured with the heat exchange component has the defect of too large space occupation, which is not conducive to the compactness and efficiency of the equipment.

[0004] In view of the above, the utility model is provided. UTILITY MODEL CONTENT

[0005] The application provides a power supply device and a formation and capacity equipment, aiming to solve the problem of poor integration of the heat exchange component with the power module in the existing technology, the defect of too large space occupation, and the problem of not conducive to the compactness and efficiency of the equipment.

[0006] One aspect of the application provides a power supply device, comprising a heat insulation box, a heat exchange component, a power module and an air duct support; the heat insulation box forms an accommodation space, the air duct support is arranged in the accommodation space and forms a receiving cavity, the receiving cavity is in communication with the accommodation space; the heat exchange component and the power module are stacked and spaced apart in a first direction and are both arranged on the air duct support, and the power module is arranged in the receiving cavity and at least part of the heat exchange component is arranged in the accommodation space; wherein the heat exchange component is used for heat exchange with the gas in the accommodation space and enables the heat exchanged gas flow to circulate between the receiving cavity and the accommodation space.

[0007] In some embodiments, the heat exchange component comprises a heat exchanger and a fan; the heat exchanger is arranged in the accommodation space and arranged on the air duct support, the fan is arranged in the receiving cavity and arranged on the air duct support, and the fan is located between the heat exchanger and the power module in the first direction.

[0008] In some embodiments, the air duct support comprises a first partition support and a second partition support stacked along a first direction, the first partition support is connected with the second partition support and together encloses a receiving cavity; the heat exchanger and the fan are arranged on an end of the second partition support away from the first partition support in the first direction; and the power module is connected with the first partition support and / or the second partition support at two ends in a second direction to be suspended on the air duct support.

[0009] In some embodiments, the first partition support is provided with a ventilation hole along the second direction to communicate the receiving cavity with the accommodation space.

[0010] In some embodiments, the first partition support comprises two first air duct partitions spaced along the second direction and a second air duct partition connected between the two first air duct partitions; the second partition support comprises two third air duct partitions spaced along the second direction and a fourth air duct partition connected between the two third air duct partitions, the two third air duct partitions are correspondingly connected with the two first air duct partitions in the first direction; the power module is connected with the corresponding first air duct partition and / or third air duct partition at two ends in the second direction, and the heat exchanger and the fan are connected to the fourth air duct partition.

[0011] In some embodiments, the heat insulation box comprises an inner shell layer and an outer shell layer, the inner shell layer forms an accommodation space, and the outer shell layer is arranged outside the inner shell layer and forms a heat insulation cavity with the inner shell layer; the power supply device further comprises a heat insulation layer arranged in the heat insulation cavity and connected with the inner shell layer and / or the outer shell layer; and / or, the heat insulation layer is arranged in the accommodation space and connected with the inner shell layer; and / or, the heat insulation layer is arranged on the outer surface of the outer shell layer and connected with the outer shell layer.

[0012] In some embodiments, the power supply device further comprises busbar connectors arranged in pairs and spaced along the second direction, one end of the busbar connectors is arranged on the air duct support and electrically connected with the power module in the second direction, and the other end of the busbar connectors extends out of the heat insulation box for electrically connecting the positive / negative electrode probes; the power module comprises a plurality of DCDC power supplies spaced along a third direction, and each DCDC power supply is connected between a pair of busbar connectors at two ends in the second direction.

[0013] In some embodiments, the heat exchanger is a water-cooled heat exchanger.

[0014] In some embodiments, the heat insulation box is further provided with a pipe through hole for the pipe of an external cooling medium circulating device to pass through the pipe through hole to connect the heat exchanger for circulating cooling medium, and / or for an external power supply wire harness to pass through the pipe through hole to connect the power module for power supply.

[0015] Another aspect of the present application provides a formation and dispensing equipment comprising the power supply device as described above.

[0016] The power supply device and the formation and distribution equipment provided by the application have at least the following beneficial effects compared with the prior art.

[0017] By optimizing the structure of the power supply device, the heat exchange assembly, the power module and the air duct support are arranged in the accommodation space formed by the heat insulation box. The accommodation cavity formed by the air duct support is in communication with the accommodation space. The heat exchange assembly and the power module are stacked and spaced apart in the first direction and are arranged on the air duct support. The power module is arranged in the accommodation cavity, and at least part of the heat exchange assembly is arranged in the accommodation space. Therefore, the heat exchange assembly and the power module are highly integrated, which facilitates the reduction of space occupation and promotes the compactness and efficiency of the equipment.

[0018] In addition, since the heat insulation box can isolate the high-temperature environment of the formation and distribution outside, the power module is located in the accommodation cavity formed by the air duct support. The air duct support can jointly insulate the power module with the heat insulation box, thereby ensuring the efficient insulation of the power module from the high-temperature environment of the formation and distribution outside the heat insulation box. At the same time, the heat exchange assembly is used to exchange heat with the gas in the accommodation space, and the airflow after heat exchange is circulated between the accommodation cavity and the accommodation space, so as to continuously remove the heat generated by the power module, thereby significantly improving the heat dissipation efficiency of the power module.

[0019] Therefore, the power supply device provided by the application has high integration, which facilitates the reduction of space occupation and promotes the compactness and efficiency of the equipment. Through the cooperative insulation design of the heat insulation box and the air duct support, the heat exchange assembly is used to circulate the heat dissipation of the power module, which can greatly improve the heat dissipation efficiency of the power module.

[0020] Other features and advantages of the power supply device and the formation and distribution equipment provided by the application are described in detail in the subsequent specific embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the specific embodiments of the application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.

[0022] Figure 1 The overall structure diagram of the power supply device provided by the embodiment of the application is shown in the figure.

[0023] Figure 2 The cross-sectional view of the power supply device provided by the embodiment of the application is shown in the figure.

[0024] Figure 3 The gas flow direction diagram in the power supply device provided by the embodiment of the application is shown in the figure.

[0025] Figure 4 A partial structure schematic diagram of a power supply device provided for an embodiment of the present application is shown in FIG. 1.

[0026] Figure 5 A partial structure schematic diagram of a power supply device provided for an embodiment of the present application is shown in FIG. 1.

[0027] Figure 6 An enlarged schematic diagram of a partial structure R provided for an embodiment of the present application is shown in FIG. 3.

[0028] Figure 7 A module schematic diagram of a formation and capacity equipment provided for an embodiment of the present application is shown in FIG. 6.

[0029] The reference signs are as follows:

[0030] 100, a power supply device;

[0031] 10, an insulation box; 10A, a containing space; 11, an inner shell layer; 12, an outer shell layer; 10B, an insulation cavity; 13, a pipeline through hole;

[0032] 20, a heat exchange assembly; 21, a heat exchanger; 22, a fan;

[0033] 30, a power module; 31, a DCDC power supply;

[0034] 40, an air duct support; 40A, a containing cavity; 41, a first partition support; 41A, a ventilation hole; 411, a first air duct partition; 412, a second air duct partition; 42, a second partition support; 421, a third air duct partition; 422, a fourth air duct partition;

[0035] 50, a busbar connecting piece; 51, a first busbar clamping block; 52, a second busbar clamping block; 53, a busbar copper bar;

[0036] 60, a support frame;

[0037] 1000, a formation and capacity equipment;

[0038] L1, a first direction; L2, a second direction; L3, a third direction. DETAILED DESCRIPTION

[0039] In order to make the above and other features and advantages of the present application clearer, the present application will be further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explanation and are only illustrative, not restrictive.

[0040] In the following description, numerous specific details are set forth to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without the specific details. In other instances, well-known steps or procedures are not described in detail in order to avoid obscuring the present application.

[0041] In the description of the present application, it needs to be understood that, as the description of orientation or positional relationship appears, such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., if no special indication, it is understood that the orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0042] In addition, as the features limited by "first", "second" appear, it is only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. The features limited by "first", "second" can explicitly or implicitly include at least one of the limited features. As the description of "plurality" appears, it generally means at least two, such as two, three, etc., unless otherwise specifically limited.

[0043] In the present application, unless otherwise specifically indicated and limited, as the terms "mounting", "connecting", "connecting", "fixing" and the like appear, they should be understood in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0044] In the description of the present specification, if the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" and the like appear, it means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0045] In the foregoing, the total inventive concept of the embodiments of the present application is to provide a power supply device 100, by optimizing the structure of the power supply device 100, the heat exchange assembly 20, the power module 30 and the air duct support 40 are integrated in the internal accommodation space 10A of the heat insulation box 10 with heat insulation function, and the power module 30 is arranged in the accommodation cavity 40A formed by the air duct support 40, the accommodation cavity 40A and the accommodation space 10A are communicated to form a circulating air duct, the air duct support 40 can not only provide support for the fixation of the heat exchange assembly 20 and the power module 30, but also cooperate with the heat insulation box 10 to form a double heat insulation structure, so as to realize the effective isolation of the power module 30 and the high temperature environment of the external composition; and the heat exchange assembly 20 can exchange heat with the gas, so that the gas flow after heat exchange can circulate between the accommodation cavity 40A and the accommodation space 10A, thereby realizing the continuous heat dissipation of the power module 30. By this design, the heat exchange assembly 20 and the power module 30 can be highly integrated in the heat insulation box 10, so as to facilitate the reduction of space occupation, promote the compactness and efficiency of the equipment, and effectively improve the heat dissipation efficiency of the power module.

[0046] Based on the above concept, referring to Figures 1-6 The power supply device 100 provided by the embodiments of the present application includes a heat insulation box 10, a heat exchange assembly 20, a power module 30 and an air duct support 40. The heat insulation box 10 forms an accommodation space 10A, the air duct support 40 is arranged in the accommodation space 10A and forms an accommodation cavity 40A, and the accommodation cavity 40A is communicated with the accommodation space 10A. The heat exchange assembly 20 and the power module 30 are stacked and spaced apart in a first direction L1 and are both arranged on the air duct support 40, and the power module 30 is arranged in the accommodation cavity 40A, and at least part of the heat exchange assembly 20 is arranged in the accommodation space 10A. The heat exchange assembly 20 is used for exchanging heat with the gas in the accommodation space 10A and making the gas flow after heat exchange circulate between the accommodation cavity 40A and the accommodation space 10A.

[0047] It can be understood that the heat insulation box 10 in the embodiment of the present application can be a square box. The heat insulation box 10 is the main structure of the power supply device 100, and an accommodation space 10A is formed in the heat insulation box 10. The accommodation space 10A is used to accommodate key components such as the heat exchange assembly 20, the power supply module 30, and the air duct support 40. The heat insulation box 10 can be made of a material with heat insulation function to effectively insulate the high-temperature environment outside and protect the power supply module 30 from high temperature.

[0048] Further, the air duct support 40 is arranged in the accommodation space 10A. The accommodation cavity 40A formed by the air duct support 40 is in communication with the accommodation space 10A. One end of the air duct support 40 along the first direction L1 can be directly fixed to the inner wall of the heat insulation box 10, and the rest of the air duct support 40 is spaced apart from the inner wall of the heat insulation box 10 to facilitate the circulation of the gas between the accommodation cavity 40A and the accommodation space 10A through the spacing part. The air duct support 40 not only provides support for the fixation of the heat exchange assembly 20 and the power supply module 30, but also cooperates with the heat insulation box 10 to form a double heat insulation structure through the structural design, thereby further enhancing the insulation effect of the power supply module 30 from the high-temperature environment outside.

[0049] The heat exchange assembly 20 and the power supply module 30 are stacked and spaced apart in the first direction L1 and are both arranged on the air duct support 40. The heat exchange assembly 20 is a key heat dissipation component in the power supply device 100, at least part of which is arranged in the accommodation space 10A and connected to the air duct support 40 to exchange heat with the gas in the accommodation space 10A. After heat exchange, the gas can circulate between the accommodation cavity 40A and the accommodation space 10A. In this way, the heat exchange assembly 20 can continuously remove the heat generated by the power supply module 30, thereby achieving effective heat dissipation. The power supply module 30 is used to provide power for the formation and dispensing equipment. Since the power supply module 30 will generate heat during operation, the temperature rise of the power supply module 30 can be effectively inhibited through the heat dissipation of the heat exchange assembly 20 and the double heat insulation of the air duct support 40 and the heat insulation box 10.

[0050] Therefore, the heat exchange assembly 20, the power supply module 30, and the air duct support 40 are all integrated in the accommodation space 10A of the heat insulation box 10, which realizes a highly integrated design and facilitates the reduction of space occupation. Moreover, the power supply device 100 is more compact and efficient. The air duct support 40 cooperates with the heat insulation box 10 to form a double heat insulation structure, which effectively insulates the power supply module 30 from the high-temperature environment outside. The heat exchange assembly 20 exchanges heat with the gas in the accommodation space 10A and makes the airflow after heat exchange circulate between the accommodation cavity 40A and the accommodation space 10A, thereby realizing continuous heat dissipation of the power supply module 30 to ensure the stability and reliability of the power supply module 30 during operation.

[0051] It should be noted that the heat exchange assembly 20 in the embodiment of the present application can be spaced apart from the inner wall of the heat insulation box 10 in the first direction L1 and the second direction L2 to provide a passage for gas circulation and flow, thereby facilitating continuous heat dissipation of the power module 30.

[0052] Reference Figure 2 As shown in FIG. 1, in some embodiments, the heat exchange assembly 20 includes a heat exchanger 21 and a fan 22; the heat exchanger 21 is arranged in the accommodation space 10A and disposed on the air duct support 40, the fan 22 is arranged in the receiving cavity 40A and disposed on the air duct support 40, and the fan 22 is located between the heat exchanger 21 and the power module 30 in the first direction L1.

[0053] In the embodiment, the heat exchanger 21, the fan 22, and the power module are sequentially and spaced apart in the first direction L1, the air duct support 40 is partially located between the heat exchanger 21 and the fan 22 in the first direction L1, and the heat exchanger 21 and the fan 22 are both fixed on the air duct support 40. The heat exchanger 21 as a heat exchange device can exchange heat with the gas in the accommodation space 10A efficiently. When the power module 30 generates heat, the heat is transferred to the heat exchanger 21 through the air duct support 40 and the gas in the accommodation space 10A, realizing heat transfer. After the heat exchange of the gas by the heat exchanger 21, the fan 22 can effectively drive the gas to circulate between the receiving cavity 40A and the accommodation space 10A, thereby continuously removing the heat generated by the power module 30. In this way, the heat exchange assembly 20 has a compact structure, and through the synergistic effect of the heat exchanger 21 and the fan 22, the heat exchange assembly 20 can achieve efficient heat dissipation effect, thereby ensuring that the power module 30 maintains a stable temperature during a long time of operation.

[0054] It should also be noted that the gas flow direction in the embodiment can refer to Figure 3 As shown in FIG. 1, the gas in the accommodation space 10A is heat exchanged by the heat exchanger 21, the heat-exchanged gas enters the receiving cavity 40A under the action of the fan 22 and flows through the power module 30, and then enters the accommodation space 10A from the receiving cavity 40A and is heat-exchanged again by the heat exchanger 21 to realize gas circulation. Of course, in some embodiments, the fan 22 can also supply the gas near the power module 30 in the receiving cavity 40A to the heat exchanger 21 for heat exchange, and the heat-exchanged gas passes through the accommodation space 10A and then returns to the receiving cavity 40A and flows through the power module 30, and then is supplied to the heat exchanger 21 for heat exchange under the action of the fan 22, thereby achieving continuous heat dissipation of the power module 30.

[0055] Continuing to refer to Figure 2In some embodiments, the air duct support 40 comprises a first partition support 41 and a second partition support 42 stacked along the first direction L1, the first partition support 41 is connected with the second partition support 42 and together encloses the receiving cavity 40A; the heat exchanger 21 and the fan 22 are arranged on the end of the second partition support 42 away from the first partition support 41 along the first direction L1; the power module 30 is connected to the first partition support 41 and / or the second partition support 42 at both ends along the second direction L2 to be suspended on the air duct support 40.

[0056] The air duct support 40 in the embodiments of the present application is in a box-like shape, which is mainly composed of the first partition support 41 and the second partition support 42, the first partition support 41 and the second partition support 42 are stacked along the first direction L1, the first partition support 41 and the second partition support 42 are connected along the first direction L1 to together enclose the receiving cavity 40A, the end of the first partition support 41 away from the second partition support 42 is connected to the inner wall of the heat insulation box 10, the rest of the first partition support and the second partition support 42 are both spaced apart from the inner wall of the heat insulation box 10 to allow gas to flow; the end of the second partition support 42 away from the first partition support 41 is connected with the heat exchanger 21 and the fan 22 along the first direction L1 respectively, wherein the fan 22 is located in the receiving cavity 40A, the heat exchanger 21 is located in the accommodation space 10A and is spaced apart from the inner wall of the heat insulation box 10 to allow gas to flow; the power module 30 is connected to the first partition support 41 at both ends along the second direction L2 to be suspended on the air duct support 40, so that the gas can flow in the receiving cavity 40A.

[0057] In some embodiments, the power module 30 can also be connected to the first partition support 41 and the second partition support 42 at both ends along the second direction L2 at the same time, or only to the second partition support 42, which can be suspended on the air duct support 40, so that the gas can flow in the receiving cavity 40A.

[0058] As shown in Figure 4 In some embodiments, the first partition support 41 is provided with a ventilation hole 41A along the second direction L2 to communicate the receiving cavity 40A and the accommodation space 10A, so that the gas can flow between the receiving cavity 40A and the accommodation space 10A through the ventilation hole 41A.

[0059] In this embodiment, the first partition bracket 41 has ventilation holes 41A facing the second direction L2 at both ends. Gas enters the accommodating space 10A through the ventilation holes 41A from the receiving cavity 40A, and flows along the first partition bracket 41 toward the heat exchanger 21 on the second partition bracket 42. After heat exchange in the heat exchanger 21, the gas passes through the second partition bracket 42 along the first direction L1 under the action of the fan 22 and enters the receiving cavity 40A. After flowing through the power module 30, the gas enters the accommodating space 10A again through the ventilation holes 41A, thus realizing gas circulation. Of course, depending on the air supply direction of the fan 22, the gas can also circulate in the reverse direction along this path, which can achieve continuous heat dissipation of the power module 30.

[0060] In some embodiments, multiple ventilation holes 41A may be opened at intervals along the third direction L3 to meet the heat dissipation requirements when multiple DC-DC power supplies 31 are installed.

[0061] In some embodiments, the first partition bracket 41 includes two first air duct partitions 411 spaced apart along the second direction L2 and a second air duct partition 412 connected between the two first air duct partitions 411; the second partition bracket 42 includes two third air duct partitions 421 spaced apart along the second direction L2 and a fourth air duct partition 422 connected between the two third air duct partitions 421, the two third air duct partitions 421 being correspondingly connected to the two first air duct partitions 411 along the first direction L1; the power module 30 is connected to the corresponding first air duct partitions 411 and / or third air duct partitions 421 at both ends along the second direction L2, and the heat exchanger 21 and the fan 22 are connected to the fourth air duct partition 422.

[0062] It is understood that, in this embodiment, the heat exchanger 21 and the fan 22 can be arranged along the first direction L1 and connected to both sides of the fourth air duct baffle 422. The fourth air duct baffle 422 can be designed with through holes for gas flow to ensure that the gas can enter the receiving cavity 40A after heat exchange. The two ends of the power module 30 along the second direction L2 are respectively connected to the first air duct baffle 411 (e.g., Figure 2 As shown), ventilation holes 41A are opened on the two first air duct partitions 411 and are located at the end of the power module 30 away from the fan 22; one side of the second air duct partition 412 along the first direction L1 is connected to the inner wall of the heat insulation box 10, and the other side can be used for the control circuit board. After the two first air duct partitions 411 and the two third air duct partitions 421 are connected accordingly, they all maintain a certain distance from the inner wall of the heat insulation box 10 to allow gas to circulate.

[0063] refer to Figure 2As shown, the heat insulation box 10 in the embodiment of the present application can be made of heat insulation material. In some embodiments, to improve the heat insulation effect, the heat insulation box 10 includes an inner shell layer 11 and an outer shell layer 12. The inner shell layer 11 forms a containing space 10A. The outer shell layer 12 is arranged outside the inner shell layer 11 and forms a heat insulation cavity 10B with the inner shell layer 11. The design of the heat insulation cavity 10B can further improve the heat insulation performance of the heat insulation box 10, so as to inhibit the temperature in the containing space 10A from rising due to the influence of the high-temperature environment outside.

[0064] To further improve the heat insulation effect, the power supply device 100 in some embodiments further includes a heat insulation layer (not shown). The heat insulation layer is made of heat insulation material. The heat insulation layer can be arranged in the heat insulation cavity 10B and connected to the inner shell layer 11 and / or the outer shell layer 12. In addition, the heat insulation layer can be arranged in the containing space 10A and connected to the side of the inner shell layer 11 facing the containing space 10A. In addition, the heat insulation layer can be arranged on the outer surface of the outer shell layer 12 and connected to the outer shell layer 12. Through the above design, the heat insulation performance of the heat insulation box 10 is significantly improved, thereby ensuring the efficient insulation of the high-temperature environment outside and the power supply module 30.

[0065] Considering the power supply function of the power supply device 100 to the chemical component containing device 1000, as shown in Figure 2 and Figures 4-6 In some embodiments, the power supply device 100 further includes busbar connecting pieces 50 arranged in pairs and spaced apart along the second direction L2. One end of the busbar connecting piece 50 is arranged on the air duct support 40 and electrically connected to the power supply module 30 in the second direction L2, and the other end extends out of the heat insulation box 10 for electrical connection with the positive / negative probe. The power supply module 30 includes a plurality of DCDC power supplies 31 arranged in the third direction L3. Each DCDC power supply 31 is connected between a pair of busbar connecting pieces 50 in the second direction L2, thereby meeting the power supply demand of multiple groups of positive / negative probes.

[0066] It should be noted that the heat insulation box 10 in the embodiment of the present application is provided with mounting holes at both ends in the second direction L2. The mounting holes are adapted to the size of the busbar connecting piece 50. After the other end of the busbar connecting piece 50 extends out of the heat insulation box 10, the outer periphery of the busbar connecting piece 50 is tightly connected to the heat insulation box 10, so as to form a sealed containing space 10A inside the heat insulation box 10, thereby improving the heat insulation effect of the heat insulation box 10.

[0067] Referring to Figure 6As shown, in some embodiments, the busbar connecting piece 50 comprises a first busbar clamping block 51, a second busbar clamping block 52, and a busbar copper bar 53; the first busbar clamping block 51 is arranged on the air duct support 40 at one end along the second direction L2, the second busbar clamping block 52 and the end of the first busbar clamping block 51 away from the air duct support 40 enclose a clamping groove, and one end of the busbar copper bar 53 along the second direction L2 is connected with the power module 30, and the other end extends out of the heat insulation box 10 through the clamping groove.

[0068] The first busbar clamping block 51 and the second busbar clamping block 52 in the embodiments of the present application are both made of sealing insulating material, the first busbar clamping block 51 is arranged on the first air duct partition plate 411 at one end along the second direction L2, the second busbar clamping block 52 and the end of the first busbar clamping block 51 away from the air duct support 40 enclose a clamping groove, and one end of the busbar copper bar 53 along the second direction L2 is connected with the power module 30, and the other end extends out of the heat insulation box 10 through the clamping groove and the mounting hole to connect the positive or negative probe, thereby ensuring the power supply function of the power supply device 100.

[0069] In order to improve the stability of power supply, with reference to Figure 4 As shown, in some embodiments, the power supply device 100 further comprises two support frames 60 arranged at intervals along the second direction L2, and the air duct support 40 is arranged between the two support frames 60 along the second direction L2; one end of the support frame 60 along the first direction L1 is connected with the heat insulation box 10, and the other end is connected with the end of the first busbar clamping block 51 away from the air duct support 40, so as to provide support for the first busbar clamping block 51, thereby effectively improving the overall structural stability of the busbar connecting piece 50, and further making the power supply of the power supply device 100 more stable.

[0070] In some embodiments, the heat exchanger 21 is a water-cooled heat exchanger, compared with the traditional air-cooled heat exchanger, the water-cooled heat exchanger uses water as the cooling medium, has a higher energy efficiency ratio, can save energy, and reduces operating costs.

[0071] In order to meet the supply and circulation of the cooling medium of the heat exchanger 21, with reference to Figure 4 As shown, in some embodiments, the heat insulation box 10 is further provided with a pipeline through hole 13, and two pipeline through holes 13 are arranged at intervals along the first direction L1, so that the pipeline of the external cooling medium circulating device passes through the pipeline through hole 13 to connect the cooling medium inlet and the cooling medium outlet of the heat exchanger 21, thereby realizing the circulation of the cooling medium.

[0072] In some embodiments, the pipeline through hole 13 is also used for the external power supply wire harness to pass through the pipeline through hole 13 to connect the power module 30 for power supply.

[0073] With reference to Figure 7As shown, another embodiment of the present application provides a formation and dispensing device 1000, comprising the power supply device 100 as described above. The formation and dispensing device 1000 has a pressing machine, and the power supply device 100 can be designed to be mounted on the top of the pressing machine and electrically connected with the positive and negative probes on the pressing machine. The mounting of the power supply device 100 on the top of the pressing machine can save the wire harness used when the power supply device 100 is electrically connected with the positive and negative probes, and is more conducive to reducing the overall volume of the formation and dispensing device 1000. Of course, the power supply device 100 can also be mounted on the side of the pressing machine. In this way, the design is convenient for wire harness connection and is more conducive to maintenance.

[0074] In summary, the power supply device 100 provided by the embodiments of the present application has high integration, which is conducive to reducing the space occupation, promoting the compactness and efficiency of the equipment; and through the cooperative heat insulation design of the heat insulation box 10 and the air duct support 40, the heat exchange assembly 20 is used to circulate and cool the power module 30, which can greatly improve the heat dissipation efficiency of the power module 30, so as to promote the stable performance of the power module 30.

[0075] Although the embodiments of the present application have been shown and described above, it should be understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, replacements and variations to the above embodiments within the scope of the present application.

Claims

1. A power supply device (100), characterized by, The heat insulation box (10), the heat exchange assembly (20), the power module (30) and the air duct support (40) are provided. The heat insulation box (10) forms an accommodation space (10A), the air duct support (40) is arranged in the accommodation space (10A) and forms a receiving cavity (40A), and the receiving cavity (40A) is in communication with the accommodation space (10A). The heat exchange assembly (20) and the power module (30) are stacked and spaced apart in a first direction (L1) and are both arranged on the air duct support (40), and the power module (30) is arranged in the receiving cavity (40A), and at least part of the heat exchange assembly (20) is arranged in the accommodation space (10A). The heat exchange assembly (20) is used for heat exchange with gas in the accommodation space (10A) and enables the heat-exchanged gas flow to circulate between the receiving cavity (40A) and the accommodation space (10A).

2. The power supply device (100) according to claim 1, wherein The heat exchange assembly (20) comprises a heat exchanger (21) and a fan (22). The heat exchanger (21) is arranged in the accommodation space (10A) and is arranged on the air duct support (40), the fan (22) is arranged in the receiving cavity (40A) and is arranged on the air duct support (40), and the fan (22) is located between the heat exchanger (21) and the power module (30) in the first direction (L1).

3. The power supply device (100) according to claim 2, wherein The air duct support (40) comprises a first partition support (41) and a second partition support (42) which are stacked in the first direction (L1), the first partition support (41) is connected with the second partition support (42) and together encloses the receiving cavity (40A); The heat exchanger (21) and the fan (22) are arranged on an end of the second partition support (42) away from the first partition support (41) in the first direction (L1); The power module (30) is connected with the first partition support (41) and / or the second partition support (42) at two ends thereof in a second direction (L2) to be suspended on the air duct support (40).

4. The power supply device (100) according to claim 3, characterized in that The first partition support (41) is provided with a ventilation hole (41A) in the second direction (L2) to communicate the receiving cavity (40A) with the accommodation space (10A).

5. The power supply device (100) according to claim 3, wherein The first partition support (41) comprises two first air duct partitions (411) which are spaced apart in the second direction (L2) and a second air duct partition (412) which is connected between the two first air duct partitions (411). The second partition support (42) comprises two third air duct partitions (421) arranged at intervals along the second direction (L2) and a fourth air duct partition (422) connected between the two third air duct partitions (421), and the two third air duct partitions (421) are correspondingly connected with the two first air duct partitions (411) along the first direction (L1); The power module (30) is connected with the corresponding first air duct partition (411) and / or third air duct partition (421) at two ends along the second direction (L2), and the heat exchanger (21) and the fan (22) are connected on the fourth air duct partition (422).

6. The power supply device (100) according to any one of claims 1-5, characterized in that, The heat insulation box (10) comprises an inner shell layer (11) and an outer shell layer (12), the inner shell layer (11) forms the accommodation space (10A), and the outer shell layer (12) is arranged outside the inner shell layer (11) and forms a heat insulation cavity (10B) with the inner shell layer (11); The power supply device (100) further comprises a heat insulation layer arranged in the heat insulation cavity (10B) and connected with the inner shell layer (11) and / or the outer shell layer (12); and / or the heat insulation layer is arranged in the accommodation space (10A) and connected with the inner shell layer (11); and / or the heat insulation layer is arranged on the outer surface of the outer shell layer (12) and connected with the outer shell layer (12).

7. The power supply device (100) according to claim 1, characterized in that Busbar connectors (50) are further arranged in pairs and at intervals along the second direction (L2), one end of the busbar connector (50) is arranged on the air duct support (40) and electrically connected with the power module (30) along the second direction (L2), and the other end extends out of the heat insulation box (10) for electrically connecting positive / negative electrode probes; The power module (30) comprises a plurality of DCDC power supplies (31) arranged at intervals along a third direction (L3), and each DCDC power supply (31) is connected between a pair of busbar connectors (50) at two ends along the second direction (L2).

8. The power supply device (100) according to any one of claims 2 to 5, characterized in that The heat exchanger (21) is a water-cooled heat exchanger.

9. The power supply device (100) according to claim 8, characterized in that The heat insulation box (10) is further provided with a pipe through hole (13) for connecting the heat exchanger (21) with a pipe of an external cooling medium circulating device to circulate cooling medium, and / or for connecting the power module (30) with an external power supply wire harness to supply power.

10. A formation and dispensing apparatus (1000), characterized by The power supply device (100) according to any one of claims 1-9.

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