Glue injection mechanism for semiconductor packaging mold

Abstract

The utility model discloses a glue injection mechanism for a semiconductor packaging mould, which relates to the technical field of glue injection for semiconductor packaging and comprises a gun barrel, a stirring component and a heating component, the top end of the gun barrel is communicated with a clinker pipe, the bottom end of the gun barrel is communicated with a thickening pipe, and the bottom end of the thickening pipe is communicated with a gun head. The stirring assembly is arranged, so that the stirring blades in the thickening pipe rotate under the action of the stirring assembly, and glue in the gun barrel, the thickening pipe and the gun head is stirred and mixed through rotation of the stirring blades, so that the glue in the gun barrel, the thickening pipe and the gun head is stirred and mixed, and the glue in the gun barrel and the thickening pipe is stirred and mixed. And the glue is heated through cooperation of the heating assembly, the glue is evenly heated through cooperation of the stirring assembly and the heating assembly, and then the glue in the gun barrel, the thickening pipe and the gun head is prevented from being solidified after shutdown.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging injection technology, specifically to a semiconductor packaging mold injection mechanism. Background Technology

[0002] A semiconductor chip is a fundamental component used in integrated circuits. Also known as an integrated circuit chip or chip, it is a thin film made of semiconductor materials (such as silicon) on which multiple electronic devices (such as transistors, capacitors, and resistors) and circuit connections are integrated. The main function of a semiconductor chip is to connect electronic devices and circuits together to realize various functions of electronic devices. It can store and process information, control the operation of electronic devices, and realize various functions such as computing, communication, display, and storage.

[0003] Currently, when applying adhesive to semiconductor packaging molds, workers place the molds on the worktable of an adhesive dispensing machine and then operate the machine to apply adhesive to the molds using a dispensing plate. However, in existing technology, the machine sometimes stops during the dispensing process, causing the adhesive inside the glue gun to solidify, reducing its fluidity and affecting the quality of subsequent dispensing. Therefore, we propose an adhesive dispensing mechanism for semiconductor packaging molds. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor packaging mold dispensing mechanism to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a semiconductor packaging mold dispensing mechanism, comprising a gun barrel, a stirring assembly, and a heating assembly. The top end of the gun barrel is connected to a glue tube, and the bottom end of the gun barrel is connected to a thickening tube. The bottom end of the thickening tube is connected to a gun head. A valve for controlling the opening and closing of the gun head is installed on the gun head. The stirring assembly is installed inside the thickening tube and is used to stir the glue to prevent it from solidifying rapidly after the machine stops. The stirring assembly is also used to stir the components in the glue to ensure uniform mixing. The heating assembly penetrates the gun barrel, the thickening tube, and the gun head and is used to heat the glue inside the gun barrel, the thickening tube, and the gun head after the machine stops.

[0006] Preferably, the agitation assembly includes a rotating tube installed inside the gun barrel, a rotating block fixedly connected to the bottom end of the rotating tube, multiple sets of connecting columns fixedly connected to the outer side of the rotating block, stirring blades fixedly connected to the connecting columns, and a rotating component for driving the rotating tube to rotate installed at the top end of the rotating tube, which is beneficial for agitating the glue. Firstly, it reduces the glue solidification speed after the equipment stops, and secondly, it makes the materials of each component in the glue more uniformly mixed.

[0007] Preferably, the rotating component includes a fixed frame fixedly connected to the gun barrel, a motor fixedly connected to the fixed frame, a coupling fixedly connected to the output end of the motor, a drive shaft extending into the gun barrel fixedly connected to one end of the coupling, the drive shaft being rotatably connected to the gun barrel, and a transmission component connected to the rotating tube at the end of the drive shaft, which facilitates the stable rotation of the stirring blade, thereby facilitating the stirring and mixing of the glue.

[0008] Preferably, the transmission component includes a first bevel gear fixedly connected to the drive shaft, and a second bevel gear fixedly connected to the rotating tube meshes with the outer side of the first bevel gear, which is beneficial for stable power transmission.

[0009] Preferably, the heating assembly includes a protective sleeve installed inside the rotating tube, the protective sleeve penetrating the gun barrel, the thickening tube, and the gun head, and a heating rod is installed inside the protective sleeve. Two sets of wires extending to the outside of the gun barrel are connected to the heating rod, and plugs are installed at the ends of the wires. This facilitates heating the glue inside the gun barrel, the thickening tube, and the gun head, and prevents the glue from solidifying after the equipment is stopped, which would reduce its fluidity and affect the semiconductor packaging operation.

[0010] Preferably, the rotating tube has several sets of slots, which facilitates heat dissipation and thus makes it easier to heat the glue.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] This invention incorporates a stirring component, which causes the stirring blades inside the thickening tube to rotate. The rotation of the stirring blades agitates and mixes the glue inside the gun barrel, thickening tube, and gun head. Combined with the heating component, the glue is heated evenly. This combination of stirring and heating ensures that the glue in the gun barrel, thickening tube, and gun head does not solidify after the machine is stopped. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2This is a schematic cross-sectional view of the present invention.

[0015] Figure 3 This is a schematic diagram of the stirring component structure of this utility model;

[0016] Figure 4 This is a schematic diagram of the heating component structure of this utility model;

[0017] Figure 5 This is a schematic diagram of the connection structure between the rotating tube and the heating component of this utility model.

[0018] In the diagram: 1-Barrel; 2-Connecting pipe; 3-Thickened pipe; 4-Gunhead; 5-Valve; 6-Agitating assembly; 7-Heating assembly; 8-Rotating pipe; 9-Rotating block; 10-Connecting column; 11-Agitating blade; 12-Rotating component; 13-Fixed frame; 14-Motor; 15-Coupling; 16-Drive shaft; 17-Transmission component; 18-First bevel gear; 19-Second bevel gear; 20-Protective sleeve; 21-Heating rod; 22-Wire; 23-Plug; 24-Slot. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1-5 This utility model provides a technical solution: a semiconductor packaging mold glue injection mechanism, including a gun barrel 1, a stirring component 6, and a heating component 7. The top end of the gun barrel 1 is connected to a glue tube, and the bottom end of the gun barrel 1 is connected to a thickening tube 3. The bottom end of the thickening tube 3 is connected to a gun head 4. A valve 5 for controlling the opening and closing of the gun head 4 is installed on the gun head 4. The stirring component 6 is installed inside the thickening tube 3 and is used to stir the glue to prevent the glue from solidifying rapidly after the machine stops. The stirring component 6 is also used to stir the components in the glue to make them evenly mixed. The heating component 7 penetrates the gun barrel 1, the thickening tube 3, and the gun head 4 and is used to heat the glue inside the gun barrel 1, the thickening tube 3, and the gun head 4 after the machine stops.

[0021] In this solution, after the glue dispensing equipment stops, the glue inside the gun barrel 1, thickening tube 3, and gun head 4 is stirred and mixed by the action of the stirring component 6, and then the glue is heated by the action of the heating component 7. The combination of the stirring component 6 and the heating component 7 ensures that the glue is heated evenly, thereby preventing the glue inside the gun barrel 1, thickening tube 3, and gun head 4 from solidifying after the machine stops.

[0022] The stirring assembly 6 includes a rotating tube 8 installed inside the barrel 1. A rotating block 9 is fixedly connected to the bottom end of the rotating tube 8. Multiple sets of connecting columns 10 are fixedly connected to the outer side of the rotating block 9. Stirring blades 11 are fixedly connected to the connecting columns 10. A rotating component 12 for driving the rotating tube 8 to rotate is installed at the top end of the rotating tube 8. The rotating component 12 includes a fixing frame 13 fixedly connected to the barrel 1. A motor 14 is fixedly connected to the fixing frame 13. A coupling 15 is fixedly connected to the output end of the motor 14. A drive shaft 16 extending into the barrel 1 is fixedly connected to one end of the coupling 15. The drive shaft 16 is rotatably connected to the barrel 1. A transmission component 17 connected to the rotating tube 8 is connected to the end of the drive shaft 16. The transmission component 17 includes a first bevel gear fixedly connected to the drive shaft 16. A second bevel gear 19 fixedly connected to the rotating tube 8 meshes with the outer side of the first bevel gear 18.

[0023] In this solution, during the glue injection process, the motor 14 is started, which drives the coupling 15 to rotate. The coupling 15 then drives the drive shaft 16 to rotate, which in turn drives the first bevel gear 18 to rotate. The first bevel gear 18 then drives the second bevel gear 19 to rotate, which in turn drives the rotating tube 8 to rotate. The rotating tube 8 then drives the rotating block 9 to rotate, which in turn drives the connecting column 10 and the stirring blade 11 to rotate. The rotation of the stirring blade 11 agitates the glue inside the gun barrel 1, the thickened tube 3, and the gun head 4, thus facilitating the uniform mixing of the various components in the glue.

[0024] In this solution, after the glue dispensing equipment stops, the motor 14 is started. The motor 14 will cause the drive shaft 16 to rotate through the coupling 15. Therefore, the rotating tube 8 will rotate through the action of the first bevel gear 18 and the second bevel gear 19, which will cause the rotating block 9, the connecting column 10 and the stirring blade 11 to rotate. At this time, the glue is stirred by the rotation of the stirring blade 11, which reduces the speed at which the glue solidifies after the equipment stops.

[0025] The heating assembly 7 includes a protective sleeve 20 installed inside the rotating tube 8. The protective sleeve 20 passes through the gun barrel 1, the thickened tube 3, and the gun head 4. A heating rod 21 is installed inside the protective sleeve 20. Two sets of wires 22 extending to the outside of the gun barrel 1 are connected to the heating rod 21. The ends of the wires 22 are equipped with plugs 23, which facilitates heating the glue inside the gun barrel 1, the thickened tube 3, and the gun head 4, and prevents the glue from solidifying after the equipment is stopped, which would reduce its fluidity and affect the semiconductor packaging operation.

[0026] In this solution, plug 23 is connected to the power supply, and wire 22 is energized, which causes heating rod 21 to heat up. The heating rod 21 is heated by the current, thus heating the glue and preventing the glue from solidifying after the machine is stopped.

[0027] In this design, the rotating tube 8 has several sets of slots 24, which facilitates heat dissipation and makes it easier to heat the glue.

[0028] Working principle: During the glue injection process, the motor 14 is started, which drives the coupling 15 to rotate. The coupling 15 then drives the drive shaft 16 to rotate, which in turn drives the first bevel gear 18 to rotate. The first bevel gear 18 then drives the second bevel gear 19 to rotate, which in turn drives the rotating tube 8 to rotate. The rotating tube 8 then drives the rotating block 9 to rotate, which in turn drives the connecting column 10 and the stirring blade 11 to rotate. The rotation of the stirring blade 11 agitates the glue inside the gun barrel 1, the thickened tube 3, and the gun head 4, thus facilitating the uniform mixing of the various components in the glue.

[0029] In this solution, after the dispensing equipment stops, the motor 14 is started, which drives the drive shaft 16 to rotate via the coupling 15. This causes the rotating tube 8 to rotate via the action of the first bevel gear 18 and the second bevel gear 19, which in turn causes the rotating block 9, the connecting column 10, and the stirring blade 11 to rotate. The rotation of the stirring blade 11 agitates the adhesive. During this process, the plug 23 is connected to the power supply, and the wire 22 is energized, which heats the heating rod 21. The heating rod 21 is heated by the current, thus heating the adhesive. The rotation of the stirring blade 11 and the heating of the heating coil ensure that the adhesive inside the gun barrel 1, the thickened tube 3, and the gun head 4 is heated evenly, preventing the adhesive from solidifying after shutdown and affecting subsequent semiconductor packaging.

[0030] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor packaging mold dispensing mechanism, comprising: Gun barrel (1), the top end of the gun barrel (1) is connected to a clinker pipe, and the bottom end of the gun barrel (1) is connected to a thickening pipe (3), the bottom end of the thickening pipe (3) is connected to a gun head (4), and a valve (5) for controlling the opening and closing of the gun head (4) is installed on the gun head (4). Its characteristic is that it further includes: A stirring component (6) is installed inside the thickened tube (3). The stirring component (6) is used to stir the glue to prevent the glue from solidifying quickly after the machine stops. The stirring component (6) is also used to stir the components in the glue to make them evenly mixed. Heating component (7) extends through the gun barrel (1), the thickening tube (3), and the gun head (4). The heating component (7) is used to heat the glue inside the gun barrel (1), the thickening tube (3), and the gun head (4) after the machine has stopped.

2. The semiconductor packaging mold dispensing mechanism according to claim 1, characterized in that: The stirring assembly (6) includes a rotating tube (8) installed inside the gun barrel (1). A rotating block (9) is fixedly connected to the bottom end of the rotating tube (8). Multiple sets of connecting columns (10) are fixedly connected to the outer side of the rotating block (9). A stirring blade (11) is fixedly connected to the connecting column (10). A rotating component (12) for driving the rotating tube (8) to rotate is installed at the top end of the rotating tube (8).

3. The semiconductor packaging mold dispensing mechanism according to claim 2, characterized in that: The rotating component (12) includes a fixed bracket (13) fixedly connected to the barrel (1), a motor (14) fixedly connected to the fixed bracket (13), a coupling (15) fixedly connected to the output end of the motor (14), a drive shaft (16) extending into the barrel (1) fixedly connected to one end of the coupling (15), the drive shaft (16) being rotatably connected to the barrel (1), and a transmission component (17) connected to the rotating tube (8) connected to the end of the drive shaft (16).

4. The semiconductor packaging mold dispensing mechanism according to claim 3, characterized in that: The transmission component (17) includes a first bevel gear fixedly connected to the drive shaft (16), and a second bevel gear (19) fixedly connected to the rotating tube (8) meshes with the outer side of the first bevel gear (18).

5. The semiconductor packaging mold dispensing mechanism according to claim 4, characterized in that: The heating assembly (7) includes a protective sleeve (20) installed inside the rotating tube (8). The protective sleeve (20) passes through the barrel (1), the thickened tube (3), and the gun head (4). A heating rod (21) is installed inside the protective sleeve (20). Two sets of wires (22) extending to the outside of the barrel (1) are connected to the heating rod (21). A plug (23) is installed at the end of the wires (22).

6. The semiconductor packaging mold dispensing mechanism according to claim 5, characterized in that: The rotating tube (8) has several sets of slots (24).

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