Strip cutting machine for semiconductor plastic package mold cleaning glue

Abstract

The utility model relates to the technical field of mold cleaning adhesive processing, and discloses a strip cutting machine for semiconductor plastic package mold mold cleaning adhesive, which comprises a machine body, a guide roller group is rotatably connected to one side in the machine body, and support plates are fixedly connected to the front side and the rear side of the upper part of the machine body. A movable roller and a fixed roller are vertically arranged in the sides, close to each other, of the supporting plates, rotating shafts are rotatably connected to the interiors of the movable roller and the fixed roller, an adjusting assembly is rotatably connected to the exterior of the front end of the rotating shaft on the upper side, and the adjusting assembly is used for adjusting the position of the movable roller. According to the utility model, the position between the movable roller and the fixed roller can be adjusted according to the thickness of the mold cleaning adhesive, so that the friction force on the mold cleaning adhesive is increased, the mold cleaning adhesive can stably move towards the cutting mechanism along with the rotation of the movable roller, the subsequent cutting precision is improved, and the downward pressure of the cutter can be adjusted according to the thickness of the mold cleaning adhesive; therefore, damage to the machine body is reduced while accurate cutting of the machine body can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of mold clearing adhesive processing technology, and in particular to a strip cutting machine for clearing mold adhesive in semiconductor plastic encapsulation molds. Background Technology

[0002] Strip cutters are mainly used to cut large rolls or blocks of material into strips of a specific width, and are widely used in industries such as semiconductors, electronics, and plastics. In semiconductor packaging, strip cutters can be used to cut mold cleaning adhesive (usually a sticky plastic or resin material) into strips or sheets suitable for use, and then apply them to mold cleaning and maintenance.

[0003] In semiconductor packaging, mold release adhesive is typically used for cleaning and protecting the mold during the packaging process. Its main function is to prevent material from adhering to the mold surface during packaging. Because semiconductor packaging involves precise processes and mold protection, the cutting accuracy of the mold release adhesive is crucial. The thickness of the mold release adhesive varies during production; therefore, adjusting the equipment's operating parameters according to different adhesive thicknesses is essential for improving production efficiency and ensuring cutting quality. However, traditional equipment typically only allows manual adjustment of the roller spacing, failing to achieve automated adjustment based on varying adhesive thicknesses. This leads to unstable friction, which in turn affects the stability of adhesive delivery and cutting accuracy. Therefore, a strip-cutting machine for mold release adhesive in semiconductor molding dies is proposed to address these issues. Utility Model Content

[0004] To overcome the above shortcomings, this utility model provides a strip cutting machine for clearing adhesive in semiconductor molding compounds. It aims to improve the problem that traditional equipment in the prior art can only adjust the roller spacing manually, and cannot achieve automatic adjustment according to the different thicknesses of the clearing adhesive, resulting in unstable friction and thus affecting the conveying stability and cutting accuracy of the clearing adhesive.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a strip cutting machine for clearing mold adhesive from semiconductor molding compounds, comprising a machine body, a guide roller assembly rotatably connected to one side of the machine body, and support plates fixedly connected to both the front and rear sides of the upper part of the machine body. Movable rollers and fixed rollers are arranged vertically and vertically on the adjacent side of the support plates. Rotary shafts are rotatably connected inside both the movable and fixed rollers. An adjustment component is rotatably connected to the front end of the upper rotating shaft, which is used to adjust the position of the movable rollers. A connecting rod is fixedly connected to the adjacent side of the inside of the support plates. The upper rotating shaft is slidably connected to the outside of the connecting rod, and the lower rotating shaft is fixedly connected to the outside of the connecting rod. Sliding grooves are formed inside the support plates, and the upper rotating shaft is slidably connected inside the sliding grooves.

[0006] As a further description of the above technical solution:

[0007] A support frame is fixedly connected to the upper side of the machine body. A cylinder is fixedly connected inside the support frame. A connecting plate is fixedly connected to the output end of the cylinder. A cutter is fixedly connected to the bottom of the rotating shaft. Telescopic rods are fixedly connected to both sides of the upper part of the connecting plate. The telescopic rods are fixedly connected to the upper part of the inner wall of the support frame. Through slots are opened on both sides of the inside of the support frame. A sliding rod is fixedly connected inside the through slot. A return spring is sleeved on the outside of the sliding rod.

[0008] As a further description of the above technical solution:

[0009] The adjustment assembly includes an electric actuator, which is fixedly connected to one side of the upper part of the machine body. A rotating rod is fixedly connected to the output end of the electric actuator. An eccentric wheel is rotatably connected to the outside of the rotating rod, and one end of the rotating shaft is rotatably connected to the other side inside the eccentric wheel.

[0010] As a further description of the above technical solution:

[0011] Fixed blocks are fixedly connected to the upper parts of both sides of the outer wall of the support frame. A pull block 1 is attached to the upper part of the fixed block. A movable rod is fixedly connected to the bottom of the pull block 1. A connecting block is fixedly connected to the bottom end of the movable rod. A spring 1 is fixedly connected to the bottom of the connecting block. One end of the spring 1 is fixedly connected to the upper side of the connecting plate. Positioning holes are opened inside the movable rod and the fixed blocks. A positioning rod is slidably connected inside the positioning holes. A pull block 2 is fixedly connected to one end of the positioning rod. A spring 2 is sleeved on the outer side of the positioning rod.

[0012] As a further description of the above technical solution:

[0013] One end of the reset spring is fixedly connected to the bottom inside the through groove, and the other end of the reset spring is fixedly connected to the bottom of both ends of the connecting plate.

[0014] As a further description of the above technical solution:

[0015] One end of the second spring is fixedly connected to one side of the second pull block, and the other end of the second spring is fixedly connected to one side of the fixed block.

[0016] As a further description of the above technical solution:

[0017] A guide plate is installed on one side of the machine body, and a collection box is slidably connected inside the guide plate. A base is fixedly connected to the upper side of the inside of the guide plate, and one side of the base is fixedly connected to the inside of the machine body.

[0018] As a further description of the above technical solution:

[0019] The two sides of the connecting plate are slidably connected inside the through groove and outside the slide rod.

[0020] This utility model has the following beneficial effects:

[0021] 1. In this utility model, when the mold-clearing adhesive is conveyed between the movable roller and the fixed roller by the guide roller assembly, the electric push rod is activated to drive the rotating rod to drive the eccentric wheel, causing it to rotate on one side of the rotating shaft inside the movable roller. As the eccentric wheel rotates upward, it drives the movable roller to slide downward inside the slide groove. This allows the movable roller to adjust its distance according to the thickness of the mold-clearing adhesive, realizing the position adjustment between the movable roller and the fixed roller according to the thickness of the mold-clearing adhesive. This increases the friction force on the mold-clearing adhesive, enabling it to move smoothly towards the cutting mechanism with the rotation of the movable roller, thus improving the accuracy of subsequent cutting.

[0022] 2. In this utility model, by pulling the first pull block, the positioning rod and the second spring are pulled, causing the positioning rod to move out of the positioning hole. Then, the first pull block is pulled, causing the first spring to be pulled through the connecting block, thus adjusting the downward pressure of the cutter. Then, the cylinder is activated, causing the cutter to move downward through the connecting plate. At the same time, the telescopic rod is pulled, moving downward through the connecting plate and sliding inside the through groove. Simultaneously, it slides outside the slide rod and squeezes the return spring, thus reducing the downward pressure on the cutter. This allows the downward pressure of the cutter to be adjusted according to the thickness of the mold clearing adhesive, ensuring accurate cutting while reducing damage to the machine body. Attached Figure Description

[0023] Figure 1 This is a front perspective view of a strip cutting machine for clearing mold adhesive from semiconductor molding compounds, as proposed in this utility model.

[0024] Figure 2 This is a rear perspective view of a strip cutting machine for clearing mold adhesive from semiconductor molding compounds, as proposed in this utility model.

[0025] Figure 3 for Figure 1 Enlarged view of point A in the middle;

[0026] Figure 4 for Figure 2 Enlarged view of section B in the middle.

[0027] Legend:

[0028] 1. Machine body; 2. Guide roller assembly; 3. Support plate; 4. Connecting rod; 5. Movable roller; 6. Rotating shaft; 7. Eccentric wheel; 8. Rotating rod; 9. Electric push rod; 10. Slide groove; 12. Fixed roller; 13. Support frame; 14. Cylinder; 15. Telescopic rod; 16. Connecting plate; 17. Cutter; 18. Through groove; 19. Slide rod; 20. Return spring; 21. Fixed block; 22. Pull block one; 23. Movable rod; 24. Positioning hole; 25. Connecting block; 26. Spring one; 27. Pull block two; 28. Positioning rod; 29. ​​Spring two; 30. Base; 31. Guide plate; 32. Collection box. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Reference Figure 1 , Figure 2 , Figure 3 The present invention provides an embodiment of a strip cutting machine for clearing mold adhesive from semiconductor encapsulation molds, comprising a machine body 1, a guide roller group 2 rotatably connected to one side of the machine body 1, and support plates 3 fixedly connected to the front and rear sides of the upper part of the machine body 1. Movable rollers 5 and fixed rollers 12 are arranged vertically on the adjacent side of the support plates 3. Rotary shafts 6 are rotatably connected inside the movable rollers 5 and fixed rollers 12. An adjustment component is rotatably connected to the front end of the upper rotating shaft 6. The adjustment component is used to adjust the position of the movable rollers 5. A connecting rod 4 is fixedly connected to the adjacent side of the inside of the support plates 3. The upper rotating shaft 6 is slidably connected to the outside of the connecting rod 4, and the lower rotating shaft 6 is fixedly connected to the outside of the connecting rod 4. Slide grooves 10 are provided inside the support plates 3. The upper rotating shaft 6 is slidably connected to the inside of the slide grooves 10 to ensure the smooth downward movement of the movable rollers 5.

[0031] The adjustment assembly includes an electric push rod 9, which is fixedly connected to the upper side of the machine body 1. The output end of the electric push rod 9 is fixedly connected to a rotating rod 8. An eccentric wheel 7 is rotatably connected to the outside of the rotating rod 8. One end of the rotating shaft 6 is rotatably connected to the other side inside the eccentric wheel 7, so that it can complete the distance adjustment of the movable roller 5. A guide plate 31 is installed on one side of the machine body 1. A collection box 32 is slidably connected inside the guide plate 31. A base 30 is fixedly connected to the upper side inside the guide plate 31. One side of the base 30 is fixedly connected to the inside of the machine body 1.

[0032] When the mold-cleaning adhesive is conveyed to the space between the movable roller 5 and the fixed roller 12 via the guide roller group 2, the electric actuator 9 is activated, causing the rotating rod 8 to drive the eccentric wheel 7 to rotate. This causes the rotating shaft 6 inside the movable roller 5 to rotate on one side, so that as the eccentric wheel 7 rotates and moves upward, it drives the movable roller 5 to slide downward inside the slide groove 10. This allows the movable roller 5 to adjust its distance according to the thickness of the mold-cleaning adhesive, and allows the position between the movable roller 5 and the fixed roller 12 to be adjusted according to the thickness of the mold-cleaning adhesive. This increases the friction force on the mold-cleaning adhesive, enabling it to move smoothly towards the cutting mechanism as the movable roller 5 rotates, thus improving the accuracy of subsequent cutting.

[0033] Reference Figure 1 , Figure 2 , Figure 4 A support frame 13 is fixedly connected to the other side of the upper part of the body 1. A cylinder 14 is fixedly connected inside the support frame 13. A connecting plate 16 is fixedly connected to the output end of the cylinder 14. A cutter 17 is fixedly connected to the bottom of the rotating shaft 6. Telescopic rods 15 are fixedly connected to both sides of the upper part of the connecting plate 16. The telescopic rods 15 are fixedly connected to the upper part of the inner wall of the support frame 13. A through groove 18 is opened on both sides of the inside of the support frame 13. A slide rod 19 is fixedly connected inside the through groove 18. A return spring 20 is sleeved on the outside of the slide rod 19. One end of the return spring 20 is fixedly connected to the bottom side of the inside of the through groove 18. The other end of the return spring 20 is fixedly connected to the bottom of both ends of the connecting plate 16. The two sides of the connecting plate 16 are slidably connected to the inside of the through groove 18 and the outside of the slide rod 19.

[0034] Fixing blocks 21 are fixedly connected to the upper part of both sides of the outer wall of the support frame 13. Pull blocks 22 are attached to the upper part of the fixing blocks 21. Movable rods 23 are fixedly connected to the bottom of pull blocks 22. Connecting blocks 25 are fixedly connected to the bottom of the movable rods 23. Springs 26 are fixedly connected to the bottom of the connecting blocks 25. One end of springs 26 is fixedly connected to the upper side of the connecting plate 16. Positioning holes 24 are opened inside the movable rods 23 and the fixing blocks 21. Positioning rods 28 are slidably connected inside the positioning holes 24. Pull blocks 27 are fixedly connected to one end of the positioning rods 28. Springs 29 are sleeved on the outer side of the positioning rods 28. One end of springs 29 is fixedly connected to one side of pull blocks 27. The other end of springs 29 is fixedly connected to one side of the fixing blocks 21.

[0035] By pulling the first pull block 22, the positioning rod 28 and the second spring 29 are pulled, causing the positioning rod 28 to move out of the positioning hole 24. Then, the first pull block 22 is pulled so that the first spring 26 is pulled through the connecting block 25, adjusting the downward pressure of the cutter 17. Then, the cylinder 14 is activated so that the cutter 17 is moved downward through the connecting plate 16. At the same time, the telescopic rod 15 is pulled and moves downward through the connecting plate 16, sliding inside the through groove 18 and outside the slide rod 19, while squeezing the return spring 20, which reduces the downward pressure on the cutter 17. This allows the downward pressure of the cutter 17 to be adjusted according to the thickness of the mold clearing glue, ensuring accurate cutting while reducing damage to the machine body 1.

[0036] Working principle: When the device is needed, when the mold cleaning adhesive is conveyed to the space between the movable roller 5 and the fixed roller 12 by the guide roller group 2, the electric push rod 9 is activated, which drives the rotating rod 8 to drive the eccentric wheel 7. This causes the rotating shaft 6 inside the movable roller 5 to rotate and move upward, while the eccentric wheel 7 moves upward, driving the movable roller 5 to slide downward inside the slide groove 10. This allows the movable roller 5 to adjust its distance according to the thickness of the mold cleaning adhesive. This enables the position between the movable roller 5 and the fixed roller 12 to be adjusted according to the thickness of the mold cleaning adhesive, increasing the friction force on the mold cleaning adhesive. As the movable roller 5 rotates, it can move smoothly towards the cutting mechanism, improving the accuracy of subsequent cutting.

[0037] By pulling the first pull block 22, the positioning rod 28 and the second spring 29 are pulled, causing the positioning rod 28 to move out of the positioning hole 24. Then, the first pull block 22 is pulled, causing it to pull the first spring 26 via the connecting block 25, thus adjusting the downward pressure of the cutter 17. Then, the cylinder 14 is activated, causing it to move the cutter 17 downward via the connecting plate 16. At the same time, the telescopic rod 15 is pulled, moving downward via the connecting plate 16 and sliding inside the through groove 18, while sliding outside the slide rod 19, and pressing the reset spring 20, thus reducing the downward pressure on the cutter 17. This allows the downward pressure of the cutter 17 to be adjusted according to the thickness of the mold clearing adhesive, ensuring accurate cutting while reducing damage to the machine body 1.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A strip cutting machine for removing mold adhesive from semiconductor molding compounds, comprising a machine body (1), characterized in that: The machine body (1) is rotatably connected to a guide roller group (2) on one side inside. The upper front and rear sides of the machine body (1) are fixedly connected to support plates (3). On the side of the support plate (3) that is close to each other, there are movable rollers (5) and fixed rollers (12) arranged vertically. The movable rollers (5) and fixed rollers (12) are rotatably connected to a rotating shaft (6). The front end of the upper rotating shaft (6) is rotatably connected to an adjustment component. The adjustment component is used to adjust the position of the movable rollers (5). The side of the support plate (3) that is close to each other inside is fixedly connected to a connecting rod (4). The upper rotating shaft (6) is slidably connected to the outside of the connecting rod (4). The lower rotating shaft (6) is fixedly connected to the outside of the connecting rod (4). The support plate (3) is provided with a sliding groove (10). The upper rotating shaft (6) is slidably connected to the inside of the sliding groove (10).

2. A strip cutting machine for clearing mold adhesive from semiconductor molding compounds according to claim 1, characterized in that: A support frame (13) is fixedly connected to the other side of the upper part of the body (1). A cylinder (14) is fixedly connected inside the support frame (13). A connecting plate (16) is fixedly connected to the output end of the cylinder (14). A cutter (17) is fixedly connected to the bottom of the rotating shaft (6). Telescopic rods (15) are fixedly connected to both sides of the upper part of the connecting plate (16). The telescopic rods (15) are fixedly connected to the upper part of the inner wall of the support frame (13). A through groove (18) is opened on both sides of the inside of the support frame (13). A slide rod (19) is fixedly connected inside the through groove (18). A return spring (20) is sleeved on the outside of the slide rod (19).

3. A strip cutting machine for clearing mold adhesive from semiconductor molding compounds according to claim 1, characterized in that: The adjustment assembly includes an electric actuator (9), which is fixedly connected to the upper side of the body (1). The output end of the electric actuator (9) is fixedly connected to a rotating rod (8). An eccentric wheel (7) is rotatably connected to the outside of the rotating rod (8). One end of the rotating shaft (6) is rotatably connected to the other side inside the eccentric wheel (7).

4. A strip cutting machine for clearing mold adhesive from semiconductor molding compounds according to claim 2, characterized in that: The upper part of both sides of the outer wall of the support frame (13) is fixedly connected to a fixing block (21). The upper part of the fixing block (21) is fitted with a pull block (22). The bottom of the pull block (22) is fixedly connected to a movable rod (23). The bottom end of the movable rod (23) is fixedly connected to a connecting block (25). The bottom of the connecting block (25) is fixedly connected to a spring (26). One end of the spring (26) is fixedly connected to the upper side of the connecting plate (16). The movable rod (23) and the fixing block (21) are both provided with positioning holes (24). The positioning hole (24) is slidably connected to a positioning rod (28). One end of the positioning rod (28) is fixedly connected to a pull block (27). The outer side of the positioning rod (28) is fitted with a spring (29).

5. A strip cutting machine for removing mold adhesive from semiconductor molding compounds according to claim 2, characterized in that: One end of the reset spring (20) is fixedly connected to the bottom inside of the through groove (18), and the other end of the reset spring (20) is fixedly connected to the bottom of both ends of the connecting plate (16).

6. A strip cutting machine for removing mold adhesive from semiconductor molding compounds according to claim 4, characterized in that: One end of the second spring (29) is fixedly connected to one side of the second pull block (27), and the other end of the second spring (29) is fixedly connected to one side of the fixing block (21).

7. A strip cutting machine for clearing mold adhesive from semiconductor molding compounds according to claim 1, characterized in that: A guide plate (31) is installed on one side of the machine body (1). A collection box (32) is slidably connected inside the guide plate (31). A base (30) is fixedly connected to the upper side of the inside of the guide plate (31). One side of the base (30) is fixedly connected to the inside of the machine body (1).

8. A strip cutting machine for clearing mold adhesive from semiconductor molding compounds according to claim 2, characterized in that: The two sides of the connecting plate (16) are slidably connected inside the through groove (18) and outside the slide rod (19).

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