High-temperature-resistant vacuum insulated panel

Abstract

The utility model discloses a high-temperature-resistant vacuum insulated panel which comprises a barrier film, a modified polyimide heat sealing strip, a core material and an adsorbent. The barrier film comprises an upper heat-resistant layer, a barrier layer and a lower heat-resistant layer, the upper side of the barrier layer is compositely connected with the upper heat-resistant layer, and the lower side of the barrier layer is compositely connected with the lower heat-resistant layer; the barrier film comprises an upper barrier film and a lower barrier film; one side of the modified polyimide heat sealing strip is in sealing connection with the upper barrier film, and the other side of the modified polyimide heat sealing strip is in sealing connection with the lower barrier film, so that a vacuum sealing cavity is formed between the upper barrier film and the lower barrier film; the core material is arranged in the vacuum sealing cavity; the adsorbent is arranged on the core material. According to the vacuum insulated panel, the modified polyimide heat sealing strips are arranged, and the modified polyimide heat sealing strips have a good heat-resisting effect, so that the manufactured vacuum insulated panel has a good high-temperature-resisting effect.

Description

Technical Field

[0001] This utility model relates to the field of vacuum insulation panel technology, and in particular to a high-temperature resistant vacuum insulation panel. Background Technology

[0002] Vacuum insulation panels consist of a high-barrier surface packaging bag, a core material, and a getter or adsorbent. By increasing the internal vacuum level, the gas remaining in the insulation space is removed, thereby eliminating various heat transfer paths caused by the gas and isolating heat conduction to achieve the purpose of heat preservation, heat insulation, and energy saving.

[0003] High-barrier packaging bags are made by heat-sealing an upper barrier film and a lower barrier film. In the existing technology, both the upper and lower barrier films are provided with PE heat-sealing layers. When the vacuum insulation board is used at high temperatures, the PE heat-sealing layer will melt, thus affecting the heat insulation effect of the vacuum insulation board. Utility Model Content

[0004] Based on the aforementioned problems in the prior art, the purpose of this application is to provide a high-temperature resistant vacuum insulation panel, which, by setting a modified polyimide heat-sealing strip, has a good heat resistance effect, thereby making the vacuum insulation panel with good high-temperature resistance.

[0005] The technical solution adopted by this application to solve its technical problem is: a high-temperature resistant vacuum insulation board, including a barrier film, a modified polyimide heat-sealing strip, a core material and an adsorbent;

[0006] The barrier film includes an upper heat-resistant layer, a barrier layer, and a lower heat-resistant layer. The upper side of the barrier layer is compositely connected to the upper heat-resistant layer, and the lower side of the barrier layer is compositely connected to the lower heat-resistant layer. The barrier film includes an upper barrier film and a lower barrier film.

[0007] One side of the modified polyimide heat-sealing strip is sealed to the upper barrier film, and the other side of the modified polyimide heat-sealing strip is sealed to the lower barrier film, so as to form a vacuum sealing cavity between the upper barrier film and the lower barrier film.

[0008] The core material is disposed inside a vacuum-sealed cavity; the adsorbent is disposed on the core material.

[0009] Furthermore, the upper heat-resistant layer is an upper polyimide film layer, and the lower heat-resistant layer is a lower polyimide film layer.

[0010] Furthermore, the thickness of the upper polyimide film layer is 10μm-100μm, and the thickness of the lower polyimide film layer is 10μm-100μm.

[0011] Furthermore, the barrier layer is an aluminum foil layer.

[0012] Furthermore, the thickness of the aluminum foil layer is 7μm-12μm.

[0013] Furthermore, the upper heat-resistant layer and the barrier layer are bonded together by a modified polyimide heat-sealing layer, and the lower heat-resistant layer and the barrier layer are bonded together by a modified polyimide heat-sealing layer.

[0014] Furthermore, the thickness of the modified polyimide heat-sealing strip is 20μm-50μm.

[0015] Furthermore, the core material is glass fiber felt or centrifugal cotton.

[0016] Furthermore, the adsorbent is one or more of calcium oxide, cobalt oxide, barium-lithium alloy, and ferroalloy.

[0017] Furthermore, the modified polyimide heat-sealing strip includes a U-shaped heat-sealing strip and a strip-shaped heat-sealing strip. The U-shaped heat-sealing strip is heat-sealed together with the upper barrier film and the lower barrier film to form a barrier bag with an opening. The strip-shaped heat-sealing strip is disposed between the upper barrier film and the lower barrier film to heat-seal the upper barrier film and the lower barrier film located above and below the opening together.

[0018] The beneficial effects of this application are as follows: During manufacturing, after the core material and adsorbent are bagged and vacuum-sealed, the upper and lower barrier films are heat-sealed together using a modified polyimide heat-sealing strip, thus completing the manufacturing process. The modified polyimide heat-sealing strip achieves high heat-sealing strength after being heat-sealed with the upper and lower barrier films. Simultaneously, due to the excellent heat resistance of the upper and lower heat-resistant layers, and the excellent heat resistance of the modified polyimide heat-sealing strip, the resulting vacuum insulation panel exhibits good high-temperature resistance. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the high-temperature resistant vacuum insulation panel in this application;

[0020] Figure 2 This is a cross-sectional view of the barrier membrane in this application;

[0021] Figure 3 This is a schematic diagram showing the connection between the barrier film and the modified polyimide heat seal strip in this application.

[0022] Explanation of reference numerals in the attached figures

[0023] Barrier membrane 1, upper barrier membrane 1a, lower barrier membrane 1b, upper heat-resistant layer 11, barrier layer 12, lower heat-resistant layer 13, modified polyimide heat-sealing strip 2, U-shaped heat-sealing strip 21, strip heat-sealing strip 22, core material 3, adsorbent 4. Detailed Implementation

[0024] To better explain and facilitate understanding of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] like Figures 1 to 3 As shown, this utility model discloses a high-temperature resistant vacuum insulation panel, comprising a barrier film 1, a modified polyimide heat-sealing strip 2, a core material 3, and an adsorbent 4. The barrier film 1 comprises an upper heat-resistant layer 11, a barrier layer 12, and a lower heat-resistant layer 13. The upper side of the barrier layer 12 is compositely connected to the upper heat-resistant layer 11, and the lower side of the barrier layer 12 is compositely connected to the lower heat-resistant layer 13. The barrier film 1 comprises an upper barrier film 1a and a lower barrier film 1b. One side of the modified polyimide heat-sealing strip 2 is sealed to the upper barrier film 1a, and the other side of the modified polyimide heat-sealing strip 2 is sealed to the lower barrier film 1b, so that a vacuum-sealed cavity is formed between the upper barrier film 1a and the lower barrier film 1b. The core material 3 is disposed within the vacuum-sealed cavity. The adsorbent 4 is disposed on the core material 3.

[0026] Thus, in the manufacturing process of the high-temperature resistant vacuum insulation panel of this utility model, the core material 3 and the adsorbent 4 are bagged and vacuum-sealed. The upper barrier film 1a and the lower barrier film 1b are then heat-sealed together using a modified polyimide heat-sealing strip 2, thereby completing the manufacturing process. The modified polyimide heat-sealing strip 2 achieves high heat-sealing strength after heat-sealing with the upper barrier film 1a and the lower barrier film 1b. Simultaneously, due to the good heat resistance of the upper heat-resistant layer 11 and the lower heat-resistant layer 13, and the good heat resistance of the modified polyimide heat-sealing strip 2, the resulting vacuum insulation panel exhibits excellent high-temperature resistance.

[0027] Optionally, the upper heat-resistant layer 11 is an upper polyimide film layer, and the lower heat-resistant layer 13 is a lower polyimide film layer. The polyimide film layer has good heat resistance, resulting in a vacuum insulation panel with good heat resistance.

[0028] The thickness of the upper polyimide film layer is 10μm-100μm, and the thickness of the lower polyimide film layer is 10μm-100μm. Preferably, the thickness of the upper polyimide film layer is 40μm-50μm, and the thickness of the lower polyimide film layer is 40μm-50μm, so that the prepared vacuum insulation panel has good heat resistance.

[0029] Preferably, the barrier layer 12 is an aluminum foil layer with a thickness of 7μm-12μm. The aluminum foil layer has extremely high moisture resistance and gas barrier properties, which makes the vacuum insulation panel have a good barrier effect.

[0030] Traditional heat-resistant layers are composited with epoxy resin and barrier layers, but their drawback is insufficient high-temperature resistance. To address this issue, in this embodiment, the upper heat-resistant layer 11 and barrier layer 12 are composited together with a modified polyimide heat-sealing layer, and the lower heat-resistant layer 13 and barrier layer 12 are composited together with a modified polyimide heat-sealing layer. This results in a vacuum insulation panel with excellent heat resistance; even at a high temperature of 250°C, the upper heat-resistant layer 11, barrier layer 12, and lower heat-resistant layer 13 maintain good bonding, as do the upper barrier film 1a and lower barrier film 1b.

[0031] In this embodiment, the thickness of the modified polyimide heat-sealing strip 2 is 20μm-50μm. Preferably, the thickness of the modified polyimide heat-sealing strip 2 is 25μm, ensuring that the sealing strength meets requirements after heat sealing of the vacuum insulation panel. The modified polyimide heat-sealing strip 2 is a readily available material. The core material 3 is glass fiber felt or centrifugal cotton, and the adsorbent 4 is one or more of calcium oxide, cobalt oxide, barium-lithium alloy, and ferroalloy.

[0032] In this embodiment, the modified polyimide heat-sealing strip 2 includes a U-shaped heat-sealing strip 21 and a strip-shaped heat-sealing strip 22. The U-shaped heat-sealing strip 21 is heat-sealed together with the upper barrier film 1a and the lower barrier film 1b to form a barrier bag with an opening. The strip-shaped heat-sealing strip 22 is disposed between the upper barrier film 1a and the lower barrier film 1b to heat-seal the upper barrier film 1a and the lower barrier film 1b located above and below the opening.

[0033] After the U-shaped heat-sealing strip 21 is heat-sealed together with the upper barrier film 1a and the lower barrier film 1b, the whole is formed into a barrier bag, which makes it easy to place the core material 3 into the barrier bag through the opening. Finally, the vacuum insulation board is made by heating the strip heat-sealing strip 22.

[0034] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A high-temperature resistant vacuum insulation panel, characterized in that: Includes barrier film, modified polyimide heat seal strip, core material and adsorbent; The barrier film includes an upper heat-resistant layer, a barrier layer, and a lower heat-resistant layer. The upper side of the barrier layer is compositely connected to the upper heat-resistant layer, and the lower side of the barrier layer is compositely connected to the lower heat-resistant layer. The barrier film includes an upper barrier film and a lower barrier film. One side of the modified polyimide heat-sealing strip is sealed to the upper barrier film, and the other side of the modified polyimide heat-sealing strip is sealed to the lower barrier film, so as to form a vacuum sealing cavity between the upper barrier film and the lower barrier film. The core material is disposed inside a vacuum-sealed cavity; the adsorbent is disposed on the core material.

2. The high-temperature resistant vacuum insulation board as described in claim 1, characterized in that: The upper heat-resistant layer is an upper polyimide film layer, and the lower heat-resistant layer is a lower polyimide film layer.

3. The high-temperature resistant vacuum insulation board as described in claim 2, characterized in that: The thickness of the upper polyimide film layer is 10μm-100μm, and the thickness of the lower polyimide film layer is 10μm-100μm.

4. The high-temperature resistant vacuum insulation board as described in claim 1, characterized in that: The barrier layer is an aluminum foil layer.

5. The high-temperature resistant vacuum insulation board as described in claim 4, characterized in that: The thickness of the aluminum foil layer is 7μm-12μm.

6. The high-temperature resistant vacuum insulation panel as described in claim 1, characterized in that: The upper heat-resistant layer and the barrier layer are bonded together by a modified polyimide heat-sealing layer, and the lower heat-resistant layer and the barrier layer are bonded together by a modified polyimide heat-sealing layer.

7. The high-temperature resistant vacuum insulation board as described in claim 1, characterized in that: The thickness of the modified polyimide heat-sealing strip is 20μm-50μm.

8. The high-temperature resistant vacuum insulation board as described in claim 1, characterized in that: The core material is fiberglass felt or centrifugal cotton.

9. The high-temperature resistant vacuum insulation board as described in claim 1, characterized in that: The adsorbent is one or more of calcium oxide, cobalt oxide, barium-lithium alloy, and ferroalloy.

10. The high-temperature resistant vacuum insulation panel as described in claim 1, characterized in that: The modified polyimide heat-sealing strip includes a U-shaped heat-sealing strip and a strip-shaped heat-sealing strip. The U-shaped heat-sealing strip is heat-sealed together with an upper barrier film and a lower barrier film to form a barrier bag with an opening. The strip-shaped heat-sealing strip is disposed between the upper barrier film and the lower barrier film to heat-seal the upper barrier film and the lower barrier film located above and below the opening together.

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