Semiconductor stacking equipment

Abstract

The utility model relates to the technical field of stacking equipment, in particular to semiconductor stacking equipment which comprises a lifting device and a rack outer box body, the lifting device comprises a lifting moving platform and a lifting transmission mechanism, the rack outer box body comprises a rack inlet a and a one-way movable bracket, and when a goods shelf enters the lifting moving platform from the rack inlet a, the lifting transmission mechanism is driven by the one-way movable bracket to move. And the lifting transmission mechanism drives the lifting moving platform to directionally move up and down in the vertical direction, so that the goods shelf can be placed on the one-way movable bracket. According to the utility model, the lifting transmission mechanism drives the lifting moving platform to directionally move up and down along the vertical direction, and the goods shelf can be placed on the one-way movable bracket by utilizing the one-way passing characteristic of the one-way movable bracket, so that a layer-by-layer stacking structure in the vertical direction is realized; a plurality of stackers can be used at the same time without mutual interference and mutual influence, the production and manufacturing cost and the later maintenance cost are low, the stacking efficiency is higher, and a user can use the stacker conveniently.

Description

Technical Field

[0001] This utility model relates to the field of stacking equipment technology, specifically a semiconductor stacking equipment. Background Technology

[0002] In the semiconductor manufacturing process, there are usually many sub-steps. Some of these sub-steps can be completed smoothly in one place, while others may need to be outsourced or stored in sufficient quantities for batch processing. Before outsourcing or storing locally, these semi-finished products need to be packaged, transported or stored in a warehouse. How to conveniently stack the shelves or pallets for storing semi-finished products and minimize the stacking area is a problem that needs to be solved.

[0003] The common stacking method currently used is to use manual labor or multi-axis robotic arms to remove individual shelves or pallets from the conveyor line for palletizing and arranging, forming a three-dimensional stacking area. However, the purchase and maintenance costs of robotic arms are high, and people familiar with the operating system are required to operate the palletizing program. Traditional manual handling is more time-consuming and labor-intensive, and the efficiency of manual handling is easily affected by individual differences, which is not stable and inefficient, and is not convenient for the stacking and transfer of shelves or pallets.

[0004] To address the above shortcomings, we need to develop a semiconductor stacking device to meet the needs of a wide range of users. Utility Model Content

[0005] To address the aforementioned issues of high procurement and maintenance costs associated with existing automated stacking methods using multi-axis robotic arms, and instability and low efficiency with manual stacking methods, the technical solution adopted by this utility model is as follows:

[0006] A semiconductor stacking device includes a lifting and hoisting device for stacking racks and a frame housing for limiting the stacking position of the racks. The lifting and hoisting device includes a lifting and moving platform for supporting the racks and a lifting transmission mechanism for driving the movement. The frame housing includes a rack inlet a for the racks to slide into and a one-way movable support for supporting the racks. When the racks enter the lifting and moving platform from the rack inlet a, the lifting transmission mechanism drives the lifting and moving platform to move vertically up and down, so that the racks can be placed on the one-way movable support.

[0007] As described above, in a semiconductor stacking device, the lifting and lowering device includes a drive shaft for transmitting power and a drive motor for providing power. The drive shaft is hinged to the inner housing of the frame of the lifting and lowering device, and the drive motor is fixedly connected to the inner housing of the frame. The drive motor drives the drive shaft to rotate through a first transmission mechanism, and the drive shaft drives the lifting and moving platform to move vertically up and down through a second transmission mechanism.

[0008] In a semiconductor stacking device as described above, the first transmission mechanism includes an active component mounted on the output end of the drive motor, a driven component mounted on the transmission shaft, and a transmission component mounted between the active component and the driven component. When the drive motor is started, the active component drives the driven component through the transmission component, thereby causing the transmission shaft to rotate.

[0009] In a semiconductor stacking device as described above, the second transmission mechanism includes a crank fixedly connected to the transmission shaft, a piston mounted on the lifting and moving platform, and a connecting rod hinged between the crank and the piston. When the transmission shaft rotates, the crank drives the piston to move up and down in the vertical direction through the connecting rod.

[0010] As described above, in a semiconductor stacking device, the unidirectional movable support includes a fixed support and a movable support plate. The fixed support is installed on the rack side plates located on both sides of the outer casing of the rack. The movable support plate has a hinged end that is hinged to the fixed support. The supporting end of the movable support plate for placing the shelf is located between the lifting and moving platform and the rack side plate.

[0011] In the semiconductor stacking device described above, an elastic deformation member is installed between the fixed support and the movable support plate. The bottom of the movable support plate contacts the support groove surface of the fixed support plate under the influence of the elastic deformation member. When the movable support plate disengages from the support groove, the movable support plate is elastically reset on the support groove by the elastic deformation member.

[0012] As described above, in a semiconductor stacking device, the rack housing includes a guide and limiting assembly for restricting the entry position of the rack. The guide assembly includes a first limiting member for correcting the forward direction of the rack, a second limiting member for restricting the lateral position of the rack, and a third limiting member for blocking the forward movement of the rack. The first limiting member is located on the rack housing near the rack entrance a, the third limiting member is located on the rack housing away from the rack entrance a, and the second limiting member is located between the first limiting member and the third limiting member.

[0013] In the semiconductor stacking device described above, the first limiting member and / or the second limiting member have guide surfaces that open on both sides toward the rack entry direction on the side near the rack entrance a, the third limiting member has a blocking surface on the side toward the lifting and moving platform for blocking the movement of the rack, and the second limiting member has a positioning surface on the side toward the lifting and moving platform for limiting the lateral position of the rack.

[0014] As described above, in a semiconductor stacking device, the outer casing of the rack includes rack side plates located on the left and right sides of the rack's forward direction. A load-bearing pulley assembly for the rack to slide is installed on the side of the rack side plate facing the lifting and moving platform. The load-bearing pulley assembly has a plurality of soft rubber pulleys arranged at intervals along the rack's forward direction. The horizontal installation height of the soft rubber pulleys is higher than the lowest point of movement of the lifting and moving platform and lower than the highest point of movement of the lifting and moving platform. The plurality of soft rubber pulleys are located on the same horizontal plane.

[0015] As described above, in a semiconductor stacking device, the lifting and moving platform includes at least two guide columns for limiting the direction of movement. The guide columns are mounted on the inner housing of the lifting and hoisting device, and the inner housing is equipped with guide bushings for limiting the position of the guide columns.

[0016] The beneficial effects of this utility model are as follows:

[0017] 1. This utility model adopts a lifting and hoisting device that facilitates automated stacking of shelves. The lifting and transmission mechanism drives the lifting and moving platform to move vertically up and down. Utilizing the one-way passage characteristic of the unidirectional movable support, the shelves can be placed on the unidirectional movable support by their own weight, realizing a vertical stacking structure. With the outer casing of the frame restricting the stacking position of the shelves, it avoids the shelf tilting accidents that often occur due to inaccurate manual stacking. Multiple stacking devices can be used simultaneously. After stacking to a certain height, the shelves are transferred to the designated storage area by a robotic arm, which speeds up the stacking efficiency of the production line. Compared with stacking methods using multiple robotic arms, this stacking equipment requires less space, and multiple devices can be used simultaneously without interference or impact. The production and maintenance costs are lower, the stacking efficiency is higher, and it is convenient for users.

[0018] 2. The lifting and hoisting device of this utility model uses a crank-piston connecting rod as the second transmission mechanism to drive the lifting and moving platform to achieve vertical directional reciprocating lifting and hoisting. Compared with the method of using cylinders or hydraulic cylinders to drive lifting and hoisting, the instantaneous impact force of the crank-piston connecting rod is lower, which can avoid damage to the semi-finished products inside the shelf or pallet. The driving torque is larger and can withstand the load weight of multiple stacks. On this basis, the lifting and hoisting device can use gear transmission as the first transmission mechanism to increase the driving force of the crank-piston connecting rod, enhance the transmission torque to resist the stacked weight, and successfully complete the stacking operation.

[0019] 3. The lifting and hoisting device of this utility model adopts multiple guide columns and guide bushings to assist in directional movement in the inner box of the frame, which effectively improves the accuracy of repeated directional movement, further improves the stability of the stacking structure, and avoids the frequent shelf tilting accidents caused by inaccurate manual stacking. On this basis, the outer box of the frame is also equipped with guide limiting components, which restrict the entry posture and placement position of the shelf from multiple aspects such as shelf forward direction positioning, shelf lateral positioning, and shelf entry correction, further controlling the preset position of the shelf when and after entering, which is conducive to unifying and standardizing the repeated positioning of subsequent stacking.

[0020] 4. The one-way movable support of this utility model is also equipped with an elastic deformation component between the fixed support and the movable support plate. The elastic deformation component itself tightens the movable support plate, so that after the shelf opens the movable support plate, the movable support plate can achieve elastic reset, avoiding the shelf stacking delay from tipping over or falling, improving the stability of repeated stacking and improving the efficiency of repeated stacking. Attached Figure Description

[0021] Figure 1 This is a perspective view of a semiconductor stacking device according to the present invention.

[0022] Figure 2 This is an internal structural diagram of a semiconductor stacking device according to the present invention.

[0023] Figure 3 This is a front view of a semiconductor stacking device according to the present invention.

[0024] Figure 4 This is a top view of a semiconductor stacking device according to the present invention.

[0025] Figure 5 for Figure 3 EE section view.

[0026] Figure 6 for Figure 4 FF section view.

[0027] Figure 7This is a schematic diagram A of the working process of a semiconductor stacking device according to the present invention.

[0028] Figure 8 This is a schematic diagram (B) illustrating the working process of a semiconductor stacking device according to this utility model.

[0029] Figure 9 C is a schematic diagram of the working process of a semiconductor stacking device according to this utility model.

[0030] Figure 10 This is a schematic diagram (D) illustrating the working process of a semiconductor stacking device according to this utility model. Detailed Implementation

[0031] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0032] Example 1:

[0033] like Figures 1 to 10 The semiconductor stacking equipment shown includes a lifting device 1 for stacking racks b and a frame outer casing 3 for limiting the stacking position of racks b. The lifting device 1 is used by the semiconductor stacking equipment to push racks b or pallets to stack into a vertical stacking structure. The frame outer casing 3 is a limiting structure used by the semiconductor stacking equipment to limit the placement posture of racks b when entering the stacking area from the production line. The lifting device 1 includes a lifting moving platform 11 for supporting racks b and a lifting transmission mechanism 2 for driving the movement. The frame outer casing 3 includes a frame entrance a for racks b to slide into and one-way movable supports 7 for supporting racks b. Multiple one-way movable supports 7 are installed around the lifting moving platform 11 around the frame outer casing 3. Multiple one-way movable supports 7 support racks b from different directions simultaneously, improving the stability of stacking and increasing the load-bearing capacity.

[0034] Specifically, in this embodiment, the one-way movable support 7 includes a fixed support 71 and a movable support plate 72. The fixed support 71 is installed on the side plates 31 of the frame located on both sides of the outer casing 3 of the frame. The movable support plate 72 is hinged to the fixed support 71 at its movable hinge end. The supporting end of the movable support plate 72 for placing the shelf b is located between the lifting and moving platform 11 and the side plate 31 of the frame. The upper end surface of the movable support plate 72 directly contacts the shelf b, and the lower end surface of the movable support plate 72 directly contacts the fixed support 71.

[0035] In use, shelf b enters the lifting and moving platform 11 (i.e., enters the stacking area) from the rack entrance a of the outer casing 3. After the outer casing 3 restricts the position of shelf b, shelf b is adjusted horizontally to a suitable stacking posture or angle (i.e., shelf b is aligned). The lifting transmission mechanism 2 (which can be pneumatic, hydraulic, electric, or mechanical) is activated to drive the lifting and moving platform 11 to rise vertically, pushing shelf b to open the movable pallet 72 on the one-way movable support 7. When the height of the lifting and moving platform 11 is higher than the movable pallet... After 72, the movable pallet 72 falls to the fixed support 71 under its own weight. The lifting transmission mechanism 2 drives the lifting moving platform 11 to move downward in the vertical direction, placing the shelf b on the movable pallet 72. Multiple movable pallets 72 support the shelf b at the same time, realizing the stacking of the first layer of shelves. Using the same steps, the lifting device 1 pushes the second layer of shelves through the lifting moving platform 11, lifting the second layer of shelves from the bottom of the first layer of shelves upward. The second layer of shelves then falls onto the movable pallet 72, realizing the stacking of subsequent shelves. After the shelves are stacked to a certain height, they are transferred to the designated cargo area by the robotic arm.

[0036] As another embodiment 101 of embodiment 1, such as Figure 6 The semiconductor stacking device shown has an elastic deformation element 73 installed between a fixed support 71 and a movable pallet 72. The elastic deformation element 73 can be one of a spring, a sheet spring, a rubber wire, or a plastic ring. The bottom of the movable pallet 72 contacts the support groove surface of the fixed support 71 due to the elastic tension of the elastic deformation element 73. When the movable pallet 72 is disengaged from the support groove, it is elastically reset to the support groove by the elastic deformation element 73. The elasticity of the elastic deformation element 73 tightens the movable pallet 72, so that after the shelf b pushes open the movable pallet 72, the movable pallet 72 can achieve elastic reset, avoiding the delay in reset that may cause the shelf b to tip over or fall, thus improving the stability and efficiency of repeated stacking.

[0037] As another embodiment 102 of embodiment 1, such as Figures 1 to 10 The semiconductor stacking equipment shown includes a frame housing 3 with frame side plates 31 located on the left and right sides of the shelf b in the forward direction. A load-bearing pulley group 6 is installed on the side of the frame side plate 31 facing the lifting and moving platform 11 for the shelf b to slide. The load-bearing pulley group 6 has a plurality of soft rubber pulleys 61 arranged at intervals along the forward direction of the shelf b. The horizontal installation height of the soft rubber pulleys 61 is higher than the lowest point of the lifting and moving platform 11 and lower than the highest point of the lifting and moving platform 11. The plurality of soft rubber pulleys 61 are located on the same horizontal plane. The soft rubber pulleys 61 serve to support the shelf b, so that the shelf b can continue to slide on the load-bearing pulley group 6 with the inertia of movement when entering until it is completely entered into the stacking area, which facilitates the subsequent stacking steps.

[0038] As another embodiment 103 of embodiment 102, the load-bearing pulley group 6 also includes a pulley motor (not shown) for driving the soft rubber pulley 61 to rotate in a specific direction (clockwise or counterclockwise). The pulley motor is installed on the first soft rubber pulley 61 near the rack entrance a. Under the force of the pulley motor driving the soft rubber pulley 61 to rotate, the rack b can be driven to enter the stacking area faster. It does not need to rely on the sliding caused by the inertia of the rack b itself. The movement of the rack b can also be stopped by stopping the rotation of the pulley motor, so as to avoid the rack b rebounding when it contacts the outer box 3 of the rack, which would cause inaccurate stacking positioning and improve the stopping positioning accuracy of the rack b.

[0039] As another embodiment 104 of embodiment 1, a counting sensor for detecting the number of times the movable pallet 72 moves can be installed on the unidirectional movable support 7 to determine the number of stacks on the shelf b, so that the user or the automated stacking system can judge the stacking amount in real time and avoid the collapse caused by excessive stacking.

[0040] Example 2:

[0041] Based on Example 1, such as Figures 6 to 10 as well as Figure 2 The semiconductor stacking device shown includes a lifting and lowering device 1, which includes a drive shaft 21 for transmitting power and a drive motor 22 for providing power. The drive shaft 21 (which may be a self-lubricating bushing or a bearing) is hinged to the inner housing 4 of the frame of the lifting and lowering device 1. Preferably, the drive shaft 21 is hinged to the side of the inner housing 4 using a bearing 43. The drive motor 22 is fixedly connected to the bottom of the inner housing 4. The drive motor 22 drives the drive shaft 21 to rotate through a first transmission mechanism 23. The drive shaft 21 drives the lifting and moving platform 11 to move vertically up and down through a second transmission mechanism 24.

[0042] Specifically, in this embodiment, the first transmission mechanism 23 uses gear transmission as the power transmission method. The first transmission mechanism 23 includes an active member 231 (i.e., active gear) installed at the output end of the drive motor 22, a driven member 232 (i.e., driven gear) installed on the transmission shaft 21, and a transmission member 233 (i.e., transmission gear) installed between the active member 231 and the driven member 232. When the drive motor 22 starts, the active member 231 drives the driven member 232 through the transmission member 233, so that the transmission shaft 21 rotates. The gear transmission method is more stable and has a larger transmission torque.

[0043] Specifically, in this embodiment, the second transmission mechanism 24 includes a crank 241 fixedly connected to the transmission shaft 21, a piston 242 mounted on the lifting and moving platform 11, and a connecting rod 243 hinged between the crank 241 and the piston 242. The inner housing 4 of the frame is equipped with a piston bushing 45 for restricting the directional movement of the piston 242. When the transmission shaft 21 rotates, the crank 241 drives the piston 242 to move up and down in the vertical direction through the connecting rod 243. The piston 242 is driven by the crank-piston-connecting rod to drive the lifting and moving platform 11 to achieve directional lifting and lowering in the vertical direction.

[0044] As another embodiment 201 of embodiment 2, the first transmission mechanism 23 can also adopt a belt drive as the power transmission method. The first transmission mechanism 23 includes an active component 231 (i.e., active pulley) installed at the output end of the drive motor 22, a driven component 232 (i.e., driven pulley) installed on the transmission shaft 21, and a transmission component 233 (i.e., transmission belt, which can be a belt or synchronous belt) installed between the active component 231 and the driven component 232. The belt drive method can have a certain buffering and vibration absorption capacity, reduce impact, and has low operating noise. Compared with gear transmission, it has lower maintenance costs.

[0045] As another embodiment 202 of embodiment 2, the first transmission mechanism 23 can also adopt sprocket transmission as the power transmission method. The first transmission mechanism 23 includes a driving member 231 (i.e., driving sprocket) installed at the output end of the drive motor 22, a driven member 232 (i.e., driven sprocket) installed on the transmission shaft 21, and a transmission member 233 (i.e., transmission chain) installed between the driving member 231 and the driven member 232. This embodiment has lower manufacturing cost and is easier to maintain.

[0046] Example 3:

[0047] Based on Example 1, such as Figures 1 to 10The semiconductor stacking equipment shown includes a rack housing 3 comprising a guide and limiting assembly 5 for restricting the entry position of the rack. The guide assembly includes a first limiting member 51 for correcting the forward direction of the rack, a second limiting member 52 for restricting the lateral position of the rack, and a third limiting member 53 for blocking the forward movement of the rack. The first limiting member 51 is located near the rack entrance a on the rack housing 3, the third limiting member 53 is located away from the rack entrance a on the rack housing 3, and the second limiting member 52 is located between the first limiting member 51 and the third limiting member 53. The first limiting member 51 and the second limiting member 52 are symmetrically arranged on both sides of the rack housing 3 along the forward direction of the rack b. The first limiting member 51, the second limiting member 52, and the third limiting member 53 respectively restrict the posture and orientation of the rack b in different directions and at different stages of movement, so that the rack b can be adjusted and aligned to meet the preset stacking posture, avoiding misalignment, lateral deviation, and other phenomena between each layer of rack b, reducing the stacking error between each layer of rack b, and improving the stacking stability of the rack b.

[0048] In another embodiment of embodiment 3, the first limiting member 51 or the second limiting member 52 has guide surfaces 511 that open on both sides toward the direction of the rack b entering, near the rack entrance a. The guide surfaces 511 can be arc-shaped plus flat, or curved. The guide surfaces 511 are bent or inclined toward the direction away from the center of the rack outer casing 3. The guide surfaces 511 allow the outer side of the rack b to slide into a defined position or space, guiding the rack b from a wider passage to a narrower passage. In addition, the third limiting member 53 has a side facing the lifting moving platform 11 for blocking the rack. The blocking surface 531 of the shelf b blocks the forward direction of the shelf b, thereby stopping the movement of the shelf b and achieving the effect of end braking. The second limiting member 52 has a positioning surface 521 on the side facing the lifting moving platform 11 for limiting the lateral position of the shelf b. The positioning surface 521 limits the space on both sides of the shelf b from both sides of the outer box 3 of the frame, and is the key limiting surface for the lateral positioning of the shelf b. In use, the guide surface 511 guides the shelf b to adjust its entry posture and orientation, the positioning surface 521 limits the lateral position of the shelf b, and the blocking surface 531 limits the front and rear position of the shelf b.

[0049] Example 4:

[0050] Based on Example 1, such as Figures 1 to 10The semiconductor stacking device shown includes a lifting and moving platform 11 comprising at least two guide columns 41 for limiting the direction of movement. The guide columns 41 are installed on the top of the inner housing 4 of the lifting and raising device 1. The inner housing 4 is equipped with guide bushings 42 for limiting the position of the guide columns 41. The guide columns 41 and guide bushings 42 are used together to enhance the directional movement accuracy of the lifting and moving platform 11, reduce movement deviation, improve the repetitive movement positioning accuracy of the lifting and moving platform 11, reduce the shaking of the lifting and moving platform 11 during movement, and improve the stability of the shelf b during movement.

[0051] As another embodiment 401 of embodiment 4, such as Figures 1 to 10 The semiconductor stacking device shown in this embodiment preferably uses three guide pillars 41 on the top of the inner box 4 of the frame. Compared with only two guide pillars 41, three guide pillars 41 can achieve a more stable support effect by using three-point positioning, avoiding the lifting and moving platform 11 from deviating to both sides due to excessive force, and effectively improving the stability and moving accuracy of the lifting and moving platform 11 during the movement process.

[0052] like Figures 1 to 10 As shown, the specific embodiments of this utility model are as follows:

[0053] Before stacking, shelf b leaves the conveyor belt on the production line and enters the interior of the semiconductor stacking equipment from the rack entrance a. After contacting the soft rubber pulley 61, it slides on the load-bearing pulley group 6 on both sides by its own inertia or the thrust of the production line conveyor belt. When shelf b enters the rack entrance a, it contacts the guide surface 511 of the first limiting member 51 and adjusts its entry posture and orientation, so that shelf b achieves a correct posture. Shelf b passes through the rack entrance a and enters the stacking area (i.e., the space above the lifting moving platform 11). It contacts the guide surface 511 or positioning surface 521 of the second limiting member 52, makes a final lateral position correction and continues to maintain this posture to continue moving. Finally, it stops moving after contacting the blocking surface 531 of the third limiting member 53.

[0054] When stacking, such as Figure 7 As shown in process A, after the shelf b has been adjusted to a limiting posture, it is located in the stacking area (i.e., the space above the lifting and moving platform 11); as Figure 8As shown in process B, the drive motor 22 is started to drive the active component 231 (i.e., the drive gear). The active component 231 drives the driven component 232 (i.e., the driven gear) through the transmission component 233 (i.e., the transmission gear). The driven component 232 drives the transmission shaft 21 to rotate relative to the inner housing 4 of the frame. The transmission shaft 21 drives the piston component 242 to move in a directional direction relative to the piston bushing 45 through the crank component 241 and the connecting rod component 243. The piston component 242 lifts and pushes the lifting platform 11 toward the shelf b above, and lifts the shelf b. When the lifting platform 11 stacks the shelf b on top, the shelf b pushes aside the movable pallets 72 along the way, and the shelf b reaches the stacking position; as Figure 9 As shown in process C, the movable support plate 72 elastically returns to its original position in the support groove of the fixed support 71 under the influence of the elastic deformation member 73; as Figure 10 As shown in process D, the piston 242, under the influence of the crank 241 and the connecting rod 243, drives the lifting and moving platform 11 to move downward in a directional direction. The lifting and moving platform 11 returns to a position lower than the movable pallet 72, and the shelf b is stuck on the upper surface of the movable pallet 72. Multiple movable pallets 72 simultaneously support the shelf b, so that the shelf b is positioned and stacked on the movable pallet 72, realizing the stacking of the shelf b.

[0055] Using the same steps as above, the lifting device 1 pushes the second-level shelf through the lifting mobile platform 11, lifting the second-level shelf from the bottom of the first-level shelf upwards. The second-level shelf then falls onto the movable pallet 72, realizing the stacking of subsequent shelves. After the shelves are stacked to a certain height, the stack is transferred to the designated cargo area by the robotic arm.

[0056] The above examples are merely illustrative of the technical content of this utility model to facilitate reader understanding, but do not imply that the implementation of this utility model is limited to these embodiments. Any technical extensions or re-creations made based on this utility model are protected by this utility model. The scope of protection of this utility model is defined by the claims.

Claims

1. A semiconductor stacking device, characterized in that: The device includes a lifting and hoisting device (1) for stacking shelves and a frame housing (3) for limiting the stacking position of the shelves. The lifting and hoisting device (1) includes a lifting and moving platform (11) for supporting the shelves and a lifting transmission mechanism (2) for driving the movement. The frame housing (3) includes a frame entrance a for the shelves to slide into and a one-way movable support (7) for supporting the shelves. When the shelves enter the lifting and moving platform (11) from the frame entrance a, the lifting transmission mechanism (2) drives the lifting and moving platform (11) to move vertically up and down, so that the shelves can be placed on the one-way movable support (7).

2. The semiconductor stacking device according to claim 1, characterized in that: The lifting and raising device (1) includes a transmission shaft (21) for transmitting power and a drive motor (22) for providing power. The transmission shaft (21) is hinged to the inner box (4) of the frame of the lifting and raising device (1). The drive motor (22) is fixedly connected to the inner box (4) of the frame. The drive motor (22) drives the transmission shaft (21) to rotate through the first transmission mechanism (23). The transmission shaft (21) drives the lifting and moving platform (11) to move vertically up and down through the second transmission mechanism (24).

3. A semiconductor stacking device according to claim 2, characterized in that: The first transmission mechanism (23) includes an active member (231) installed at the output end of the drive motor (22), a driven member (232) installed on the transmission shaft (21), and a transmission member (233) installed between the active member (231) and the driven member (232). When the drive motor (22) starts, the active member (231) drives the driven member (232) through the transmission member (233) so that the transmission shaft (21) rotates.

4. A semiconductor stacking device according to claim 2, characterized in that: The second transmission mechanism (24) includes a crank (241) fixedly connected to the transmission shaft (21), a piston (242) mounted on the lifting moving platform (11), and a connecting rod (243) hinged between the crank (241) and the piston (242). When the transmission shaft (21) rotates, the crank (241) drives the piston (242) to move up and down in the vertical direction through the connecting rod (243).

5. A semiconductor stacking device according to claim 1, characterized in that: The one-way movable support (7) includes a fixed support (71) and a movable support plate (72). The fixed support (71) is installed on the side plates (31) of the frame located on both sides of the outer casing (3) of the frame. The movable support plate (72) has a hinged end that is hinged to the fixed support (71). The supporting end of the movable support plate (72) for placing the shelf is located between the lifting moving platform (11) and the side plate (31) of the frame.

6. A semiconductor stacking device according to claim 5, characterized in that: An elastic deformation member (73) is installed between the fixed support (71) and the movable support plate (72). The bottom of the movable support plate (72) is in contact with the support groove surface of the fixed support (71) due to the elastic tension of the elastic deformation member (73). When the movable support plate (72) is disengaged from the support groove, the movable support plate (72) is elastically reset on the support groove by the elastic deformation member (73).

7. A semiconductor stacking device according to claim 1, characterized in that: The rack outer casing (3) includes a guide limiting component (5) for restricting the entry position of the rack. The guide limiting component (5) includes a first limiting member (51) for correcting the forward direction of the rack, a second limiting member (52) for restricting the lateral position of the rack, and a third limiting member (53) for blocking the forward movement of the rack. The first limiting member (51) is located in the rack outer casing (3) near the rack entrance a, and the third limiting member (53) is located in the rack outer casing (3) away from the rack entrance a. The second limiting member (52) is located between the first limiting member (51) and the third limiting member (53).

8. A semiconductor stacking device according to claim 7, characterized in that: The first limiting member (51) and / or the second limiting member (52) have guide surfaces (511) that open on both sides toward the rack entry direction on the side near the rack entrance a, the third limiting member (53) has a blocking surface (531) for blocking the movement of the rack on the side toward the lifting moving platform (11), and the second limiting member (52) has a positioning surface (521) for limiting the lateral position of the rack on the side toward the lifting moving platform (11).

9. A semiconductor stacking device according to any one of claims 1-8, characterized in that: The outer casing (3) of the rack includes rack side plates (31) located on the left and right sides of the rack in the forward direction. The rack side plates (31) facing the lifting moving platform (11) are equipped with a load-bearing pulley group (6) for the rack to slide. The load-bearing pulley group (6) has a number of soft rubber pulleys (61) arranged at intervals along the forward direction of the rack. The horizontal installation height of the soft rubber pulleys (61) is higher than the lowest point of the lifting moving platform (11) and lower than the highest point of the lifting moving platform (11). The number of soft rubber pulleys (61) are located on the same horizontal plane.

10. A semiconductor stacking device according to any one of claims 1-8, characterized in that: The lifting and moving platform (11) includes at least two guide columns (41) for limiting the direction of movement. The guide columns (41) are installed on the inner box (4) of the frame of the lifting and raising device (1). The inner box (4) of the frame is equipped with guide bushings (42) for limiting the position of the guide columns (41).

Images