Multi-layer circuit board through hole pulse electroplating device

Abstract

The utility model relates to the technical field of electroplating devices, in particular to a multilayer circuit board through hole pulse electroplating device. According to the technical scheme, the electroplating device comprises a bottom plate, a filter box, an electroplating tank, a mounting frame, a storage frame and a vibration motor, the filter box is arranged at the upper end of the bottom plate, the electroplating tank is arranged at the upper end of the filter box, a hydraulic rod is arranged above the electroplating tank, the mounting frame is arranged at the lower end of the hydraulic rod, and the storage frame is arranged below the mounting frame; guide plates are arranged at the two ends of the storage frame, springs are arranged between the guide plates and the mounting frame, and a vibration motor is arranged on the rear side of the lower end of the mounting frame. When the multi-layer circuit board through holes are subjected to pulse electroplating processing, the storage frame for storing the multi-layer circuit board is connected with the vibration structure, so that shaking is realized, and the problems that bubbles are formed in the through holes sometimes due to the fact that the through holes are small, and part of the through holes cannot be subjected to effective electroplating processing are solved.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to a pulse electroplating device for through-holes of multilayer circuit boards. Background Technology

[0002] Multilayer circuit boards typically contain numerous vias for connecting conductive signals between different layers. By using a pulse electroplating device, these vias can be electroplated to ensure the uniformity and density of the metal deposition layer within them, thereby improving the signal transmission performance of the circuit board, reducing signal loss, and enhancing the reliability of the circuit board.

[0003] However, during the electroplating process of multilayer circuit boards, due to the small size of the through holes, air bubbles sometimes form in the through holes, resulting in some through holes being unable to undergo effective electroplating, which in turn affects the production quality of multilayer circuit boards. To address this issue, we propose a pulse electroplating device for through holes of multilayer circuit boards. Utility Model Content

[0004] The purpose of this invention is to address the problems existing in the background technology by proposing a pulse electroplating device for through-holes of multilayer circuit boards.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a multilayer circuit board through-hole pulse electroplating device, comprising a base plate, a filter box, an electroplating tank, a mounting frame, a storage frame, and a vibration motor. The filter box is provided at the upper end of the base plate, the electroplating tank is provided at the upper end of the filter box, a hydraulic rod is provided above the electroplating tank, the mounting frame is provided at the lower end of the hydraulic rod, the storage frame is provided below the mounting frame, guide plates are provided at both ends of the storage frame, springs are provided between the guide plates and the mounting frame, and a vibration motor is provided at the rear side of the lower end of the mounting frame.

[0006] Preferably, the upper end of the mounting frame is provided with symmetrically distributed bearing brackets, and screws with relatively distributed threads are rotatably mounted inside the bearing brackets. Nuts with symmetrical distribution are rotatably sleeved on the outer wall of the screws. The screws are rotatably supported at the upper end of the mounting frame through the bearing brackets.

[0007] Preferably, each nut has a clamping plate at its lower end, and each clamping plate has a sleeve plate at its rear end. The sleeve plate is slidably mounted on the inner rear wall of the mounting frame. The clamping plate slides on the inner rear wall of the mounting frame via the sleeve plate, guiding the sleeve plate and thus guiding the clamping plate.

[0008] Preferably, a guide rod is slidably inserted inside the guide plate, with its upper end connected to the lower end of the mounting frame and located inside the spring. The guide rod is slidably supported inside the guide plate, and the storage frame slides on the outer wall of the guide rod via the guide plate, thereby limiting the spring and preventing it from shifting outward.

[0009] Preferably, a liquid pump is installed at both ends of the electroplating tank, and the two ends of the liquid pump are respectively connected to the electroplating tank and the filter box. The liquid pump draws the electroplating solution from inside the electroplating tank and then delivers it to the filter box.

[0010] Preferably, the filter box is equipped with multiple sets of filter screens, and the lower inner wall of the storage frame is provided with equally spaced support strips. Metal ions, organic matter, or other impurities contained in the electroplating solution are removed by filtration through the filter screens, and the support strips provide multi-point support for the circuit board.

[0011] Preferably, the outer wall of one end of the screw is provided with rotating rods arranged in a ring array, the outer wall of the hydraulic rod is sleeved with a mounting bracket, the upper end of the filter box is provided with an electromagnetic guide rail, and the lower end of the mounting bracket is provided with an electromagnetic slider slidably mounted on the outer wall of the electromagnetic guide rail. When rotating the screw, the screw is rotated by gripping the rotating rods, which facilitates the application of force to the screw rotation.

[0012] Preferably, an opening and closing door is rotatably mounted on the front end of the filter box. A sealing gasket is provided at the opposite end of the opening and closing door and the filter box. The opening and closing door is bolted to the filter box. The opening and closing door controls the opening and closing of the filter box, the sealing gasket improves the sealing of the contact surface, and the opening and closing door is fixed to the front end of the filter box by bolts.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0014] 1. This utility model uses a storage frame to store multi-layer circuit boards. A hydraulic rod drives the storage frame into an electroplating tank. Electroplating is performed on the internal through-holes of the multi-layer circuit boards using the solution inside the electroplating tank. During the electroplating process, a vibration motor operates, and the mounting frame, being elastically installed with the storage frame, causes the storage frame to vibrate, which in turn causes the internal multi-layer circuit boards to vibrate. This prevents the formation of air bubbles in the internal through-holes of the multi-layer circuit boards or ensures that the electroplating solution is fully immersed in the through-holes, thereby improving the electroplating quality of the internal through-holes of the multi-layer circuit boards. Attached Figure Description

[0015] Figure 1 This is a front-view three-dimensional structural diagram of the present invention;

[0016] Figure 2 This is a side view of the three-dimensional structure of the present invention;

[0017] Figure 3 This is a rear-view three-dimensional structural diagram of the present invention;

[0018] Figure 4 This is a top sectional three-dimensional structural diagram of the filter box of this utility model;

[0019] Figure 5 This is a top-view perspective view of the storage frame of this utility model.

[0020] Reference numerals: 1. Base plate; 2. Filter box; 3. Liquid pump; 4. Electromagnetic guide rail; 5. Electroplating tank; 6. Mounting bracket; 7. Hydraulic rod; 8. Mounting frame; 9. Storage frame; 10. Opening door; 11. Electromagnetic slider; 12. Filter screen; 13. Nut; 14. Vibration motor; 15. Screw; 16. Clamping plate; 17. Bearing bracket; 18. Rotary rod; 19. Guide rod; 20. Support bar; 21. Guide plate; 22. Spring; 23. Sleeve plate. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1-5 As shown, the present invention proposes a multilayer circuit board through-hole pulse electroplating device, including a base plate 1, a filter box 2, an electroplating tank 5, a mounting frame 8, a storage frame 9, and a vibration motor 14. The filter box 2 is provided on the upper end of the base plate 1, the electroplating tank 5 is provided on the upper end of the filter box 2, a hydraulic rod 7 is provided above the electroplating tank 5, the mounting frame 8 is provided at the lower end of the hydraulic rod 7, the storage frame 9 is provided below the mounting frame 8, guide plates 21 are provided at both ends of the storage frame 9, and springs 22 are provided between the guide plates 21 and the mounting frame 8. The vibration motor 14 is provided on the rear side of the lower end of the mounting frame 8.

[0023] A guide rod 19, whose upper end is connected to the lower end of the mounting frame 8 and is located inside the spring 22, is slidably inserted into the guide plate 21.

[0024] The upper end of the mounting frame 8 is provided with symmetrically distributed bearing brackets 17. Inside the bearing brackets 17, screws 15 with relatively distributed threads are rotatably installed. Nuts 13 with symmetrical distribution are rotatably sleeved on the outer wall of the screws 15.

[0025] Each nut 13 has a clamping plate 16 at its lower end, and a sleeve plate 23 is provided at the rear end of each clamping plate 16. The sleeve plate 23 is slidably installed on the inner wall of the rear side of the mounting frame 8.

[0026] One end of the screw 15 has a ring-shaped array of rotating rods 18 on its outer wall. The hydraulic rod 7 is fitted with a mounting bracket 6 on its outer wall. The filter box 2 has an electromagnetic rail 4 on its upper end. The mounting bracket 6 has an electromagnetic slider 11 that is slidably mounted on the outer wall of the electromagnetic rail 4 on its lower end.

[0027] Based on the implementation steps of Embodiment 1: During use, the storage frame 9 is located above the electroplating tank 5. The multilayer circuit board is placed on the support bar 20, ensuring that the lower end of the multilayer circuit board is not obscured. The gripping screw 18 drives the screw 15 to rotate. Because the clamping plate 16 is guided by the sleeve plate 23, it moves relative to the clamping plate 16, clamping the multilayer circuit board and stabilizing it on the support bar 20 of the storage frame 9. The electromagnetic slider 11 is slidably installed on the outer wall of the electromagnetic guide rail 4, driving the mounting frame 6 to move laterally, located in the electroplating tank 5. When in the upper position, the hydraulic rod 7 drives the mounting frame 8 to descend, and the storage frame 9 is immersed in the electroplating tank 5. The vibration motor 14 operates, causing the spring 22 to vibrate, which in turn causes the storage frame 9 to vibrate. The multilayer circuit board follows the vibration of the storage frame 9, and the air bubbles in the through holes of the multilayer circuit board burst, preventing the air bubbles from obstructing the electroplating solution from entering the through holes. It also avoids the situation where the through holes are too small and the electroplating solution cannot be completely immersed in the through holes. The through holes of the multilayer circuit board are in effective contact with the electroplating solution, realizing effective through-hole electroplating of the multilayer circuit board and improving the pulse electroplating quality of the multilayer circuit board.

[0028] like Figures 1-5 As shown, compared with Embodiment 1, the multilayer circuit board through-hole pulse electroplating device proposed in this utility model further includes: liquid pumps 3 are provided at both ends of the electroplating tank 5, and the two ends of the liquid pumps 3 are respectively connected to the electroplating tank 5 and the filter box 2;

[0029] The filter box 2 is equipped with multiple sets of filter screens 12;

[0030] A door 10 is rotatably installed at the front end of the filter box 2. A sealing gasket is provided on the opposite end of the door 10 and the filter box 2. The door 10 and the filter box 2 are installed by bolts.

[0031] In this embodiment, during the use of the electroplating solution, two liquid pumps 3 operate to draw the electroplating solution from the electroplating tank 5 into the filter box 2. Metal ions, organic matter, or other impurities in the electroplating solution are filtered through the filter screen 12. The filtered electroplating solution is then drawn back into the electroplating tank 5 by the liquid pumps 3, thereby circulating the electroplating solution and improving its utilization rate.

[0032] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

[0033] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A multilayer circuit board through-hole pulse electroplating device, comprising a base plate (1), a filter box (2), an electroplating tank (5), a mounting frame (8), a storage frame (9), and a vibration motor (14), characterized in that: A filter box (2) is provided on the upper end of the base plate (1), an electroplating tank (5) is provided on the upper end of the filter box (2), a hydraulic rod (7) is provided above the electroplating tank (5), an installation frame (8) is provided at the lower end of the hydraulic rod (7), a storage frame (9) is provided below the installation frame (8), guide plates (21) are provided at both ends of the storage frame (9), springs (22) are provided between the guide plates (21) and the installation frame (8), and a vibration motor (14) is provided on the rear side of the lower end of the installation frame (8).

2. The multilayer circuit board through-hole pulse electroplating device according to claim 1, characterized in that: The upper end of the mounting frame (8) is provided with symmetrically distributed bearing brackets (17), and the bearing brackets (17) are rotatably installed with screws (15) with relatively distributed threads, and the outer wall of the screws (15) is rotatably sleeved with symmetrically distributed nuts (13).

3. The multilayer circuit board through-hole pulse electroplating device according to claim 2, characterized in that: Each nut (13) has a clamping plate (16) at its lower end, and a sleeve plate (23) is provided at the rear end of each clamping plate (16). The sleeve plate (23) is slidably installed on the inner wall of the rear side of the mounting frame (8).

4. The multilayer circuit board through-hole pulse electroplating device according to claim 1, characterized in that: The guide plate (21) has a guide rod (19) whose upper end is connected to the lower end of the mounting frame (8) and is located inside the spring (22).

5. The multilayer circuit board through-hole pulse electroplating device according to claim 1, characterized in that: The electroplating tank (5) is equipped with a liquid pump (3) at both ends, and the two ends of the liquid pump (3) are connected to the electroplating tank (5) and the filter box (2) respectively.

6. The multilayer circuit board through-hole pulse electroplating apparatus according to claim 1, characterized in that: The filter box (2) is equipped with multiple sets of filter screens (12), and the storage frame (9) has equidistantly distributed support strips (20) on its lower inner wall.

7. The multilayer circuit board through-hole pulse electroplating apparatus according to claim 2, characterized in that: The screw (15) has a ring array of rotating rods (18) on one end of its outer wall. The hydraulic rod (7) is fitted with a mounting bracket (6) on its outer wall. The filter box (2) has an electromagnetic guide rail (4) on its upper end. The mounting bracket (6) has an electromagnetic slider (11) that is slidably mounted on the outer wall of the electromagnetic guide rail (4) on its lower end.

8. The multilayer circuit board through-hole pulse electroplating apparatus according to claim 1, characterized in that: The filter box (2) is rotatably mounted with an opening and closing door (10). The opening and closing door (10) and the filter box (2) are both provided with sealing gaskets at opposite ends. The opening and closing door (10) and the filter box (2) are installed by bolts.

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