Laminar flow air drying machine for semiconductor substrate wafer

Abstract

The utility model discloses a laminar flow air drying machine for a semiconductor substrate wafer, which relates to the technical field of semiconductor wafer drying, and comprises a lifting mechanism, a track base and a support arm arranged on one side of the track base, and a guide assembly is arranged between the track base and the support arm; and the drying mechanism comprises a water tank arranged below the supporting arm, a bracket is fixedly connected to one side wall of the lower end of the supporting arm, the bracket is composed of a plurality of silicon wafer seat rods, and cavities are formed in the silicon wafer seat rods. According to the laminar flow air drying machine for the semiconductor substrate wafer, the wafer is placed on the silicon wafer seat rod, the silicon wafer seat rod is provided with the plurality of cavities, the cavities are communicated with the air guide pipe, further, a worker drives the suction fan, and under the action of negative pressure, the cavities attract a water film on the surface of the wafer to move downwards, so that the wafer is dried, and the wafer is dried. Therefore, the effect of completely stripping moisture on the surface of the wafer is achieved, the operation is simple, convenient and safe, the cost is saved, and the drying device does not need to use any chemical substance and does not cause environmental pollution.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer drying technology, and in particular to a laminar flow air dryer for semiconductor substrate wafers. Background Technology

[0002] The mainstream drying technology for semiconductor substrate wafers (Si, SiC, compound semiconductors, etc.) is a combination of online spin drying and slow lifting with infrared heating. Spin drying uses centrifugal force to remove water droplets from the wafer surface. The slow lifting combined with infrared heating technology first uses the surface tension of water to slowly lift the wafer from the water, and then dries the wafer with infrared heating.

[0003] The existing semiconductor substrate wafer drying technology has the following shortcomings: (1) The drying effect is not good. Although the spin drying method can remove water droplets, it will leave extremely small water droplets. The slow lifting combined with infrared heating drying technology also leaves extremely small water mist molecules, which causes tiny water ripples or watermarks to form on the wafer surface during infrared heating. These tiny watermarks seriously affect the quality of the finished wafer. (2) The drying time required by the above-mentioned known drying methods is long, which affects the production efficiency, has low practicality, and is not convenient for widespread use. Utility Model Content

[0004] The purpose of this invention is to provide a laminar flow drying machine for semiconductor substrate wafers to solve the problems mentioned in the background art.

[0005] To solve the above problems, the technical solution adopted by this utility model is as follows:

[0006] Laminar flow drying equipment for semiconductor substrate wafers, including

[0007] The lifting mechanism includes a track base and a support arm disposed on one side of the track base. A guide assembly is provided between the track base and the support arm. A servo motor is fixedly connected to the upper wall of the track base. The output end of the servo motor is connected to a lead screw through a coupling. A lifting block is movably connected to the outside of the lead screw. One side wall of the lifting block is fixedly connected to one side wall of the support arm.

[0008] The drying mechanism includes a water tank located below a support arm. A bracket is fixedly connected to one side wall of the lower end of the support arm. The bracket is composed of multiple silicon wafer holders. Each silicon wafer holder has a cavity inside and several holes communicating with the cavity are opened on the outer wall of the silicon wafer holder. An air duct communicating with the cavity is provided on the outer wall of the silicon wafer holder, and a negative pressure component is provided on one side of the air duct.

[0009] Preferably, the guide assembly includes a slide rail and a slider. The two slide rails are symmetrically and fixedly disposed on one side wall of the track base. The slider is slidably connected to one side of the slide rail, and one side wall of the slider is fixedly connected to one side wall of the support arm.

[0010] Preferably, the negative pressure component includes a suction fan and a main air duct, one end of which is connected to the end of the air guide duct away from the silicon wafer support rod.

[0011] Preferably, the negative pressure component further includes an air purification box, which is connected to the end of the suction fan, and the end of the main air duct away from the air guide duct is connected to the side wall of the air purification box.

[0012] Compared with the prior art, this utility model has the following advantages:

[0013] This invention can completely remove moisture from the surface of wafers, leaving no extremely small water droplets or water mist molecules, which can greatly improve the drying effect and yield. It is easy and safe to operate, saves costs, and this drying device does not require the use of any chemicals, so it will not cause environmental pollution.

[0014] This invention places the wafer on a silicon wafer holder, which has several cavities connected to a ventilation duct. Furthermore, the operator drives a suction fan, and under negative pressure, the cavities draw the water film on the wafer surface downwards, thereby achieving the effect of removing the moisture from the wafer surface. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall external structure of a laminar flow dryer for semiconductor substrate wafers.

[0016] Figure 2 A first-view structural schematic diagram of a laminar flow air dryer for semiconductor substrate wafers;

[0017] Figure 3 For laminar flow drying of semiconductor substrate wafers Figure 2 A magnified view of a portion of point A in the middle.

[0018] In the diagram: 100, lifting mechanism; 101, track base; 102, support arm; 103, servo motor; 104, lead screw; 105, slide rail; 106, slider; 200, drying mechanism; 201, water tank; 202, silicon wafer support rod; 203, air duct; 204, exhaust fan; 205, main air duct; 206, air purification box. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1:

[0021] Please see Figures 1-3 As shown, this utility model is a laminar flow drying machine for semiconductor substrate wafers, including...

[0022] The lifting mechanism 100 includes a track base 101 and a support arm 102 disposed on one side of the track base 101. A guide assembly is provided between the track base 101 and the support arm 102. A servo motor 103 is fixedly connected to the upper wall of the track base 101. The output end of the servo motor 103 is connected to a lead screw 104 through a coupling. A lifting block is movably connected to the outside of the lead screw 104. One side wall of the lifting block is fixedly connected to one side wall of the support arm 102.

[0023] The drying mechanism 200 includes a water tank 201 located below the support arm 102. A bracket is fixedly connected to one side wall of the lower end of the support arm 102. The bracket is composed of multiple silicon wafer support rods 202. The silicon wafer support rods 202 have cavities inside and several holes communicating with the cavities are opened on the outer wall of the silicon wafer support rods 202. A duct 203 communicating with the cavities is provided on the outer wall of the silicon wafer support rods 202. A negative pressure component is provided on one side of the duct 203.

[0024] Depend on Figures 1-2 It is known that the guide assembly includes a slide rail 105 and a slider 106. The two slide rails 105 are symmetrically and fixedly disposed on one side wall of the track base 101. The slider 106 is slidably connected to one side of the slide rail 105. One side wall of the slider 106 is fixedly connected to one side wall of the support arm 102.

[0025] As can be seen from the above, during use, the operator drives the servo motor 103, which in turn drives the lead screw 104 to rotate. By utilizing the characteristics of the lifting block externally connected to the lead screw 104 and the sliding block 106 slidably connected to one side of the slide rail 105, the support arm 102 is driven to rise, further pulling the wafer slowly out of the pure water. Afterwards, the operator introduces clean air with negative pressure from above the wafer. The laminar airflow passes over the wafer surface, and the water forms a thin water film on the wafer surface, which flows downward under the action of gravity, playing a preliminary drying role.

[0026] Example 2:

[0027] The lifting mechanism 100 includes a track base 101 and a support arm 102 disposed on one side of the track base 101. A guide assembly is provided between the track base 101 and the support arm 102. A servo motor 103 is fixedly connected to the upper wall of the track base 101. The output end of the servo motor 103 is connected to a lead screw 104 through a coupling. A lifting block is movably connected to the outside of the lead screw 104. One side wall of the lifting block is fixedly connected to one side wall of the support arm 102.

[0028] The drying mechanism 200 includes a water tank 201 located below the support arm 102. A bracket is fixedly connected to one side wall of the lower end of the support arm 102. The bracket is composed of multiple silicon wafer support rods 202. The silicon wafer support rods 202 have cavities inside and several holes communicating with the cavities are opened on the outer wall of the silicon wafer support rods 202. A duct 203 communicating with the cavities is provided on the outer wall of the silicon wafer support rods 202. A negative pressure component is provided on one side of the duct 203.

[0029] refer to Figures 1-3 As shown, the negative pressure assembly includes a suction fan 204 and a main air duct 205. One end of the main air duct 205 is connected to the end of the air guide duct 203 away from the silicon wafer support rod 202.

[0030] The negative pressure assembly also includes an air purification box 206, which is connected to the end of the suction fan 204, and the end of the main air duct 205 away from the air guide duct 203 is connected to the side wall of the air purification box 206.

[0031] As can be seen from the above, the wafer is placed on the silicon wafer holder 202, which has several cavities and is connected to the air duct 203. Furthermore, the operator drives the suction fan 204, and under the action of negative pressure, the cavity attracts the water film on the surface of the wafer to move downward, thereby achieving the effect of removing the moisture from the surface of the wafer. In addition, this utility model can also perform a laminar flow drying process separately outside the pure water tank 201, and the structural design is user-friendly.

[0032] All standard parts used in this invention can be purchased from the market, and irregularly shaped parts can be customized according to the description and drawings. The specific connection methods for each part all employ conventional methods such as bolts, rivets, and welding, which are mature technologies in the prior art. The machinery, parts, and equipment all use conventional models in the prior art, and the circuit connections also use conventional connection methods in the prior art, which will not be detailed here. Any content not described in detail in this specification belongs to the prior art known to those skilled in the art.

[0033] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0034] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0035] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0037] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0038] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A laminar flow drying machine for semiconductor substrate wafers, characterized in that: include The lifting mechanism (100) includes a track base (101) and a support arm (102) disposed on one side of the track base (101). A guide assembly is provided between the track base (101) and the support arm (102). A servo motor (103) is fixedly connected to the upper wall of the track base (101). The output end of the servo motor (103) is connected to a lead screw (104) through a coupling. A lifting block is movably connected to the outside of the lead screw (104). One side wall of the lifting block is fixedly connected to one side wall of the support arm (102). The drying mechanism (200) includes a water tank (201) disposed below the support arm (102). A bracket is fixedly connected to one side wall of the lower end of the support arm (102). The bracket is composed of multiple silicon wafer holder rods (202). The silicon wafer holder rod (202) has a cavity inside and several holes communicating with the cavity are opened on the outer wall of the silicon wafer holder rod (202). The outer wall of the silicon wafer holder rod (202) is provided with an air guide pipe (203) communicating with the cavity. A negative pressure component is provided on one side of the air guide pipe (203).

2. The laminar flow drying machine for semiconductor substrate wafers according to claim 1, characterized in that: The guide assembly includes a slide rail (105) and a slider (106). The two slide rails (105) are symmetrically and fixedly disposed on one side wall of the track base (101). The slider (106) is slidably connected to one side of the slide rail (105). One side wall of the slider (106) is fixedly connected to one side wall of the support arm (102).

3. The laminar flow drying machine for semiconductor substrate wafers according to claim 1, characterized in that: The negative pressure assembly includes a suction fan (204) and a main air duct (205), one end of which is connected to the end of the air guide duct (203) away from the silicon wafer support rod (202).

4. The laminar flow drying machine for semiconductor substrate wafers according to claim 3, characterized in that: The negative pressure assembly also includes an air purification box (206), which is connected to the end of the suction fan (204), and the end of the main air duct (205) away from the air guide duct (203) is connected to the side wall of the air purification box (206).

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