Common inductance type laser image fusion distance sensing device
By using a shared-sensing laser image fusion distance sensing device, which utilizes a CMOS sensor shared by a reflector and a semi-reflective lens, combined with an LED fill light, the high cost and large space occupation caused by the independent laser displacement sensor and 2D camera lens are solved, achieving accurate distance measurement and convenient installation.
Patent Information
- Application Number
- CN202422836205.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-11-20
AI Technical Summary
Existing laser displacement sensors and 2D camera lenses are relatively independent, costly, space-consuming, and require subsequent calibration and maintenance, resulting in high maintenance costs.
The device employs a shared-sensor laser image fusion distance sensing device. By setting a reflector and a semi-reflective lens inside the housing, the laser receiving lens module and the image receiving lens module share a single CMOS sensor. Combined with an LED fill light, it achieves dynamic object visual positioning, and the positional relationship is calibrated before leaving the factory.
It reduces the cost of ranging sensors, minimizes their footprint, simplifies the installation process, reduces maintenance requirements, and enables accurate ranging of dynamic objects.
Smart Images
Figure CN223539001U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of distance sensing devices, and particularly relates to a co-sensing laser image fusion distance sensing device. Background Technology
[0002] Currently, high-precision distance measurement on the market primarily uses laser displacement sensors. Laser displacement sensors operate on the principle of triangulation. A laser emitter emits a laser beam; when the laser strikes the surface of a target object, some of the light is reflected back to the sensor's photosensitive element. By analyzing the position of the laser spot on the photosensitive element and the relative position of the photosensitive element to the laser emitter, the precise distance between the measured surface and the sensor can be calculated.
[0003] However, currently, when the object being measured is dynamic, the laser displacement sensor cannot determine the object's real-time position. Therefore, the position where the laser shines on the object's surface changes, and the measured value is not the true value of the location of interest, causing measurement errors. Current technology can use a vision system consisting of a two-dimensional camera lens to locate the object's real-time position, thereby informing the mechanical structure to adjust the position of the laser displacement sensor and achieve accurate measurement of the location of interest. While this functionality is achieved, the two measurement systems are relatively independent, resulting in high costs and large space requirements. The positional relationship between the camera and the laser displacement sensor needs to be calibrated after installation, and subsequent loosening requires recalibration, leading to high maintenance costs. Utility Model Content
[0004] The purpose of this invention is to provide a common-sensor laser image fusion distance sensing device to address the current problems of relatively independent laser displacement sensors and 2D camera lenses, high cost, large space occupation, and the need for post-installation calibration of the positional relationship between the camera and the laser displacement sensor, which requires recalibration if the sensor becomes loose, resulting in high maintenance costs.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a co-sensing laser image fusion distance sensing device, comprising a housing, wherein a CMOS sensor, a motherboard, an image receiving lens module, a laser receiving lens module and a laser emitter are disposed on the inner walls of both sides of the housing, a reflector and a semi-reflective lens are disposed in the middle position of the housing, a communication power supply interface is disposed on the side end of the housing, and a top cover is disposed on the housing.
[0006] As a further description of the above technical solution:
[0007] The motherboard is fixed to the inner wall of the housing by screws. A thermally conductive silicone pad is attached to the back of the motherboard. The CMOS sensor is connected to the motherboard. The motherboard is also provided with wiring terminals.
[0008] As a further description of the above technical solution:
[0009] A rubber pad is provided between the communication power supply interface and the outer casing.
[0010] As a further description of the above technical solution:
[0011] One side of the outer casing has an inwardly recessed surface, and laser protective lenses are provided on both the recessed surface and the laser receiving lens module.
[0012] As a further description of the above technical solution:
[0013] The laser emitter is connected to the laser limiting stage, and the laser clamping plate is pressed onto the laser emitter.
[0014] As a further description of the above technical solution:
[0015] The laser protective mirror is equipped with an anti-reflective coating.
[0016] As a further description of the above technical solution:
[0017] The housing contains a lens module mounting platform, and the lens module mounting platform is provided with a lens module limiting groove. The laser receiving lens module is connected to the lens module limiting groove.
[0018] As a further description of the above technical solution:
[0019] The housing contains a square platform with a limiting groove. The bottom of the image receiving lens is connected to the limiting groove, and the rear end of the image receiving lens is connected to the fill light circuit board.
[0020] As a further description of the above technical solution:
[0021] The outer casing is provided with several through holes and mounting holes. Several LED fill lights pass through the through holes and are connected to the fill light circuit board. The image receiving protective window is installed in the mounting holes.
[0022] As a further description of the above technical solution:
[0023] The reflector and the semi-reflective lens are respectively located between the motherboard and the laser receiving lens module, and between the motherboard and the image receiving lens module. The reflector is connected to the reflector base, and the semi-reflective lens is connected to the lens base.
[0024] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are:
[0025] 1. In this utility model, by placing the reflector and the semi-reflective mirror between the motherboard and the laser receiving lens module, and between the motherboard and the image receiving lens module, respectively, a special optical path structure is used to enable the laser receiving lens module and the image receiving lens module to share a single CMOS sensor. This solution not only achieves the dynamic object visual positioning function, but also reduces the cost of the ranging sensor. By setting an LED fill light, no additional light source is needed during image acquisition, reducing costs and space occupation. Furthermore, the laser and image receiving lens modules are pre-calibrated at the factory, so subsequent installation does not require calibration of the relative positional relationship between the laser and the image sensor, making installation more convenient, the structure more compact, and maintenance costs lower.
[0026] 2. In this utility model, the motherboard is fixed to the upper part of the main body by screws. A thermally conductive silicone pad is attached to the back of the motherboard to achieve insulation and heat conduction functions. A CMOS sensor is designed on the motherboard for image reception, converting optical signals into electrical signals to achieve photoelectric conversion of images. In addition, the CMOS sensor can also receive reflected lasers. By accurately sensing the position of different pixels on the sensor and combining the positional relationship between the laser emission point and the receiving point on the CMOS sensor, the specific distance of the measured surface can be accurately calculated using the principle of triangulation. Attached Figure Description
[0027] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0028] Figure 1 This is a three-dimensional view of a co-sensing laser image fusion distance sensing device.
[0029] Figure 2 Decomposition of a co-sensing laser image fusion distance sensing device Figure 1 .
[0030] Figure 3 Decomposition of a co-sensing laser image fusion distance sensing device Figure 2 .
[0031] Figure 4 Decomposition of a co-sensing laser image fusion distance sensing device Figure 3 .
[0032] Legend:
[0033] 1-Housing; 2-CMOS sensor; 3-Main board; 4-Image receiving lens module; 5-Laser receiving lens module; 6-Laser emitter; 7-Reflector; 8-Semi-reflective lens; 9-Communication power supply interface; 10-Top cover; 11-Terminal block; 12-Concave surface; 13-Laser protection lens; 14-Laser limiting stage; 15-Laser clamping plate; 16-Lens module mounting platform; 17-Square platform; 18-Through hole; 19-Mounting hole; 20-Fill light circuit board; 21-Image receiving protection window; 22-LED fill light. Detailed Implementation
[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.
[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0037] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0038] In the description of the embodiments of this utility model, it should be noted that the terms "upper" and "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed when in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0039] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0040] Please see Figure 1-4 This utility model provides a technical solution: a co-sensing laser image fusion distance sensing device, including a housing 1. The inner walls on both sides of the housing 1 are provided with a CMOS sensor 2, a motherboard 3, an image receiving lens module 4, a laser receiving lens module 5, and a laser emitter 6. A reflector 7 and a semi-reflective lens 8 are provided in the middle of the housing 1. A communication power supply interface 9 is provided on the side of the housing 1. A top cover 10 is provided on the housing 1.
[0041] The motherboard 3 is fixed to the inner wall of the housing 1 by screws. A thermally conductive silicone pad is attached to the back of the motherboard 3. The CMOS sensor 2 is connected to the motherboard 3. The motherboard 3 is also provided with a terminal block 11.
[0042] A rubber pad is provided between the communication power supply interface 9 and the outer casing 1.
[0043] The outer casing 1 has an inwardly recessed surface 12 on one side, and a laser protective lens 13 is provided on both the concave surface 12 and the laser receiving lens module 5.
[0044] The laser emitter 6 is connected to the laser limiting stage 14, and the laser clamping plate 15 is pressed onto the laser emitter 6. The laser limiting stage is integrally formed from a shell, with a groove in the middle, and the same diameter as the laser emitter. It can precisely limit the left and right position of the laser. The laser emitter is placed on the laser limiting stage, and the laser clamping plate is fixed to the laser limiting stage by screws, pressing the laser and preventing it from shifting.
[0045] The laser protective mirror 13 is provided with an anti-reflective film. This reduces the reflection of the laser from the glass surface and increases the laser utilization rate. Silicone rubber is used to bond it to the through-hole of the outer shell to protect the laser from damage and contamination, while also achieving a seal on the outer shell.
[0046] The outer casing 1 contains a lens module mounting platform 16, which has a lens module limiting groove. The laser receiving lens module 5 is connected to the lens module limiting groove, thus achieving precise installation and positioning.
[0047] A square platform 17 is provided inside the housing 1. A limiting groove is provided inside the square platform 17. The bottom of the image receiving lens is connected to the limiting groove, and the rear end of the image receiving lens is connected to the fill light circuit board 20.
[0048] The outer casing 1 is provided with a plurality of through holes 18 and mounting holes 19. A plurality of LED fill lights pass through the through holes 18 and are connected to the fill light circuit board 20. The image receiving protective window is installed in the mounting holes 19.
[0049] The reflector 7 and the semi-reflective lens 8 are respectively located between the motherboard 3 and the laser receiving lens module 5, and between the motherboard 3 and the image receiving lens module 4. The reflector 7 is connected to the reflector base, and the semi-reflective lens 8 is connected to the lens base.
[0050] The outer casing has a reflector base, and the reflector is glued to the reflector base with the reflective surface facing outward. The outer casing also has a semi-reflective lens base, and the semi-reflective lens is glued to the semi-reflective lens base with the reflective surface facing the reflector. When the laser reflected by the object is received by the laser receiving lens module, it is directed towards the reflector. The reflector reflects the laser onto the semi-reflective lens, and the semi-reflective lens then reflects the laser onto the CMOS sensor, thus realizing the reception and sensing of the reflected laser.
[0051] The front end of the housing has four through holes. The LED fill light is installed in the through holes and fixed with glue, which realizes the fixation of the fill light and the sealing of the housing. The LED emits optical fiber to illuminate the surface of the object being measured. The optical fiber reflected by the surface of the object being measured passes through the image receiving lens and illuminates the light-transmitting surface of the semi-reflective lens, and then illuminates the CMOS sensor, realizing the reception and sensing of the object image light.
[0052] Working principle: By placing the reflector and semi-reflective mirror between the motherboard and the laser receiving lens module, and between the motherboard and the image receiving lens module, respectively, a special optical path structure enables the laser receiving lens module and the image receiving lens module to share a single CMOS sensor. This solution not only achieves dynamic object visual positioning but also reduces the cost of the ranging sensor. By setting an LED supplementary light, no additional light source is needed during image acquisition, reducing costs and space occupation. Furthermore, the laser and image receiving lens modules are pre-calibrated at the factory, eliminating the need to calibrate the relative positional relationship between the laser and image sensor during subsequent installation, making installation more convenient, the structure more compact, and maintenance costs lower.
[0053] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A co-sensing laser image fusion distance sensing device, characterized in that, The device includes a housing, on which a CMOS sensor, a motherboard, an image receiving lens module, a laser receiving lens module, and a laser emitter are disposed on the inner walls of both sides. A reflector and a semi-reflective lens are disposed in the middle of the housing. A communication power supply interface is disposed on the side of the housing. A top cover is disposed on the housing.
2. The co-sensing laser image fusion distance sensing device according to claim 1, characterized in that, The motherboard is fixed to the inner wall of the housing by screws. A thermally conductive silicone pad is attached to the back of the motherboard. The CMOS sensor is connected to the motherboard. The motherboard is also provided with wiring terminals.
3. The co-sensing laser image fusion distance sensing device according to claim 2, characterized in that, A rubber pad is provided between the communication power supply interface and the outer casing.
4. The co-sensing laser image fusion distance sensing device according to claim 1, characterized in that, One side of the outer casing has an inwardly recessed surface, and laser protective lenses are provided on both the recessed surface and the laser receiving lens module.
5. The co-sensing laser image fusion distance sensing device according to claim 1, characterized in that, The laser emitter is connected to the laser limiting stage, and the laser clamping plate is pressed onto the laser emitter.
6. The co-sensing laser image fusion distance sensing device according to claim 4, characterized in that... The laser protective mirror is provided with an anti-reflective coating.
7. The co-sensing laser image fusion distance sensing device according to claim 1, characterized in that, The housing contains a lens module mounting platform, and the lens module mounting platform is provided with a lens module limiting groove. The laser receiving lens module is connected to the lens module limiting groove.
8. The co-sensing laser image fusion distance sensing device according to claim 7, characterized in that, The housing contains a square platform with a limiting groove. The bottom of the image receiving lens is connected to the limiting groove, and the rear end of the image receiving lens is connected to the fill light circuit board.
9. A co-sensing laser image fusion distance sensing device according to claim 7, characterized in that, The outer casing has several through holes and mounting holes. Several LED fill lights pass through the through holes and are connected to the fill light circuit board. The image receiving protective window is installed in the mounting holes.
10. A co-sensing laser image fusion distance sensing device according to claim 7, characterized in that, The reflector and the semi-reflective lens are respectively located between the motherboard and the laser receiving lens module, and between the motherboard and the image receiving lens module. The reflector is connected to the reflector base, and the semi-reflective lens is connected to the lens base.