Computer mainboard fixing device

Abstract

The utility model discloses a computer mainboard fixing device which comprises a mainboard installing and fixing plate, side baffles are fixedly connected to the two sides of the top end of the mainboard installing and fixing plate respectively, and two air inlet flow guide bins are symmetrically and fixedly connected to one end of the mainboard installing and fixing plate. The end, close to the middle of the main plate mounting and fixing plate, of the air inlet flow guide bin is designed to be in an arc shape, an exhaust fan is fixedly mounted at the other end of the air inlet flow guide bin, and two dust removal outer frames are symmetrically and fixedly connected to the end, close to the air inlet flow guide bin, of the main plate mounting and fixing plate. And two second inserting grooves are symmetrically formed in the top end of the end, close to the air inlet flow guide bin, of the main board mounting and fixing plate, and second inserting frames are slidably inserted into the inner sides of the second inserting grooves. Through cooperative work of the air inlet flow guide bin and the exhaust fan, a targeted airflow path is formed, it is ensured that air flows above and below the mainboard, heat generated by the mainboard is effectively taken away, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of computer chassis, specifically a computer motherboard fixing device. Background Technology

[0002] With the continuous development of computer technology, high-performance processors and high-speed applications place increasingly higher demands on motherboard heat dissipation. Traditional motherboard mounting methods involve directly installing the motherboard into the computer case. Relying solely on case fans or natural convection often fails to meet the heat dissipation needs of the motherboard bottom under high loads in modern computers, easily leading to overheating, performance degradation, or even hardware damage. In addition, the accumulation of dust and impurities is also an important factor affecting computer stability and lifespan. Therefore, there is an urgent need for a computer motherboard mounting device to solve the above problems. Utility Model Content

[0003] The purpose of this invention is to provide a computer motherboard fixing device to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a computer motherboard fixing device, including a motherboard mounting plate, with side baffles fixedly connected to both sides of the top of the motherboard mounting plate, two air intake chambers symmetrically fixedly connected to one end of the motherboard mounting plate, the end of the air intake chamber near the middle of the motherboard mounting plate being arc-shaped, an exhaust fan fixedly installed at the other end of the air intake chamber, and two dust removal frames symmetrically fixedly connected to the end of the motherboard mounting plate near the air intake chamber.

[0005] Preferably, the motherboard mounting plate has two second insertion slots symmetrically opened at the top end near the air intake chamber. A second insertion frame is slidably inserted into the inner side of the second insertion slot, and a fine filter screen is fixedly installed on the inner side of the second insertion frame.

[0006] Preferably, the top of the dust removal frame is provided with a first insertion slot, a first insertion frame is movably inserted into the first insertion slot, and a coarse filter screen is fixedly installed inside the first insertion frame.

[0007] Preferably, motherboard support columns are uniformly fixedly connected to the top of the motherboard mounting plate, and rubber gaskets are fixedly installed on the top of the motherboard support columns.

[0008] Preferably, the air intake guide chamber has an air inlet through one end near the exhaust fan, the air inlet is matched with the exhaust fan, a support frame is fixedly connected to the top inner side of the air intake guide chamber, a protective cover is fixedly installed on the top of the support frame, and the protective cover is located inside the top of the air intake guide chamber.

[0009] Preferably, handles are fixedly connected to the top center of the first and second plug-in frames respectively.

[0010] Preferably, the top height of the rubber pad is lower than the top height of the side baffle.

[0011] Preferably, the height of the air intake guide chamber is designed to be twice the height of the side baffle.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] This utility model's motherboard is mounted in a suspended manner using motherboard support columns and rubber gaskets. This not only increases the gap between the motherboard and the mounting plate, facilitating airflow, but also reduces vibration and wear that might occur from direct contact between the motherboard and the motherboard support columns, improving system stability and durability. Through the coordinated operation of the air intake chamber and exhaust fan, a targeted airflow path is formed, ensuring airflow above and below the motherboard, effectively removing heat generated by the motherboard and improving heat dissipation efficiency. By incorporating coarse and fine filters, dust and other impurities can be effectively blocked from entering the motherboard, protecting the motherboard and other electronic components from contamination and extending the equipment's lifespan. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the main three-dimensional structure of the present utility model;

[0015] Figure 2 This is a schematic diagram of the main body disassembled structure in this utility model;

[0016] Figure 3 This is a schematic diagram of the main body disassembled structure in this utility model.

[0017] In the diagram: 1-Main board mounting plate; 2-Side baffle; 3-Air intake duct; 4-Exhaust fan; 5-Dust collector frame; 6-Main board support column; 7-Rubber gasket; 8-First insertion slot; 9-First insertion frame; 10-Coarse filter; 11-Second insertion slot; 12-Second insertion frame; 13-Fine filter; 14-Air inlet; 15-Support frame; 16-Protective cover. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] In the background technology: the traditional method of fixing the motherboard is to directly install it in the computer case. If only the case fan or natural convection is used, it is often difficult to meet the heat dissipation requirements of the bottom of the motherboard when the modern computer is running under high load. This can easily lead to overheating, performance degradation or even hardware damage. In addition, the accumulation of dust and impurities is also an important factor affecting the stability and lifespan of the computer. Based on the above technical problems, the following are the implementation examples and working principles for solving the technical problems.

[0020] Please see Figure 1-3 This utility model provides an embodiment of a computer motherboard fixing device, including a motherboard mounting plate 1. Side baffles 2 are fixedly connected to both sides of the top of the motherboard mounting plate 1. Two air intake chambers 3 are symmetrically fixedly connected to one end of the motherboard mounting plate 1. The end of the air intake chamber 3 near the middle of the motherboard mounting plate 1 is arc-shaped. The arc design can change the direction of airflow, so that the air flows into the interior of the motherboard mounting plate 1 to improve the heat dissipation effect. An exhaust fan 4 is fixedly installed at the other end of the air intake chamber 3. Two dust removal frames 5 are symmetrically fixedly connected to the end of the motherboard mounting plate 1 near the air intake chamber 3. An air inlet 14 is opened through the end of the air intake chamber 3 near the exhaust fan 4. The air inlet 14 and the exhaust fan 4 are matched. The exhaust fan 4 delivers air to the interior of the air intake chamber 3 through the air inlet 14. A support frame 15 is fixedly connected to the top of the inner side of the air intake chamber 3. A protective cover 16 is fixedly installed on the top of the support frame 15, and the protective cover 16 is located inside the top of the air intake chamber 3.

[0021] Two second insertion slots 11 are symmetrically opened at the top of the main board mounting plate 1 near the air intake chamber 3. A second insertion frame 12 is slidably inserted into the inner side of the second insertion slot 11. The insertion method facilitates maintenance and replacement. A fine filter screen 13 is fixedly installed inside the second insertion frame 12. A first insertion slot 8 is opened at the top of the dust removal frame 5. A first insertion frame 9 is movably inserted into the inside of the first insertion slot 8. A coarse filter screen 10 is fixedly installed inside the first insertion frame 9. The entry of dust is reduced by the dual filtration of the coarse filter screen 10 and the fine filter screen 13. A handle is fixedly connected to the middle of the top of the first insertion frame 9 and the second insertion frame 12 respectively. The handle design makes it easy to pull out the first insertion frame 9 or the second insertion frame 12, which is convenient for later replacement of the coarse filter screen 10 or the fine filter screen 13.

[0022] The top of the motherboard mounting plate 1 is uniformly fixed with motherboard support pillars 6. Rubber pads 7 are fixedly installed on the top of the motherboard support pillars 6. The rubber pads 7 can reduce the vibration of the motherboard and reduce the wear caused by direct contact between the motherboard and the motherboard support pillars 6. The top of the rubber pads 7 is lower than the top of the side baffle 2, which can make the top of the motherboard and the top of the motherboard mounting plate 1 form an open space with closed sides, which facilitates the air to flow in one direction, reduces the dissipation and increases the air velocity. The height of the air intake guide chamber 3 is designed to be twice the height of the side baffle 2, so that the airflow is evenly distributed at both the top and bottom of the motherboard.

[0023] Working principle: During use, firstly, the motherboard mounting plate 1 is fixed inside the computer case at the motherboard mounting position. Then, the motherboard is mounted on top of the motherboard mounting plate 1 using the motherboard support pillar 6 and rubber pad 7. After the motherboard is installed, it is positioned horizontally across the center line of the air intake chamber 3. Half of the air exhausted from the air intake chamber 3 is above the motherboard, and half is below it. Then, the exhaust fan 4 is connected to the computer's built-in power supply. When the computer is started, the exhaust fan 4 is activated. The exhaust fan 4 delivers air into the air intake chamber 3 through the coarse filter 10. Because the end of the air intake chamber 3 away from the exhaust fan 4 is arc-shaped, it helps to guide the airflow to turn smoothly, reduce airflow resistance, and improve heat dissipation efficiency. This causes the airflow to turn and flow through the secondary filtration of the fine filter 13 to the inside of the motherboard mounting plate 1. Since the motherboard is mounted on the top of the rubber pad 7, there is a gap between the motherboard and the top of the motherboard mounting plate 1. The air flowing out of the air intake chamber 3 carries the heat generated by the motherboard and is discharged from the end of the motherboard mounting plate 1 away from the air intake chamber 3, thereby achieving heat dissipation for the motherboard and accelerating the airflow above the motherboard to accelerate heat dissipation.

[0024] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A computer motherboard fixing device, comprising a motherboard mounting plate (1), characterized in that: Side baffles (2) are fixedly connected to the top two sides of the motherboard mounting plate (1). Two air intake chambers (3) are symmetrically fixedly connected to one end of the motherboard mounting plate (1). The end of the air intake chamber (3) near the middle of the motherboard mounting plate (1) is arc-shaped. An exhaust fan (4) is fixedly installed at the other end of the air intake chamber (3). Two dust removal frames (5) are symmetrically fixedly connected to the end of the motherboard mounting plate (1) near the air intake chamber (3).

2. The computer motherboard fixing device according to claim 1, characterized in that: The main board mounting plate (1) has two second insertion slots (11) symmetrically opened at the top end near the air intake guide chamber (3). A second insertion frame (12) is slidably inserted into the inner side of the second insertion slot (11). A fine filter screen (13) is fixedly installed on the inner side of the second insertion frame (12). The top end of the dust removal frame (5) has a first insertion slot (8). A first insertion frame (9) is movably inserted into the inside of the first insertion slot (8). A coarse filter screen (10) is fixedly installed inside the first insertion frame (9).

3. The computer motherboard fixing device according to claim 1, characterized in that: The motherboard mounting plate (1) is uniformly fixedly connected to the top of the motherboard support column (6), and the top of the motherboard support column (6) is fixedly installed with a rubber gasket (7).

4. A computer motherboard fixing device according to claim 1, characterized in that: An air inlet (14) is provided through one end of the air intake chamber (3) near the exhaust fan (4). The air inlet (14) is matched with the exhaust fan (4). A support frame (15) is fixedly connected to the top inner side of the air intake chamber (3). A protective cover plate (16) is fixedly installed on the top of the support frame (15), and the protective cover plate (16) is located inside the top of the air intake chamber (3).

5. A computer motherboard fixing device according to claim 2, characterized in that: Handles are fixedly connected to the top center of the first plug-in frame (9) and the second plug-in frame (12).

6. A computer motherboard fixing device according to claim 3, characterized in that: The top height of the rubber pad (7) is lower than the top height of the side baffle (2).

7. A computer motherboard fixing device according to claim 1, characterized in that: The height of the air intake guide chamber (3) is designed to be twice the height of the side baffle (2).

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