Fingerprint chip structure for realizing internal and external conduction function by implanting copper cylinders
By embedding copper pillars into the fingerprint chip body and electrically connecting them to the metal frame and circuit board, the switch structure is eliminated, solving the compact design problem of the fingerprint recognition chip, improving user experience and energy saving.
Patent Information
- Application Number
- CN202423212540.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-25
- Publication Date
- 2025-11-11
- Estimated Expiration
- 2034-12-25
AI Technical Summary
Existing smart fingerprint door locks require additional switching circuits and external conduction devices for their fingerprint recognition chips, resulting in a non-compact structural design that fails to meet appearance design requirements.
Copper pillars are implanted into the fingerprint chip body and electrically connected to the metal frame and circuit board, eliminating the need for additional switch structures and forming an integrated design.
It achieves a compact design of the fingerprint chip structure, saving space, improving user experience, enabling one-handed operation, and reducing power consumption.
Smart Images

Figure CN223539205U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of fingerprint chip technology, and in particular to a fingerprint chip structure that achieves internal and external conductivity by implanting copper pillars. Background Technology
[0002] With the improvement of fingerprint recognition technology, home access control systems are gradually incorporating smart fingerprint door lock technology. Door locks are the most important part of home security and a necessity for every household, which has laid a solid foundation for the market entry of smart fingerprint door locks. Smart fingerprint door locks are different from mechanical locks. Although both serve a security function, smart fingerprint door locks are far superior to traditional locks in terms of security, convenience, and interactivity. This is why smart fingerprint door locks have gained rapid acceptance from the public.
[0003] Currently, the fingerprint recognition chips used in smart fingerprint door locks require additional switching circuits and external conduction devices to activate the entire circuit and enable the circuit to be turned on or woken up. From a structural design perspective, this requires adding extra area or space to the product to achieve the circuit activation or wake-up function; from an aesthetic design perspective, it may not meet or satisfy customers' specific requirements for appearance.
[0004] Therefore, there is an urgent need for a fingerprint chip structure that achieves internal and external conductivity by implanting copper pillars, which can solve the above problems. Utility Model Content
[0005] The purpose of this invention is to provide a fingerprint chip structure that achieves internal and external conductivity by implanting copper pillars, thereby solving the problems existing in the prior art.
[0006] To achieve the above objectives, this utility model provides the following solution:
[0007] This utility model provides a fingerprint chip structure that achieves internal and external conductivity by implanting copper pillars, including a fingerprint chip body and a circuit board. The fingerprint chip body is integrated on the top of the circuit board. A through hole is opened on the fingerprint chip body, and a copper pillar is embedded in the through hole. A metal frame is provided on the outside of the fingerprint chip body. Both the copper pillar and the metal frame are electrically connected to the circuit board.
[0008] Preferably, the via is located in the uncoppered area of the fingerprint chip body.
[0009] Preferably, the copper pillar is soldered to the fingerprint chip body using an SMT process.
[0010] Preferably, the surface of the circuit board is provided with a first pad and a second pad, the copper pillar is electrically connected to the first pad, and the metal frame is electrically connected to the second pad.
[0011] Preferably, a conductive adhesive layer is coated between the copper pillar and the first pad, and between the metal frame and the second pad.
[0012] The present invention achieves the following beneficial technical effects compared to the prior art:
[0013] This utility model provides a fingerprint chip structure that achieves internal and external conductivity by embedding copper pillars. The structure includes a fingerprint chip body and a circuit board. The fingerprint chip body is integrated on top of the circuit board, and a through-hole is formed on the fingerprint chip body. A copper pillar is embedded within the through-hole, and a metal frame is provided on the outside of the fingerprint chip body. Both the copper pillar and the metal frame are electrically connected to the circuit board. This design eliminates the need for an additional switch structure, combining the switch structure with the fingerprint chip's placement structure into a single integrated structure. This design is more convenient and can be used in various compact new product designs. This design saves product design space, transforming a separate design into an integrated design. The saved space can address certain special customer requirements. Users can switch from pressing the switch with one hand and pressing the fingerprint with the other to single-handed operation, which is convenient and fast, effectively improving the user experience. It also allows the product to switch from standby power supply to active power supply, further saving energy. Attached Figure Description
[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0015] Figure 1 A schematic diagram of a fingerprint chip structure combination that achieves internal and external conduction function by implanting copper pillars, provided by this utility model;
[0016] Figure 2 This is an exploded view of a fingerprint chip structure that achieves internal and external conductivity by implanting copper pillars, as provided by this utility model. Detailed Implementation
[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0018] The purpose of this invention is to provide a fingerprint chip structure that achieves internal and external conductivity by implanting copper pillars, thereby solving the problems existing in the prior art.
[0019] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0020] Example 1:
[0021] This embodiment provides a fingerprint chip structure that achieves internal and external conductivity by implanting copper pillars, such as... Figure 1 and 2 As shown, it includes a fingerprint chip body 1 and a circuit board 2. The fingerprint chip body 1 is integrated on the top of the circuit board 2. A through hole 3 is opened on the fingerprint chip body 1, and a copper pillar 4 is embedded in the through hole 3. A metal frame 5 is provided on the outside of the fingerprint chip body 1. Both the copper pillar 4 and the metal frame 5 are electrically connected to the circuit board 2.
[0022] As one implementation, the via 3 is formed in the uncoppered area of the fingerprint chip body 1.
[0023] In one implementation, the copper pillar 4 is soldered to the fingerprint chip body 1 using SMT technology.
[0024] In one embodiment, the surface of the circuit board 2 is provided with a first pad 6 and a second pad 7, the copper pillar 4 is electrically connected to the first pad 6 as a signal +, and the metal frame 5 is electrically connected to the second pad 7 as a signal -.
[0025] In one implementation, conductive adhesive layers are coated between the copper pillar 4 and the first pad 6, and between the metal frame 5 and the second pad 7, thereby achieving electrical connection.
[0026] This utility model provides a fingerprint chip structure that achieves internal and external conductivity by embedding copper pillars. This design eliminates the need for an additional switch structure, integrating the switch structure with the fingerprint chip's placement structure into a single unit. This design is more convenient and can be used in various compact new product designs. The design saves product design space, transforming it from a separate design to an integrated one, allowing the saved space to address specific customer requirements. Users can switch from pressing the switch with one hand and pressing the fingerprint with the other to single-handed operation, which is more convenient and faster, effectively improving the user experience. Furthermore, the product transitions from standby power supply to active power supply, further saving energy.
[0027] This utility model uses specific examples to illustrate its principles and implementation methods. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the idea of this utility model. In summary, the content of this specification should not be construed as a limitation of this utility model.
Claims
1. A fingerprint chip structure that achieves internal and external conductivity by implanting copper pillars, comprising a fingerprint chip body and a circuit board, wherein the fingerprint chip body is integrated on top of the circuit board, characterized in that: The fingerprint chip body has a through hole, and a copper pillar is embedded in the through hole. The fingerprint chip body is surrounded by a metal frame, and the copper pillar and the metal frame are electrically connected to the circuit board.
2. The fingerprint chip structure according to claim 1, which achieves internal and external conductivity by implanting copper pillars, is characterized in that: The via is located in the uncoppered area of the fingerprint chip body.
3. The fingerprint chip structure according to claim 1, which achieves internal and external conductivity by implanting copper pillars, is characterized in that: The copper pillars are soldered to the fingerprint chip body using SMT technology.
4. The fingerprint chip structure according to claim 1, which achieves internal and external conductivity by implanting copper pillars, is characterized in that: The circuit board has a first pad and a second pad on its surface. The copper pillar is electrically connected to the first pad, and the metal frame is electrically connected to the second pad.
5. The fingerprint chip structure according to claim 4, which achieves internal and external conductivity by implanting copper pillars, is characterized in that: A conductive adhesive layer is coated between the copper pillar and the first pad, and between the metal frame and the second pad.