Detection device and semiconductor process equipment

Abstract

The utility model discloses a detection device and semiconductor processing equipment, and belongs to the technical field of semiconductor processing. The detection device is used for detecting installation information of a base in the semiconductor process chamber, the process chamber is provided with an opening above the base, the detection device comprises a device body and at least three detection pieces, the shape of the outer contour of the device body is the same as that of the opening, and the detection pieces are arranged on the device body. The device body is provided with an opening and is used for being detachably lapped at the opening, the detection pieces are arranged on the device body at intervals in the circumferential direction of the device body, each detection piece is provided with a detection probe, each detection probe penetrates through the device body, and each detection probe is used for abutting against the base. Therefore, the height of the pedestal at the abutting position can be detected. According to the scheme, the problem of poor wafer processing easily caused by a mode of detecting the station and the levelness of the base in the related technology can be solved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a detection device and semiconductor process equipment. Background Technology

[0002] With the rapid development of the semiconductor silicon wafer industry, the demand for semiconductor process chambers is also increasing rapidly. As an important component of the semiconductor process chamber, the levelness and position of the substrate in the process have a direct impact on the process results. During the process, the substrate often needs to perform transfer, processing, annealing and other processes at different stations. Inaccurate station positioning can lead to a series of problems such as robotic arms scratching the wafer surface and the process film thickness not meeting the standards.

[0003] Related technologies typically use calipers and levels to check the height and levelness of the substrate within the process chamber. However, due to the inherent errors in using calipers and levels, inaccurate and incomplete adjustments can occur when adjusting the height and levelness of the substrate. This can easily lead to defects in wafer processing during the process.

[0004] In summary, the methods used in the detection base positioning and leveling of the related technologies can easily lead to defects in wafer processing. Utility Model Content

[0005] This application discloses a testing device and semiconductor process equipment to solve the problem that the positioning and levelness of the testing base in related technologies can easily lead to poor wafer processing.

[0006] To solve the above-mentioned technical problems, this application adopts the following technical solution:

[0007] A detection device is provided for detecting mounting information of a substrate within a semiconductor process chamber, the process chamber having an opening above the substrate. The detection device includes a device body and at least three detection elements.

[0008] The outer contour of the device body is the same as the shape of the opening and is used to detachably attach to the opening. Each of the detection elements is circumferentially spaced around the device body and is provided on the device body. Each of the detection elements has a detection probe, each of the detection probes passes through the device body and is used to abut against the base to detect the height of the base at the abutment point.

[0009] A semiconductor process apparatus includes a process chamber and the aforementioned detection device, the detection device being detachably attached to the opening of the process chamber.

[0010] The technical solution adopted in this application can achieve the following beneficial effects:

[0011] In this application, by employing at least three detection elements spaced apart, the height of a plane can be detected, thereby detecting the height of the substrate at the contact point, i.e., the substrate's process position within the process chamber. When the values ​​detected by the at least three detection elements are identical and within a preset threshold, it means that the substrate's position and levelness within the process chamber meet the requirements. In this case, wafer processing defects are less likely to occur. When the values ​​detected by the at least three detection elements are different, and / or the detected values ​​are not within the preset threshold, it means that the substrate's position and / or levelness within the process chamber do not meet the requirements. In this case, the substrate's position and / or levelness within the process chamber can be adjusted accordingly until the values ​​detected by the at least three detection elements are identical and within the preset threshold, thus completing the detection. Therefore, the method for detecting the substrate's position and levelness disclosed in this application is less likely to cause wafer processing defects. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of the device body and each detection element disclosed in the embodiments of this application when they are disposed on the process chamber;

[0013] Figure 2 This is a schematic diagram of the structure of the device body and each detection element disclosed in the embodiments of this application when they are disposed on the support member;

[0014] Figure 3 This is a partial structural schematic diagram of the detection device disclosed in the embodiments of this application;

[0015] Figure 4 This is a schematic diagram of the structure of the device body disclosed in the embodiments of this application;

[0016] Figure 5 This is a schematic diagram of the structure of the first locating pin disclosed in an embodiment of this application;

[0017] Figure 6 This is a cross-sectional view of the first locating pin disclosed in an embodiment of this application;

[0018] Figure 7 This is a top view of the first locating pin disclosed in an embodiment of this application;

[0019] Figure 8 This is a schematic diagram of the structure of the support member disclosed in the embodiments of this application;

[0020] Figure 9 and Figure 10 These are schematic diagrams of the clamping components from different perspectives as disclosed in the embodiments of this application;

[0021] Figure 11 for Figure 10 The clamping parts along Figure 10 A sectional view along line AA in the middle;

[0022] Figures 12 to 14 These are schematic diagrams of the mounting pad structure from different perspectives disclosed in the embodiments of this application;

[0023] Figure 15 This is a cross-sectional view of the mounting pad disclosed in an embodiment of this application;

[0024] Figure 16 This is a schematic diagram of a process chamber containing a base and a motor, as disclosed in an embodiment of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 100 - Process chamber, 110 - Opening, 120 - Chamber cover positioning pin, 130 - Base, 140 - Motor;

[0027] 200 - Device body, 210 - Annular protrusion, 220 - Notch, 230 - First through hole, 240 - Limiting protrusion, 241 - Second pin hole, 242 - Third through hole, 250 - Second through hole;

[0028] 300 - Detection component, 310 - Detection probe, 320 - First housing, 330 - Second housing, 331 - Data display window;

[0029] 400 - First locating pin, 410 - Pin body, 420 - First connector, 421 - First connecting hole;

[0030] 500 - Support component, 510 - Leveling protrusion, 520 - Limiting ring;

[0031] 600-Clamping component, 610-Second connecting hole, 611-Smooth hole, 612-Threaded hole, 620-Clamping hole, 621-Main body, 622-Deformation opening, 630-First surface, 640-Second surface, 650-Third connecting hole;

[0032] 700 - Second connector;

[0033] 800 - Mounting pad, 810 - Third side, 820 - Fourth side, 830 - C-type opening. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] The detection device disclosed in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.

[0036] Please refer to Figures 1-16 This application discloses a detection device, which includes a device body 200 and at least three detection elements 300.

[0037] The detection device disclosed in this application can be used to detect the installation information of the base 130 in the semiconductor process chamber 100. That is, the detection device disclosed in this application is installed on the process chamber 100 to detect the installation information of the base 130 in the process chamber 100, specifically the process position of the base 130 in the process chamber 100.

[0038] Specifically, before testing, the operator needs to open the chamber cover at the opening 110 of the process chamber 100. That is, the process chamber 100 has an opening 110 above the base 130, and the chamber cover is used to seal this opening 110. After opening the chamber cover, the operator can easily install the testing device at the opening 110 and perform the test. After the test is completed, the operator needs to remove the testing device from the process chamber 100 and close the chamber cover to allow the process chamber 100 to perform wafer processing. That is, the device body 200 is detachably attached to the opening 110, thus allowing the testing device to be detachably attached to the process chamber 100. Furthermore, to ensure that the device body 200 can smoothly attach to the opening 110, the shape of the outer contour of the device body 200 can be the same as the shape of the opening 110, facilitating the attachment of the device body 200 to the opening 110. Optionally, since the opening 110 is usually circular, the shape of the outer contour of the device body 200 can also be circular.

[0039] Each detection element 300 is circumferentially spaced around the device body 200, and each detection element 300 has a detection probe 310. Each detection probe 310 passes through the device body 200 and is used to abut against the base 130. Specifically, the device body 200 has a plurality of second through holes 250 spaced apart, and each detection probe 310 corresponds one-to-one with each second through hole 250. That is, the detection probe 310 can pass through the second through hole 250 and abut against the base 130, so that the base 130 can... When each detection probe 310 is squeezed, the data display window 331 of each detection element 300 (i.e., the data display window 331 described below) will display the detected value. Based on the value detected by each detection element 300, it can be determined whether the base 130 has reached the process position in the process chamber 100 and whether the base 130 is set horizontally. That is, each detection element 300 can detect the height of the base 130 at the contact point, thereby detecting the process position of the base 130 in the process chamber 100 and the levelness of the base 130.

[0040] In this application, since at least three detection elements 300 are used for detection, and these at least three detection elements 300 are spaced apart, the height of a plane can be detected by the at least three detection elements 300, and thus the height of the base 130 at the contact point can be detected, that is, the process position of the base 130 in the process chamber 100. When the values ​​detected by the at least three detection elements 300 are the same and within a preset threshold, it means that the position and level of the base 130 in the process chamber 100 meet the requirements. At this time, it is not easy to have problems with wafer processing defects during wafer processing. When the values ​​detected by the at least three detection elements 300 are different, and / or the detected values ​​are not within the preset threshold, it means that the position and / or level of the base 130 in the process chamber 100 do not meet the requirements. At this time, the position and / or level of the base 130 in the process chamber 100 can be adjusted accordingly until the values ​​detected by the at least three detection elements 300 are the same and within the preset threshold, thereby completing the detection. Therefore, the method of detecting the position and levelness of the base 130 disclosed in this application is less likely to cause problems with wafer processing defects.

[0041] Furthermore, due to the high detection accuracy of the inspection component 300, the detection error of each inspection component 300 during the inspection process is small. This allows for more accurate and comprehensive adjustment of the height and level of the corresponding base 130, avoiding the risk of the robotic arm scratching the wafer. For details, please refer to... Figure 16Under the action of the motor 140, the base 130 can move vertically within the process chamber 100 to change its process position. When the values ​​detected by the various detectors 300 are different, and / or the detected values ​​are not within a preset threshold, the position and / or level of the base 130 within the process chamber 100 need to be adjusted accordingly. Specifically, the position of the base 130 within the process chamber 100 can be adjusted by the motor 140, and the level of the base 130 can be adjusted by the first adjusting member between the base 130 and the motor 140 until the values ​​detected by the various detectors 300 are the same and within the preset threshold, thus completing the detection. Furthermore, the controller of the motor 140 can record this process position so that in the next process, the motor 140 can directly drive the base 130 to that position, meaning that the detectors 300 do not need to detect again whether the base 130 has reached the process position within the process chamber 100.

[0042] Optionally, during the process, it is necessary not only to ensure the levelness of the base 130 and to ensure that the base 130 reaches the correct process position, but also to ensure that the base 130 is centered horizontally within the process chamber 100, that is, to ensure that the base 130 is coaxially positioned with the process chamber 100. For this purpose, a feeler gauge can be used for measurement. Specifically, the feeler gauge can be inserted from different positions between the side of the base 130 and the inner wall of the process chamber 100 to check whether the base 130 is coaxially positioned with the process chamber 100.

[0043] In another embodiment, please refer to Figure 3 The device body 200 is provided with an annular protrusion 210 protruding from the device body 200. The annular protrusion 210 is coaxially arranged with the device body 200. When the device body 200 overlaps with the opening 110, the annular protrusion 210 is located inside the process chamber 100, and the outer peripheral surface of the annular protrusion 210 is opposite to the inner wall of the process chamber 100, so that the central axis of the annular protrusion 210 coincides with the central axis of the process chamber 100. This makes the central axis of the device body 200 coincide with the central axis of the process chamber 100. At this time, since the outer peripheral surface of the annular protrusion 210 is opposite to the inner wall of the process chamber 100, the annular protrusion 210 avoids the sealing ring that plays a sealing role at the opening 110. That is, the detection device is not affected by the sealing ring during the detection process, which ensures the detection accuracy of the detection device, that is, it provides a great guarantee for the accuracy of the station measurement.

[0044] Please refer to Figure 2The detection device may further include a first positioning pin 400, which is located at the center of the device body 200 and can be inserted into a first pin hole at the center of the base 130. That is, when the motor 140 drives the base 130 closer to the device body 200, if the first positioning pin 400 is inserted into the first pin hole, it means that the base 130 is coaxial with the device body 200, and thus the base 130 is coaxial with the process chamber 100. This arrangement ensures that the concentricity of the base 130 meets the assembly requirements and eliminates the need for a plug. Multiple measurements are taken with a ruler to ensure measurement accuracy and prevent scratches on the sides of the base 130. This arrangement also simplifies the measurement process, saving time and effort. If the first positioning pin 400 cannot be inserted into the first pin hole, it means that the base 130 and the device body 200 are not coaxial. That is, the base 130 is eccentrically positioned in the process chamber 100. This application can adjust the second adjusting member between the motor 140 and the base 130 to make the first positioning pin 400 insert into the first pin hole, thereby ensuring that the concentricity of the base 130 meets the assembly requirements.

[0045] In a further embodiment, please refer to Figure 2 and Figure 4 To further ensure that the annular protrusion 210 and the process chamber 100 are coaxially arranged, a notch 220 is provided on the edge of the device body 200. The notch 220 allows a spacing measuring tool, such as a feeler gauge, to pass through to detect the spacing between the outer peripheral surface of the annular protrusion 210 and the inner wall of the process chamber 100. That is, the notch 220 is a concentric confirmation notch. By using the spacing measuring tool, it can be determined whether the spacing between the outer peripheral surface of the annular protrusion 210 and the inner wall of the process chamber 100 is equal to the design value, thereby further determining whether the annular protrusion 210 and the process chamber 100 are coaxially arranged. When the spacing value detected by the spacing measuring tool is equal to the design value, it means that the annular protrusion 210 and the process chamber 100 are coaxially arranged. This can further ensure that the device body 200 and the process chamber 100 are coaxially arranged. Therefore, when the first positioning pin 400 is inserted into the first pin hole, it can be determined that the base 130 and the process chamber 100 are coaxially arranged.

[0046] Optionally, the edge of the device body 200 may be provided with multiple notches 220 at intervals. In this case, the spacing measuring tool can be detected from different positions, thereby reducing detection errors.

[0047] Alternatively, please refer to Figure 4 The device body 200 has a first through hole 230 at its center. Please refer to [reference needed]. Figures 5 to 7The first positioning pin 400 includes a pin body 410 and a first connecting member 420. The circumferential dimension of the first connecting member 420 is larger than that of the pin body 410. One end of the pin body 410 is connected to the first connecting member 420. Specifically, the first connecting member 420 may have an assembly hole, and one end of the pin body 410 may be interference-fitted with the assembly hole. Alternatively, the pin body 410 and the first connecting member 420 may be integrally formed. The other end of the pin body 410 may pass through the first through hole 230 and be inserted into the first pin hole. Because the circumferential dimension of the first connecting member 420 is larger than that of the pin body 410, the first positioning pin 400 will not completely pass through the first through hole 230, which ensures the stability of the first positioning pin 400 on the device body 200. Of course, the first positioning pin 400 may only include the pin body 410.

[0048] In this embodiment, the first connector 420 has a first connecting hole 421 on the side opposite to the pin 410. The first connector 420 can be suspended on the device body 200 through the first connecting hole 421. That is, when the first positioning pin 400 is not used to detect whether the base 130 is coaxially arranged with the process chamber 100, the first positioning pin 400 can be removed from the first through hole 230. To prevent the first positioning pin 400 from being lost, the first positioning pin 400 can be suspended on the device body 200 so that it can be picked up and used directly next time. Optionally, the first connecting hole 421 can be a threaded hole.

[0049] Optionally, to avoid unexpected changes in the position of the detection device on the process chamber 100 during the detection process, which could affect the detection accuracy of the base 130, please refer to... Figure 2 and Figure 4 The device body 200 has a protruding limiting protrusion 240 on its edge, and a second pin hole 241 is provided on the limiting protrusion 240. When the device body 200 overlaps with the opening 110, at least a portion of the second pin hole 241 can be inserted into and limited in fit with the chamber cover positioning pin 120 on the process chamber 100. That is, through the mutual cooperation between the second pin hole 241 and the chamber cover positioning pin 120, the position of the detection device can be prevented from changing, thereby avoiding affecting the detection accuracy of the base 130. At the same time, since the chamber cover positioning pin 120 itself is a component for positioning and sealing the chamber cover of the opening 110, this arrangement can reuse the chamber cover positioning pin 120, thereby improving the utilization rate of the chamber cover positioning pin 120. Of course, the edge of the device body 200 may not have a limiting protrusion 240.

[0050] Optionally, the second pin hole 241 can be a strip hole, and the second pin hole 241 extends radially along the device body 200. This type of second pin hole 241 can avoid the problem that the second pin hole 241 cannot be limited and matched with the chamber cover positioning pin 120 due to machining errors.

[0051] Optionally, a third through hole 242 may also be provided on the limiting protrusion 240. The third through hole 242 is spaced apart from the second pin hole 241. The function of the third through hole 242 is the same as that of the notch 220 mentioned above. That is, the spacing measuring tool can pass through the third through hole 242 to detect the distance between the outer peripheral surface of the annular protrusion 210 and the inner wall of the process chamber 100, thereby determining whether the annular protrusion 210 and the process chamber 100 are coaxially arranged. This arrangement can make full use of the limiting protrusion 240.

[0052] Alternatively, please refer to Figure 2 and Figure 8 The testing device may also include a support member 500. When all the testing elements 300 are in a non-operating state, i.e., when the operator removes the device body 200 and each testing element 300 from the process chamber 100, the device body 200 and each testing element 300 can be placed on the support member 500. The support member 500 can support the device body 200 and each testing element 300, and the testing probes 310 of each testing element 300 can rest against the support member 500 to zero each testing element 300 while preventing damage to the testing probes 310. Alternatively, the testing device may not include the support member 500, meaning that after the operator removes the device body 200 and each testing element 300 from the process chamber 100, it can be placed directly on the ground.

[0053] Optionally, the support member 500 may have a protruding leveling protrusion 510 for zeroing each detection component 300. That is, each detection probe 310 can abut against the leveling protrusion 510 to zero each detection component 300, facilitating subsequent use of the detection device. Therefore, the area of ​​the zeroing portion on the support member 500 is relatively small, which makes it easier to ensure the operator's machining accuracy of the leveling protrusion 510. Simultaneously, the protruding leveling protrusion 510 makes it easier for the detection probes 310 to be compressed into position, thus making it easier to achieve the zeroing requirements of the detection components 300. Of course, the support member 500 may also not have a protruding leveling protrusion 510.

[0054] Optionally, to ensure the stability of the support member 500 in supporting the device body 200 and each detection element 300, a limiting ring 520 is provided on the edge of the support member 500. The outer peripheral surface of the annular protrusion 210 can be matched with the inner peripheral surface of the limiting ring 520 to ensure the stability of the device body 200 and each detection element 300 on the support member 500, thereby ensuring the stability of the support member 500 in supporting the device body 200 and each detection element 300.

[0055] Optionally, the detection element 300 may include a first housing 320 and a detection probe 310. The detection probe 310 is telescopically disposed in the first housing 320. Specifically, a spring is provided inside the first housing 320, and one end of the detection probe 310 is connected to the spring. When the detection probe 310 is subjected to compressive force, the spring can be compressed to retract the detection probe 310 into the first housing 320. When the detection probe 310 is not subjected to compressive force, the spring returns to its original deformation to allow the detection probe 310 to extend out of the first housing 320. The first housing 320 may be interference-fitted with the second through hole 250 mentioned above to ensure the installation stability of each detection element 300 on the device body 200.

[0056] In another embodiment, please refer to Figure 2 The detection device may also include a clamping member 600, which is located on the side of the device body 200 where the detection member 300 is located. Specifically, the clamping member 600 may have a third connecting hole 650, which may be a threaded hole. The clamping member 600 is installed on the device body 200 through the third connecting hole 650 and the threaded connector. The clamping member 600 can clamp the first housing 320. That is, under the combined action of the clamping member 600 and the second through hole 250, the installation stability of each detection member 300 on the device body 200 can be further ensured.

[0057] Alternatively, please refer to Figure 9 and Figure 10 The clamping member 600 has a second connecting hole 610 and a deformable clamping hole 620. The clamping hole 620 includes a connected main body 621 and a deformable opening 622. The first housing 320 can be fitted inside the main body 621. The extending direction of the deformable opening 622 intersects the central axis of the second connecting hole 610. Optionally, the extending direction of the deformable opening 622 is perpendicular to the central axis of the second connecting hole 610, and the central axis of the main body 621 is perpendicular to the central axis of the second connecting hole 610, so that the extending direction of the deformable opening 622, the central axis of the main body 621, and the central axis of the second connecting hole 610 are perpendicular to each other. The deformation opening 622 is connected to the second connecting hole 610. The detection device may also include a second connecting member 700, which cooperates with the second connecting hole 610 to make the opening of the deformation opening 622 smaller. At this time, the main body 621 can squeeze the first housing 320, that is, the clamping hole 620 can clamp the first housing 320.

[0058] In this embodiment, please refer to Figure 11The second connecting hole 610 can be a smooth hole 611 connected to the deformation opening 622, and the other part can be a threaded hole 612. The second connecting member 700 can be a threaded connecting member. One end of the second connecting member 700 can pass through the smooth hole 611 and be threadedly engaged with the threaded hole 612. During the threaded engagement, the opening of the deformation opening 622 can be gradually reduced, so that the clamping hole 620 can achieve the effect of clamping the first housing 320.

[0059] Optionally, the clamping member 600 has a first surface 630 facing the device body 200, and the first surface 630 may be a curved surface.

[0060] In another embodiment, the first surface 630 is a plane and is in contact with the device body 200 to ensure that the clamping member 600 is horizontally set on the device body 200, thereby ensuring the verticality of the setting of the detection member 300 on the device body 200, and thus ensuring the accuracy of the data detection of the detection member 300.

[0061] Optionally, the detection element 300 may further include a second housing 330, which is connected to the first housing 320. The second housing 330 is provided with a data display window 331, which can display the values ​​detected by the detection element 300. The circumferential dimension of the second housing 330 is larger than that of the first housing 320, so that the data display window 331 is larger and thus easier for the operator to read the values.

[0062] Please refer to Figure 2 The testing device may also include a mounting pad 800, which assists in installation. Specifically, a portion of the first housing 320 can be fitted within the mounting pad 800, with one end of the mounting pad 800 abutting against the clamping member 600 and the other end abutting against the second housing 330. This allows all testing elements 300 to be positioned at the same height on the device body 200, ensuring the consistency of testing for each element 300. Furthermore, since a portion of the first housing 320 is clamped by the clamping member 600, and the other portion is fitted within the mounting pad 800, the installation stability of the testing elements 300 on the device body 200 is further ensured. Of course, the testing device may also exclude the mounting pad 800.

[0063] Optionally, the clamping member 600 has a second surface 640 facing the second housing 330, please refer to Figures 12 to 15The mounting pad 800 has a third surface 810 and a fourth surface 820 arranged opposite to each other. The second surface 640, the third surface 810, and the fourth surface 820 can all be planar. During the installation of each detection element 300, the second surface 640 and the third surface 810 are in contact. The second housing 330 has a plane facing the fourth surface 820, and the fourth surface 820 can be in contact with this plane. This ensures that the mounting pad 800 and the second housing 330 are horizontally positioned on the mounting pad 800, thereby further ensuring the perpendicularity of each detection element 300 on the device body 200, and further ensuring the accuracy of the data detection of each detection element 300. Of course, the second surface 640, the third surface 810, and the fourth surface 820 do not have to be planar.

[0064] Optionally, the mounting pad 800 has a C-shaped opening 830 to allow the first housing 320 to be detachably fitted onto the mounting pad 800. That is, the C-shaped opening 830 facilitates the removal of the mounting pad 800 from the first housing 320, and the surface of the mounting pad 800 that contacts the first housing 320 can be an arc surface to ensure a closer fit between the first housing 320 and the mounting pad 800, thereby guaranteeing assembly accuracy. Specifically, after the mounting pad 800 assists in the installation of the first test piece 300, the mounting pad 800 can be removed from the first housing 320 of that test piece 300 to facilitate the installation of other test pieces 300. In this application, the same mounting pad 800 can be used to install all test pieces 300, which improves the utilization rate of the mounting pad 800 and reduces the production cost of the testing device. Of course, the mounting pad 800 may not have the C-shaped opening 830.

[0065] Optionally, the device body 200 can be a hollow mounting plate with each detection element 300 spaced apart on the mounting plate. This can reduce the weight of the device body 200 and lower the production cost of the device body 200. At the same time, this structure of the device body 200 makes it easier for operators to grasp the device body 200, thereby facilitating the installation of the device body 200 on the process chamber 100.

[0066] Optionally, this application also discloses a semiconductor process apparatus, including a process chamber 100 and the detection device described above, wherein the detection device is detachably attached to the opening 110 of the process chamber 100.

[0067] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. For the sake of brevity, they will not be described in detail here.

[0068] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A detection device for detecting installation information of a base (130) within a semiconductor process chamber (100), the process chamber (100) having an opening (110) above the base (130), characterized in that, The detection device includes a device body (200) and at least three detection elements (300). The outer contour of the device body (200) is the same as the shape of the opening (110) and is used to detachably attach to the opening (110). Each of the detection elements (300) is circumferentially spaced around the device body (200) and is provided on the device body (200). Each of the detection elements (300) has a detection probe (310). Each of the detection probes (310) passes through the device body (200) and is used to abut against the base (130) to detect the height of the base (130) at the abutment point.

2. The detection device according to claim 1, characterized in that, The device body (200) is provided with an annular protrusion (210) protruding from the device body (200). When the device body (200) overlaps the opening (110), the annular protrusion (210) is located inside the process chamber (100), and the outer peripheral surface of the annular protrusion (210) is opposite to the inner wall of the process chamber (100), so that the central axis of the device body (200) coincides with the central axis of the process chamber (100). The detection device further includes a first positioning pin (400), which is located at the center of the device body (200) and can be inserted into a first pin hole at the center of the base (130).

3. The detection device according to claim 2, characterized in that, The edge of the device body (200) has a notch (220) through which a spacing measuring tool can pass to detect the distance between the outer peripheral surface of the annular protrusion (210) and the inner wall of the process chamber (100).

4. The detection device according to claim 2, characterized in that, The device body (200) has a first through hole (230) at its center. The first positioning pin (400) includes a pin body (410) and a first connector (420). The circumferential dimension of the first connector (420) is larger than that of the pin body (410). One end of the pin body (410) is connected to the first connector (420). The other end of the pin body (410) can pass through the first through hole (230) and be inserted into the first pin hole. The first connector (420) has a first connecting hole (421) on the side away from the pin body (410). The first connector (420) can be suspended from the device body (200) through the first connecting hole (421).

5. The detection device according to claim 1, characterized in that, The edge of the device body (200) is provided with a limiting protrusion (240), and a second pin hole (241) is provided on the limiting protrusion (240). When the device body (200) overlaps with the opening (110), at least a part of the second pin hole (241) can be inserted into and limited by the chamber cover positioning pin (120) on the process chamber (100).

6. The detection device according to claim 1, characterized in that, The detection device also includes a support member (500), on which a leveling protrusion (510) protrudes. When all the detection elements (300) are in a non-working state, the support member (500) can support the device body (200) and each of the detection elements (300), and each of the detection probes (310) can abut against the leveling protrusion (510) to zero each of the detection elements (300).

7. The detection device according to claim 1, characterized in that, The detection device further includes a clamping member (600) and a second connecting member (700). The clamping member (600) is disposed on the side of the device body (200) where the detection member (300) is located. The detection member (300) includes a first housing (320) and a detection probe (310). The detection probe (310) is retractably disposed in the first housing (320). The clamping member (600) has a second connecting hole (610) and a deformable clamping hole (620). The clamping hole (620) includes a connected main body (621) and a deformation opening (622). The extension direction of the deformation opening (622) intersects the central axis of the second connecting hole (610), and the deformation opening (622) communicates with the second connecting hole (610). The second connector (700) cooperates with the second connecting hole (610) to reduce the opening of the deformation opening (622) so that the clamping hole (620) clamps the first housing (320).

8. The detection device according to claim 7, characterized in that, The clamping member (600) has a first surface (630) facing the device body (200), the first surface (630) being planar and fitting against the device body (200).

9. The detection device according to claim 7, characterized in that, The detection device further includes a mounting pad (800), and the detection component (300) further includes a second housing (330). The second housing (330) is connected to the first housing (320), and the second housing (330) is provided with a data display window (331). The circumferential dimension of the second housing (330) is larger than that of the first housing (320). A portion of the first housing (320) can be fitted into the mounting pad (800), and one end of the mounting pad (800) can abut against the clamping component (600), and the other end of the mounting pad (800) can abut against the second housing (330).

10. The detection device according to claim 9, characterized in that, The clamping member (600) has a second surface (640) facing the second housing (330), and the mounting pad (800) has a third surface (810) and a fourth surface (820) facing away from each other. The second surface (640), the third surface (810) and the fourth surface (820) are all planar, and the second surface (640) is in contact with the third surface (810), and the fourth surface (820) is in contact with the plane of the second housing (330) facing the fourth surface (820).

11. The detection device according to claim 9, characterized in that, The mounting pad (800) has a C-shaped opening (830) so that the first housing (320) can be detachably fitted onto the mounting pad (800).

12. A semiconductor process apparatus, characterized in that, The invention includes a process chamber (100) and a detection device according to any one of claims 1-11, the detection device being detachably attached to the opening (110) of the process chamber (100).

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