Air bag device of wafer bonding equipment

Abstract

The utility model discloses an air bag device of wafer bonding equipment. The air bag device comprises a mounting frame, a floating mechanism, a fixing frame and an air bag which are sequentially arranged from top to bottom, the air bag is installed below the fixing frame, and the fixing frame is rotationally connected with the installation frame through a floating mechanism. The floating mechanism comprises a ball bearing and a plurality of supporting rods, the two ends of the ball bearing are connected to the fixing frame and the mounting frame respectively, the supporting rods are circumferentially distributed on the periphery of the ball bearing at intervals, the lower ends of the supporting rods are fixedly connected to the fixing frame, and the upper ends of the supporting rods movably penetrate through movable holes formed in the mounting frame. Therefore, through the arrangement of the floating mechanism, when the air bag presses the wafers downwards in the wafer bonding process, the air bag can swing freely within a certain range through the rotary connection of the ball bearing and the limiting of the supporting rods, the effect of removing bubbles in the two wafers from the middle to the outside can be achieved, it is ensured that the two wafers are bonded tightly, and the bonding quality of the wafers is improved. And the bonding strength and precision are improved.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor manufacturing, and in particular to an airbag device for wafer bonding equipment. Background Technology

[0002] Wafer bonding technology refers to the process of tightly bonding two mirror-polished homogeneous or heterogeneous wafers together through chemical and physical interactions. After the wafers are bonded, the atoms at the interface react under the action of external forces to form covalent bonds and become a single unit, thus achieving a specific bonding strength at the bonding interface.

[0003] Bonding technology can effectively solve the problems of lattice mismatch and flatness. This requires ensuring that the difference in surface flatness and elastic modulus between the two bonded wafers is small; the surfaces required for bonding need to be very smooth, and the surface roughness requirements are very high. Current technology typically places two wafers in a wafer bonding machine and uses a pressure head to apply pressure to the two wafers to ensure a tight bond. The pressure head is generally made of graphite, but graphite pressure heads are relatively hard and can affect wafer bonding. Therefore, some pressure heads use flexible pressure heads made of airbags to improve the compression effect; however, in the production process, wafers are often reused, and wafer warping occurs. This means that even with the existing vertical airbag pressing method, defects such as loose bonding, misalignment of the two wafers, and residual air bubbles between the wafers still exist, affecting bonding strength and accuracy.

[0004] To overcome the above-mentioned shortcomings, the inventors have specifically invented an airbag device for wafer bonding equipment, which leads to this invention. Utility Model Content

[0005] The purpose of this invention is to provide an airbag device for wafer bonding equipment, which can solve the above-mentioned defects and has the advantage of ensuring tight bonding.

[0006] To achieve the above objectives, the solution of this utility model is:

[0007] An airbag device for a wafer bonding apparatus includes a mounting frame, a floating mechanism, a fixed frame, and an airbag arranged sequentially from top to bottom. The airbag is mounted below the fixed frame, and the fixed frame and the mounting frame are rotatably connected via the floating mechanism. The floating mechanism includes a ball bearing and several support rods. The two ends of the ball bearing are respectively connected to the fixed frame and the mounting frame. Each support rod is circumferentially spaced around the outer periphery of the ball bearing. The lower end of the support rod is connected and fixed to the fixed frame, and the upper end of the support rod is movably inserted through a movable hole provided on the mounting frame.

[0008] Furthermore, the fixing frame is provided with a fixing groove, and a fixing rod is horizontally arranged in the fixing groove. The bearing part of the ball bearing allows the fixing rod to pass through and rotate freely in the fixing groove. The connecting rod part of the ball bearing is connected and fixed to the mounting frame.

[0009] Furthermore, the movable hole is a countersunk hole set on the side of the mounting bracket, and the countersunk hole penetrates the bottom surface of the mounting bracket; the support rod has four rods, all of which are bolts, the head of the bolt is accommodated in the movable hole, and the shank of the bolt passes downward through the movable hole and is locked and fixed with the fixing hole set on the fixing bracket.

[0010] Furthermore, an airbag mounting plate is provided below the fixing frame; the airbag mounting plate includes an upper support plate and a lower support plate arranged vertically, and the upper part of the airbag is clamped and fixed by the upper support plate and the lower support plate; the lower support plate is annular, and the lower part of the airbag can expand downward from the annular hole of the lower support plate to form an arc bulge after inflation.

[0011] Furthermore, a sensor mounting plate and several pressure sensors are provided between the airbag mounting plate and the fixing frame; the sensor mounting plate is connected to the upper part of the fixing airbag mounting plate, and the pressure sensors are distributed circumferentially around the center of the fixing frame; both the fixing frame and the sensor mounting plate are disc-shaped, the outer diameter of the fixing frame is smaller than the outer diameter of the sensor mounting plate, the upper inner end of the pressure sensor is connected to the bottom of the fixing frame, and the lower outer end of the pressure sensor is connected to the top of the sensor mounting plate.

[0012] Furthermore, the sensor mounting plate has an upper groove that runs vertically between adjacent pressure sensors, and the upper part of the airbag has multiple air nozzles that extend out of the upper support plate and are located in the upper groove.

[0013] With the above-mentioned equipment, the airbag of this invention is connected to the fixed frame, which is connected by a floating mechanism. Thus, during the wafer bonding process, the airbag is first inflated and then pressed against the upper wafer. Through the rotational connection of the ball bearing and the limiting of each support rod, the airbag automatically levels itself according to the flatness of the wafer, ensuring that the inflated airbag can fit tightly against the upper wafer. This prevents misalignment caused by uneven flatness and local pressure between the two wafers during bonding. Moreover, the airbag can remove air bubbles from the middle of the two wafers outward, ensuring a tight bond between the two wafers, leaving no air bubbles between the wafers, improving bonding strength and precision, and greatly increasing bonding success rate. Attached Figure Description

[0014] Figure 1 This is a perspective view of the present invention applied to a wafer bonding equipment according to an embodiment of the present invention;

[0015] Figure 2 This is a perspective view of an embodiment of the present utility model, showing the concealed airbag device cover;

[0016] Figure 3 for Figure 2 A 3D view of the airbag device with the top cover removed;

[0017] Figure 4 for Figure 3 A 3D view without the mounting bracket;

[0018] Figure 5 This is a perspective view of the airbag and airbag mounting plate of the airbag device according to an embodiment of the present utility model.

[0019] Labeling explanation: Wafer 1;

[0020] Airbag device 100, mounting bracket 110, movable hole 111, floating mechanism 120, ball bearing 121, support rod 122, bearing part 123, connecting rod part 124, fixing bracket 130, fixing groove 131, fixing rod 132, fixing hole 133, airbag 140, air nozzle 141, airbag device top cover 150, airbag device outer cover 160, airbag mounting plate 170, upper support plate 171, lower support plate 172, sensor mounting plate 180, pressure sensor 181, inner upper side 182, outer lower side 183, upper groove 184;

[0021] Frame 200; machine base 300; centering device 500; vertical linear module 800; control device 900. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] like Figure 1 As shown in the figure, this embodiment illustrates a wafer bonding apparatus, including an airbag device 100 for bonding wafer 1, as well as a frame 200, a machine base 300, a centering device 500, a vertical linear module 800, and a control device 900.

[0024] A vertical linear module 800 and a control device 900 are mounted on the rack 200. The airbag device 100 is mounted on the vertical linear module 800 and is suspended above the machine table 300. The machine table 300 is used to place two wafers 1 to be pressed, and the two wafers 1 are aligned using the centering device 500. The vertical linear module 800 is used to control the up and down movement of the airbag device 100 to press the wafers 1 together. The control device 900 is used to control the operation of the airbag device 100, the vertical linear module 800, and the centering device 500.

[0025] For example Figures 2 to 5The airbag device 100 includes a mounting frame 110, a floating mechanism 120, a fixed frame 130, and an airbag 140 arranged sequentially. The airbag 140 is installed below the fixed frame 130, and the fixed frame 130 and the mounting frame 110 are rotatably connected through the floating mechanism 120. The floating mechanism 120 includes a ball bearing 121 and several support rods 122. The two ends of the ball bearing 121 are respectively connected to the fixed frame 130 and the mounting frame 110. Each support rod 122 is circumferentially spaced around the outer periphery of the ball bearing 121. The lower end of the support rod 122 is connected and fixed to the fixed frame 130, and the upper end of the support rod 122 is movably inserted through the movable hole 111 provided on the mounting frame 110.

[0026] Therefore, in this embodiment, the airbag 140 is connected to the fixing frame 130, and the fixing frame 130 is connected through the floating mechanism 120. Thus, during the wafer bonding process, when the airbag 140 presses down on the wafer 1, the airbag 140 can swing freely within a certain range due to the rotational connection of the ball bearing 121 and the limiting of each support rod 122. This enables the airbag 140 to achieve an adaptive leveling function and can also remove air bubbles from the middle of the two wafers 1 to the outside, ensuring a tight bond between the two wafers 1 and no air bubbles remaining between the wafers, thereby improving the bonding strength and accuracy and greatly increasing the bonding success rate.

[0027] More specifically, since the flatness of the two wafers 1 differs and cannot be completely identical, there may be an unevenness on one side when the two wafers 1 are stacked. The airbag 140 of the airbag device 100 can be pre-inflated to initially press against the upper wafer 1. Furthermore, due to the presence of the ball bearing 121, the airbag 140 can adaptively rotate and level itself according to the flatness of the wafer 1 during subsequent continuous inflation. This ensures that the airbag 140 presses the wafer 1 as a whole after inflation, ensuring that the wafer 1 is subjected to pressure as a whole. The upper wafer 1 will not be subjected to localized pressure, resulting in misalignment with the lower wafer 1. This achieves the adaptive leveling function, ensuring high flatness of the two wafers 1.

[0028] Specifically, such as Figure 1 and Figure 2 The mounting bracket 110, floating mechanism 120 and fixed bracket 130 shown may be surrounded by an airbag device top cover 150 and an airbag device outer cover 160 to protect the internal structure.

[0029] For example Figure 4The fixing frame 130 may have a fixing groove 131 in the middle, and a fixing rod 132 is horizontally arranged in the fixing groove 131. The two ends of the fixing rod 132 can be locked and fixed to both sides of the fixing groove 131. The bearing part 123 of the ball bearing 121 allows the fixing rod 132 to pass through and rotate freely in the fixing groove 131. The connecting rod part 124 of the ball bearing 121 is connected and fixed to the mounting frame 110. Thus, the airbag 140, the fixing frame 130 and the fixing rod 132 can rotate freely with the bearing part 123, which also facilitates the assembly operation.

[0030] See also Figure 3 The movable hole 111 can be a countersunk hole provided on the upper side of the mounting bracket 110, and the countersunk hole penetrates the bottom surface of the mounting bracket 110; the support rod 122 can have four rods, all of which are bolts. The head of the bolt is accommodated in the movable hole 111, and the shank of the bolt passes downward through the movable hole 111 and is locked and fixed with the fixing hole 133 provided on the fixing bracket 130. In this way, after the ball bearing 121 rotatably connects the fixing bracket 130 and the mounting bracket 110, each bolt can be installed quickly. The head of the bolt can swing within the movable hole 111. Thus, the support rods 122 formed by the bolts can limit the swing amplitude of the airbag 140 and the fixing bracket 130 without preventing them from swinging, thus ensuring the compression effect of the airbag 140.

[0031] For example Figure 4 and Figure 5 As shown, an airbag mounting plate 170 may be provided below the fixing frame 130; the airbag mounting plate 170 includes an upper support plate 171 and a lower support plate 172 arranged vertically, and the upper part of the airbag 140 is clamped and fixed by the upper support plate 171 and the lower support plate 172; the lower support plate 172 is annular, and the lower part of the airbag 140 after inflation can expand downward through the annular hole of the lower support plate 172 to form an arc bulge.

[0032] Furthermore, a sensor mounting plate 180 and several pressure sensors 181 may be provided between the airbag mounting plate 170 and the fixing frame 130.

[0033] The sensor mounting plate 180 is connected to the upper part of the fixed airbag mounting plate 170, and the pressure sensors 181 are distributed circumferentially around the center of the fixing frame 130. Both the fixing frame 130 and the sensor mounting plate 180 are disc-shaped. The outer diameter of the fixing frame 130 is smaller than the outer diameter of the sensor mounting plate 180. The upper inner end 182 of the pressure sensor 181 is connected to the bottom of the fixing frame 130, and the lower outer end 183 of the pressure sensor 181 is connected to the top of the sensor mounting plate 180.

[0034] Each pressure sensor 181 is set up to detect the pressure of the airbag 140 during the bonding process of the wafer 1 in real time, so as to achieve a good bonding effect.

[0035] To facilitate the inflation and deflation of the airbag 140, the sensor mounting plate 180 in this embodiment has an upper groove 184 that runs vertically through adjacent pressure sensors 181. The upper part of the airbag 140 has multiple air nozzles 141 extending out of the upper support plate 171 and located within the upper groove 184. Each air nozzle 141 can be connected to an external device (not shown) for inflating or deflating the airbag 140.

[0036] In summary, this utility model, by providing an airbag device 100, with the airbag 140 having an adaptive leveling function and the airbag device 100 being equipped with a pressure sensor 181, ensures controllable pressing force and tight bonding.

[0037] This invention can remove air bubbles from the middle outwards during bonding of two wafers 1, ensuring that no air bubbles are generated during wafer bonding. At the same time, the bonding force and stroke of the wafer bonding are controllable, realizing the flattening function of wafer 1, and achieving stable bonding of warped wafers 1, which can effectively improve the flatness of the bonded sheets and the bonding yield.

[0038] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected by this utility model. It should be noted that for those skilled in the art, equivalent changes and modifications without departing from the principle of this utility model should still fall within the protection scope of this utility model.

[0039] In the description of the embodiments of this application, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in when in use, or the orientation or positional relationship that is commonly understood by those skilled in the art. It is only for the convenience of describing this application and simplifying the description, and is not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation of this application.

Claims

1. An airbag device for a wafer bonding apparatus, characterized in that: It includes a mounting frame, a floating mechanism, a fixed frame, and an airbag arranged sequentially from top to bottom; the airbag is installed below the fixed frame, and the fixed frame and the mounting frame are rotatably connected through the floating mechanism; the floating mechanism includes a ball bearing and several support rods, the two ends of the ball bearing are respectively connected to the fixed frame and the mounting frame, and each support rod is circumferentially spaced around the outer periphery of the ball bearing, the lower end of the support rod is connected and fixed to the fixed frame, and the upper end of the support rod is movably inserted through a movable hole provided on the mounting frame.

2. The airbag device for a wafer bonding apparatus according to claim 1, characterized in that: The fixing frame has a fixing groove, and a fixing rod is horizontally arranged in the fixing groove. The bearing part of the ball bearing allows the fixing rod to pass through and rotate freely in the fixing groove. The connecting rod part of the ball bearing is connected and fixed to the mounting frame.

3. The airbag device for a wafer bonding apparatus according to claim 1, characterized in that: The movable hole is a countersunk hole set on the side of the mounting bracket, and the countersunk hole penetrates the bottom surface of the mounting bracket; the support rod has four rods, all of which are bolts, the head of the bolt is accommodated in the movable hole, and the shank of the bolt passes downward through the movable hole and is locked and fixed with the fixing hole set on the fixed bracket.

4. The airbag device for a wafer bonding apparatus according to claim 1, characterized in that: An airbag mounting plate is provided below the fixing frame; the airbag mounting plate includes an upper support plate and a lower support plate arranged vertically, and the upper part of the airbag is clamped and fixed by the upper support plate and the lower support plate; the lower support plate is annular, and the lower part of the airbag can expand downward through the annular hole of the lower support plate to form an arc bulge after inflation.

5. The airbag device for a wafer bonding apparatus according to claim 4, characterized in that: A sensor mounting plate and several pressure sensors are provided between the airbag mounting plate and the fixing frame; the sensor mounting plate is connected to the upper part of the fixing airbag mounting plate, and the pressure sensors are distributed circumferentially around the center of the fixing frame; both the fixing frame and the sensor mounting plate are disc-shaped, the outer diameter of the fixing frame is smaller than the outer diameter of the sensor mounting plate, the upper inner end of the pressure sensor is connected to the bottom of the fixing frame, and the lower outer end of the pressure sensor is connected to the top of the sensor mounting plate.

6. The airbag device for a wafer bonding apparatus according to claim 5, characterized in that: The sensor mounting plate has an upper groove that runs vertically between adjacent pressure sensors, and the upper part of the airbag has multiple air nozzles that extend out of the upper support plate and are located in the upper groove.

Images