High-voltage filter

Abstract

The utility model discloses a high-voltage filter which comprises an insulating shell, a positive electrode copper bar, a negative electrode copper bar, a grounding bar group, an X capacitor assembly and a Y capacitor assembly, the positive electrode copper bar, the negative electrode copper bar and the grounding bar group are all installed on the insulating shell, a plurality of grooves are formed in the back face of the insulating shell, glue is smeared in the grooves, and the X capacitor assembly and the Y capacitor assembly are arranged in the grooves. The X capacitor assembly comprises at least two pins, one pin is welded with the positive electrode copper bar, the other pin is welded with the negative electrode copper bar, the Y capacitor assembly comprises at least two first Y capacitors, one pin comprises a first pin and a second pin, the other pin comprises a third pin and a fourth pin, the first pin is welded with the positive electrode copper bar, the third pin is welded with the negative electrode copper bar, and the fourth pin is welded with the negative electrode copper bar. And the second pin and the fourth pin are welded with the grounding bar group. According to the scheme, a PCB is omitted, the capacitors are directly connected to the positive electrode copper bar, the negative electrode copper bar and the grounding copper bar, the high-low voltage wiring structure is simple, and the size of part design can be reduced to the maximum extent.

Description

Technical Field

[0001] This application relates to the technical field of filters, and more particularly to a high-voltage filter. Background Technology

[0002] In recent years, the development of new energy vehicles has been rapid. The operation of high-power vehicle electric motors in this industry presents significant design challenges for the electrical connections of filters in the motor controller system. In electric drive systems, filters are key components for filtering, removing low-frequency noise, and optimizing EMC electromagnetic parameters. Due to the compact space of the electric drive controller and the structural requirements of the filter itself, multiple functional components, such as capacitors and positive and negative high-voltage busbars, need to be connected, increasing the complexity of the filter. Currently, the industry widely uses PCB circuit board bridging, moving multiple capacitors onto the PCB and then connecting them to the positive and negative high-voltage copper busbars, relying on bolts for fixation.

[0003] The technical requirements for PCB board current are overly complex, and their design concept and reliability have certain hidden dangers. In the filtering components, multiple X and Y capacitors need to be connected to the positive and negative high-voltage copper busbars and the grounding copper busbar. Due to the number of capacitors and the limited structural space of the electric drive inverter, many designs use custom PCB boards to connect the copper busbars and capacitors. The capacitors need to be transferred to the PCB board before the current is diverted back to the positive and negative high-voltage copper busbars, increasing the cost of the filter. Furthermore, the need for custom PCB boards increases design costs. This connection method also lengthens the circuit, causing the capacitance of small-value capacitors to be diluted in long circuits, losing their functional effectiveness and violating the electrical design principles. Utility Model Content

[0004] The purpose of this application is to provide a high-voltage filter that eliminates the need for a PCB board and directly connects capacitors to the positive, negative, and ground copper busbars, simplifying the high and low voltage wiring structure, facilitating assembly, reducing processing and material costs, and minimizing the size of the component design by stacking the capacitors directly under the copper busbars.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] On one hand, a high-voltage filter is provided, comprising: an insulating housing, a positive copper busbar, a negative copper busbar, a grounding busbar, an X-capacitor assembly, and a Y-capacitor assembly. The positive copper busbar, the negative copper busbar, and the grounding busbar are all mounted on the insulating housing. Multiple grooves are formed on the back of the insulating housing, and adhesive is applied to the grooves. The X-capacitor assembly and the Y-capacitor assembly are respectively disposed in the grooves and fixed to the grooves by the adhesive. The X-capacitor assembly includes at least two pins, one pin being soldered to the positive copper busbar and the other pin being soldered to the negative copper busbar. The Y-capacitor assembly includes at least two first Y capacitors, one of which includes a first pin and a second pin, and the other includes a third pin and a fourth pin. The first pin is soldered to the positive copper busbar, the second pin is soldered to the grounding busbar, the third pin is soldered to the negative copper busbar, and the fourth pin is soldered to the grounding busbar.

[0007] Furthermore, the X capacitor assembly includes a first X capacitor and a second X capacitor, wherein the capacitance value of the first X capacitor is greater than the capacitance value of the second X capacitor. The first X capacitor includes a fifth pin and a sixth pin, and the second X capacitor includes a seventh pin and an eighth pin. The fifth pin and the seventh pin are both welded to the positive copper busbar, and the sixth pin and the eighth pin are both welded to the negative copper busbar.

[0008] Furthermore, the pins of the X capacitor assembly extend toward the front of the insulating housing and are welded to the positive copper busbar and the negative copper busbar respectively. The insulating housing is hollowed out corresponding to the pin positions of the X capacitor assembly so that the pins of the X capacitor assembly extend vertically.

[0009] Furthermore, the Y capacitor assembly also includes two second Y capacitors, the capacitance of which is smaller than that of the first Y capacitor. One of the second Y capacitors includes a ninth pin and a tenth pin, and the other second Y capacitor includes an eleventh pin and a twelfth pin. The ninth pin is welded to the positive copper busbar, the eleventh pin is welded to the negative copper busbar, and the tenth and twelfth pins are both welded to the grounding busbar.

[0010] Furthermore, the leads of the second Y capacitor all extend vertically toward the front of the insulating housing, and the insulating housing has through holes corresponding to the lead positions of the second Y capacitor, so that the leads of the second Y capacitor extend vertically.

[0011] Furthermore, the grounding busbar group includes a first grounding copper busbar and a second grounding copper busbar, the tenth pin is welded to the first grounding copper busbar, and the twelfth pin is welded to the second grounding copper busbar.

[0012] Furthermore, the positive electrode copper busbar extends toward the back of the insulating shell to form a first welding portion, and the first pin is welded to the first welding portion; the negative electrode copper busbar extends toward the back of the insulating shell to form a second welding portion, and the third pin is welded to the second welding portion.

[0013] Furthermore, the grounding busbar group also includes a third grounding copper busbar, to which both the second pin and the fourth pin are soldered.

[0014] Furthermore, a distance of 1-2 mm is left between the pin end of the X capacitor assembly and the soldering position; a distance of 1-2 mm is left between the pin end of the Y capacitor assembly and the soldering position.

[0015] Furthermore, an identification code is provided on the outer surface of the insulating shell.

[0016] The beneficial effects of this application are as follows: This solution abandons the traditional PCB circuit board bridging method. By directly installing and bonding the X capacitor assembly and Y capacitor assembly in the groove on the back of the insulating shell, direct connection between the capacitor components and the positive copper busbar, negative copper busbar, and ground busbar is achieved. The two pins of the X capacitor assembly are soldered to the positive and negative copper busbars respectively to filter low-frequency noise; while the Y capacitor assembly contains at least two first Y capacitors, whose pins are soldered to the positive copper busbar, negative copper busbar, and ground busbar respectively to further optimize EMC electromagnetic parameters. This design not only simplifies the high and low voltage wiring structure and reduces assembly difficulty and cost, but also reduces design and material costs by eliminating the PCB board. At the same time, the capacitor components are directly stacked under the copper busbar, minimizing the component design volume. In addition, the direct soldering connection method is more stable and reliable than the PCB circuit board connection, reducing the risk of failure due to poor connection or looseness. The shortened current path also reduces the loss caused by resistance and inductance, avoiding the problem of capacitance dilution in long-line circuits with small capacitance values, thus ensuring the filtering effect of the capacitor. Attached Figure Description

[0017] The present application will now be described in further detail with reference to the accompanying drawings and embodiments.

[0018] Figure 1 This is a perspective view of the high-voltage filter described in the embodiments of this application;

[0019] Figure 2 This is a front view of the high-voltage filter described in the embodiment of this application;

[0020] Figure 3 This is a rear view of the high-voltage filter described in the embodiment of this application;

[0021] Figure 4 This is a three-dimensional representation of the high-voltage filter described in the embodiments of this application. Figure 1 (Excluding the insulating housing);

[0022] Figure 5 This is a three-dimensional representation of the high-voltage filter described in the embodiments of this application. Figure 2 (Insulating housing not included)

[0023] In the diagram: 1. Insulating shell; 2. Positive copper busbar; 201. First welding part; 3. Negative copper busbar; 301. Second welding part; 4. Grounding busbar assembly; 401. First grounding copper busbar; 402. Second grounding copper busbar; 403. Third grounding copper busbar; 5. X capacitor assembly; 501. First X capacitor; 502. Second X capacitor; 5011. Fifth pin; 5012. Sixth pin; 5021. Seventh pin; 5022. Eighth pin; 6. Y capacitor assembly; 601. First Y capacitor; 602. Second Y capacitor; 6011. First pin; 6012. Second pin; 6013. Third pin; 6014. Fourth pin; 6021. Ninth pin; 6022. Tenth pin; 6023. Eleventh pin; 6024. Twelfth pin. Detailed Implementation

[0024] To make the technical problems solved by this application, the technical solutions adopted, and the technical effects achieved clearer, the technical solutions of the embodiments of this application are further described in detail below. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0027] like Figures 1-5 As shown, this embodiment provides a high-voltage filter, including: an insulating housing 1, a positive copper busbar 2, a negative copper busbar 3, a grounding busbar 4, an X-capacitor assembly 5, and a Y-capacitor assembly 6. The positive copper busbar 2, the negative copper busbar 3, and the grounding busbar 4 are all mounted on the insulating housing 1. Multiple grooves are formed on the back of the insulating housing 1, and adhesive is applied to the grooves. The X-capacitor assembly 5 and the Y-capacitor assembly 6 are respectively disposed in the grooves and fixed to the grooves by the adhesive. The X-capacitor assembly 5 includes at least two leads, one of which is connected to the positive terminal... The copper busbar 2 is welded, and another pin is welded to the negative copper busbar 3. The Y capacitor assembly 6 includes at least two first Y capacitors 601. One of the first Y capacitors 601 includes a first pin 6011 and a second pin 6012, and the other first Y capacitor 601 includes a third pin 6013 and a fourth pin 6014. The first pin 6011 is welded to the positive copper busbar 2, the second pin 6012 is welded to the grounding busbar 4, the third pin 6013 is welded to the negative copper busbar 3, and the fourth pin 6014 is welded to the grounding busbar 4.

[0028] Based on the above scheme, the traditional PCB circuit board bridging method is abandoned. Instead, the capacitor components (X capacitor assembly 5 and Y capacitor assembly 6) are directly connected to the positive copper busbar 2, the negative copper busbar 3, and the ground busbar 4. This design simplifies the high and low voltage wiring structure, improves assembly efficiency, and reduces costs. Specifically, X capacitor assembly 5 and Y capacitor assembly 6 are placed in a groove on the back of the insulating housing 1 and glued together. This design not only simplifies the capacitor installation process but also improves the stability and reliability of the capacitors. X capacitor assembly 5 has at least two pins, one of which is soldered to the positive copper busbar 2 and the other to the negative copper busbar 3. This connection method allows the X capacitor to provide filtering between the positive and negative terminals, removing low-frequency noise. Y capacitor assembly 6 includes at least two first Y capacitors 601, each with two pins. One of the first Y capacitors 601 has its first pin 6011 soldered to the positive copper busbar 2, and its second pin 6012 soldered to the ground busbar 4. The other first Y capacitor 601 has its third pin 6013 soldered to the negative copper busbar 3, and its fourth pin 6014 soldered to the ground busbar 4. This connection method allows the Y capacitors to provide filtering between the positive, negative, and ground terminals, further optimizing EMC electromagnetic parameters. In the electric drive system, current flows through the positive copper busbar 2 and the negative copper busbar 3, while the capacitors are connected to the circuit through pins soldered to the copper busbars. This design not only simplifies the current path but also reduces the distance the current travels on the PCB board, thereby reducing losses caused by resistance and inductance.

[0029] This solution simplifies the filter structure and reduces assembly difficulty and cost by eliminating the PCB board and directly connecting the capacitors to the copper busbar. Direct soldering provides a more robust and reliable connection than a PCB, reducing the risk of failure due to poor connections or looseness. Directly connecting the capacitors to the copper busbar shortens the current path, reducing losses from resistance and inductance, and preventing capacitance dilution in long circuits, thus ensuring effective filtering. The elimination of the need for a custom PCB reduces design and material costs. Furthermore, stacking the capacitors directly beneath the copper busbar minimizes component size, further reducing costs.

[0030] Furthermore, the X-capacitor assembly 5 includes a first X-capacitor 501 and a second X-capacitor 502. The capacitance value of the first X-capacitor 501 is greater than that of the second X-capacitor 502. The first X-capacitor 501 includes a fifth pin 5011 and a sixth pin 5012, and the second X-capacitor 502 includes a seventh pin 5021 and an eighth pin 5022. Both the fifth pin 5011 and the seventh pin 5021 are soldered to the positive copper busbar 2, and both the sixth pin 5012 and the eighth pin 5022 are soldered to the negative copper busbar 3. These two capacitors differ in their electrical characteristics, specifically in their capacitance values: the capacitance value of the first X-capacitor 501 is designed to be greater than that of the second X-capacitor 502. In terms of physical connection, the first X-capacitor 501 includes the fifth pin 5011 and the sixth pin 5012, while the second X-capacitor 502 includes the seventh pin 5021 and the eighth pin 5022. The two capacitors have similar pin connections: their positive leads (pin 5011 and pin 5021) are soldered to the positive copper busbar 2, while their negative leads (pin 6012 and pin 8022) are soldered to the negative copper busbar 3. This design allows the X-capacitor assembly 5 to play a more precise role in the filtering process. Because the first X-capacitor 501 has a larger capacitance, it can more effectively filter out low-frequency noise and interference. The second X-capacitor 502, although with a smaller capacitance, exhibits better filtering performance in the high-frequency range. Therefore, by properly matching these two capacitors, the X-capacitor assembly 5 can provide excellent filtering effects over a wider frequency range.

[0031] Furthermore, the pins of the X-capacitor assembly 5 extend towards the front of the insulating housing 1 and are welded to the positive copper busbar 2 and the negative copper busbar 3, respectively. The insulating housing 1 is hollowed out at the pin positions of the X-capacitor assembly 5, allowing the pins of the X-capacitor assembly 5 to extend vertically. The pins of the X-capacitor assembly 5 are no longer confined to the back of the insulating housing 1, but extend towards the front of the insulating housing 1 and are directly welded to the positive copper busbar 2 and the negative copper busbar 3. To achieve this design, the insulating housing 1 is hollowed out at the positions corresponding to the pins of the X-capacitor assembly 5. This hollowed-out design not only ensures that the pins of the X-capacitor assembly 5 can extend vertically, but also makes the welding process more convenient and efficient. During welding, the operator can directly approach the pins from the front of the insulating housing 1 without worrying about space limitations or obstructed vision. In addition, this design brings additional advantages. Since the pins extend directly from the front of the insulating housing 1 and are welded to the copper busbars, the electrical connection is more direct and tighter. This helps to reduce losses caused by resistance and inductance, improving the overall performance of the filter.

[0032] In some embodiments, the Y-capacitor assembly 6 further includes two second Y-capacitors 602, the capacitance of which is smaller than that of the first Y-capacitor 601. One of the second Y-capacitors 602 includes a ninth pin 6021 and a tenth pin 6022, and the other includes an eleventh pin 6023 and a twelfth pin 6024. The ninth pin 6021 is welded to the positive copper busbar 2, the eleventh pin 6023 is welded to the negative copper busbar 3, and the tenth pin 6022 and the twelfth pin 6024 are both welded to the ground busbar 4. In addition to the at least two first Y-capacitors 601 mentioned above, the Y-capacitor assembly 6 now also includes two second Y-capacitors 602. These two second Y-capacitors 602 differ from the first Y-capacitors 601 in electrical characteristics, mainly in their capacitance values: the capacitance of the second Y-capacitors 602 is designed to be smaller than that of the first Y-capacitors 601. Physically, each second Y-capacitor 602 includes two pins. One of the second Y capacitors 602 includes pins 6021 (ninth) and 6022 (tenth), while the other includes pins 6023 (eleventh) and 6024 (twelfth). The pin connections of these two second Y capacitors 602 differ: pin 6021 is soldered to the positive copper busbar 2, pin 6023 is soldered to the negative copper busbar 3, and pins 6022 and 6024 are both soldered to the ground busbar 4. This design allows the Y capacitor assembly 6 to play a more detailed and comprehensive role in the filtering process. Because the second Y capacitors 602 have smaller capacitance values, their filtering effect on high-frequency noise and interference is more significant. Therefore, by properly matching the first Y capacitor 601 and the second Y capacitor 602, the Y capacitor assembly 6 can provide excellent filtering performance over a wider frequency range, thus meeting the high requirements for filters in the electric drive systems of new energy vehicles.

[0033] Furthermore, this extended Y-capacitor assembly 6 design offers additional advantages. Because the pins of each capacitor are directly soldered to the copper busbar or ground busbar 4, the electrical connections between them are tighter and more reliable. This helps reduce the risk of failure due to poor or loose connections and improves the overall stability and durability of the filter.

[0034] Meanwhile, the leads of the second Y capacitor 602 all extend vertically towards the front of the insulating housing 1. The insulating housing 1 has through holes corresponding to the lead positions of the second Y capacitor 602, allowing the leads of the second Y capacitor 602 to extend vertically. The insulating housing 1 has carefully designed through holes at the corresponding lead positions of the second Y capacitor 602. The size and position of these through holes have been precisely calculated to ensure that the leads of the second Y capacitor 602 can extend vertically without obstruction. This design not only makes the soldering process more intuitive and convenient but also improves the stability and reliability of the electrical connection.

[0035] Typically, grounding busbar group 4 consists of a first grounding copper busbar 401 and a second grounding copper busbar 402, which together constitute an important grounding system in the filter. In terms of connection, the two pins of the second Y capacitor 602 (i.e., pin 10 6022 and pin 12 6024) are soldered to the first grounding copper busbar 401 and the second grounding copper busbar 402 in grounding busbar group 4, respectively. This design ensures a tight and reliable electrical connection between the capacitor and the grounding system, contributing to improved overall filter performance and stability. Specifically, the soldering connection of pin 10 6022 to the first grounding copper busbar 401 provides a stable grounding path for the filter, helping to filter out common-mode noise in the system. The soldering connection of pin 12 6024 to the second grounding copper busbar 402 further enhances the grounding effect of the filter, enabling it to better cope with interference in complex electromagnetic environments. Furthermore, by designing grounding busbar group 4 to include two independent grounding copper busbars, the high-voltage filter of this application also achieves significant improvements in the flexibility and reliability of the grounding system. This design allows the filter to flexibly adjust the grounding path as needed to adapt to different operating environments and electromagnetic interference conditions.

[0036] Specifically, the positive copper busbar 2 extends towards the back of the insulating housing 1 and forms a first welding portion 201, with the first pin 6011 welded to the first welding portion 201; the negative copper busbar 3 extends towards the back of the insulating housing 1 and forms a second welding portion 301, with the third pin 6013 welded to the second welding portion 301. The first welding portion 201 of the positive copper busbar 2 is specifically designed for welding to the first pin 6011 of the first Y capacitor 601. This design ensures that the positive terminal of the capacitor can be directly and tightly connected to the positive copper busbar 2, thereby reducing resistance and inductance losses in the electrical connection and improving the overall performance of the filter. Similarly, the second welding portion 301 of the negative copper busbar 3 is also designed for welding to the third pin 6013 of the second Y capacitor 602. This connection method also ensures that the electrical connection between the negative terminal of the capacitor and the negative copper busbar 3 is both stable and reliable. By designing the positive copper busbar 2 and the negative copper busbar 3 to extend towards the back of the insulating housing 1, and forming a welded portion in the extended portion, the high-voltage filter of this application achieves significant progress in electrical connection. This design not only simplifies the connection process between the capacitor components and the copper busbars, but also improves the stability and reliability of the connection. Simultaneously, since the welded portion is located on the back of the insulating housing 1, it also reduces operational difficulties caused by space constraints or obstructed vision.

[0037] Optionally, the grounding busbar group 4 further includes a third grounding copper busbar 403, to which both the second pin 6012 and the fourth pin 6014 are soldered. By introducing the third grounding copper busbar 403, the high-voltage filter of this application achieves further improvements in the flexibility and reliability of the grounding system. This design allows the filter to flexibly adjust the grounding path as needed to adapt to different operating environments and electromagnetic interference conditions. Simultaneously, the presence of the third grounding copper busbar 403 also increases the filter's ability to cope with interference in complex electromagnetic environments.

[0038] It is worth mentioning that a 1-2mm distance is maintained between the pin tip of the X capacitor assembly 5 and the soldering position; a 1-2mm distance is also maintained between the pin tip of the Y capacitor assembly 6 and the soldering position. During the soldering process, due to physical phenomena such as thermal expansion and contraction, slight displacement or stress may occur between the pin and the copper busbar. This distance acts as a buffer, reducing the risk of loosening between the pin and the copper busbar due to stress concentration. This is crucial for ensuring the long-term stable operation of the filter. Furthermore, maintaining an appropriate distance allows for greater flexibility and control in the soldering process. Operators can more easily adjust the position and angle of the pins to ensure the soldering point is in the optimal position, which helps improve the strength and reliability of the soldering and reduces failures caused by poor soldering.

[0039] To ensure the traceability and identifiability of the filter, the outer surface of the insulating housing 1 is designed for laser engraving of identification codes. This design not only improves the filter's identification efficiency but also enhances its convenience during production, installation, and maintenance. Laser engraving is a method of permanently marking a material surface using laser technology. This method offers advantages such as clear markings, wear resistance, and fade resistance, making it ideal for marking electrical equipment such as high-voltage filters. Laser engraving of identification codes on the outer surface of the insulating housing 1 ensures that the filter maintains the integrity and readability of its markings throughout its entire lifespan. However, in some cases, laser engraving may not be feasible due to material characteristics, process limitations, or cost considerations. To address this, an alternative solution is provided: a label is first applied to the outer surface of the insulating housing 1. This label is designed to be 15*25mm in size to ensure it can accommodate sufficient identification information without negatively impacting the overall appearance and performance of the filter.

[0040] To ensure the filter described in this solution can operate continuously, stably, and efficiently, a comprehensive data test was performed on the filter, as shown below:

[0041] I. Withstand Voltage Test

[0042] (1) Voltage withstand capability between positive and negative copper busbars:

[0043] Test voltage: 600VDC

[0044] Test procedure: The voltage rises for 10 seconds, is held for 60 seconds, and then drops for 10 seconds.

[0045] Test results: No breakdown, leakage current less than or equal to 5mA.

[0046] (2) Withstand voltage between the positive and negative copper busbars and the insulating shell:

[0047] Test voltage: 3000VDC

[0048] Test procedure: The voltage rises for 10 seconds, is held for 60 seconds, and then drops for 10 seconds.

[0049] Test results: No breakdown, leakage current less than or equal to 5mA.

[0050] (3) Withstand voltage between the positive and negative copper busbars and ground (all grounding copper busbars need to be connected in series): Test voltage: 3000VDC

[0051] Test procedure: The voltage rises for 10 seconds, is held for 60 seconds, and then drops for 10 seconds.

[0052] Test results: No breakdown, leakage current less than or equal to 5mA.

[0053] II. Insulation Resistance Test

[0054] (1) Insulation resistance between the positive and negative copper busbars:

[0055] Test voltage range: 1000VDC

[0056] Test procedure: Increase the pressure for 10 seconds, hold for 60 seconds, and then decrease it for 10 seconds.

[0057] Test results: Insulation resistance is greater than or equal to 20MΩ.

[0058] (2) Insulation resistance between the positive and negative copper busbars short-circuited and grounded:

[0059] Test voltage range: 1000VDC

[0060] Test procedure: Increase the pressure for 10 seconds, hold for 60 seconds, and then decrease it for 10 seconds.

[0061] Test results: Insulation resistance is greater than or equal to 600MΩ.

[0062] III. Mechanical Performance Testing

[0063] (1) The weld strength of capacitors and copper busbars:

[0064] Test requirements: The tensile strength at the connection point must be greater than or equal to 40N.

[0065] Capacitor bonding strength:

[0066] Test requirement: Adhesion strength greater than 500N.

[0067] IV. Capacitance Measurement

[0068] Measurement conditions: The measurement was performed at a voltage of 1Vac and a frequency of 1kHz, and the data was recorded.

[0069] Measurement points and range:

[0070] Measurement point 1: Between the positive and negative electrodes

[0071] Capacitance range: 2410nF ± 20% (i.e., 1928~2892nF).

[0072] Measurement point 2: Positive terminal to ground (all grounding copper busbars connected in series)

[0073] Capacitance range: 421.99nF ± 10% (i.e., 379.791~464.189nF).

[0074] Measurement point 3: Negative terminal to ground (all grounding copper busbars connected in series)

[0075] Capacitance range: 421.99nF ± 10% (i.e., 379.791~464.189nF).

[0076] In summary, the filter testing parameters provided by this solution cover multiple aspects such as electrical performance, mechanical performance, and capacitance value, ensuring that the quality and performance of the filter meet the design requirements.

[0077] In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and other orientations or positional relationships are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used merely for descriptive distinction and have no special meaning.

[0078] In the description of this specification, references to terms such as "an embodiment," "example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0079] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style of the specification is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0080] The technical principles of this application have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this application and should not be construed as limiting the scope of protection of this application in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this application without inventive effort, and these embodiments will all fall within the scope of protection of this application.

Claims

1. A high-voltage filter, characterized in that, include: An insulating housing (1), a positive copper busbar (2), a negative copper busbar (3), a grounding busbar (4), an X capacitor assembly (5), and a Y capacitor assembly (6) are provided. The positive copper busbar (2), the negative copper busbar (3), and the grounding busbar (4) are all mounted on the insulating housing (1). Multiple grooves are provided on the back of the insulating housing (1), and adhesive is applied to the grooves. The X capacitor assembly (5) and the Y capacitor assembly (6) are respectively disposed in the grooves and are adhered to them by the adhesive. The X capacitor assembly (5) includes at least two pins, one of which is soldered to the positive copper busbar (2), and the other pin is... The negative copper busbar (3) is welded, and the Y capacitor assembly (6) includes at least two first Y capacitors (601), one of which includes a first pin (6011) and a second pin (6012), and the other includes a third pin (6013) and a fourth pin (6014). The first pin (6011) is welded to the positive copper busbar (2), the second pin (6012) is welded to the grounding busbar (4), the third pin (6013) is welded to the negative copper busbar (3), and the fourth pin (6014) is welded to the grounding busbar (4).

2. The high-voltage filter according to claim 1, characterized in that, The X capacitor assembly (5) includes a first X capacitor (501) and a second X capacitor (502). The capacitance value of the first X capacitor (501) is greater than that of the second X capacitor (502). The first X capacitor (501) includes a fifth pin (5011) and a sixth pin (5012). The second X capacitor (502) includes a seventh pin (5021) and an eighth pin (5022). The fifth pin (5011) and the seventh pin (5021) are both welded to the positive copper busbar (2). The sixth pin (5012) and the eighth pin (5022) are both welded to the negative copper busbar (3).

3. The high-voltage filter according to claim 1, characterized in that, The pins of the X capacitor assembly (5) extend toward the front of the insulating housing (1) and are welded to the positive copper busbar (2) and the negative copper busbar (3) respectively. The insulating housing (1) is hollowed out corresponding to the pin positions of the X capacitor assembly (5) so that the pins of the X capacitor assembly (5) extend vertically.

4. The high-voltage filter according to any one of claims 1-3, characterized in that, The Y capacitor assembly (6) further includes two second Y capacitors (602), the capacitance of which is smaller than that of the first Y capacitor (601). One of the second Y capacitors (602) includes a ninth pin (6021) and a tenth pin (6022), and the other second Y capacitor (602) includes an eleventh pin (6023) and a twelfth pin (6024). The ninth pin (6021) is welded to the positive copper busbar (2), the eleventh pin (6023) is welded to the negative copper busbar (3), and the tenth pin (6022) and the twelfth pin (6024) are both welded to the grounding busbar (4).

5. The high-voltage filter according to claim 4, characterized in that, The pins of the second Y capacitor (602) extend vertically toward the front of the insulating housing (1). The insulating housing (1) has through holes corresponding to the pin positions of the second Y capacitor (602) so that the pins of the second Y capacitor (602) extend vertically.

6. The high-voltage filter according to claim 4, characterized in that, The grounding busbar group (4) includes a first grounding copper busbar (401) and a second grounding copper busbar (402). The tenth pin (6022) is welded to the first grounding copper busbar (401), and the twelfth pin (6024) is welded to the second grounding copper busbar (402).

7. The high-voltage filter according to any one of claims 1-3, characterized in that, The positive electrode copper busbar (2) extends toward the back of the insulating shell (1) and forms a first welding part (201), and the first pin (6011) is welded to the first welding part (201); the negative electrode copper busbar (3) extends toward the back of the insulating shell (1) and forms a second welding part (301), and the third pin (6013) is welded to the second welding part (301).

8. The high-voltage filter according to claim 7, characterized in that, The grounding busbar group (4) also includes a third grounding copper busbar (403), and the second pin (6012) and the fourth pin (6014) are both soldered to the third grounding copper busbar (403).

9. The high-voltage filter according to any one of claims 1-3, characterized in that, The pin end of the X capacitor assembly (5) is 1-2 mm away from the soldering position; the pin end of the Y capacitor assembly (6) is 1-2 mm away from the soldering position.

10. The high-voltage filter according to any one of claims 1-3, characterized in that, The outer surface of the insulating shell (1) is provided with an identification code.

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