Anti-voltage substrate

Abstract

The utility model discloses a pressure-resistant substrate, which relates to the technical field of circuit substrates and comprises a substrate body, limiting units arranged on the left side and the right side of the substrate body and pressure-resistant units arranged on the upper side and the lower side of the substrate body. Each limiting unit comprises U-shaped frames arranged on the left side and the right side of the base plate body, extrusion assemblies arranged in the U-shaped frames and a locking assembly arranged between the two U-shaped frames. The compression-resistant unit comprises a heat dissipation assembly arranged at the top end of the substrate body and a buffer assembly arranged at the bottom end of the substrate body. According to the piezoelectric substrate, the two ends of the substrate body are placed in the two rectangular holes, the two extrusion plates descend to extrude the upper portion of the substrate body, meanwhile, the bottom plate and the flexible columns are arranged to abut against the lower portion of the substrate body, and the fixing effect of the substrate body is optimized; and meanwhile, the top plate, the bottom plate and the two U-shaped frames form a whole, so that the anti-pressure capability of the substrate body is improved.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a pressure-resistant circuit board. Background Technology

[0002] The substrate is the basic material for manufacturing PCBs. Generally, the substrate is a copper-clad laminate. In the manufacturing process of single-sided and double-sided printed circuit boards, selective hole processing, chemical copper plating, electroplating, etching and other processes are carried out on the substrate material - copper-clad laminate to obtain the required circuit pattern. The substrate is made of high-purity alumina as the main raw material through high pressure forming, high temperature firing, and then cutting and polishing. Ceramic substrate is the basic material for manufacturing thick film and thin film circuits.

[0003] A search revealed a public (announcement) document (CN214901420U) disclosing a pressure-resistant circuit board, belonging to the technical field of circuit board technology. The board includes a base, a support rod movably connected to the top center of the base, a first spring connected to the bottom of the support rod, and a fixed connection between the first spring and the base on the side away from the support rod. Limiting blocks are welded to the middle of the left and right sides of the support rod, and the bottoms of the limiting blocks are connected to the top surface of the base via second springs. A washer is detachably connected to the top surface of the support rod, and the bottom of the washer is connected to the limiting blocks. The circuit board is detachably connected to the side of the support rod. This invention utilizes symmetrically distributed limiting holes on both sides of the circuit board for connection to the support rod, and the washer at the connection point facilitates the installation and removal of the circuit board. The first and second springs provide cushioning and shock absorption for the circuit board, ensuring it is not damaged.

[0004] Although the above solution uses the first and second springs to buffer and dampen the circuit board, ensuring that the circuit board is not damaged, the fixing effect of the board is not good enough, which causes the board to move and be damaged when it is impacted. In addition, the board needs to dissipate heat in time and ensure good pressure resistance. Utility Model Content

[0005] The main purpose of this utility model is to provide a pressure-resistant circuit board. By setting a limiting unit, it solves the problem that the fixing effect of the board is not good enough, which leads to the board moving and being damaged when it is impacted. By setting a pressure-resistant unit, it solves the problem that the board needs to dissipate heat in time while ensuring good pressure resistance.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A pressure-resistant circuit board includes a board body, limiting units disposed on the left and right sides of the board body, and pressure-resistant units disposed on the upper and lower sides of the board body.

[0008] The limiting unit includes a U-shaped frame disposed on the left and right sides of the substrate body, a pressing component disposed inside the U-shaped frame, and a locking component disposed between the two U-shaped frames;

[0009] The pressure-resistant unit includes a heat dissipation component disposed at the top of the substrate body and a buffer component disposed at the bottom of the substrate body.

[0010] Preferably, the extrusion assembly in the limiting unit includes a rectangular hole opened inside the U-shaped frame, a first elastic post disposed at the top of the rectangular hole, a first spring disposed on the surface of the first elastic post, and an extrusion plate fixedly connected to the bottom end of the first elastic post.

[0011] Preferably, the locking assembly in the limiting unit includes two snap-fit ​​plates fixedly connected to one side of one of the U-shaped frames, a through hole opened in the middle of the snap-fit ​​plates, two snap-fit ​​grooves opened inside the other side of the U-shaped frame, a second elastic post disposed inside the snap-fit ​​groove, a second spring disposed on the surface of the second elastic post, and an extension post fixedly connected to one side of the second elastic post.

[0012] The extension post is configured to match the corresponding through hole.

[0013] Preferably, the limiting unit further includes two limiting grooves formed on one side of the U-shaped frame;

[0014] The two limiting grooves are symmetrically arranged along the middle of the rectangular hole.

[0015] Preferably, the heat dissipation component in the pressure-resistant unit includes a top plate disposed at the top of the substrate body, a plurality of vent holes opened inside the top plate, and a first extension plate fixedly connected to both sides of the top plate.

[0016] Preferably, the buffer assembly in the pressure-resistant unit includes a base plate disposed at the bottom end of the substrate body, a plurality of flexible columns fixedly connected to the top end of the base plate, and a second extension plate fixedly connected to both sides of the base plate.

[0017] Preferably, the first extension plate and the second extension plate in the compression-resistant unit are respectively engaged with the corresponding limiting groove.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] I. In this utility model, by setting the limiting unit, the two ends of the substrate body are placed inside the two rectangular holes. Then, by using the elastic force of the first elastic column and the first spring, the two extrusion plates are driven to descend and extrude the upper part of the substrate body. At the same time, by setting the bottom plate and multiple flexible columns, the substrate body is held against the lower part, which optimizes the fixing effect of the substrate body. Meanwhile, the two U-shaped frames are attached together by setting the snap-fit ​​plate and snap-fit ​​groove, and the extension column is snapped into the through hole, which further improves the fixing effect and impact resistance of the substrate.

[0020] Second, in this utility model, by setting the top plate and multiple vent holes in the pressure-resistant unit, the heat generated by the substrate body will be dissipated through the two rectangular holes and multiple vent holes. Furthermore, the top plate and the bottom plate are engaged with the corresponding limiting grooves by means of the first extension plate and the second extension plate. In this way, the top plate, the bottom plate and the two U-shaped frames form a whole, thereby improving the pressure resistance of the substrate body. Attached Figure Description

[0021] Figure 1 This is a cross-sectional view of the present invention;

[0022] Figure 2 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 3 This is a three-dimensional structural diagram of one of the U-shaped frames in this utility model;

[0024] Figure 4 This is a cross-sectional view of another U-shaped frame in this utility model;

[0025] Figure 5 This is a three-dimensional structural diagram of the base plate of this utility model.

[0026] In the picture:

[0027] 1. Substrate body;

[0028] 2. Limiting unit; 201. U-shaped frame; 202. First spring; 203. First elastic post; 204. Extrusion plate; 205. Rectangular hole; 206. Limiting groove; 207. Snap-fit ​​plate; 208. Through hole; 209. Snap-fit ​​groove; 210. Extension post; 211. Second spring; 212. Second elastic post;

[0029] 3. Compression-resistant unit; 301. Top plate; 302. Ventilation hole; 303. First extension plate; 304. Flexible column; 305. Bottom plate; 306. Second extension plate. Detailed Implementation

[0030] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments. Example 1

[0031] like Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5 As shown, a pressure-resistant circuit board includes a board body 1, a limiting unit 2 disposed on the left and right sides of the board body 1, and a pressure-resistant unit 3 disposed on the upper and lower sides of the board body 1.

[0032] The limiting unit 2 includes a U-shaped frame 201 disposed on the left and right sides of the substrate body 1, a pressing component disposed inside the U-shaped frame 201, and a locking component disposed between the two U-shaped frames 201.

[0033] The pressure-resistant unit 3 includes a heat dissipation component disposed at the top of the substrate body 1 and a buffer component disposed at the bottom of the substrate body 1.

[0034] The extrusion assembly in the limiting unit 2 includes a rectangular hole 205 opened inside the U-shaped frame 201, a first elastic post 203 disposed at the top of the rectangular hole 205, a first spring 202 disposed on the surface of the first elastic post 203, and an extrusion plate 204 fixedly connected to the bottom end of the first elastic post 203.

[0035] The locking assembly in the limiting unit 2 includes two snap-fit ​​plates 207 fixedly connected to one side of one of the U-shaped frames 201, a through hole 208 opened in the middle of the snap-fit ​​plate 207, two snap-fit ​​grooves 209 opened inside one side of the other U-shaped frame 201, a second elastic post 212 disposed inside the snap-fit ​​groove 209, a second spring 211 disposed on the surface of the second elastic post 212, and an extension post 210 fixedly connected to one side of the second elastic post 212.

[0036] The extension post 210 is matched with the corresponding through hole 208.

[0037] The limiting unit 2 also includes two limiting grooves 206 formed on one side of the U-shaped frame 201;

[0038] Two limiting grooves 206 are symmetrically arranged along the middle of the rectangular hole 205.

[0039] The heat dissipation components in the pressure-resistant unit 3 include a top plate 301 disposed at the top of the substrate body 1, a plurality of vent holes 302 opened inside the top plate 301, and a first extension plate 303 fixedly connected to both sides of the top plate 301.

[0040] The buffer assembly in the pressure-resistant unit 3 includes a base plate 305 disposed at the bottom end of the substrate body 1, a plurality of flexible columns 304 fixedly connected to the top end of the base plate 305, and a second extension plate 306 fixedly connected to both sides of the base plate 305.

[0041] In the compression-resistant unit 3, the first extension plate 303 and the second extension plate 306 are respectively engaged with the corresponding limiting groove 206.

[0042] The two ends of the substrate body 1 are placed inside the two rectangular holes 205. Then, the elastic force of the first elastic post 203 and the first spring 202 drives the two extrusion plates 204 to descend and extrude the upper part of the substrate body 1. At the same time, the bottom plate 305 and multiple flexible posts 304 are set to hold the substrate body 1 against the bottom, which optimizes the fixing effect of the substrate body 1. Meanwhile, the two U-shaped frames 201 are attached together by the setting of the snap-fit ​​plate 207 and the snap-fit ​​groove 209. At the same time, the extension post 210 is snapped into the through hole 208, which further improves the fixing effect and impact resistance of the substrate. Example 2

[0043] like Figure 1 , Figure 2 , Figure 3 , Figure 4 as well as Figure 5 As shown, a pressure-resistant circuit board includes a board body 1, a limiting unit 2 disposed on the left and right sides of the board body 1, and a pressure-resistant unit 3 disposed on the upper and lower sides of the board body 1.

[0044] The limiting unit 2 includes a U-shaped frame 201 disposed on the left and right sides of the substrate body 1, a pressing component disposed inside the U-shaped frame 201, and a locking component disposed between the two U-shaped frames 201.

[0045] The pressure-resistant unit 3 includes a heat dissipation component disposed at the top of the substrate body 1 and a buffer component disposed at the bottom of the substrate body 1.

[0046] The extrusion assembly in the limiting unit 2 includes a rectangular hole 205 opened inside the U-shaped frame 201, a first elastic post 203 disposed at the top of the rectangular hole 205, a first spring 202 disposed on the surface of the first elastic post 203, and an extrusion plate 204 fixedly connected to the bottom end of the first elastic post 203.

[0047] The locking assembly in the limiting unit 2 includes two snap-fit ​​plates 207 fixedly connected to one side of one of the U-shaped frames 201, a through hole 208 opened in the middle of the snap-fit ​​plate 207, two snap-fit ​​grooves 209 opened inside one side of the other U-shaped frame 201, a second elastic post 212 disposed inside the snap-fit ​​groove 209, a second spring 211 disposed on the surface of the second elastic post 212, and an extension post 210 fixedly connected to one side of the second elastic post 212.

[0048] The extension post 210 is matched with the corresponding through hole 208.

[0049] The limiting unit 2 also includes two limiting grooves 206 formed on one side of the U-shaped frame 201;

[0050] Two limiting grooves 206 are symmetrically arranged along the middle of the rectangular hole 205.

[0051] The heat dissipation components in the pressure-resistant unit 3 include a top plate 301 disposed at the top of the substrate body 1, a plurality of vent holes 302 opened inside the top plate 301, and a first extension plate 303 fixedly connected to both sides of the top plate 301.

[0052] The buffer assembly in the pressure-resistant unit 3 includes a base plate 305 disposed at the bottom end of the substrate body 1, a plurality of flexible columns 304 fixedly connected to the top end of the base plate 305, and a second extension plate 306 fixedly connected to both sides of the base plate 305.

[0053] In the compression-resistant unit 3, the first extension plate 303 and the second extension plate 306 are respectively engaged with the corresponding limiting groove 206.

[0054] With the top plate 301 and multiple vent holes 302, the heat generated by the substrate body 1 is dissipated through the two rectangular holes 205 and multiple vent holes 302. The top plate 301 and the bottom plate 305 are engaged with the corresponding limiting grooves 206 by means of the first extension plate 303 and the second extension plate 306. In this way, the top plate 301, the bottom plate 305 and the two U-shaped frames 201 form a whole, thereby improving the compressive strength of the substrate body 1.

[0055] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A voltage-resistant circuit board, comprising a board body (1), characterized in that, It also includes limiting units (2) disposed on the left and right sides of the substrate body (1), and anti-pressure units (3) disposed on the upper and lower sides of the substrate body (1). The limiting unit (2) includes a U-shaped frame (201) disposed on the left and right sides of the substrate body (1), a pressing component disposed inside the U-shaped frame (201), and a locking component disposed between the two U-shaped frames (201); The pressure-resistant unit (3) includes a heat dissipation component disposed at the top of the substrate body (1) and a buffer component disposed at the bottom of the substrate body (1).

2. The pressure-resistant circuit board according to claim 1, characterized in that: The extrusion assembly in the limiting unit (2) includes a rectangular hole (205) opened inside the U-shaped frame (201), a first elastic post (203) set at the top of the rectangular hole (205), a first spring (202) set on the surface of the first elastic post (203), and an extrusion plate (204) fixedly connected to the bottom of the first elastic post (203).

3. The pressure-resistant circuit board according to claim 2, characterized in that: The locking assembly in the limiting unit (2) includes two snap-fit ​​plates (207) fixedly connected to one side of one of the U-shaped frames (201), a through hole (208) opened in the middle of the snap-fit ​​plate (207), two snap-fit ​​grooves (209) opened inside one side of the other U-shaped frame (201), a second elastic post (212) disposed inside the snap-fit ​​groove (209), a second spring (211) disposed on the surface of the second elastic post (212), and an extension post (210) fixedly connected to one side of the second elastic post (212). The extension post (210) is matched with the corresponding through hole (208).

4. The pressure-resistant circuit board according to claim 3, characterized in that: The limiting unit (2) also includes two limiting grooves (206) opened on one side of the U-shaped frame (201); The two limiting grooves (206) are symmetrically arranged along the middle of the rectangular hole (205).

5. A pressure-resistant circuit board according to claim 4, characterized in that: The heat dissipation components in the pressure-resistant unit (3) include a top plate (301) disposed at the top of the substrate body (1), a plurality of vent holes (302) opened inside the top plate (301), and a first extension plate (303) fixedly connected to both sides of the top plate (301).

6. A pressure-resistant circuit board according to claim 5, characterized in that: The buffer assembly in the pressure-resistant unit (3) includes a base plate (305) disposed at the bottom end of the substrate body (1), a plurality of flexible columns (304) fixedly connected to the top end of the base plate (305), and a second extension plate (306) fixedly connected to both sides of the base plate (305).

7. A pressure-resistant circuit board according to claim 6, characterized in that: In the pressure-resistant unit (3), the first extension plate (303) and the second extension plate (306) are respectively engaged with the corresponding limiting groove (206).

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