Heat dissipation structure with combination of heat pipe and cast aluminum radiator

Abstract

The utility model relates to a heat pipe and cast aluminum radiator combined heat radiation structure, comprising a heat radiation housing comprising a heat radiation upper cover and a heat radiation lower cover, the heat radiation upper cover is connected with the heat radiation lower cover in a covering manner, and the heat radiation upper cover and the heat radiation lower cover are enclosed to form an accommodating cavity; the cast aluminum radiator is arranged at the upper end of the radiating upper cover; the PCB assembly is arranged in the accommodating cavity; the heat dissipation aluminum block is arranged at the upper end of the PCB assembly, and the heat dissipation aluminum block is used for gathering heat generated by the PCB assembly; and the heat pipe is arranged at the upper end of the heat dissipation aluminum block, is arranged between the heat dissipation aluminum block and the heat dissipation upper cover, and is used for transferring heat in the heat dissipation aluminum block to the cast aluminum radiator. By adopting the structure, rapid and uniform heat dissipation of internal elements of the equipment is realized, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of equipment heat dissipation technology, specifically to a heat dissipation structure combining a heat pipe and a cast aluminum radiator. Background Technology

[0002] With technological advancements, various devices have seen significant increases in functional requirements and computing power demands, leading to higher requirements for heat dissipation performance. However, this also results in increased heat generation from these devices. To ensure stable operation and improved performance of the controller, the corresponding heat dissipation requirements have also increased. To better meet these demands, it is necessary to improve the controller's heat dissipation performance. Existing controllers primarily rely on the heat conduction of the PCB components and heat sink for heat transfer, or add heat sink fins to the heat sink to improve heat dissipation efficiency. However, these controllers suffer from low heat transfer efficiency, localized heating, low heat dissipation per unit volume, and low overall heat dissipation efficiency.

[0003] Therefore, there is an urgent need to provide a heat dissipation structure that combines heat pipes and cast aluminum radiators to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings and defects of the prior art and provide a heat dissipation structure that combines a heat pipe and a cast aluminum radiator, which enables rapid and uniform heat dissipation of internal components, increases the heat dissipation area, and improves heat dissipation efficiency.

[0005] The objective of this utility model is achieved through the following technical solution:

[0006] A heat dissipation structure combining a heat pipe and a cast aluminum radiator, characterized in that it comprises:

[0007] The heat dissipation housing includes a heat dissipation upper cover and a heat dissipation lower cover, wherein the heat dissipation upper cover is closed and connected to the heat dissipation lower cover, and the heat dissipation upper cover and the heat dissipation lower cover together form a receiving cavity;

[0008] A cast aluminum radiator is located at the upper end of the radiator cover;

[0009] The PCB assembly is disposed within the receiving cavity;

[0010] A heat dissipation aluminum block is disposed on the upper end of the PCB assembly, and the heat dissipation aluminum block is used to concentrate the heat generated by the PCB assembly;

[0011] A heat pipe is located at the upper end of the heat dissipation aluminum block, between the heat dissipation aluminum block and the heat dissipation cover, to transfer heat from the heat dissipation aluminum block to the cast aluminum radiator.

[0012] Optionally, the cast aluminum radiator has a finned heat dissipation structure.

[0013] Optionally, the cast aluminum radiator and the heat dissipation cover are integrally formed.

[0014] Optionally, both the upper and lower heat dissipation covers are provided with mounting holes that penetrate the upper and lower end faces, and the upper heat dissipation cover is threadedly connected to the lower heat dissipation cover.

[0015] Optionally, the heat pipes are provided in several groups, and several of the heat pipes are soldered to the lower end of the heat dissipation cover by lead-free welding, and the heat dissipation aluminum block is connected to the heat pipes.

[0016] Optionally, a thermally conductive insulating pad is also provided between the PCB assembly and the heat sink aluminum block.

[0017] Optionally, the PCB assembly is detachably connected to the heat sink cover by bolts.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] In this invention, the heat dissipation housing includes a heat dissipation upper cover and a heat dissipation lower cover. The heat dissipation upper cover is positioned above the heat dissipation lower cover, and a receiving cavity is formed between the two covers. The PCB assembly, the heat dissipation aluminum block, and the heat pipe are all housed within this cavity. A cast aluminum heat sink is positioned above the heat dissipation upper cover. The PCB assembly is located within the cavity, and the heat dissipation aluminum block is positioned above the PCB assembly. The heat dissipation aluminum block absorbs and concentrates the heat generated by the PCB assembly, facilitating subsequent heat dissipation. The heat pipe is positioned above the heat dissipation aluminum block and between the heat dissipation aluminum block and the heat dissipation upper cover. It absorbs the heat concentrated in the heat dissipation aluminum block and transfers it to the cast aluminum heat sink for further heat dissipation. Through the arrangement of these components, rapid and uniform heat dissipation of the internal components is achieved, the heat dissipation area is increased, and the heat dissipation efficiency is improved. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the exploded structure of this utility model.

[0021] Figure 2 This is a schematic diagram of the structure of this utility model.

[0022] Figure 3 This is a cross-sectional front view of the present invention.

[0023] The above figures include the following reference numerals:

[0024] 11. Heat sink top cover, 12. Heat sink bottom cover, 13. Receiving cavity, 14. Mounting hole, 2. Cast aluminum heat sink, 3. PCB assembly, 4. Heat sink aluminum block, 5. Heat pipe, 6. Thermally conductive insulating pad. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of the present invention is not limited thereto.

[0026] This utility model proposes a heat dissipation structure that combines a heat pipe and a cast aluminum radiator.

[0027] Reference Figures 1 to 3 In this embodiment, it includes:

[0028] The heat dissipation housing includes a heat dissipation upper cover 11 and a heat dissipation lower cover 12. The heat dissipation upper cover 11 is closed and connected to the heat dissipation lower cover 12, and the heat dissipation upper cover 11 and the heat dissipation lower cover 12 surround and form a receiving cavity 13.

[0029] A cast aluminum radiator 2 is disposed on the upper end of the heat dissipation cover 11;

[0030] PCB assembly 3 is disposed within receiving cavity 13;

[0031] A heat dissipation aluminum block 4 is located on the upper end of the PCB assembly 3. The heat dissipation aluminum block 4 is used to concentrate the heat generated by the PCB assembly 3.

[0032] Heat pipe 5 is located at the upper end of heat dissipation aluminum block 4. Heat pipe 5 is located between heat dissipation aluminum block 4 and heat dissipation cover 11 to transfer heat from heat dissipation aluminum block 4 to cast aluminum radiator 2.

[0033] Optionally, in this embodiment, the heat dissipation structure combining the heat pipe 5 and the cast aluminum radiator 2 includes a heat dissipation shell, a cast aluminum radiator 2, a PCB assembly 3, a heat dissipation aluminum block 4, and a heat pipe 5. The heat dissipation shell includes a heat dissipation upper cover 11 and a heat dissipation lower cover 12. The heat dissipation upper cover 11 covers the upper end of the heat dissipation lower cover 12, and a receiving cavity 13 is formed between the heat dissipation upper cover 11 and the heat dissipation lower cover 12. The PCB assembly 3, the heat dissipation aluminum block 4, and the heat pipe 5 are all disposed in the receiving cavity 13, and the cast aluminum radiator 2 is disposed on the upper end of the heat dissipation upper cover 11. The PCB assembly 3 is disposed in the receiving cavity 13, and the heat dissipation aluminum block 4 is disposed on the upper end of the PCB assembly 3. When the PCB assembly 3 works in the receiving cavity 13, it usually generates a large amount of heat, which is dissipated through the upper... The heat dissipation aluminum block 4 at one end absorbs and concentrates heat, facilitating subsequent heat dissipation. A heat pipe 5 is located at the upper end of the heat dissipation aluminum block 4, between it and the heat dissipation cover 11. The heat pipe 5 absorbs the heat concentrated in the heat dissipation aluminum block 4 and transfers it to the cast aluminum radiator 2 for further heat dissipation. The heat pipe 5 possesses excellent thermal conductivity, far exceeding that of ordinary metals, enabling rapid heat transfer from the heat source to the heat dissipation area. Therefore, using the heat pipe 5 for heat conduction improves the heat dissipation efficiency within the cavity 13, quickly transferring internal heat to the air. Furthermore, the heat pipe 5 evenly distributes heat to the externally mounted cast aluminum radiator 2, increasing the heat dissipation area and efficiency. Through the arrangement of these components, rapid and uniform heat dissipation of the internal components is achieved, the heat dissipation area is increased, and the heat dissipation efficiency is improved.

[0034] In this embodiment, the cast aluminum radiator 2 has a finned heat dissipation structure. This structure significantly increases the heat dissipation area, allowing heat to be transferred from the heat pipe 5 to the fins and rapidly dissipated into the surrounding environment. Furthermore, the finned structure is suitable for heat transfer between various fluids and phase change heat transfer, meaning that cold air or coolant can be introduced into the finned radiator to improve the device's heat dissipation efficiency and enable effective heat dissipation under various complex conditions. Further, the cast aluminum radiator 2 and the heat dissipation cover 11 are integrally formed. This integral forming improves the connection stability between the heat dissipation cover 11 and the cast aluminum radiator 2 and also facilitates processing and molding.

[0035] In this embodiment, both the upper heat dissipation cover 11 and the lower heat dissipation cover 12 are provided with mounting holes 14 that penetrate the upper and lower end faces. That is, the heat dissipation cover and the lower heat dissipation cover 12 are connected by threaded mounting holes 14, which facilitates the replacement or maintenance of internal components. In other embodiments, the upper heat dissipation cover 11 and the lower heat dissipation cover 12 can also be connected by snap-fit ​​or pin, which is not limited here.

[0036] In this embodiment, several groups of heat pipes 5 are provided. These groups of heat pipes 5 are soldered to the lower end of the heat dissipation cover 11 using lead-free soldering, which reduces environmental pollution while achieving solder connection between the heat pipes 5 and the heat dissipation cover 11. The heat dissipation aluminum block 4 is connected to the heat pipes 5 through the heat pipes 5. The heat dissipation aluminum block 4 concentrates the heat generated by the PCB assembly 3 and then transfers it to the heat pipes 5. The aluminum block has good thermal conductivity and is lightweight and low in cost. In other embodiments, copper blocks can be used instead of heat dissipation aluminum blocks 4. Copper blocks have better thermal conductivity, but they usually have higher density and cost, making them suitable for applications where weight and cost requirements are not high. This is not a limitation.

[0037] In this embodiment, a thermally conductive insulating pad 6 is provided between the PCB assembly 3 and the aluminum block to reduce air thermal resistance, effectively reduce the high temperature generated in the temperature field, and improve the shock resistance of the device. Furthermore, in this embodiment, the PCB assembly 3 is detachably connected to the heat dissipation cover 12 by bolts to increase the stability of the device. In other embodiments, the connection between the PCB assembly 3 and the heat dissipation cover 12 can also be achieved by pins or buckles, which is not limited here.

[0038] The embodiments described above are merely illustrative of the implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A heat dissipation structure combining a heat pipe and a cast aluminum radiator, characterized in that, include: The heat dissipation housing includes a heat dissipation upper cover and a heat dissipation lower cover, wherein the heat dissipation upper cover is closed and connected to the heat dissipation lower cover, and the heat dissipation upper cover and the heat dissipation lower cover together form a receiving cavity; A cast aluminum radiator is located at the upper end of the radiator cover; The PCB assembly is disposed within the receiving cavity; A heat dissipation aluminum block is disposed on the upper end of the PCB assembly, and the heat dissipation aluminum block is used to concentrate the heat generated by the PCB assembly; A heat pipe is located at the upper end of the heat dissipation aluminum block, between the heat dissipation aluminum block and the heat dissipation cover, to transfer heat from the heat dissipation aluminum block to the cast aluminum radiator.

2. The heat dissipation structure combining a heat pipe and a cast aluminum radiator according to claim 1, characterized in that, The cast aluminum radiator has a finned heat dissipation structure.

3. The heat dissipation structure combining a heat pipe and a cast aluminum radiator according to claim 1, characterized in that, The cast aluminum radiator and the heat dissipation cover are integrally formed.

4. The heat dissipation structure combining a heat pipe and a cast aluminum radiator according to claim 3, characterized in that, Both the upper and lower heat dissipation covers are provided with mounting holes that penetrate the upper and lower end faces, and the upper heat dissipation cover is threadedly connected to the lower heat dissipation cover.

5. The heat dissipation structure combining a heat pipe and a cast aluminum radiator according to claim 4, characterized in that, The heat pipes are provided in several groups, and several of the heat pipes are soldered to the lower end of the heat dissipation cover by lead-free welding, and the heat dissipation aluminum block is connected to the heat pipes.

6. The heat dissipation structure combining a heat pipe and a cast aluminum radiator according to claim 1, characterized in that, A thermally conductive insulating pad is also provided between the PCB assembly and the heat sink aluminum block.

7. The heat dissipation structure combining a heat pipe and a cast aluminum radiator according to claim 1, characterized in that, The PCB assembly is detachably connected to the heat sink cover by bolts.

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