Subsynchronous oscillation suppression device with water cooling structure

Abstract

The utility model discloses a subsynchronous oscillation suppression device with a water cooling structure, which comprises a device body and further comprises a cooling substrate arranged at the bottom of the device body, the cooling substrate is provided with a water cooling assembly used for carrying out water cooling on the device body, and the water cooling assembly comprises a cooling cavity formed in the cooling substrate. The cooling cavity is provided with a cooling pipe in a disc mode, one side of the cooling base plate is fixedly connected with a water tank, a first water pump is arranged in the water tank, and the output end of the first water pump is connected with one end of the cooling pipe. According to the subsynchronous oscillation suppression device, through the arrangement of the water cooling assembly, water cooling of the subsynchronous oscillation suppression device is achieved, circulation and mutual mixing of cooling liquid absorbing heat are avoided under the action of the cooling assembly, and meanwhile under the action of the processing assembly, the cooling liquid absorbing heat can be recycled. And the probability that heat is difficult to transfer from the heating component to the cooling liquid due to obstruction of the bubbles is reduced.

Description

Technical Field

[0001] This utility model relates to the field of power grid technology, specifically to a subsynchronous oscillation suppression device with a water-cooled structure. Background Technology

[0002] According to existing publicly available technology, CN208190263U discloses a subsynchronous oscillation suppression device suitable for doubly-fed induction generators (DFIGs). The subsynchronous oscillation suppression device includes: a signal acquisition module, a lead-lag correction module, and a control signal output module. The signal acquisition module is connected to the DFIG induction generator in the DFIG and is used to acquire data from the DFIG induction generator. The signal acquisition module is connected to the lead-lag correction module, which is also connected to the control signal output module. The control signal output module is used to connect to the back-to-back converter in the DFIG induction generator. The lead-lag correction module modulates the data from the DFIG induction generator so that the control signal output module controls the back-to-back converter based on the modulated data from the DFIG induction generator, thereby suppressing subsynchronous oscillations during grid-connected operation of the DFIG induction generator.

[0003] In order to maintain a good cooling effect, the subsynchronous oscillation suppression device uses a water cooling system to cool the heat generated during operation. However, since the cooling water is constantly circulating during use, the heated cooling water will flow back into the water tank, causing the cooling water in the tank to mix with the heated cooling water. This will cause the temperature of the cooling water in the tank to rise, thus affecting the cooling effect of the subsynchronous oscillation suppression device. Furthermore, under the condition of local overheating of the cooling water and fluctuations in the delivery pressure, air bubbles will be generated in the cooling pipes. These air bubbles will obstruct the transfer of heat from the heat-generating components to the coolant, thereby affecting the coolant's heat adsorption effect.

[0004] Therefore, a subsynchronous oscillation suppression device with a water-cooled structure is urgently needed to solve the above problems. Utility Model Content

[0005] To achieve the above objectives, the present invention provides the following technical solution: a subsynchronous oscillation suppression device with a water-cooled structure, comprising a device body and a cooling substrate disposed at the bottom of the device body, wherein the cooling substrate is provided with a water-cooling component for water-cooling the device body.

[0006] The water-cooling assembly includes a cooling cavity formed on a cooling substrate, a cooling pipe arranged in a disc in the cooling cavity, a water tank fixedly connected to one side of the cooling substrate, a first water pump inside the water tank, the output end of the first water pump being connected to one end of the cooling pipe, and the water tank being provided with a cooling component for partitioning the cooling water and a processing component provided in the cooling component for treating air bubbles in the cooling water.

[0007] The cooling assembly includes a recovery tank located on the side of the water tank away from the cooling substrate. The other end of the cooling pipe is connected to the recovery tank. A cooling box is connected to one side of the recovery tank via a connecting pipe. A second water pump is provided on the side wall of the connecting pipe. Multiple semiconductor cooling fins are provided on the side wall of the cooling box. A delivery pipe is fixedly connected to the side of the cooling box away from the recovery tank. The other end of the delivery pipe is connected to the water tank. A third water pump is provided on the side wall of the delivery pipe. The cooling box is equipped with a contact assembly for improving the contact efficiency between the cooling water and the semiconductor cooling fins.

[0008] Temperature sensors are installed on the side wall of the cooling box.

[0009] The contact assembly includes a fixed rod fixedly connected between two opposing inner walls of the cooling box. Multiple guide plates are slidably connected to the side walls of the two fixed rods. The guide plates are staggered. A push rod motor is provided on one side of the cooling box. An output rod is provided at the output end of the push rod motor. Each guide plate is connected to the output rod.

[0010] The processing assembly includes a processing pipe fixedly connected to the high point of the conveying pipe, a float plate slidably connected inside the processing pipe, multiple through holes on the side wall of the float plate, a fixing ring fixedly connected to the processing pipe, a conical plug hole on the side of the fixing ring near the float plate, a plug on the side of the float plate near the fixing ring, the float plate being connected to the fixing ring via two telescopic components, and a one-way valve at the end of the processing pipe away from the conveying pipe.

[0011] The telescopic assembly includes a telescopic tube fixedly connected to the fixed ring on the side near the float. A telescopic rod is slidably connected to the telescopic tube. One end of the telescopic rod is connected to the float. A telescopic plate is connected to the end of the telescopic rod inside the telescopic tube. A spring is connected to the side of the telescopic plate away from the telescopic rod. The other end of the spring is connected to the bottom wall of the telescopic tube.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This invention, through the inclusion of a water-cooling component, achieves water cooling of the subsynchronous oscillation suppression device. Simultaneously, the cooling component utilizes a zoned operation mode to collect and cool the used coolant. This allows for timely cooling of the high-temperature coolant without affecting the coolant circulation cooling of the device itself, preventing the coolant from absorbing heat and causing circulation and mixing, thus improving the cooling effect on the device. Furthermore, the processing component collects and removes gases from the coolant, reducing the likelihood of heat transfer from the heating components to the coolant due to air bubbles, thereby enhancing the coolant's heat absorption effect. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the internal structure of the cooling component of this utility model;

[0016] Figure 3 This is a schematic diagram of the internal structure of the contact component of this utility model;

[0017] Figure 4 This is a schematic diagram of the internal structure of the processing component of this utility model.

[0018] In the diagram: 1. Device body; 2. Cooling base plate; 301. Cooling chamber; 302. Cooling pipe; 303. Water tank; 401. Recovery box; 402. Cooling box; 403. Connecting pipe; 404. Semiconductor cooling fins; 405. Conveying pipe; 406. Third water pump; 501. Fixing rod; 502. Guide plate; 503. Push rod motor; 601. Processing pipe; 602. Float plate; 603. Through hole; 604. Fixing ring; 605. One-way valve; 606. Conical plug; 607. Plug; 701. Telescopic pipe; 702. Telescopic rod; 703. Telescopic plate; 704. Spring; 8. Temperature sensor. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1

[0021] Please see Figures 1-4The subsynchronous oscillation suppression device with a water-cooled structure shown in the figure includes a device body 1 and a cooling substrate 2 disposed at the bottom of the device body 1. The cooling substrate 2 is provided with a water-cooling component for water cooling the device body 1.

[0022] The water cooling assembly includes a cooling cavity 301 formed on the cooling base plate 2, a cooling pipe 302 arranged in a disc in the cooling cavity 301, a water tank 303 fixedly connected to one side of the cooling base plate 2, a first water pump inside the water tank 303, the output end of the first water pump being connected to one end of the cooling pipe 302, and the water tank 303 being provided with a cooling component for partitioning the cooling water and a processing component provided in the cooling component for treating air bubbles in the cooling water.

[0023] It should be noted that by setting up the water-cooling component, while achieving water cooling of the subsynchronous oscillation suppression device, the cooling component, under the action of the partition operation mode, collects the used coolant and uses it to cool the used coolant. Thus, without affecting the coolant circulation cooling of the device body 1, the high-temperature coolant is cooled in time, thereby avoiding the circulation and mixing of the heat-absorbing coolant, and thus improving the cooling effect of the device body 1.

[0024] It is worth noting that the subsynchronous oscillation suppression device includes a signal acquisition module, a lead-lag correction module, and a control signal output module. The signal acquisition module is used to connect to the doubly-fed induction generator in the doubly-fed wind turbine and to acquire data from the doubly-fed induction generator. The signal acquisition module is connected to the lead-lag correction module, which is connected to the control signal output module. The control signal output module is used to connect to the back-to-back converter in the doubly-fed wind turbine. The lead-lag correction module modulates the data from the doubly-fed induction generator so that the control signal output module controls the back-to-back converter based on the modulated data from the doubly-fed induction generator, thereby suppressing subsynchronous oscillations during grid-connected operation of the doubly-fed wind turbine.

[0025] Please see Figure 1 and Figure 2 The cooling assembly shown in the figure includes a recovery tank 401 located on the side of the water tank 303 away from the cooling substrate 2. The other end of the cooling pipe 302 is connected to the recovery tank 401. The cooling box 402 is connected to one side of the recovery tank 401 via a connecting pipe 403. A second water pump is provided on the side wall of the connecting pipe 403. Multiple semiconductor cooling fins 404 are provided on the side wall of the cooling box 402. A conveying pipe 405 is fixedly connected to the side of the cooling box 402 away from the recovery tank 401. The other end of the conveying pipe 405 is connected to the water tank 303. A third water pump 406 is provided on the side wall of the conveying pipe 405. The cooling box 402 is provided with a contact assembly for improving the contact efficiency between the cooling water and the semiconductor cooling fins 404.

[0026] It should be noted here that by setting up the cooling components and using the zoned operation mode, the used coolant is collected and used to cool it down, so as to cool the high-temperature coolant in a timely manner without affecting the coolant circulation cooling of the device body 1.

[0027] It is worth noting that the semiconductor cooling fins 404 are arranged in a U-shape, and no semiconductor cooling fins 404 are provided on the side of the cooling box 402 near the device body 1.

[0028] Please see Figure 3 Temperature sensor 8 is located on the side wall of the cooling box 402 shown in the figure;

[0029] It should be noted here that temperature sensor 8 is used to detect the temperature of the cooling fluid.

[0030] The contact assembly includes a fixed rod 501 fixedly connected between two opposing inner walls of the cooling box 402. Multiple guide plates 502 are slidably connected to the side walls of the two fixed rods 501. The guide plates 502 are staggered. A push rod motor 503 is provided on one side of the cooling box 402. An output rod is provided at the output end of the push rod motor 503. Each guide plate 502 is connected to the output rod.

[0031] It should be noted here that the contact components are designed to improve the cooling efficiency of the coolant.

[0032] Working principle: During operation, this subsynchronous oscillation suppression device collects voltage and current data from the doubly-fed induction generator (DFIG) through a signal acquisition module. The voltage and current data are then modulated by a lead-lag correction module. This allows the control signal output module to generate a control signal based on the modulated voltage and current data and send it to a back-to-back converter. The back-to-back converter then controls the output power of the DFIG according to the control signal. This solves the problem in existing technologies where DFIG wind turbines are prone to subsynchronous oscillations due to the increasing risk of subsynchronous oscillations, which is detrimental to the safe and stable operation of wind farms and power transmission systems. This device provides subsynchronous oscillation suppression capabilities during grid-connected operation of DFIG wind turbines, thereby improving the stability of DFIG wind turbine operation. (It should be emphasized that the specific structure and working principle of this subsynchronous oscillation suppression device are existing technologies, and will not be elaborated upon here. For details, please refer to CN208190263U, which discloses a subsynchronous oscillation suppression device.)

[0033] Furthermore, during the operation of the device body 1, the first water pump in the water tank 303 is activated to deliver coolant to the cooling pipe 302, thereby absorbing the heat generated during the operation of the device body and achieving water cooling of the device body 1, ensuring the normal use of the device body 1. After the coolant carries away the heat generated by the device body 1, it will flow to the recovery tank 401, and then be delivered to the cooling tank 402 by the second water pump on the connecting pipe 403. After the coolant in the cooling tank 402 accumulates to a certain amount, the second water pump is turned off, so that the coolant can flow to the recovery tank 401, but cannot flow to the cooling tank 402.

[0034] The coolant gathered in the cooling chamber 402 dissipates heat in a timely manner through the cooling effect of the semiconductor cooling fins 404 and the auxiliary effect of the contact components. When the temperature sensor 8 detects that the temperature of the coolant in the cooling chamber 402 has reached the required level, the cooled coolant is transported to the water tank 303 by the third water pump 406 on the delivery pipe 405. After the coolant in the cooling chamber 402 has been transported, the third water pump 406 is stopped and the second water pump is started to transport the high-temperature coolant recovered in the recovery tank 401 back to the cooling chamber 402 for cooling, thus completing a cooling cycle. Under the action of the cooling components, the used coolant is collected and used for cooling in a zoned operation mode. This allows for timely cooling of the high-temperature coolant without affecting the coolant circulation and cooling of the device body 1, thus avoiding the circulation and mixing of the heat-absorbing coolant and improving the cooling effect of the device body 1.

[0035] Example 2

[0036] Please see Figure 4 This embodiment further illustrates Example 1. The processing component shown in the figure includes a processing pipe 601 fixedly connected to the high point of the conveying pipe 405. A float plate 602 is slidably connected inside the processing pipe 601. Multiple through holes 603 are opened on the side wall of the float plate 602. A fixing ring 604 is fixedly connected to the processing pipe 601. A conical plug hole 606 is opened on the side of the fixing ring 604 near the float plate 602. A plug 607 is provided on the side of the float plate 602 near the fixing ring 604. The float plate 602 is connected to the fixing ring 604 through two telescopic components. A one-way valve 605 is provided at the end of the processing pipe 601 away from the conveying pipe 405.

[0037] It should be noted here that the processing components are designed to collect and expel gases from the coolant, reducing the likelihood that heat will be difficult to transfer from the heat-generating components to the coolant due to the obstruction of air bubbles, thereby improving the coolant's heat adsorption effect.

[0038] It is worth noting that the one-way valve 605 is directed from the inside to the outside of the processing pipe 601.

[0039] Please see Figure 4 The telescopic assembly shown in the figure includes a telescopic tube 701 fixedly connected to the fixed ring 604 near the float 602. A telescopic rod 702 is slidably connected to the telescopic tube 701. One end of the telescopic rod 702 is connected to the float 602. A telescopic plate 703 is connected to one end of the telescopic rod 702 inside the telescopic tube 701. A spring 704 is connected to the side of the telescopic plate 703 away from the telescopic rod 702. The other end of the spring 704 is connected to the bottom wall of the telescopic tube 701.

[0040] It should be noted here that the telescopic component is used to provide guidance and reset for the float 602.

[0041] Working principle: During the circulation of coolant, local overheating and fluctuations in delivery pressure can cause bubbles to form in the cooling pipe 302. These bubbles will gather together and rise to the highest point of the piping system due to buoyancy. Since the delivery pipe 405 is located at the highest point of the entire cooling water delivery and circulation, the bubbles separated from the coolant rise to the interior of the processing pipe 601 and gather in the gas collection chamber of the processing pipe 601 through multiple sets of through holes 603 on the float plate 602. Finally, they are discharged outward through the one-way valve 605. By collecting and discharging the gas in the coolant, the probability of heat being difficult to transfer from the heat-generating components to the coolant due to the obstruction of bubbles is reduced, thereby improving the heat adsorption effect of the coolant.

[0042] Meanwhile, after the gas in the coolant is discharged, the coolant will enter the interior of the processing pipe 601 and push the float 602 closer to the fixed ring 604, so that the plug 607 on the float 602 abuts against the conical plug hole 606 on the fixed ring 604, thereby preventing the coolant from overflowing.

[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A subsynchronous oscillation suppression device with a water-cooled structure, comprising: Device body (1); Its characteristic is that it further includes: A cooling substrate (2) is disposed at the bottom of the device body (1), and the cooling substrate (2) is provided with a water cooling component for water cooling the device body (1); The water-cooling assembly includes a cooling cavity (301) formed on the cooling substrate (2), a cooling pipe (302) is provided in a disc in the cooling cavity (301), a water tank (303) is fixedly connected to one side of the cooling substrate (2), a first water pump is provided inside the water tank (303), the output end of the first water pump is connected to one end of the cooling pipe (302), the water tank (303) is provided with a cooling component for cooling water in zones and a processing component provided in the cooling component for treating air bubbles in the cooling water.

2. The subsynchronous oscillation suppression device with a water-cooled structure according to claim 1, characterized in that: The cooling assembly includes a recovery box (401) disposed on the side of the water tank (303) away from the cooling substrate (2). The other end of the cooling pipe (302) is connected to the recovery box (401). A cooling box (402) is connected to one side of the recovery box (401) via a connecting pipe (403). A second water pump is provided on the side wall of the connecting pipe (403). A plurality of semiconductor cooling fins (404) are provided on the side wall of the cooling box (402). A conveying pipe (405) is fixedly connected to the side of the cooling box (402) away from the recovery box (401). The other end of the conveying pipe (405) is connected to the water tank (303). A third water pump (406) is provided on the side wall of the conveying pipe (405). The cooling box (402) is provided with a contact assembly for improving the contact efficiency between the cooling water and the semiconductor cooling fins (404).

3. The subsynchronous oscillation suppression device with a water-cooled structure according to claim 2, characterized in that: The side wall of the cooling box (402) is fitted with a temperature sensor (8).

4. The subsynchronous oscillation suppression device with a water-cooled structure according to claim 2, characterized in that: The contact assembly includes a fixed rod (501) fixedly connected between two opposite inner walls of the cooling box (402). Multiple guide plates (502) are slidably connected to the side walls of the two fixed rods (501). The guide plates (502) are staggered. A push rod motor (503) is provided on one side of the cooling box (402). An output rod is provided at the output end of the push rod motor (503). Each guide plate (502) is connected to the output rod.

5. The subsynchronous oscillation suppression device with a water-cooled structure according to claim 2, characterized in that: The processing assembly includes a processing pipe (601) fixedly connected to the high point of the conveying pipe (405), a float plate (602) slidably connected inside the processing pipe (601), a plurality of through holes (603) being provided on the side wall of the float plate (602), a fixing ring (604) being fixedly connected to the processing pipe (601), a conical plug hole (606) being provided on the side of the fixing ring (604) near the float plate (602), a plug (607) being provided on the side of the float plate (602) near the fixing ring (604), the float plate (602) being connected to the fixing ring (604) through two telescopic components, and a one-way valve (605) being provided at the end of the processing pipe (601) away from the conveying pipe (405).

6. The subsynchronous oscillation suppression device with a water-cooled structure according to claim 5, characterized in that: The telescopic assembly includes a telescopic tube (701) fixedly connected to the fixed ring (604) on the side near the float (602). The telescopic tube (701) is slidably connected to a telescopic rod (702). One end of the telescopic rod (702) is connected to the float (602). One end of the telescopic rod (702) located inside the telescopic tube (701) is connected to a telescopic plate (703). A spring (704) is connected to the side of the telescopic plate (703) away from the telescopic rod (702). The other end of the spring (704) is connected to the bottom wall of the telescopic tube (701).

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