Semiconductor composite cleaning agent heating and blending tank

Abstract

The utility model discloses a semiconductor composite cleaning agent heating and blending tank which comprises a tank body. The stirring shaft is hollow, the upper end of the stirring shaft is open, the stirring shaft is vertically arranged in the tank body, the upper end of the stirring shaft penetrates out of the tank body and is in transmission connection with the stirring driving mechanism, a plurality of feeding holes are formed in the side wall of the lower part of the stirring shaft, and stirring paddles are further mounted on the outer wall; the hollow rod is arranged in the stirring shaft in an up-and-down sliding mode and makes contact with the inner wall of the stirring shaft, small holes corresponding to the feeding holes are formed in the side wall of the hollow rod, the small holes and the corresponding feeding holes are staggered, and the upper end of the hollow rod extends out of the stirring shaft and is in transmission connection with an adjusting driving mechanism; the material pushing piston is arranged in the hollow rod through a lifting mechanism and is in sealing contact with the inner wall of the hollow rod; the driving mechanism is adjusted to drive the hollow rod to move to the small hole to correspond to the corresponding feeding hole, the material pushing piston descends to feed the material into the tank body from the small hole and the feeding hole, the material with small content of components is dispersed and then fed into the tank body to be stirred by the stirring shaft and the stirring paddle, rapid and uniform mixing can be achieved, and the stirring efficiency can be improved.

Description

Technical Field

[0001] This application relates to the field of heated mixing tanks for semiconductor composite cleaning agents. Background Technology

[0002] Heated mixing tanks are used in the food, dairy, pharmaceutical, daily chemical, beverage, oil, chemical, and pigment industries for heating, mixing, or sterilization. They feature automatic temperature control, heat preservation, and stirring functions. Semiconductor composite cleaning agents comprise organic bases, polar aprotic solvents, organic alcohol ethers, corrosion inhibitors, chelating agents, arginine, 2-amino-2-methyl-1-propanol, surfactants, and water. These components enable the semiconductor composite cleaning agent to effectively remove metallic impurities and organic contaminants under strongly alkaline conditions, while protecting metal surfaces from corrosion. It is suitable for various cleaning needs in semiconductor manufacturing processes.

[0003] When preparing semiconductor composite cleaning agents, it is necessary to ensure that all components are mixed evenly to guarantee the removal of metal impurities and organic contaminants and the protection of metal surfaces. However, the content of corrosion inhibitors, arginine, 2-amino-2-methyl-1-propanol, surfactants, and other components in the semiconductor composite cleaning agent is low, requiring thorough mixing with other components. In this case, heat preservation can be used to ensure uniform mixing, but this takes a long time and prolongs the preparation time of the semiconductor composite cleaning agent. When it is necessary to speed up the preparation of the semiconductor composite cleaning agent, if mechanical rapid stirring is used for thorough mixing, it will cause a large number of bubbles to be generated on the surface of the semiconductor composite cleaning agent by the corrosion inhibitors and surfactants, affecting production. Utility Model Content

[0004] This utility model aims to solve at least one of the technical problems existing in the prior art. To this end, this utility model proposes a heating and mixing tank for semiconductor composite cleaning agents that can accelerate the mixing speed, and the technical solution adopted includes:

[0005] A semiconductor composite cleaning agent heating and mixing tank, comprising:

[0006] Tank body;

[0007] A hollow, open-top stirring shaft is vertically installed inside the tank, with its upper end extending out of the tank and connected to the stirring drive mechanism. The lower side wall of the stirring shaft has multiple feeding holes that communicate with its interior, and multiple stirring paddles are also installed on its outer wall.

[0008] A hollow rod is slidably disposed inside the stirring shaft and in contact with its inner wall. The side wall of the hollow rod is provided with a small hole corresponding to the feeding hole. The small hole is misaligned with the corresponding feeding hole. The upper end of the hollow rod extends out of the stirring shaft and is connected to the adjustment drive mechanism.

[0009] The pusher piston is installed inside the hollow rod and can be moved up and down via a lifting mechanism, and is in sealed contact with the inner wall of the hollow rod.

[0010] The adjustment drive mechanism is used to drive the hollow rod to move until the small hole corresponds to the corresponding feeding hole, and the pusher piston descends to send the material contained in the hollow rod into the tank through the small hole and the feeding hole.

[0011] The technical solution adopted by one embodiment of this utility model to solve its technical problem is: the pusher piston is provided with a vertically penetrating air vent hole, and the air vent hole is provided with a removable sealing plug.

[0012] The technical solution adopted by one embodiment of this utility model to solve its technical problem is: the bottom wall of the stirring shaft is provided with an ejector 23 that matches the vent hole.

[0013] The technical solution adopted by one embodiment of this utility model to solve its technical problem is as follows: the pusher piston includes an annular sliding member and a plug body disposed in the annular sliding member, and the sliding member is slidably connected to the hollow rod.

[0014] The technical solution adopted by one embodiment of this utility model to solve its technical problem is as follows: it further includes a shell, which is disposed outside the tank and surrounds the outer wall to form a heating cavity, and the shell is provided with a working medium inlet and a working medium outlet communicating with the interior of the heating cavity.

[0015] The technical solution adopted by one embodiment of this utility model to solve its technical problem is: the upper end of the tank is provided with a feeding port that communicates with its interior.

[0016] The beneficial effects of this utility model are:

[0017] Small amounts of the component are injected into the tank through small holes and feeding holes under the pressure of the pusher piston. The material is dispersed through multiple small holes before being injected into the tank. Since the stirring shaft is rotating when the small amounts of the component flow into the tank, the material flows out from the side wall of the stirring shaft and is agitated by the stirring shaft and stirring paddle. Even at a very slow stirring speed, it can achieve rapid and uniform mixing, which is beneficial to improving stirring efficiency. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0019] Figure 1 This is a cross-sectional view of the semiconductor composite cleaning agent heating and mixing tank described in this embodiment;

[0020] Figure 2for Figure 1 Enlarged view of point A in the middle. Detailed Implementation

[0021] This section will describe in detail the specific embodiments of the present utility model. The preferred embodiments of the present utility model are shown in the accompanying drawings. The purpose of the drawings is to supplement the textual description with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the present utility model, but they should not be construed as limiting the scope of protection of the present utility model.

[0022] In the description of this utility model, "multiple" means two or more; "greater than," "less than," and "exceeding" are understood to exclude the stated number; "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly specifying the number of indicated technical features or their sequential relationship.

[0023] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0024] In this utility model, unless otherwise explicitly defined, the terms "setting," "installing," and "connecting" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to a fixed connection, a detachable connection, or an integral molding; they can refer to a mechanical connection; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0025] See attached document Figure 1 As shown, an embodiment of this application is proposed. The semiconductor composite cleaning agent heating and mixing tank described in this embodiment includes:

[0026] Tank 10;

[0027] The stirring shaft 20, which is hollow inside and open at the top, is vertically installed inside the tank 10. Its upper end extends out of the tank 10 and is connected to the stirring drive mechanism 30. The lower side wall of the stirring shaft 20 is provided with multiple feeding holes 21 that communicate with its interior, and multiple stirring paddles 22 are also installed on the outer wall.

[0028] A hollow rod 40 is slidably disposed inside the stirring shaft 20 and in contact with its inner wall. The side wall of the hollow rod 40 is provided with a small hole corresponding to the feeding hole 21. The small hole is misaligned with the corresponding feeding hole 21. The upper end of the hollow rod 40 extends out of the stirring shaft 20 and is connected to the adjustment drive mechanism 50.

[0029] The pusher piston 60 is disposed inside the hollow rod 40 and can be moved up and down via the lifting mechanism 70, and is in sealed contact with the inner wall of the hollow rod 40.

[0030] The adjustment drive mechanism 50 is used to drive the hollow rod 40 to move until the small hole corresponds to the feeding hole 21, and the pusher piston 60 descends to send the material contained in the hollow rod 40 into the tank 10 through the small hole and the feeding hole 21.

[0031] When feeding materials, a large amount of the component is put into the tank 10. The upper end of the hollow rod 40 is open. The stirring drive mechanism 30 is started. The stirring drive mechanism 30 drives the stirring shaft 20 to drive the stirring paddle 22 to rotate in the tank 10 to stir and mix the various components of the semiconductor composite cleaning agent.

[0032] A small amount of component material is fed into the hollow rod 40 and stored between the pusher piston 60 and the inner bottom wall of the hollow rod 40. The hollow rod 40 is slidably connected to the stirring shaft 20. The hollow rod and the stirring shaft can be slidably connected by matching slide bars and grooves. When the stirring shaft rotates, it drives the hollow rod to rotate. When a small amount of component material needs to be added, the drive mechanism 50 drives the hollow rod 40 to move until the small hole corresponds to the feeding hole 21. At this time, the lifting mechanism 70 pushes the pusher piston down to compress the space between it and the bottom of the hollow rod, so that the small amount of component is injected into the tank through the small hole and the feeding hole under the pressure of the pusher piston 60. The material is dispersed through multiple small holes and then injected into the tank. Since the stirring shaft is rotating when the small amount of component flows into the tank, the material flows out from the side wall of the stirring shaft and is agitated by the stirring shaft and the stirring paddle. Even at a very slow stirring speed, rapid and uniform mixing can be achieved, which is beneficial to improving stirring efficiency.

[0033] The pusher piston 60 is provided with a vertically penetrating vent hole 61, and a removable sealing plug 62 is provided at the vent hole 61. After a small amount of the component is added, the sealing plug 62 is opened, and the pusher piston 60 can be raised to the point where the hollow rod 40 is removed via the lifting mechanism 70, so that a small amount of the component can be added again. In another embodiment, after the semiconductor composite cleaning agent heating and mixing tank has been mixed, and the small hole and the feeding hole 21 are aligned, the pusher piston 60 can be driven to rise.

[0034] Based on the above, the bottom wall of the stirring shaft 20 is provided with an ejector 23 that matches the venting hole 61. When the lifting mechanism 70 pushes the pusher piston 60 down to the bottom of the hollow rod 40, the ejector 23 is aligned with the piston and ejected, and the lifting mechanism 70 can drive the pusher piston 60 to rise.

[0035] Preferably, the pusher piston 60 includes an annular sliding member 63 and a plug 64 disposed within the annulus of the sliding member 63, the sliding member 63 being slidably connected to the hollow rod 40. When the stirring shaft 20 rotates, the stirring shaft 20 drives the hollow rod 40 to rotate synchronously. At this time, the sliding member 63 rotates relative to the hollow rod 40, and the plug 64 is sealed within the annulus of the sliding member 63.

[0036] The mixing tank also includes an outer shell 80, which is disposed outside the tank body 10 and forms a heating cavity between the outer shell 80 and its outer wall. The outer shell 80 is provided with a working medium inlet and a working medium outlet communicating with the interior of the heating cavity. When mixing the semiconductor composite cleaning agent, a heat-insulating working medium flows into the outer shell 80 to keep the interior of the tank body 10 warm, which helps to improve the mixing rate.

[0037] Preferably, the lower end of the tank 10 is provided with a product outlet. After the product is prepared, the product outlet is opened and the prepared semiconductor composite cleaning agent flows out from the product outlet.

[0038] Preferably, the upper end of the tank body 10 is provided with a feeding port 11 that communicates with its interior, which facilitates the feeding of components with large content.

[0039] The adjustment drive mechanism 50 is a screw jack, which is installed on the top of the tank 10. The hollow rod 40 has a protrusion at one end extending from the stirring shaft 20. The protrusion engages with the screw of the screw jack. The screw jack can drive its screw to rotate to realize the up and down movement of the hollow rod 40, and at the same time lock the hollow rod 40 in the current position to ensure that the small hole is maintained in a position that is misaligned or aligned with the feeding hole 21.

[0040] Of course, this utility model is not limited to the above-described embodiments. Those skilled in the art can make equivalent modifications or substitutions without departing from the spirit of this utility model. All such equivalent modifications and substitutions are included within the scope defined by the claims of this application.

Claims

1. A heating and mixing tank for a semiconductor composite cleaning agent, characterized in that, include: Tank body (10); The stirring shaft (20) is hollow inside and open at the top. It is vertically installed inside the tank (10). Its upper end extends out of the tank (10) and is connected to the stirring drive mechanism (30). The lower side wall of the stirring shaft (20) is provided with multiple feeding holes (21) that communicate with its interior. Multiple stirring paddles (22) are also installed on the outer wall. A hollow rod (40) is slidably disposed inside the stirring shaft (20) and in contact with its inner wall. The side wall of the hollow rod (40) is provided with a small hole corresponding to the feeding hole (21). The small hole is misaligned with the corresponding feeding hole (21). The upper end of the hollow rod (40) extends out of the stirring shaft (20) and is connected to the adjustment drive mechanism (50) for transmission. The pusher piston (60) is installed inside the hollow rod (40) and can be moved up and down by the lifting mechanism (70), and is in sealed contact with the inner wall of the hollow rod (40); The adjustment drive mechanism (50) is used to drive the hollow rod (40) to move to the small hole corresponding to the feeding hole (21), and the pusher piston (60) descends to send the material contained in the hollow rod (40) into the tank (10) through the small hole and the feeding hole (21).

2. The semiconductor composite cleaning agent heating and mixing tank according to claim 1, characterized in that, The pusher piston (60) is provided with a vertically penetrating vent hole (61), and a removable sealing plug (62) is provided at the vent hole (61).

3. The semiconductor composite cleaning agent heating and mixing tank according to claim 2, characterized in that, The bottom wall of the stirring shaft (20) is provided with an ejector (23) that matches the vent hole (61).

4. The semiconductor composite cleaning agent heating and mixing tank according to claim 3, characterized in that, The pusher piston (60) includes an annular sliding member (63) and a plug (64) disposed within the annular sliding member (63). The sliding member (63) is slidably connected to the hollow rod (40).

5. The semiconductor composite cleaning agent heating and mixing tank according to claim 1, characterized in that, It also includes an outer shell (80), which is disposed outside the tank body (10) and encloses the outer wall therebetween to form a heating cavity. The outer shell (80) is provided with a working fluid inlet and a working fluid outlet that communicate with the interior of the heating cavity.

6. The semiconductor composite cleaning agent heating and mixing tank according to claim 1, characterized in that, The upper end of the tank (10) is provided with a feeding port (11) that communicates with its interior.

Images